Chip drying device and chip testing system

Abstract

The application relates to the technical field of chip testing, in particular to a chip airing device and a chip testing system. The chip airing device comprises a support, a bearing table, an air cooling assembly and an auxiliary heat dissipation assembly. The bearing table is arranged on the support and is used for bearing a tray, the tray is loaded with chips, the air cooling assembly is arranged on the bearing table and is used for blowing air to the chips to dissipate heat of the chips, and the auxiliary heat dissipation assembly is arranged on the back of the bearing table and is used for absorbing heat of the chips to dissipate heat of the chips. The chip airing device can improve the heat dissipation efficiency of the chips, meanwhile, can make the chips cool more uniformly and avoid the problem of insufficient local cooling of the chips.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a chip drying device and a chip testing system. Background Technology

[0002] During the testing of BGA (Ball Grid Array) chips, baking is typically required to remove absorbed moisture. After baking, effective cooling is essential to ensure smooth subsequent processing and prevent soldering defects or cracking caused by residual moisture. However, because BGA products contain sensitive dies, rapid cooling using air conditioning poses a significant risk of die cracking. Therefore, the common practice in existing technology is to place the baked BGA chips in a temperature-controlled production environment and use large fans for remote air cooling.

[0003] While this traditional cooling method can meet basic cooling needs to some extent, its limitations are becoming increasingly apparent. First, the airflow from large fans cannot evenly cover all parts of the BGA chip, resulting in uneven cooling and potential undercooling in some areas. Second, this method relies primarily on air convection for heat dissipation, which has relatively low efficiency, making the entire cooling process time-consuming. With the continuous increase in production scale and capacity requirements, traditional air cooling has gradually become one of the main bottlenecks restricting the improvement of production line efficiency. Utility Model Content

[0004] This application provides at least one chip cooling device and a chip testing system. The chip cooling device can improve the heat dissipation efficiency of the chip and make the chip cool more evenly, avoiding the problem of insufficient local cooling of the chip.

[0005] In a first aspect, embodiments of this application provide a chip drying device, including: a bracket, a support platform, an air-cooling component, and an auxiliary heat dissipation component;

[0006] The support platform is disposed on the bracket and is used to support the tray, which contains chips.

[0007] The air-cooling component is disposed on the support platform and is used to blow air onto the chip to dissipate heat from the chip;

[0008] The auxiliary heat dissipation component is disposed on the back of the support platform and is used to absorb the heat of the chip to dissipate heat from the chip.

[0009] In one optional embodiment, the air-cooling assembly includes a first fan assembly and a second fan assembly, wherein the first fan assembly is used to blow air in a first direction and the second fan assembly is used to blow air in a second direction; there is an angle between the first direction and the second direction.

[0010] In one optional embodiment, the auxiliary heat dissipation component is a heat pipe radiator, which includes an evaporation section and a condensation section. The evaporation section is connected to the back of the support platform, and the condensation section extends outward into the path of the air blown out by the air-cooling component.

[0011] In one alternative embodiment, the evaporation section and the support platform are connected by thermally conductive adhesive.

[0012] In one alternative embodiment, the condensation section is provided with heat dissipation fins.

[0013] In one alternative embodiment, there are multiple support platforms, which are spaced apart along the height direction; the support is configured to move the support platforms to adjust their height.

[0014] In one optional embodiment, the support includes a plurality of vertical lead screws and a plurality of nuts. The plurality of vertical lead screws are distributed around the support platform, and the plurality of nuts are respectively sleeved on the plurality of vertical lead screws and respectively connected to the support platform. When the plurality of vertical lead screws rotate circumferentially, the plurality of nuts reciprocate along the axial direction of the plurality of vertical lead screws to adjust the height of the support platform.

[0015] In one optional embodiment, it further includes a control component electrically connected to the air-cooling component and the auxiliary heat dissipation component, the control component being used to control the start and stop of the air-cooling component and the auxiliary heat dissipation component.

[0016] In one optional embodiment, the control component includes a central processing unit and a temperature sensor. The temperature sensor is disposed on the support platform and is used to detect the temperature of the support platform. The central processing unit is electrically connected to the temperature sensor, the air-cooling component, and the auxiliary heat dissipation component. The central processing unit is used to control the start and stop of the air-cooling component and the auxiliary heat dissipation component according to the temperature.

[0017] Secondly, embodiments of this application also provide a chip testing system, including the chip drying device described above.

