Digital twin assisted intelligent manufacturing equipment fault diagnosis device
By using a wall-mounted mounting and heat dissipation mechanism, the installation difficulties and insufficient heat dissipation of the fault diagnosis device on compact equipment are solved, achieving convenient installation and efficient heat dissipation, and improving the operational stability and accuracy of fault diagnosis.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG TIANYUYIZHI CNC EQUIP CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-06-19
AI Technical Summary
Existing fault diagnosis devices are inconvenient to install, difficult to adapt to compact and complex equipment, and have insufficient heat dissipation performance, affecting the stability and accuracy of the equipment.
It adopts a wall-mounted installation and heat dissipation mechanism, including a fixing component and a cooling fan, to achieve convenient installation and efficient heat dissipation.
It improved the applicability and installation efficiency of the device, reduced equipment downtime, ensured normal operation and production efficiency of the equipment, and improved the stability and accuracy of fault diagnosis.
Smart Images

Figure CN224382517U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of equipment fault diagnosis devices, specifically relating to a digital twin-assisted intelligent manufacturing equipment fault diagnosis device. Background Technology
[0002] Digital twin-assisted intelligent manufacturing equipment fault diagnosis devices utilize digital twin technology to construct a virtual model of the intelligent manufacturing equipment and interact with the actual equipment in real time. By analyzing changes in the data within the virtual model, the device diagnoses faults in the actual equipment. It can monitor various parameters during equipment operation in real time, such as temperature, pressure, and vibration frequency. Using advanced algorithms and models, it processes and analyzes this data to promptly identify potential equipment faults and accurately locate the fault position. This provides a scientific basis for equipment maintenance and repair, effectively improving equipment reliability and operating efficiency, and reducing production losses caused by equipment failures.
[0003] However, existing fault diagnosis devices have some technical drawbacks in practical applications. On the one hand, their installation is not flexible and convenient enough, usually requiring external installation. For some compact and complex intelligent manufacturing equipment, it is difficult to find a suitable installation location, which limits the monitoring range of the equipment and makes it impossible to comprehensively diagnose faults in key internal components. Moreover, once disassembly is required for repair or replacement, the process is cumbersome and time-consuming, affecting the normal operation and maintenance efficiency of the equipment. On the other hand, the internal heat dissipation performance of the device is poor. As the equipment operates for longer periods and the amount of monitoring data increases, internal circuit boards and other electronic components generate a large amount of heat. Existing heat dissipation structures cannot accurately cool down the heat-generating areas, leading to heat accumulation. This may cause the performance of electronic components to degrade or even malfunction, thus affecting the stability and accuracy of the entire fault diagnosis device and failing to meet the high-precision and high-reliability fault diagnosis requirements of intelligent manufacturing equipment. Utility Model Content
[0004] To address the problems mentioned in the background section, this invention provides a digital twin-assisted intelligent manufacturing equipment fault diagnosis device, which features convenient installation and use, as well as more efficient heat dissipation and cooling.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a digital twin-assisted intelligent manufacturing equipment fault diagnosis device, comprising a housing, a circuit board inside the housing, multiple sets of diverse sensors on the outer side of the housing, a back plate on the rear side of the housing, an ear plate at the side corner of the back plate, the ear plate being fixedly connected to the inner wall of the equipment to be tested by bolts, the diverse sensors and the circuit board being electrically connected to a computer by wires, the back plate being fixedly connected to the housing by a wall-mounted mounting mechanism, and a heat dissipation mechanism being provided at the inner edge of the housing.
[0006] Preferably, the wall-mounted installation and fixing mechanism of the device includes a fixing component one, a locking block, a fixing hole and a locking seat. The locking block is provided at the side edge of the back plate, the upper end of the locking block is provided with a fixing hole, the inner wall of the housing is provided with a locking seat corresponding to the locking block, and the fixing component one is provided inside the locking seat.
[0007] Preferably, a heat dissipation groove is provided at the center of the side of the back plate.
[0008] Preferably, the fixing component includes a spring and a fixing rod, with the spring provided inside the side of the card holder and the fixing rod provided at the other end of the spring.
[0009] Preferably, the fixing component further includes a groove and a slider, with a slider provided on the side of the fixing rod and a groove corresponding to the slider provided on the side of the housing.
[0010] Preferably, the heat dissipation mechanism includes a cooling fan, a fan plate, a second fixing component, and an air outlet. The cooling fan is provided at the lower end of the housing, and the fan plate is provided at the upper end of the cooling fan located at the inner edge of the housing. An air outlet is provided on the side of the fan plate corresponding to the heat-generating position of the circuit board. The fan plate and the housing are fixedly connected by the second fixing component.
