Detection device

Abstract

The utility model discloses a detection device is used for placing in wafer box and detection device is used for detecting wafer box, and detection device includes device support, pressure sensor and circuit board, and pressure sensor is located device support and is at least one, and pressure sensor is used for contacting with wafer contact area in wafer box, and circuit board is located device support and circuit board is electrically connected with pressure sensor. According to the detection device of the utility model embodiment, the detection device is placed in wafer box to detect wafer box, and the pressure sensor of detection device contacts with wafer contact area in wafer box, can realize the detection of wafer box internal condition, for example can detect the micro deformation and damage condition in wafer box relatively accurately, so that the volume of detection device is smaller, and it is convenient to carry, effectively reduces the space that detection device occupies, saves space cost, can also make full use of the space in wafer box, need not extra occupy wafer box external space.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a detection device. Background Technology

[0002] With the continuous development of China's semiconductor industry, the market demand for chips is constantly increasing. Silicon wafers, the raw material for chip manufacturing, have also experienced rapid growth in recent years with government support. The silicon wafer processing flow generally includes key steps such as crystal growth, rounding, wire cutting, double-sided thinning, edge chamfering, surface etching, heat treatment, polishing, cleaning, epitaxy, inspection, and packaging. Finished wafers are typically stored in wafer cassettes, which directly affect the surface quality of the wafers. Prolonged use of wafer cassettes can lead to micro-deformation and damage in the internal wafer contact areas, affecting the internal particle environment and resulting in increased surface particles, decreased product yield, and increased costs.

[0003] In related technologies, wafer cells are often placed in inspection devices, such as automated optical inspection devices, to detect micro-deformations and damage inside the wafer cell. However, these inspection devices are relatively large, occupying excessive space and increasing space costs. Therefore, reducing the size of the inspection device to minimize its space requirements has become a pressing technical problem. Utility Model Content

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a detection device for detecting deformation and damage inside a wafer cassette, wherein the detection device is small in size, effectively reducing the space occupied by the detection device and saving space costs.

[0005] According to an embodiment of the present invention, the detection device is used to be placed inside a wafer cassette and to detect the wafer cassette. The detection device includes: a device support; a pressure sensor, wherein the pressure sensor is disposed on the device support and there is at least one pressure sensor, which is used to contact the wafer contact area inside the wafer cassette; and a circuit board, wherein the circuit board is disposed on the device support and electrically connected to the pressure sensor.

[0006] According to the detection device of this utility model embodiment, the detection device is placed inside the wafer cassette to detect the wafer cassette, and the pressure sensor of the detection device is in contact with the wafer contact area inside the wafer cassette, so as to realize the detection of the internal condition of the wafer cassette. For example, it can detect the micro-deformation and damage inside the wafer cassette relatively accurately. This makes the detection device small in size, easy to carry, effectively reduces the space occupied by the detection device, saves space costs, and can make full use of the space inside the wafer cassette without occupying additional space outside the wafer cassette, so that the overall size of the detection device and the wafer cassette is small.

[0007] According to some embodiments of the present invention, the detection device is retractable relative to the wafer cassette, so that the detection device can be removed or inserted.

[0008] According to some embodiments of the present invention, the wafer cassette includes a cassette body and a wafer support. The wafer support is disposed on the inner wall of the cassette body and is used to support and place wafers. The wafer support has a wafer slot for limiting the wafer. At least a portion of the pressure sensor is accommodated in the wafer slot, and at least a portion of the inner wall of the wafer slot constitutes the wafer contact area.

[0009] According to some embodiments of the present invention, the lower surface of the pressure sensor is in contact with the bottom wall of the wafer slot, and at least a portion of the bottom wall of the wafer slot constitutes the wafer contact area.

[0010] According to some embodiments of the present invention, a flexible layer is provided on the upper surface of the pressure sensor, and the flexible layer is located between the upper surface of the pressure sensor and the device support.

[0011] According to some embodiments of the present invention, the thickness of the flexible layer in the vertical direction is 1mm to 2mm; and / or, the flexible layer is a polyurethane layer.

[0012] According to some embodiments of the present invention, the device support is ring-shaped, and the central axis of the ring extends in the vertical direction.

[0013] According to some embodiments of the present invention, a single pressure sensor extends circumferentially along the device support.

[0014] According to some embodiments of the present invention, the pressure sensor extends beyond the wafer contact area in the circumferential direction of the device support at both ends; in the circumferential direction of the device support, the portion of the pressure sensor extending beyond the wafer contact area is an extension, and the dimension of the extension in the circumferential direction of the device support is 10mm to 20mm.