[0018] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0019] The chip cooling device of this application includes an air-cooling component and an auxiliary heat dissipation component. The air-cooling component dissipates heat from the chip by blowing air onto it at close range, while the auxiliary heat dissipation component dissipates heat from the chip by absorbing heat from it. Compared to the traditional method of using a large fan to blow air from a distance for heat dissipation, this chip cooling device has two heat dissipation paths, which improves the chip's heat dissipation efficiency. Furthermore, since the air-cooling component and the auxiliary heat dissipation component are located on opposite sides of the chip, the chip cooling is more uniform, avoiding the problem of insufficient cooling in certain areas.

[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 A schematic diagram of a chip drying device provided in an embodiment of this application is shown;

[0023] In the picture:

[0024] 1. Bracket; 11. Vertical lead screw; 12. Nut; 2. Support platform; 3. Air-cooled assembly; 31. First fan assembly; 32. Second fan assembly; 4. Auxiliary heat dissipation assembly. Detailed Implementation

[0025] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0026] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] refer to Figure 1 This application provides a chip cooling device, including: a support 1, a carrier platform 2, an air-cooling component 3, and an auxiliary heat dissipation component 4. The carrier platform 2 is disposed on the support 1 and serves to support a tray containing chips. The air-cooling component 3 is disposed on the carrier platform 2 and is used to blow air onto the chips to dissipate heat. The auxiliary heat dissipation component 4 is disposed on the back of the carrier platform 2 and is used to absorb heat from the chips to dissipate heat. In other words, this chip cooling device utilizes the air-cooling component 3 to dissipate heat from the chips at close range, while simultaneously utilizing the auxiliary heat dissipation component 4 to absorb heat from the chips. Compared to the traditional method of using a large fan to dissipate heat from a distance, this chip cooling device has two heat dissipation paths, which improves the chip's heat dissipation efficiency. Furthermore, since the air-cooling component 3 and the auxiliary heat dissipation component 4 are located on opposite sides of the chip, this ensures more uniform cooling and avoids the problem of insufficient cooling in certain areas.

[0031] For example, the support platform 2 is provided with a positioning structure for positioning the tray containing the chips. Specifically, the positioning structure can limit the side of the tray, preventing it from moving horizontally relative to the support platform 2. For example, the positioning structure can be a positioning groove or a positioning block. Of course, this embodiment does not specifically limit the construction of the positioning structure, and it can be selected according to actual needs.

[0032] For example, there are multiple support platforms 2, which are arranged at intervals along the height direction. Figure 1 As shown, the number of support platforms 2 can be three. Of course, this embodiment does not impose a specific limit on the number of support platforms 2, and can select according to actual needs.

[0033] For example, such as Figure 1 As shown, the air-cooling assembly 3 includes a first fan assembly 31 and a second fan assembly 32. The first fan assembly 31 blows air in a first direction, and the second fan assembly 32 blows air in a second direction. There is an angle between the first and second directions. For example, the first fan assembly 31 is located at the rear end of the support platform 2, and the air blown by the first fan assembly 31 falls on the support platform 2 and flows to the front end of the support platform 2. The second fan assembly 32 is located at the left end of the support platform 2, and the air blown by the second fan assembly 32 falls on the support platform 2 and flows to the right end of the support platform 2. This arrangement allows for a more uniform airflow distribution, ensuring that airflow passes over the surface of each chip and avoiding insufficient cooling of certain chip areas. Of course, this embodiment does not specifically limit the blowing direction of the fan assemblies; it can be selected according to actual needs.

[0034] For example, both the first fan assembly 31 and the second fan assembly 32 consist of multiple low-power fans arranged in parallel. For instance, the first fan assembly 31 consists of five low-power fans, and the second fan assembly 32 consists of two low-power fans. Of course, this embodiment does not specifically limit the number of fans in the fan assemblies, and the number can be selected according to actual needs.

[0035] For example, the fans in the air-cooling assembly 3 are all equipped with a steering mechanism to adjust the fan angle. During use, the chip may be located in different positions on the support platform 2 due to its model size, tray structure, etc. When the chip position changes, in order to ensure that the air blown by the fan can sweep evenly across the chip surface, the fan angle can be adjusted appropriately through the steering mechanism. For example, the steering mechanism can be a worm gear mechanism, a four-bar linkage, etc. Of course, this embodiment does not specifically limit the construction of the steering mechanism, and it can be selected according to actual needs.

