A semiconductor device detecting jig
By designing fixtures to test semiconductor devices with different structures, the problem of existing equipment being unable to adapt to structural changes has been solved, enabling rapid replacement and batch testing, and improving testing efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YOUPIN TECHNOLOGY (JIANGYIN) CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-06-19
AI Technical Summary
Existing continuity testing equipment can only be adapted to semiconductor devices with one type of structure, and cannot meet the testing needs of devices with different structures.
A fixture for testing semiconductor devices was designed. By quickly changing the control base plate and mounting plate, it can be adapted to semiconductor devices with different structures. It is also equipped with a horizontal movement and testing device to achieve batch continuity testing.
It enables rapid adaptation and batch conduction testing of semiconductor devices with different structures, improving testing efficiency and applicability.
Smart Images
Figure CN224383323U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a fixture for testing semiconductor devices. Background Technology
[0002] Semiconductor devices are electronic components made of semiconductor materials such as silicon, germanium, or gallium arsenide. Their conductivity can be controlled by doping, temperature, or electric field, falling between that of conductors and insulators. These devices achieve functions such as rectification, amplification, and switching through physical mechanisms such as PN junctions and field effects.
[0003] After semiconductor devices are manufactured, they need to undergo continuity testing to determine if they can function properly. Currently, existing continuity testing equipment can only be adapted to semiconductor devices with a single structure. When the structure of a semiconductor device changes, existing continuity testing equipment cannot effectively detect it.
[0004] Therefore, it is desirable to provide a fixture for testing semiconductor devices that can solve the above-mentioned technical problems. Utility Model Content
[0005] The purpose of this utility model is to provide a fixture for testing semiconductor devices, which can be adapted to semiconductor devices with different structures by quickly changing the control base plate and mounting plate, and perform continuity testing on them in batches.
[0006] To achieve the above-mentioned objectives, a fixture for testing semiconductor devices is provided, comprising a horizontal moving device and a testing device;
[0007] The horizontal moving device includes a base plate, a support base, a tooling base plate, and a driving device;
[0008] The driving device drives the support base to move linearly along the length of the base plate;
[0009] Pins are provided at both ends of the top of the support base;
[0010] The tooling base plate is provided with positioning holes at the positions corresponding to the pins, and the tooling base plate is detachably fixed to the support base by the cooperation of the pins and positioning holes.
[0011] The tooling base plate is provided with several placement stations for placing semiconductor devices to be tested;
[0012] The detection device includes a gantry frame, a lifting device, and a mounting plate;
[0013] The gantry frame is fixed to one end of the base plate;
[0014] The lifting device is located on the top of the gantry frame, and the mounting plate is detachably mounted on the lifting device;
[0015] The mounting plate is equipped with several sets of probes, and each set of probes corresponds to a placement position on the tooling base plate.
[0016] Specifically, the driving device is a rodless cylinder, and the support base is fixed on the slider of the rodless cylinder;
[0017] The base plate is provided with guide rails on both sides of the rodless cylinder, and the support seat is slidably mounted on the two guide rails.
[0018] Preferably, the tooling base plate has through holes at both the top and bottom ends of the placement station.
[0019] Specifically, the lifting device includes a cylinder and a support plate;
[0020] The cylinder is located at the top of the gantry frame, and the piston rod of the cylinder passes vertically downward through the top of the gantry frame;
[0021] The support plate is fixed to the end of the piston rod of the cylinder;
[0022] The mounting plate is fixed to the support plate with bolts.
[0023] Furthermore, guide rods are vertically fixed at the corners of the support plate, and the guide rods slide through the top of the gantry frame.
[0024] Furthermore, both the support plate and the mounting plate are provided with weight-reducing holes, which effectively reduce the weight of the support plate and the mounting plate.
[0025] Preferably, both ends of the two guide rails are provided with limit stops.
[0026] The advantages of this semiconductor device testing fixture compared to existing technologies are as follows:
[0027] By setting pins on the support and positioning holes adapted to the pins on the tooling base plate, the tooling base plate can be quickly replaced; the mounting plate is detachably mounted on the lifting device, and the mounting plate is equipped with several sets of probes, which correspond one-to-one with the placement positions on the tooling base plate, thereby adapting to semiconductor devices with different structures and performing continuity testing on them. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the structure of a semiconductor device testing fixture without the tooling base plate installed in this embodiment;
[0029] Figure 2 This is a schematic diagram of the structure of a semiconductor device testing fixture according to this embodiment. Figure 1 ;
[0030] Figure 3 This is a schematic diagram of the tooling base plate in this embodiment. Figure 1 ;
[0031] Figure 4 This is a schematic diagram of the tooling base plate in this embodiment. Figure 2 ;
[0032] Figure 5 This is a schematic diagram of the structure of a semiconductor device testing fixture according to this embodiment. Figure 2 . Detailed Implementation
[0033] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0034] Example
[0035] like Figure 1 As shown in the figure, a semiconductor device testing fixture according to this embodiment includes a horizontal moving device and a testing device.
[0036] like Figure 1 and Figure 2 As shown, the horizontal moving device includes a base plate 1, a support base 2, a tooling base plate 3, and a driving device 4; the driving device 4 drives the support base 2 to move linearly along the length of the base plate 1; pins 5 are provided at both ends of the top of the support base 2; as shown... Figure 3 and Figure 4 As shown, the tooling base plate 3 is provided with positioning holes 6 at the positions corresponding to the pins 5. The tooling base plate 3 is detachably fixed to the support base 2 through the cooperation of the pins 5 and the positioning holes 6. The tooling base plate 3 is provided with several placement stations 7 for placing semiconductor devices to be tested.