[0015] According to some embodiments of the present invention, the device support includes a single sub-support or multiple sub-supports arranged at intervals along the vertical direction, and each sub-support is provided with one pressure sensor or multiple pressure sensors arranged at intervals along the circumference of the sub-support.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is an assembly diagram of the wafer cassette and the detection device in a wafer cassette assembly according to some embodiments of the present invention;

[0019] Figure 2 yes Figure 1 A schematic diagram of the wafer cassette assembly in the diagram;

[0020] Figure 3 yes Figure 1 A schematic diagram of the detection device in the diagram;

[0021] Figure 4 yes Figure 3 A schematic diagram of some structures in the detection device;

[0022] Figure 5 yes Figure 2 A cross-sectional view of the assembly of the wafer cassette and wafers;

[0023] Figure 6 This is a comparison image of particle size inside the wafer cell, where the particle size inside the wafer cell is 0.05um;

[0024] Figure 7 This is a comparison image of particle size inside the wafer cell, where the particle size inside the wafer cell is 0.10um;

[0025] Figure 8 This is a comparison image of particle size inside the wafer cell, where the particle size inside the wafer cell is 0.20um;

[0026] Figure 9 This is a comparison chart of simulated shipment tests of wafer boxes, in which the particle size of the increased particle size on the surface of the internal wafers is 19nm.

[0027] Figure 10 This is a comparison chart of simulated shipment tests of wafer boxes, in which the particle size of the increased particle size on the surface of the internal wafers is 26nm.

[0028] Figure 11 This is a comparison chart of simulated shipment tests of wafer boxes, in which the particle size of the increased particle size on the surface of the internal wafers is 47nm.

[0029] Figure 12 This is a comparison chart of simulated shipment tests of wafer boxes, in which the particle size of the increased particle size on the surface of the internal wafer is 90nm.

[0030] Figure label:

[0031] 100. Wafer box assembly;

[0032] 1. Detection device; 11. Device support; 111. Sub-support; 112. Connecting support; 12. Pressure sensor; 13. Circuit board; 14. Battery module; 15. Flexible layer;

[0033] 2. Wafer box; 20. Box body; 21. Box cover; 22. Wafer support; 221. First wafer slot; 222. Second wafer slot; 223. Wafer contact area; 224. First wafer support; 225. Second wafer support;

[0034] 3. Wafers. Detailed Implementation

[0035] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0036] The following is for reference. Figures 1-12 The detection device 1 according to an embodiment of the present utility model is described.

[0037] Reference Figures 1-5 According to the first aspect of the present invention, the detection device 1 is used to be placed in the wafer cassette 2 and to detect the wafer cassette 2. The detection device 1 includes a device support 11, a pressure sensor 12 and a circuit board 13. The pressure sensor 12 is disposed on the device support 11 and there is at least one pressure sensor. The pressure sensor 12 is used to contact the wafer contact area 223 in the wafer cassette 2. The circuit board 13 is disposed on the device support 11 and is electrically connected to the pressure sensor 12.

[0038] By placing the detection device 1 inside the wafer cassette 2 and using it to detect the wafer cassette 2, the internal space of the wafer cassette 2 can be fully utilized without occupying additional external space, thus saving space costs. Through the contact between the pressure sensor 12 and the wafer contact area 223 inside the wafer cassette 2, the contact pressure state between the pressure sensor and the wafer contact area 223 can be detected relatively quickly and accurately. This makes the detection device 1 smaller in size, easier to carry, and effectively reduces the space occupied by the detection device 1, saving space costs.

[0039] The pressure sensor 12 and circuit board 13 are mounted on the device bracket 11. The device bracket 11 can fix and support the circuit board 13 and pressure sensor 12, and can also bring the distance between the circuit board 13 and pressure sensor 12 closer, reducing the length of the wiring harness connecting the circuit board 13 and pressure sensor 12. The electrical connection between the circuit board 13 and pressure sensor 12 enables the circuit board 13 to supply power to the pressure sensor 12 and the transmission of information between the pressure sensor 12 and the circuit board 13.