[0036] For example, the auxiliary heat dissipation component 4 is a heat pipe radiator. Specifically, the auxiliary heat dissipation component 4 includes an evaporation section and a condensation section, with the evaporation section connected to the back of the support platform 2. When the evaporation section absorbs heat from the support platform 2, the liquid working medium can absorb heat and convert to a vapor state. The liquid working medium flows to the condensation section, where it releases heat and condenses into a liquid, then returns to the evaporation section. Through the circulation of the working medium between the evaporation and condensation sections, the support platform 2 can be cooled. Of course, the auxiliary heat dissipation component 4 can also be other radiators, such as a water-cooled radiator or a composite radiator.

[0037] For example, the auxiliary heat dissipation component 4 uses a flat heat pipe. This design saves space and allows for a larger contact area between the heat pipe and the support platform 2, thereby improving the heat dissipation efficiency of the support platform 2. In addition, the flat heat pipe occupies relatively little space, allowing for more flexible arrangement in a compact space without sacrificing heat dissipation performance. Of course, this embodiment does not specifically limit the thickness of the heat pipe, and it can be selected according to actual needs.

[0038] For example, the evaporation section and the support platform 2 are connected by thermally conductive adhesive. This arrangement improves the heat transfer efficiency between the support platform 2 and the evaporation section, thereby helping to improve the heat dissipation efficiency of the support platform 2. Of course, this embodiment does not specifically limit the thickness and type of thermally conductive adhesive, and can be selected according to actual needs.

[0039] For example, the condenser section is equipped with heat dissipation fins. This configuration increases the contact area between the condenser section and the air, allowing for faster heat exchange and thus improving heat dissipation efficiency. Of course, this embodiment does not impose specific limitations on the structure and number of heat dissipation fins; they can be selected according to actual needs.

[0040] For example, the condensing section extends outward into the path of the air blown out by the air-cooling component 3. For instance, the condensing section can extend to the front or right end of the support platform 2. When the air blown out by the air-cooling component 3 flows out from the front or right end of the support platform 2, it can pass through the condensing section, carrying away the heat from the condensing section and causing the working medium to turn into a liquid state. This configuration eliminates the need for an additional fan for heat release in the condensing section, simplifying the system structure. Of course, this embodiment does not specifically limit the location of the condensing section; it can be selected according to actual needs.

[0041] For example, the support 1 is configured to be able to move the support platform 2 to adjust its height. For instance, as... Figure 1As shown, the support 1 includes a lead screw and nut mechanism, which comprises multiple vertical lead screws 11 and multiple nuts 12. The vertical lead screws 11 are distributed around the support platform 2, and the multiple nuts 12 are respectively sleeved on the vertical lead screws 11 and connected to the support platform 2. During use, when the multiple vertical lead screws are driven by a motor to rotate synchronously in the circumferential direction, the multiple nuts 12 can reciprocate along the axial direction of the multiple vertical lead screws 11, thereby driving the support platform 2 to rise and fall, thus adjusting the height of the support platform 2. This configuration allows each support platform 2 to be moved to a specified height, facilitating the loading and unloading of chips by operators or robots at that height. Of course, the support 1 can also employ other lifting methods, such as electric push rods or hydraulic push rods.

[0042] For example, the chip cooling device also includes a control component (not shown in the figure). The control component is electrically connected to the air-cooling component 3 and the auxiliary heat dissipation component 4, and is used to control the start and stop of the air-cooling component 3 and the auxiliary heat dissipation component 4. For example, the control component includes a central processing unit (CPU) and a temperature sensor. The temperature sensor is disposed on the support platform 2 and is used to detect the temperature of the support platform 2. The CPU is electrically connected to the temperature sensor, the air-cooling component 3, and the auxiliary heat dissipation component 4, and is used to control the start and stop of the air-cooling component 3 and the auxiliary heat dissipation component 4 according to the temperature. When the chip exceeds room temperature, the heat from the chip is transferred to the support platform 2, thereby increasing the temperature of the support platform 2. When the temperature sensor detects that the temperature of the support platform 2 has increased, it can feed back the temperature information to the CPU, which can then control the air-cooling component 3 and the auxiliary heat dissipation component 4 (such as the circulation pump of a liquid cooler) to start for heat dissipation. Conversely, when the chip cools down to room temperature, the chip no longer transfers heat to the support platform 2, and the temperature of the support platform 2 gradually recovers. When the temperature sensor detects that the temperature of the support platform 2 has returned to its initial temperature, it can feed back the information to the CPU, which can then control the air-cooling component 3 and the auxiliary heat dissipation component 4 to shut down to avoid energy waste. Furthermore, the control component may also include an alarm, with the central processing unit electrically connected to the alarm. The central processing unit can control the alarm to sound when the air-cooling component 3 and the auxiliary heat dissipation component 4 are turned off, so as to remind the operator to remove the chip from the carrier platform 2 in time.

