A brush tool for silicon wafer polishing, a polishing machine

Abstract

This application provides a brushing tool and a polishing machine for silicon wafer polishing, including a base and a grinding table placed on the base. The grinding table is arranged along the radial surface of the base and is detachably engaged with the base. This brushing tool for silicon wafer polishing features a detachable configuration, allowing selective adjustment of the grinding table position based on actual needs. It is not only simple in structure and highly versatile, but also optimizes the gap structure between adjacent grinding tables, increasing the inlet of the drainage channel and preventing accumulation around the grinding table, thereby improving the flow rate of the grinding solution and enhancing lubrication quality. This application also proposes a polishing machine equipped with this brushing tool.

Description

Technical Field

[0001] This application belongs to the field of semiconductor silicon wafer manufacturing technology, and in particular relates to a brush cleaning tool for silicon wafer polishing and a polishing machine equipped with the brush cleaning tool. Background Technology

[0002] In the silicon wafer polishing process, the brushing process is a crucial step. One step involves directly contacting the silicon wafer surface on a ceramic disc with a diamond disc to adjust the wafer's flatness. However, due to the unreasonable structural design of existing brushing tools, the flatness of the silicon wafer surface is inconsistent after brushing, directly affecting the surface quality of the silicon wafer. Summary of the Invention

[0003] This application provides a brushing tool and polishing machine for silicon wafer polishing, which solves the technical problem of poor uniformity of silicon wafer surface flatness caused by the unreasonable structure of existing brushing tools.

[0004] To solve at least one of the above-mentioned technical problems, the technical solution adopted in this application is:

[0005] A brushing tool for polishing silicon wafers includes a base and a grinding table placed on the base, the grinding table being arranged along the radial surface of the base and detachably engaged with the base.

[0006] Furthermore, the base is a ring-shaped chassis.

[0007] Furthermore, an annular surface for mounting the grinding table is constructed on one side of the base body, and the mounting surface protrudes from the body and is integrally formed with the body.

[0008] Furthermore, the mounting surface is concentrically arranged with the body, and the annular width of the mounting surface is not greater than the annular width of the body.

[0009] Furthermore, the mounting surface is located close to the outer edge of the body ring surface;

[0010] Alternatively, the mounting surface may be positioned at the center of the body's annular surface;

[0011] Alternatively, the mounting surface may be positioned close to the inner edge of the body's annular surface.

[0012] Furthermore, the grinding table is placed on the mounting surface, and a mounting hole is formed on the side of the grinding table near the mounting surface. The connecting piece passes through the body and the mounting surface in sequence and is connected to the mounting hole.

[0013] Furthermore, the grinding tables are fixed to the mounting surface at even intervals, and the number of grinding tables is a natural number greater than 2.

[0014] Furthermore, the gap channel between adjacent grinding tables is constructed as a trapezoidal structure, with its large end face close to the center.

[0015] Furthermore, the grinding table is constructed as a fan-shaped ring structure, with the central angle of its outer ring not greater than 45° and not less than 5°; and the difference between the central angles of its inner and outer rings is 2-5°.

[0016] A polishing machine equipped with the brushing tool described above.

[0017] This application discloses a brushing tool for silicon wafer polishing, featuring a detachable configuration that allows selective adjustment of the grinding table position based on actual needs. It boasts a simple structure and strong versatility, while also optimizing the gap between adjacent grinding tables and increasing the inlet of the drainage channel to prevent fluid buildup around the grinding table, thereby improving the flow rate of the grinding solution and enhancing lubrication quality. This application also proposes a polishing machine equipped with this brushing tool. Attached Figure Description

[0018] Figure 1 This is a front structural diagram of the scrubbing tool in this application;

[0019] Figure 2 This is a side view of the scrubbing tool in this application;

[0020] Figure 3 This is a schematic diagram of the back structure of the scrubbing tool in this application;

[0021] Figure 4 This is a schematic diagram of another mounting surface cooperating with the body in this application;

[0022] Figure 5 This is a schematic diagram of another mounting surface cooperating with the body in this application;

[0023] Figure 6 yes Figure 1 Enlarged view of section A.

[0024] In the picture:

[0025] 10. Base; 11. Main body; 12. Mounting surface

[0026] 20. Grinding table; 30. Channel; 40. Connecting parts Detailed Implementation

[0027] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0028] This embodiment proposes a brush cleaning tool for silicon wafer polishing, such as... Figure 1-2As shown, it includes a base 10 and several grinding tables 20 placed on the base 10. The grinding tables 30 can be arranged along the radial surface of the base 10 and can be detachably engaged with the base 10 through a connector 40.

[0029] Specifically, the base 10 is a ring-shaped chassis, including a body 11 and a mounting surface 12 integrally machined with the body 11. The mounting surface 12 is located on one side of the body 11 and is mainly used for mounting the grinding table 20. It is a continuous ring-shaped structure, and the mounting surface 12 protrudes from the plane of the body 11.