[0040] For example, when micro-deformation and damage occur in the wafer contact area 223, the pressure measured by the pressure sensor 12 when in contact with the wafer contact area 223 will change. For example, if there is micro-deformation on the surface of the wafer contact area 223 in contact with the pressure sensor 12, such as when there is a protrusion on the surface of the wafer contact area 223 in contact with the pressure sensor 12, the contact area between the pressure sensor 12 and the wafer contact area 223 will be smaller than the contact area when the wafer contact area 223 is not deformed or damaged. This will cause the local pressure measured by the pressure sensor 12 to increase. By comparing the pressure value measured by the pressure sensor 12 with the reference value, if it is larger than the set value, it is determined that deformation and damage have occurred. This allows for timely and relatively accurate determination of whether micro-deformation and damage have occurred in the wafer contact area 223 of the wafer cassette 2. The reference value is the value measured by the pressure sensor 12 when in contact with the wafer contact area 223 when the wafer contact area 223 is not deformed or damaged.

[0041] For example, when there is a depression on the surface where the wafer contact area 223 contacts the pressure sensor 12, the contact area between the pressure sensor 12 and the wafer contact area 223 will be smaller than the contact area when the wafer contact area 223 has not undergone micro-deformation and damage. This will cause the local pressure measured by the pressure sensor 12 to increase. By comparing the pressure value measured by the pressure sensor 12 with the reference value, if it is larger than the set value, it is determined that deformation and damage have occurred. This allows for timely and relatively accurate determination of whether the wafer contact area 223 of the wafer cassette 2 has undergone micro-deformation and damage. The reference value is the value measured when the pressure sensor 12 contacts the wafer contact area 223 when the wafer contact area 223 has not undergone micro-deformation and damage.

[0042] Compared to using optical image detectors to inspect wafer cassette 2, inspecting wafer cassette 2 using pressure sensor 12 eliminates the need for external devices such as vision sensors and light sources, thus solving the problem of light source pollution. Furthermore, compared to optical image detectors, pressure sensor 12 has lower inspection costs, and the overall size of the inspection device 1 is smaller, reducing the amount of materials used and thus lowering the manufacturing cost of the inspection device 1.

[0043] According to the embodiment of the present invention, the detection device 1 is placed inside the wafer cassette 2 to detect the wafer cassette 2. The pressure sensor 12 of the detection device 1 is in contact with the wafer contact area 223 inside the wafer cassette 2, which enables the detection of the internal condition of the wafer cassette 2. For example, it can detect micro-deformation and damage inside the wafer cassette 2 with relatively accurate results. This makes the detection device 1 small in size, easy to carry, effectively reduces the space occupied by the detection device 1, saves space costs, and can make full use of the space inside the wafer cassette 2 without occupying additional space outside the wafer cassette 2, so that the overall size of the detection device 1 and the wafer cassette 2 is small.

[0044] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5 According to some embodiments of this utility model, the detection device 1 is retractable relative to the wafer cassette 2, allowing the detection device 1 to be removed or installed. This retractable design simplifies the assembly and disassembly of the detection device 1 on the wafer cassette 2, reducing assembly and disassembly difficulty. It also reduces frictional wear on the wafer cassette 2 during assembly, thereby improving the accuracy of the detection device 1's inspection of the wafer cassette 2 and extending the service life of the wafer cassette 2.

[0045] For example, the wafer box 2 itself can guide the assembly or removal of the testing device 1 within the wafer box 2, so that the testing device 1 can be assembled or removed from the wafer box 2 in a pulling manner with relatively small force, which helps to improve the convenience of assembling or removing the testing device 1 from the wafer box 2.

[0046] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5 According to some embodiments of the present invention, the wafer cassette 2 includes a cassette body 20 and a wafer support 22. The wafer support 22 is disposed on the inner wall of the cassette body 20 and is used to support and place the wafer 3. The wafer support 22 forms a wafer slot for limiting the wafer 3. At least a portion of the pressure sensor 12 is accommodated in the wafer slot, and at least a portion of the inner wall of the wafer slot forms a wafer contact area 223.

[0047] The fact that at least a portion of the pressure sensor 12 is housed in the wafer slot can include the following situations: for example, a portion of the pressure sensor 12 may be housed in the wafer slot; or the entire pressure sensor 12 may be housed in the wafer slot.

[0048] The wafer support 22 serves to fix and support the wafer 3, while the wafer slot serves to limit the wafer 3, reducing the possibility of the wafer 3 shifting relative to the wafer support 22. For example, it can reduce the possibility of the wafer 3 moving within the wafer cassette 2 during operation. At least a portion of the pressure sensor 12 is housed in the wafer slot, and at least a portion of the inner wall of the wafer slot forms the wafer contact area 223. The wafer slot also limits the pressure sensor 12, ensuring its stable fixation within the wafer cassette 2. Furthermore, it allows the pressure sensor 12 to be directly located within the wafer contact area 223, improving the accuracy of the measured pressure in the wafer contact area 223. This enables more timely and accurate detection of micro-deformation and damage in the wafer contact area 223.