[0043] The chip cooling device of this embodiment includes a wind-cooling component 3 and an auxiliary heat dissipation component 4. The wind-cooling component 3 dissipates heat from the chip by blowing air onto it at close range, while the auxiliary heat dissipation component 4 dissipates heat from the chip by absorbing heat from it. Compared to the traditional method of using a large fan to blow air from a distance for heat dissipation, this chip cooling device has two heat dissipation paths, which can improve the heat dissipation efficiency of the chip. At the same time, since the wind-cooling component 3 and the auxiliary heat dissipation component 4 are located on opposite sides of the chip, the chip cooling can be more uniform, avoiding the problem of insufficient cooling in certain areas.

[0044] This application also provides a chip testing system, including the chip drying device described above. The specific structure of the chip drying device has been described in detail above and will not be repeated here.

[0045] The chip testing system of this application embodiment includes the chip cooling device described above. The chip cooling device includes a wind-cooling component 3 and an auxiliary heat dissipation component 4. The wind-cooling component 3 dissipates heat from the chip by blowing air onto it at close range, while the auxiliary heat dissipation component 4 dissipates heat from the chip by absorbing heat from it. Compared to the traditional method of using a large fan to blow air from a distance for heat dissipation, this chip cooling device has two heat dissipation paths, which can improve the heat dissipation efficiency of the chip. At the same time, since the wind-cooling component 3 and the auxiliary heat dissipation component 4 are located on opposite sides of the chip, the chip cooling can be more uniform, avoiding the problem of insufficient cooling in certain areas.

[0046] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0047] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip drying device, characterized in that, include: Bracket, support platform, air-cooled components, and auxiliary heat dissipation components; The support platform is disposed on the bracket and is used to support the tray, which contains chips. The air-cooling component is disposed on the support platform and is used to blow air onto the chip to dissipate heat from the chip; The auxiliary heat dissipation component is disposed on the back of the support platform and is used to absorb the heat of the chip to dissipate heat from the chip.

2. The chip drying device according to claim 1, characterized in that, The air-cooling assembly includes a first fan assembly and a second fan assembly. The first fan assembly is used to blow air in a first direction, and the second fan assembly is used to blow air in a second direction. There is an angle between the first direction and the second direction.

3. The chip drying device according to claim 1, characterized in that, The auxiliary heat dissipation component is a heat pipe radiator, which includes an evaporation section and a condensation section. The evaporation section is connected to the back of the support platform, and the condensation section extends outward into the path of the air blown out by the air-cooling component.

4. The chip drying device according to claim 3, characterized in that, The evaporation section and the support platform are connected by thermally conductive adhesive.

5. The chip drying device according to claim 3, characterized in that, The condensation section is equipped with heat dissipation fins.

6. The chip drying device according to claim 1, characterized in that, The number of the support platforms is multiple, and the multiple support platforms are arranged at intervals along the height direction; The support is configured to allow the platform to be moved to adjust its height.

7. The chip drying device according to claim 6, characterized in that, The support includes multiple vertical lead rods and multiple nuts. The multiple vertical lead rods are distributed around the support platform, and the multiple nuts are respectively sleeved on the multiple vertical lead rods and respectively connected to the support platform. When the multiple vertical lead screws rotate circumferentially, the multiple nuts reciprocate along the axial direction of the multiple vertical lead screws to adjust the height of the support platform.

8. The chip drying device according to claim 1, characterized in that, Also includes: A control component is electrically connected to the air-cooling component and the auxiliary heat dissipation component, and the control component is used to control the start and stop of the air-cooling component and the auxiliary heat dissipation component.

9. The chip drying device according to claim 8, characterized in that, The control component includes a central processing unit and a temperature sensor. The temperature sensor is disposed on the support platform and is used to detect the temperature of the support platform. The central processing unit is electrically connected to the temperature sensor, the air-cooling component, and the auxiliary heat dissipation component. The central processing unit is used to control the start and stop of the air-cooling component and the auxiliary heat dissipation component according to the temperature.

10. A chip testing system, characterized in that, Includes the chip drying apparatus according to any one of claims 1-9.

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