[0011] Preferably, the second fixing component includes a connecting plate, two bolts, and a connecting rod. The connecting rod is provided on the side of the air plate, and the connecting plate is provided at the other end of the connecting rod. The connecting plate is fixedly connected to the housing by the second bolt.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. This utility model, through the setting of a wall-mounted installation and fixing mechanism, realizes the convenient installation and stable fixing of the fault diagnosis device on the inner wall of the equipment. This installation method is not only simple to operate and saves installation time, but also can adapt to the inner walls of equipment of different sizes and shapes, greatly improving the applicability of the device. At the same time, its convenient disassembly performance allows the device to be quickly disassembled without complicated tools and cumbersome steps when it is necessary to repair or replace it, effectively reducing equipment downtime, improving equipment maintenance efficiency, and ensuring the normal operation and production efficiency of the equipment.
[0014] 2. This utility model effectively solves the problem of heat accumulation generated by electronic components such as circuit boards inside the device during operation by setting up a heat dissipation mechanism. The cooling fan can actively blow away the heat inside the device, accelerate airflow, and allow the heat to dissipate more quickly. The setting of the fan plate can guide the air blown by the cooling fan to concentrate the heat dissipation at the heat-generating position of the circuit board, improve the targeting and efficiency of heat dissipation, further reduce the temperature of the circuit board, and prevent the circuit board from experiencing performance degradation or failure due to excessive temperature. This improves the stability and accuracy of the entire fault diagnosis device, better meets the high-precision and high-reliability fault diagnosis requirements of intelligent manufacturing equipment, extends the service life of the device, and reduces the maintenance cost of the equipment. Attached Figure Description
[0015] Figure 1 This is a perspective view of the present utility model;
[0016] Figure 2 This is a perspective view of the wall-mounted installation and fixing mechanism of the present invention.
[0017] Figure 3 This is an enlarged view of the fixing component one of this utility model;
[0018] Figure 4 This is a perspective view of the heat dissipation mechanism of this utility model;
[0019] Figure 5 This is a perspective view of the second fixing component of this utility model;
[0020] In the diagram: 1. Housing; 2. Various sensors; 3. Computer; 4. Backplate; 5. Earplate; 6. Bolt 1; 7. Wall-mounted mounting mechanism; 71. Fixing component 1; 711. Spring; 712. Slide rail; 713. Slider; 714. Fixing rod; 72. Locking block; 73. Fixing hole; 74. Card seat; 8. Heat dissipation slot; 9. Heat dissipation mechanism; 91. Cooling fan; 92. Air vane; 93. Fixing component 2; 931. Connecting plate; 932. Bolt 2; 933. Connecting rod; 94. Air outlet; 10. Circuit board. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Example 1
[0023] Please see Figure 1-5 The present invention provides the following technical solution: a digital twin-assisted intelligent manufacturing equipment fault diagnosis device, comprising a housing 1, a circuit board 10 disposed inside the housing 1, multiple sets of diverse sensors 2 disposed on the outer side of the housing 1, a back plate 4 disposed on the rear side of the housing 1, an ear plate 5 disposed at the side corner of the back plate 4, the ear plate 5 being fixedly connected to the inner wall of the equipment to be tested by bolts 6, the diverse sensors 2 and the circuit board 10 being electrically connected to a computer 3 by wires, the back plate 4 being fixedly connected to the housing 1 by a wall-mounted mounting and fixing mechanism 7, and a heat dissipation mechanism 9 disposed at the inner edge of the housing 1.
[0024] Specifically, the wall-mounted mounting mechanism 7 includes a fixing component 71, a locking block 72, a fixing hole 73, and a mounting base 74. A locking block 72 is provided at the side edge of the back plate 4, and a fixing hole 73 is provided at the upper end of the locking block 72. A mounting base 74 corresponding to the locking block 72 is provided on the inner wall of the housing 1, and the fixing component 71 is disposed inside the mounting base 74.
[0025] By adopting the above technical solution, the fault diagnosis device can be easily installed on the inner wall of the equipment. The installation process is simple and quick, and it can adapt to the inner walls of equipment of different sizes and shapes, improving the applicability and installation efficiency of the device. At the same time, this installation method is also easy to disassemble. When the device needs to be repaired or replaced, it can be easily removed by simply loosening bolt 6 and fixing component 71 without affecting the normal operation of the equipment, which greatly improves maintenance efficiency.
[0026] Specifically, a heat dissipation groove 8 is provided at the center of the side of the back plate 4.
[0027] By adopting the above technical solution, an additional heat dissipation channel is provided for the heat inside the device, further enhancing the heat dissipation effect, helping to reduce the internal temperature of the device, and improving the stability and reliability of the device.