[0049] It needs to be explained that during the process of placing the wafer 3 into the wafer cassette 2 and after the wafer 3 is placed into the wafer cassette 2, at least a portion of the inner wall of the wafer slot will contact the wafer 3. This portion of the inner wall of the wafer slot that contacts the wafer 3 is the wafer contact area 223.

[0050] For example, when the testing device 1 is assembled or removed from the wafer cassette 2 in a pull-out manner, the wafer slot can guide the assembly or removal of the testing device 1 from the wafer support 22. This allows the testing device 1 to be placed into or removed from the wafer support 22 with relatively small force, which helps to improve the convenience of assembling or removing the testing device 1 from the wafer support 22.

[0051] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5 According to some embodiments of the present invention, the lower surface of the pressure sensor 12 is in contact with the bottom wall of the wafer slot, and at least a portion of the bottom wall of the wafer slot constitutes the wafer contact area 223.

[0052] The wafer contact area 223 may be formed by at least a portion of the bottom wall of the wafer card slot, for example, a portion of the bottom wall of the wafer card slot may form the wafer contact area 223; or, for another example, the entire bottom wall of the wafer card slot may form the wafer contact area 223.

[0053] The pressure sensor 12 can maintain good contact with the wafer contact area 223 under its own gravity and the gravity of the entire device support 11. There is no need to set up an additional elastic element or driving mechanism to make the pressure sensor 12 contact the wafer contact area 223. This can reduce the number of parts, which is beneficial to reducing the manufacturing cost of the detection device 1. It can also reduce the time required for the elastic element or driving mechanism to drive the pressure sensor 12 to contact the wafer contact area 223, thereby improving the timeliness of the pressure sensor 12 in detecting the wafer contact area 223.

[0054] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of the present invention, a flexible layer 15 is provided on the upper surface of the pressure sensor 12, and the flexible layer 15 is located between the upper surface of the pressure sensor 12 and the device support 11.

[0055] The flexible layer 15 has a certain elastic deformation capability in the vertical direction, which allows the pressure sensor 12 to make better contact with the wafer contact area 223. For example, the flexible layer 15 can solve the problem that the pressure sensor 12 is difficult to fully contact with the wafer contact area 223 due to the different vertical height of the bottom wall of the wafer slot. This helps to increase the effective contact area between the pressure sensor 12 and the wafer contact area 223 and improve the accuracy of the pressure measured by the pressure sensor 12.

[0056] Reference Figure 1 , Figure 3 and Figure 4According to some embodiments of this utility model, the thickness of the flexible layer 15 in the vertical direction is 1mm to 2mm. For example, the thickness of the flexible layer 15 in the vertical direction can be 1mm, 1.2mm, 1.5mm, 1.6mm, 2mm, etc. By having the thickness of the flexible layer 15 in the vertical direction be 1mm to 2mm, the flexible layer 15 can better solve the problem that the pressure sensor 12 is difficult to fully contact with the wafer contact area 223 due to the different horizontal and vertical heights of the bottom wall of the wafer slot. This helps to increase the effective contact area between the pressure sensor 12 and the wafer contact area 223, making the pressure sensor 12 more sensitive and accurate.

[0057] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of this utility model, the flexible layer 15 is a polyurethane layer. The polyurethane layer has good elastic deformation capability, which can make the flexible layer 15 have good elastic deformation capability, so as to better solve the phenomenon that the pressure sensor 12 is difficult to fully contact the wafer contact area 223 due to the different horizontal heights of the bottom wall of the wafer slot. This is beneficial to increase the effective contact area between the pressure sensor 12 and the wafer contact area 223, thereby improving the accuracy of the pressure measured by the pressure sensor 12.

[0058] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5 According to some embodiments of the present invention, the wafer support 22 includes a first wafer support 224 and a second wafer support 225. The first wafer support 224 and the second wafer support 225 are used to support and limit the wafer 3. The first wafer support 224 and the second wafer support 225 can make the wafer 3 more stably placed in the wafer box 2. For example, the first wafer support 224 and the second wafer support 225 are arranged at intervals along the circumference of the wafer 3, which can provide multi-point support and limit the wafer 3, so that the wafer 3 is more stably placed in the wafer box 2.