[0037] Specifically, in this embodiment, such as Figure 1 As shown, the driving device 4 is a rodless cylinder, and the support base 2 is fixed on the slider of the rodless cylinder; the base plate 1 is provided with guide rails 8 on both sides of the rodless cylinder, and the support base 2 is slidably mounted on the two guide rails 8; this arrangement can effectively ensure the straightness of the movement direction of the support base 2.
[0038] In this embodiment, the tooling base plate 3 is provided with through holes 9 at both the upper and lower ends of the placement station. On the one hand, after the product inspection is completed, the tooling base plate 3 can be removed from the support base 2 and placed on the external ejection device. The ejector pin on the ejection device can pass through the through hole to eject the semiconductor device, making it easy to remove.
[0039] The detection device includes a gantry frame 10, a lifting device, and a mounting plate 11; the gantry frame 10 is fixed to one end of the base plate 1; the lifting device is located on the top of the gantry frame 10, and the mounting plate 11 is detachably mounted on the lifting device; the mounting plate 11 is provided with a number of sets of probes 12, and the number of sets of probes 12 correspond one-to-one with the placement positions 7 on the tooling base plate 3.
[0040] Specifically, in this embodiment, the lifting device includes a cylinder 13 and a support plate 14; the cylinder 13 is disposed on the top of the gantry frame 10, and the piston rod of the cylinder 13 passes vertically downward through the top of the gantry frame 10; the support plate 14 is fixed to the end of the piston rod of the cylinder 13; the mounting plate 11 is fixed to the support plate 14 by bolts.
[0041] Furthermore, guide rods 15 are vertically fixed at the corners of the support plate 14. The guide rods 15 slide through the top of the gantry frame 10. This arrangement can effectively ensure the straightness of the movement direction of the mounting plate 11 and prevent it from deviating.
[0042] Furthermore, both the support plate 14 and the mounting plate 11 are provided with weight-reducing holes 16, which effectively reduce the weight of the support plate 14 and the mounting plate 11.
[0043] In this embodiment, as Figure 1 and Figure 5 As shown, both ends of the two guide rails 8 are provided with limit stops 17; with this arrangement, the two limit stops near the gantry frame 10 can effectively ensure that the tooling base plate 11 moves to the designated position, ensuring that the several sets of probes 12 on the detection device are located directly above the corresponding semiconductor devices; while the other pair of limit stops can ensure that the support base 2 moves to the designated position, which is convenient for external mechanical manual installation of the base plate.
[0044] When the above-mentioned fixture is working, the appropriate fixture base plate 3 and mounting plate 11 are first selected and loaded. The external robot arm places the fixture base plate 3, which is loaded with the semiconductor device to be tested, on the support seat 2 and positions it by the pin 5. Then, the rodless cylinder pushes the support seat 2 forward until it is directly below the testing device. Then, the cylinder 13 on the gantry 10 drives the mounting plate 11 downward until the probe 12 contacts the semiconductor device at the corresponding station and checks it. After the test is completed, the rodless cylinder drives the fixture base plate 3 backward, and the robot arm removes the fixture base plate 3.
[0045] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A fixture for testing semiconductor devices, characterized in that, Includes horizontal movement devices and detection devices; The horizontal moving device includes a base plate, a support base, a tooling base plate, and a driving device; The driving device drives the support base to move linearly along the length of the base plate; Pins are provided at both ends of the top of the support base; The tooling base plate is provided with positioning holes at the positions corresponding to the pins, and the tooling base plate is detachably fixed to the support base by the cooperation of the pins and positioning holes. The tooling base plate is provided with several placement stations for placing semiconductor devices to be tested; The detection device includes a gantry frame, a lifting device, and a mounting plate; The gantry frame is fixed to one end of the base plate; The lifting device is located on the top of the gantry frame, and the mounting plate is detachably mounted on the lifting device; The mounting plate is equipped with several sets of probes, and each set of probes corresponds to a placement position on the tooling base plate.
2. The semiconductor device testing fixture as described in claim 1, characterized in that, The driving device is a rodless cylinder, and the support base is fixed on the slider of the rodless cylinder; The base plate is provided with guide rails on both sides of the rodless cylinder, and the support seat is slidably mounted on the two guide rails.
3. The semiconductor device testing fixture as described in claim 2, characterized in that, The tooling base plate has through holes at both the top and bottom ends of the placement station.
4. The semiconductor device testing fixture as described in claim 1, characterized in that, The lifting device includes a cylinder and a support plate; The cylinder is located at the top of the gantry frame, and the piston rod of the cylinder passes vertically downward through the top of the gantry frame; The support plate is fixed to the end of the piston rod of the cylinder; The mounting plate is fixed to the support plate with bolts.
5. A semiconductor device testing fixture as described in claim 4, characterized in that, Guide rods are vertically fixed at the corners of the support plate, and the guide rods slide through the top of the gantry frame.
6. The semiconductor device testing fixture as described in claim 5, characterized in that, Both the support plate and the mounting plate are provided with weight-reducing holes, which effectively reduce the weight of the support plate and the mounting plate.
7. A semiconductor device testing fixture as described in claim 2, characterized in that, Both ends of the two guide rails are equipped with limit stops.