[0030] Preferably, the mounting surface 12 and the body 11 are concentrically arranged, and the annular width of the mounting surface 12 is not greater than the annular width of the body 11. The purpose is to ensure that the bottom surface of the grinding table 20 is mounted at a certain height from the body 11, providing sufficient height space for the control axis of the silicon wafer. The mounting surface 12 protrudes from the body 11 at a height of 2-10 cm.

[0031] Preferably, the mounting surface 12 is positioned close to the outer edge of the annular surface of the body 11, such as... Figure 6 As shown; or, the mounting surface 12 is positioned in the middle of the annular surface of the body 11, as shown. Figure 4 As shown; or, the mounting surface 12 is positioned close to the inner edge of the annular surface of the body 11, as shown. Figure 5 As shown. Such different structures may be based on different diameters of the ceramic disks used to hold the silicon wafers, and are not specifically limited here, but are all within the scope of protection of this case.

[0032] like Figure 3 As shown, the grinding table 20 is placed on the mounting surface 12. A mounting hole is formed on the side of the grinding table 20 closest to the mounting surface 12. This mounting hole is a blind hole and cannot penetrate the thickness of the grinding table 20. The grinding table 20 is directly connected to the mounting hole after passing through the body 11 and the mounting surface 12 in sequence via a connector 40. Each grinding table 20 has at least two mounting holes, i.e., it is fixedly connected to the base 10 via two connectors 40 to improve its fixing strength.

[0033] Preferably, the grinding tables 20 are fixedly mounted on the mounting surface 12 at even intervals, and the number of grinding tables 20 is a natural number greater than 2. This detachable structure allows the position of the grinding tables 20 to be adjusted based on the number of grinding tables 20 required to accommodate various flatness requirements. It is not only simple in structure but also highly versatile.

[0034] like Figure 6 As shown, the gap channel 30 between adjacent grinding tables 20 is constructed as a trapezoidal structure, with its large end face close to the center. This structural design not only increases the inlet of the drainage channel, preventing accumulation around the inner side of the grinding table 20, but also increases the flow rate of the grinding solution, thereby improving lubrication quality.

[0035] Preferably, the grinding table 20 is constructed as a fan-shaped annular structure, with the central angle θ of its outer ring not greater than 45° and not less than 5°; and the difference between the central angle β of its inner ring and the central angle θ of its outer ring is 2-5°. This ensures that the channel 30 between adjacent grinding tables 20 is a trapezoidal structure, improving the flow efficiency of the grinding fluid.

[0036] A polishing machine equipped with the brushing tool described above.

[0037] This application discloses a brushing tool for silicon wafer polishing, featuring a detachable configuration that allows selective adjustment of the grinding table position based on actual needs. It boasts a simple structure and strong versatility, while also optimizing the gap between adjacent grinding tables and increasing the inlet of the drainage channel to prevent fluid buildup around the grinding table, thereby improving the flow rate of the grinding solution and enhancing lubrication quality. This application also proposes a polishing machine equipped with this brushing tool.

[0038] The embodiments of this application have been described in detail above. These descriptions are merely preferred embodiments and should not be construed as limiting the scope of this application. All equivalent variations and modifications made within the scope of this application should still fall within the patent coverage of this application.

Claims

1. A brushing tool for polishing silicon wafers, characterized in that, The device includes a base and a grinding table placed on the base. The grinding table is arranged along the radial surface of the base and is detachably engaged with the base. The base includes a body and a mounting surface. On one side of the body, an annular mounting surface for mounting the grinding table is formed. The mounting surface protrudes from the body and is integrally formed with the body. The grinding table is placed on the mounting surface, and a mounting hole is formed on the side of the grinding table near the mounting surface. A connector passes through the body and the mounting surface in sequence and connects to the mounting hole.

2. The brushing tool for silicon wafer polishing according to claim 1, characterized in that, The base is a ring-shaped chassis.

3. A brushing tool for polishing silicon wafers according to claim 1 or 2, characterized in that, The mounting surface is concentrically arranged with the body, and the annular width of the mounting surface is not greater than the annular width of the body.

4. The brushing tool for polishing silicon wafers according to claim 3, characterized in that, The mounting surface is located near the outer edge of the body ring surface; Alternatively, the mounting surface may be positioned at the center of the body's annular surface; Alternatively, the mounting surface may be positioned close to the inner edge of the body's annular surface.

5. A brushing tool for polishing silicon wafers according to claim 4, characterized in that, The grinding tables are fixed to the mounting surface at even intervals, and the number of grinding tables is a natural number greater than 2.

6. A brushing tool for polishing silicon wafers according to claim 5, characterized in that, The gap channel between adjacent grinding tables is constructed as a trapezoidal structure, with its large end face close to the center.

7. A brushing tool for polishing silicon wafers according to claim 5 or 6, characterized in that, The grinding table is constructed as a fan-shaped ring structure, with the central angle of its outer ring not greater than 45° and not less than 5°; and the difference between the central angles of its inner and outer rings is 2-5°.

8. A polishing machine, characterized in that, It is equipped with a scrubbing tool as described in any one of claims 1-7.

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