[0059] For example, the wafer cassette 2 includes a cassette body 20 and a cassette cover 21. The cassette cover 21 is detachably disposed on the cassette body 20. The first wafer support 224 is located on the left and right sides of the cassette body 20, and the second wafer support 225 is located on the side opposite to the cassette cover 21. During the process of placing the wafer 3 into the wafer cassette 2, the cassette cover 21 can be removed from the cassette body 20 so that the wafer 3 can be placed into the wafer cassette 2 from the outside. At this time, the first wafer support 224 and the second wafer support 225 can provide multi-point support and limit the wafer 3, so that the wafer 3 is placed relatively stably in the wafer cassette 2. After the wafer 3 is placed into the wafer cassette 2, the cassette cover 21 is assembled onto the cassette body 20 to reduce the possibility of external dust, water and other impurities entering the interior of the wafer cassette 2.

[0060] For example, the wafer slot formed on the first wafer support 224 is the first wafer slot 221, and the wafer slot formed on the second wafer support 225 is the second wafer slot 222. At least part of the bottom wall of the first wafer slot 221 and the second wafer slot 222 constitutes the wafer contact area 223. The pressure sensor 12 can contact the wafer contact area 223 of the first wafer slot 221 and the second wafer slot 222 under its own gravity and the gravity of the device support 11, thereby improving the timeliness of the pressure sensor 12 in detecting the wafer contact area 223 of the first wafer support 224 and the second wafer support 225.

[0061] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of this utility model, the device support 11 is annular, with the central axis of the annulus extending in the vertical direction. The shape of the device support 11 is similar to or close to the shape of the wafer 3, which can better facilitate the contact between the detection device 1 and the wafer contact area 223 in the wafer cassette 2, making it closer to the actual contact between the wafer 3 and the wafer contact area 223 in the wafer cassette 2, thereby making the pressure sensor 12 located on the device support 11 more accurate.

[0062] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of the present invention, a single pressure sensor 12 extends circumferentially along the device support 11, such that the shape of the pressure sensor 12 is close to the shape of at least a portion of the wafer 3. This makes the contact between the pressure sensor 12 and the wafer contact area 223 in the wafer cassette 2 closer to the actual contact between at least a portion of the wafer 3 and the wafer contact area 223 in the wafer cassette 2. This allows for better detection of the pressure in the wafer contact area 223 in the wafer cassette 2, thereby making the pressure sensor 12 more accurate.

[0063] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of the present invention, the two ends of the pressure sensor 12 in the circumferential direction of the device support 11 extend beyond the two ends of the wafer contact area 223 in the circumferential direction of the device support 11, so that the detection area of ​​the pressure sensor 12 can cover the wafer contact area 223, especially the end of the wafer contact area 223 in the circumferential direction of the device support 11. This allows the pressure sensor 12 to accurately detect the micro-deformation and damage of the end of the wafer contact area 223 in the circumferential direction of the device support 11, which is beneficial to improving the accuracy of the pressure sensor 12 in detecting the wafer contact area 223.

[0064] Reference Figure 1 , Figure 3 and Figure 4 In the circumferential direction of the device support 11, the portion of the pressure sensor 12 that extends beyond the wafer contact area 223 is an extension, and the dimension of the extension in the circumferential direction of the device support 11 is 10mm to 20mm. For example, the dimension of the extension in the circumferential direction of the device support 11 can be 10mm, 13mm, 15mm, 18mm, 20mm, etc.

[0065] By making the extension portion 10mm to 20mm in the circumferential direction of the device support 11 larger, the detection area of ​​the pressure sensor 12 in the circumferential direction of the device support 11 is larger than that of the wafer contact area 223. This allows the pressure sensor 12 to accurately detect micro-deformation and damage at the end of the wafer contact area 223 in the circumferential direction of the device support 11, improving the accuracy of the pressure measured by the pressure sensor 12 and avoiding increased manufacturing costs of the detection device 1 due to an excessively large extension portion.

[0066] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of this utility model, the device support 11 includes a single sub-support 111 or multiple sub-supports 111 spaced apart in the vertical direction. Each sub-support 111 has a pressure sensor 12 or multiple pressure sensors 12 spaced apart circumferentially along the sub-support 111. A single sub-support 111 makes it easier to pull the detection device 1 out of the wafer cassette 2, thereby making it easier to insert and remove the pressure sensor 12 on the sub-support 111 in the wafer slot.