[0028] Specifically, the fixing component 71 includes a spring 711 and a fixing rod 714. The spring 711 is disposed inside the side of the card holder 74, and the fixing rod 714 is disposed at the other end of the spring 711.
[0029] By adopting the above technical solution, the elastic effect of the spring 711 is used to make the fixing rod 714 firmly lock the locking block 72, thereby achieving stable fixation between the back plate 4 and the housing 1, ensuring that the device will not loosen or fall off during operation, and improving the stability of the device.
[0030] Specifically, the fixing component 71 also includes a sliding groove 712 and a slider 713. The slider 713 is provided on the side of the fixing rod 714, and the sliding groove 712 corresponding to the slider 713 is provided on the side of the housing 1.
[0031] By adopting the above technical solution, the cooperation between the slider 713 and the slide groove 712 can facilitate the sliding of the fixing rod 714 out of the fixing hole 73, so as to facilitate the disassembly of the back plate 4.
[0032] In this embodiment, the back plate 4 is first placed on the inner wall of the device to be tested. Then, the ear plate 5 is fixedly connected to the inner wall of the device with bolts 6, so that the back plate 4 is stably installed on the inner wall of the device. Next, the retainer 74 of the housing 1 is aligned with the retaining block 72 on the back plate 4, and the housing 1 is pressed against the back plate 4 with force, so that the retaining block 72 enters the retainer 74. At this time, the spring 711 is compressed, and the fixing rod 714 is locked by the elastic force of the spring 711, thereby realizing the fixed connection between the housing 1 and the back plate 4. After the installation is completed, the multi-sensor 2 begins to monitor various parameters of the device in real time, such as temperature, pressure, vibration frequency, etc., and transmits the monitored data to the circuit board 10 through wires. The circuit board 10 then sends these data to the computer 3. The computer 3 uses advanced algorithms and models to process and analyze these data, thereby timely discovering potential faults in the device and accurately locating the fault location, providing a scientific basis for the maintenance and repair of the device. During the operation of the device, the heat dissipation slot 8 will play a certain role in heat dissipation, dissipating the heat generated inside the device, reducing the internal temperature of the device, and improving the stability and reliability of the device.
[0033] Example 2
[0034] The difference between this embodiment and Embodiment 1 is that the heat dissipation mechanism 9 includes a heat dissipation fan 91, a fan plate 92, a fixing component 93, and an air outlet 94. The heat dissipation fan 91 is provided at the lower end of the housing 1, and the fan plate 92 is provided at the upper end of the heat dissipation fan 91 at the inner edge of the housing 1. An air outlet 94 is provided on the side of the fan plate 92 corresponding to the heat-generating position of the circuit board 10. The fan plate 92 is fixedly connected to the housing 1 by the fixing component 93.
[0035] By adopting the above technical solution, the cooling fan 91 can actively dissipate the heat inside the device, accelerate airflow, and allow the heat to dissipate more quickly. The setting of the air plate 92 can guide the air blown out by the cooling fan 91 to concentrate heat dissipation at the heat-generating position of the circuit board 10, improve the targeting and efficiency of heat dissipation, further reduce the temperature of the circuit board 10, and prevent the circuit board 10 from experiencing performance degradation or failure due to excessive temperature. This improves the stability and accuracy of the entire fault diagnosis device and better meets the high-precision and high-reliability fault diagnosis requirements of intelligent manufacturing equipment.
[0036] Specifically, the fixing component 93 includes a connecting plate 931, a bolt 932, and a connecting rod 933. The connecting rod 933 is provided on the side of the air plate 92, and the connecting plate 931 is provided at the other end of the connecting rod 933. The connecting plate 931 is fixedly connected to the housing 1 by the bolt 932.
[0037] By adopting the above technical solution, this fixing method is simple and firm, and easy to install and disassemble. When it is necessary to repair or replace the heat dissipation mechanism 9, simply loosen bolt 2 932 to easily remove the fan plate 92 and the cooling fan 91 for the corresponding operation, thereby improving the maintenance efficiency of the heat dissipation mechanism 9.
[0038] In this embodiment, the back plate 4 is installed on the inner wall of the device, and the housing 1 is fixedly connected to the back plate 4. During the operation of the device, the cooling fan 91 starts to work, blowing the heat inside the device towards the air plate 92. The air outlet 94 on the air plate 92 guides the air to the heat-generating position of the circuit board 10, and performs precise heat dissipation and cooling on the circuit board 10. At the same time, the heat dissipation slot 8 also plays an auxiliary role in heat dissipation, further improving the heat dissipation effect of the device.