[0067] The multi-layer sub-support 111 can correspond to multiple wafer slots arranged at intervals in the vertical direction of the wafer support 22, and each layer of sub-support 111 is equipped with at least one pressure sensor 12, so that the wafer contact area 223 of multiple wafer slots can be detected simultaneously, which can improve the detection efficiency of the detection device 1 on the wafer box 2.

[0068] Since multiple wafer contact areas 223 are formed between the wafer and the wafer support 22 in the circumferential direction of the wafer 3, and multiple pressure sensors 12 are provided in each sub-support 111 at intervals along the circumference of the sub-support 111, the multiple wafer contact areas 223 can be detected by the pressure sensors 12 as much as possible, so as to improve the accuracy of detection.

[0069] For example, a flexible layer 15 is provided between the pressure sensor 12 on each sub-support 111 and the sub-support 111. The flexible layer 15 has a certain elastic deformation capability in the vertical direction, which allows the pressure sensor 12 to make better contact with the wafer contact area 223. For example, the flexible layer 15 can solve the problem that the pressure sensor 12 on each sub-support 111 is difficult to make full contact with the wafer contact area 223 due to the different horizontal heights of the bottom wall of the wafer slot. This helps to increase the effective contact area between the pressure sensor 12 on each sub-support 111 and the wafer contact area 223, and improve the accuracy of the pressure measured by the pressure sensor 12 on each sub-support 111.

[0070] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of the present invention, the device support 11 further includes a connecting support 112, which is used to connect the multi-layer sub-supports 111. The connecting support 112 can realize the connection between the multi-layer sub-supports 111, so that the multi-layer sub-supports 111 are integrated into one unit.

[0071] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of the present invention, the sub-support 111 is annular, so that the shape of the sub-support 111 is similar to or close to the shape of the wafer 3. This can better enable the contact between the pressure sensor 12 disposed on the sub-support 111 and the wafer contact area 223 in the wafer box 2 to be closer to the actual contact between the wafer 3 and the wafer contact area 223 in the wafer box 2, thereby making the pressure sensor 12 disposed on the sub-support 111 more accurate.

[0072] Reference Figure 1 , Figure 3 and Figure 4 According to some embodiments of this utility model, the device support 11 further includes a connecting support 112, which is used to connect multiple sub-supports 111, and the sub-supports 111 are annular. The connecting support 112 can realize the connection between multiple sub-supports 111, so that the multiple sub-supports 111 are integrated into one unit. For example, there are multiple connecting supports 112, which are arranged at intervals along the circumference of the sub-supports 111, which can provide multi-point support for the sub-supports 111 and further enhance the stability of the connection between multiple sub-supports 111.

[0073] Reference Figure 3According to some embodiments of this utility model, a battery module 14 is also included. The battery module 14 is disposed on the device bracket 11 and electrically connected to the circuit board 13. The device bracket 11 can fix and support the battery module 14. Through the electrical connection between the battery module 14 and the circuit board 13, the battery module 14 can stably provide power to the circuit board 13, so that the pressure sensor 12 can operate directly through the power of the battery module 14, avoiding the impact of unstable power on the detection accuracy of the pressure sensor 12.

[0074] Reference Figure 1 , Figure 3 and Figure 4 The wafer cassette assembly 100 according to a second aspect embodiment of the present invention includes a wafer cassette 2 and a detection device 1 according to the first aspect embodiment of the present invention.

[0075] According to the embodiment of the present invention, the wafer cassette assembly 100 is equipped with the aforementioned detection device 1, which is placed inside the wafer cassette 2 to detect the wafer cassette 2. The pressure sensor 12 of the detection device 1 is in contact with the wafer contact area 223 inside the wafer cassette 2, thereby enabling the detection of the internal condition of the wafer cassette 2. For example, it can accurately detect micro-deformation and damage inside the wafer cassette 2. This makes the detection device 1 smaller in size, easier to carry, effectively reduces the space occupied by the detection device 1, saves space costs, and can make full use of the space inside the wafer cassette 2 without occupying additional space outside the wafer cassette 2, resulting in a smaller overall size of the wafer assembly.

[0076] The following reference Figures 6-12 The invention describes the method of using the detection device 1 according to some embodiments of the present invention and the test results.

[0077] Use of testing device 1: Before testing the damage of the wafer contact area 223 inside the wafer box 2, the operating status of testing device 1 needs to be tested; at the same time, 10 new wafer boxes 2 of the same type as the wafer box 2 to be tested are used for testing to collect standard data and error range.

[0078] Testing the operational status of the testing device 1: The test is conducted with the testing device 1 not placed in the wafer cassette 2. Since no object is pressing on the pressure sensor 12, the test result should be 0. After passing the test, a new wafer cassette 2 of the same type as the one under test is used for testing.

[0079] When testing the new wafer cassette 2, the test value of each pressure sensor 12 should be within ±10% of the standard value; the number of pressure sensors 12 running in each group of 10 new wafer cassette 2 tests should be the same and continuous. The above tests can ensure that the wafer contact area 223 inside the wafer cassette 2 is in full contact with the pressure sensor 12 and that the equipment is operating normally.

[0080] Standard Data Acquisition: Ten new wafer cassettes 2 of the same type as the wafer cassette 2 under test are randomly selected for standard data acquisition. Standard data acquisition is only required once for each wafer cassette 2 of the same type. The pressure sensing device is placed inside the new wafer cassette 2, with the device bracket 11 inserted into the corresponding wafer layer of the wafer cassette 2. The wafer cassette 2 is then closed. The pressure sensor 12 obtains the pressure information of the wafer contact area 223 inside the wafer cassette 2 and converts it into an electrical signal. The electrical signal is sent in batches to the A / D conversion module of the ATmega32U4 through a multiplexer for processing, generating a digital signal. The generated digital signal is sent to the ATmega32U4 chip to obtain the status information of the wafer contact area 223 inside the wafer cassette 2. The pressure sensor 12 sends the status information of the wafer contact area 223 inside the wafer cassette 2 to the computer through the wireless communication module of the ATmega32U4 circuit board 13. The average of the ten sets of data is calculated and used as the standard data. The standard value ±10% is taken as the acceptable error range for subsequent test data.

[0081] After the standard data of the wafer contact area 223 inside the wafer cell 2 is collected, the wafer cell 2 under test is tested using the same operation. The test data is compared with the standard data. If the data is within ±10% of the standard value, it is considered qualified; otherwise, it is unqualified.

[0082] To demonstrate the effectiveness of this invention and its impact on actual wafers 3, a comparative test was conducted on a batch of wafer cassettes 2 before and after the damaged wafer cassettes 2 were removed using pressure sensor 12. This was to demonstrate the impact of damage to the wafer contact area 223 inside the wafer cassette 2 on the quality of the wafers 3 and the internal environment of the wafer cassette 2. Data comparison was performed using new wafer cassettes 2, including damaged wafer cassettes 2 and wafer cassettes 2 after the damaged wafer cassettes were removed through screening. The two test groups were abbreviated as damaged and undamaged, respectively. The test content included particle size testing inside the wafer cassette 2, metal testing inside the wafer cassette 2, and simulated shipping testing with wafers 3 loaded.

[0083] Reference Figures 6-8 , Figures 6-8 The image shows a comparison of particle size inside different types of wafer cells 2. LLS.05, LLS.10, and LLS.20 correspond to particles of 0.05µm, 0.1µm, and 0.2µm in size, respectively.

[0084] The particle size distribution inside wafer cassette 2 was measured by injecting a measured amount of ultrapure water into the cleaned and dried wafer cassette 2, followed by shaking on a shaker, and then using a liquid particle counter to measure the particle size concentration inside the wafer cassette 2. Specific steps: First, the particle concentration in the plant's ultrapure water was tested. Wafer cassette 2 could only be tested if the concentrations of 0.05µm, 0.1µm, and 0.2µm particles were below 10, 3, and 1 particles / mL, respectively. After the water quality test was passed, 10 kg of ultrapure water was injected into the cleaned and dried wafer cassette 2, placed on a shaker table, and shaken for 3 minutes at a shaking speed of 75 rpm / min. After shaking, the inlet of the liquid particle counter was inserted into the wafer cassette, with the tube centered in the water, and the test began. Ten wafer cassettes of each type were tested, for a total of 30. As can be seen from the figure, even after cleaning, the particle size inside damaged wafer cassettes 2 was still significantly higher than that of new wafer cassettes 2. After the damaged wafer cassette 2 is removed using the detection device 1, the number of particles inside the cassette is significantly reduced, reaching the level required for daily use.

[0085] Table 1 shows the metal concentration data inside different types of wafer cassettes 2. The metal testing procedure is the same as above, the only difference being the use of inductively coupled plasma mass spectrometry (ICP-MS). Ten wafer cassettes of each type 2 were tested, for a total of 30. The test value for each metal is the average of the ten wafer cassettes 2. The degree of metal contamination inside different types of wafer cassettes 2 is determined by comparing the average values. The test data shows that the metal content in wafer cassettes 2 containing damage is significantly increased; after using detection device 1 to screen and remove damaged wafer cassettes 2, the metal content decreases again.