[0039] The working principle and usage process of this utility model are as follows: First, the back plate 4 is placed on the inner wall of the equipment to be tested. Then, the ear plate 5 is fixedly connected to the inner wall of the equipment using bolts 6, ensuring the back plate 4 is stably installed on the inner wall. Next, the mounting base 74 of the housing 1 is aligned with the mounting block 72 on the back plate 4, and the housing 1 is pressed against the back plate 4, causing the mounting block 72 to enter the mounting base 74. At this time, the spring 711 is compressed, and the fixing rod 714, under the elastic force of the spring 711, holds the mounting block 72, thus achieving a fixed connection between the housing 1 and the back plate 4. After installation, the multi-sensor 2 begins to monitor various parameters of the equipment in real time, such as temperature, pressure, and vibration frequency, and transmits the monitored data to the circuit board 10 via wires. The circuit board 10 then sends this data to the computer 3. The computer 3 uses advanced algorithms and models to process and analyze this data, thereby promptly identifying potential equipment faults and accurately locating the fault location, providing a scientific basis for equipment maintenance and repair. During device operation, the heat dissipation slot 8 plays a certain role in heat dissipation, dissipating the heat generated inside the device, reducing the internal temperature of the device, and improving the stability and reliability of the device. The back plate 4 is installed on the inner wall of the equipment, and the housing 1 is fixedly connected to the back plate 4. During device operation, the cooling fan 91 starts to work, blowing the heat inside the device towards the air plate 92. The air outlet 94 on the air plate 92 guides the air to the heat-generating position of the circuit board 10, performing precise heat dissipation and cooling of the circuit board 10. At the same time, the heat dissipation slot 8 also plays an auxiliary role in heat dissipation, further improving the heat dissipation effect of the device.
[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A digital twin-assisted intelligent manufacturing equipment fault diagnosis device, comprising a housing (1), wherein a circuit board (10) is disposed inside the housing (1), multiple sets of diverse sensors (2) are disposed on the outer side of the housing (1), a back plate (4) is disposed on the rear side of the housing (1), and an ear plate (5) is disposed at the side corner of the back plate (4), the ear plate (5) is fixedly connected to the inner wall of the equipment to be tested by bolts (6), and the diverse sensors (2) and the circuit board (10) are electrically connected to a computer (3) by wires, characterized in that: The back plate (4) is fixedly connected to the housing (1) by a wall-mounted mounting mechanism (7), and a heat dissipation mechanism (9) is provided at the inner edge of the housing (1).
2. The fault diagnosis device for intelligent manufacturing equipment assisted by digital twins according to claim 1, characterized in that: The wall-mounted mounting and fixing mechanism (7) of the device includes a fixing component (71), a locking block (72), a fixing hole (73), and a mounting base (74). The locking block (72) is provided at the side edge of the back plate (4), and the upper end of the locking block (72) is provided with a fixing hole (73). The inner wall of the housing (1) is provided with a mounting base (74) corresponding to the locking block (72), and the fixing component (71) is provided inside the mounting base (74).
3. The digital twin assisted intelligent manufacturing equipment fault diagnosis device according to claim 1, characterized in that: A heat dissipation groove (8) is provided at the center of the side of the back plate (4).
4. The digital twin assisted intelligent manufacturing equipment fault diagnosis apparatus according to claim 2, characterized in that: The fixing component 1 (71) includes a spring (711) and a fixing rod (714). The spring (711) is provided inside the side of the card holder (74), and the fixing rod (714) is provided at the other end of the spring (711).
5. The digital twin assisted intelligent manufacturing equipment fault diagnosis apparatus according to claim 4, characterized in that: The fixing component 1 (71) also includes a groove (712) and a slider (713). The slider (713) is provided on the side of the fixing rod (714), and the groove (712) corresponding to the slider (713) is opened on the side of the housing (1).
6. The digital twin assisted intelligent manufacturing equipment fault diagnosis apparatus according to claim 1, characterized in that: The heat dissipation mechanism (9) includes a cooling fan (91), a fan plate (92), a fixing component two (93), and an air outlet (94). The cooling fan (91) is provided at the lower end of the housing (1), and the fan plate (92) is provided at the upper end of the cooling fan (91) at the inner edge of the housing (1). An air outlet (94) is provided on the side of the fan plate (92) corresponding to the heat-generating position of the circuit board (10). The fan plate (92) and the housing (1) are fixedly connected by the fixing component two (93).
7. The fault diagnosis device for intelligent manufacturing equipment assisted by digital twins according to claim 6, characterized in that: The second fixing component (93) includes a connecting plate (931), a second bolt (932) and a connecting rod (933). The connecting rod (933) is provided on the side of the air plate (92), and the connecting plate (931) is provided at the other end of the connecting rod (933). The connecting plate (931) is fixedly connected to the housing (1) by the second bolt (932).