[0086] Table 1

[0087]

[0088]

[0089] Reference Figures 9-12 , Figures 9-12This section presents a comparison chart of simulated shipment tests for different wafer cassettes 2. LLS.019, LLS.026, LLS.047, and LLS.090 correspond to 19nm, 26nm, 47nm, and 90nm particles, respectively. Simulated shipment of wafer cassettes 2 involves using a sorting machine to transfer wafers 3 with tested surface defects into the wafer cassette 2; packaging them in bags, sending them to the warehouse, and then returning them to have the bags removed; the sorting machine then transfers the wafers 3 out, and a wafer surface particle size analyzer measures the growth of particles on the surface of the wafers 3 to determine the impact of the wafer contact area 223 and the internal environment of the wafer cassette 2 on the wafers 3. Ten wafer cassettes of each type are tested, for a total of 30 wafer cassettes 2; each wafer cassette 2 contains 8 wafers 3, and each wafer 3 represents one set of test data, with each set of wafer cassette 2 containing 80 sets of data, for a total of 240 sets of test data. As can be seen from the figure, the wafer 3 containing damaged wafer box 2 has the largest increase in the number of particles on its surface; after the damaged wafer box 2 is removed by screening with detection device 1, the increase in the number of particles on its wafer surface is significantly reduced, approaching zero growth.

[0090] The above tests demonstrate that damage to the wafer contact area 223 has a significant impact on the internal environment of the wafer cassette 2 and the particle size of the internal wafer surface. The detection device 1 in this embodiment can effectively screen out wafer cassettes 2 with damage to the wafer contact area 223, thereby avoiding damage to the wafer 3 caused by the damage to the wafer contact area 223, thus achieving the purpose of saving costs and improving the quality of the wafer 3.

[0091] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0092] In the description of this utility model, "first feature" and "second feature" may include one or more of the features.

[0093] In the description of this utility model, "multiple" means two or more.

[0094] In the description of this utility model, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.

[0095] In the description of this utility model, the terms "above", "over" and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0096] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0097] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A detection device, characterized in that, The detection device is used to be placed inside a wafer cassette and to detect the wafer cassette. The detection device includes: Device support; A pressure sensor, wherein at least one pressure sensor is disposed on the device support, and the pressure sensor is used to contact the wafer contact area within the wafer cassette; A circuit board, which is mounted on the device bracket and electrically connected to the pressure sensor.

2. The detection device according to claim 1, characterized in that, The detection device is retractable relative to the wafer cassette, allowing it to be removed or inserted.

3. The detection device according to claim 2, characterized in that, The wafer cassette includes a cassette body and a wafer support. The wafer support is disposed on the inner wall of the cassette body and is used to support and place wafers. The wafer support has a wafer slot for limiting the wafer. At least a portion of the pressure sensor is accommodated in the wafer slot. At least a portion of the inner wall of the wafer slot constitutes the wafer contact area.

4. The detection device according to claim 3, characterized in that, The lower surface of the pressure sensor contacts the bottom wall of the wafer slot, and at least a portion of the bottom wall of the wafer slot forms the wafer contact area.

5. The detection device according to claim 4, characterized in that, The pressure sensor has a flexible layer on its upper surface, which is located between the upper surface of the pressure sensor and the device support.

6. The detection device according to claim 5, characterized in that, The thickness of the flexible layer in the vertical direction is 1mm to 2mm; and / or, the flexible layer is a polyurethane layer.

7. The detection device according to any one of claims 1-6, characterized in that, The device support is ring-shaped, and the central axis of the ring extends in the vertical direction.

8. The detection device according to claim 7, characterized in that, The single pressure sensor extends circumferentially along the device support.

9. The detection device according to claim 8, characterized in that, The pressure sensor extends beyond the wafer contact area in the circumferential direction of the device support at both ends; in the circumferential direction of the device support, the portion of the pressure sensor extending beyond the wafer contact area is an extension, and the dimension of the extension in the circumferential direction of the device support is 10mm to 20mm.

10. The detection device according to any one of claims 1-6, characterized in that, The device support includes a single sub-support or multiple sub-supports arranged at intervals along the vertical direction, with each sub-support having one pressure sensor or multiple pressure sensors arranged at intervals along the circumference of the sub-support.

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