A new structure of film capacitor without housing package

Abstract

The utility model relates to thin film capacitor technical field discloses a new structure's thin film capacitor of no shell package, including potting compound, the potting compound outside is provided with mould assembly, the both ends inboard fixed connection of potting compound has location component, the both ends top of potting compound all installs fixed buckle assembly, the mould assembly includes package mould, the package mould installs in the outside of potting compound, the package mould top installs mould seal top, the location component includes a plurality of rubber blocks, the rubber block all fixedly connected in the inboard of potting compound, a plurality of the potting compound top all are fixedly connected with wire location shell. In the utility model, through the cooperation of package mould and mould seal top, the synergies of U type clamping block and fixed buckle, fixed clamping block and the design of positioning mounting block that strengthens stability make the whole capacitor form a relatively closed and stable protection structure.

Description

Technical Field

[0001] This utility model relates to the field of thin film capacitor technology, and in particular to a novel thin film capacitor with a shell-less encapsulation structure. Background Technology

[0002] A novel type of unencased film capacitor is a capacitive element. Film capacitors use metal foil or metallized film as electrodes and organic plastic film as the dielectric. This unencased structure differs from traditional capacitors with protective casings; its electrodes and dielectric structure are directly exposed or have only a simple protective coating.

[0003] Currently used film capacitors provide additional support and fixation to internal components such as the core directly through the casing, enhancing the overall mechanical stability of the capacitor. This reduces displacement, loosening, or damage to internal components when subjected to mechanical shock, vibration, or compression, thus improving the capacitor's reliability and durability.

[0004] While current film capacitors enhance overall mechanical stability, the rigidity of the casing limits its flexibility to adapt to changes in space. This results in internal structural compression or stretching, causing additional stress at the connection points between the capacitor core and the leads. Over time, this can lead to loosening or even breakage, affecting the capacitor's electrical performance and lifespan. To address this, a novel casing-less film capacitor structure is proposed to solve these problems. Summary of the Invention

[0005] To overcome the above shortcomings, this utility model provides a novel thin-film capacitor with a shell-less encapsulation structure, aiming to improve the problem that the existing technology cannot effectively protect the internal structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A novel type of thin-film capacitor without a shell includes a potting compound, a mold assembly is disposed on the outside of the potting compound, positioning assemblies are fixedly connected to the inner sides of both ends of the potting compound, and fixing buckle assemblies are installed on the top of both ends of the potting compound;

[0008] The mold assembly includes a packaging mold, which is mounted on the outside of the potting compound, and a mold sealing top is mounted on the top of the packaging mold;

[0009] As a further description of the above technical solution:

[0010] The positioning component includes multiple rubber blocks, each of which is fixedly connected to the inner side of the potting compound. Each of the multiple potting compounds is fixedly connected to the top of a wire positioning shell. A support plate is fixedly connected to the top side of the middle part of the wire positioning shell, and the top of the support plate is fixedly connected to the inner side of the top of the potting compound.

[0011] As a further description of the above technical solution:

[0012] The fixing buckle assembly includes a fixing buckle, the bottom side of the fixing buckle end is fixedly connected to the top side of the bracket plate end, and a fixing block is engaged inside the fixing buckle;

[0013] As a further description of the above technical solution:

[0014] Both of the support plates are fixedly connected to the top side of their ends with lead-out electrodes, and both of the fixing buckles are installed on the outside of the two lead-out electrodes.

[0015] As a further description of the above technical solution:

[0016] Multiple capacitor cores are fixedly connected to the inner side of the potting compound, and the outer ends of the multiple capacitor cores are fixedly connected to the inner side of multiple rubber blocks.

[0017] As a further description of the above technical solution:

[0018] The mold sealing top has U-shaped clips fixedly connected to the inner sides of both ends. The two fixing buckles are slidably connected to the inner sides of the two U-shaped clips, and the two fixing clips are slidably connected to the outer sides of the two U-shaped clips.

[0019] As a further description of the above technical solution:

[0020] Multiple positioning mounting blocks are fixedly connected to the inner side of the mold sealing top, and the bottom of each of the multiple positioning mounting blocks is installed on the inner side of the top of the packaging mold;

[0021] As a further description of the above technical solution:

[0022] Both of the lead-out electrodes are fitted with fixing blocks on the inner side of their tops.

[0023] This utility model has the following beneficial effects:

[0024] 1. In this utility model, through the cooperation of the encapsulation mold and the mold sealing top, the synergistic effect of the U-shaped card block, the fixing buckle, the fixing block, and the design of the positioning and mounting block to enhance stability, the entire capacitor forms a relatively closed and stable protective structure. The mold sealing top fits tightly with the encapsulation mold, and the connection interface between the two is specially treated. When encountering external force squeezing or collision, the tight fit between the mold sealing top and the encapsulation mold can effectively buffer the external force and prevent the external force from being directly transmitted to the internal components.

[0025] 2. In this utility model, the capacitor core achieves precise and stable positioning through a positioning assembly consisting of rubber blocks, wire positioning shells, and support plates. Under conditions of long-term use, transportation, or slight external vibrations, it effectively prevents core displacement, ensures stable electrical performance of the capacitor, reduces the risk of failure due to loosening or displacement of the internal structure, and improves the reliability and durability of the product. Attached Figure Description

[0026] Figure 1 This is a three-dimensional schematic diagram of a novel shell-less encapsulated thin-film capacitor proposed in this utility model.

[0027] Figure 2 This is a schematic diagram of the U-shaped card block of a novel shell-less encapsulated film capacitor proposed in this utility model.

[0028] Figure 3 This is a schematic diagram of the potting compound for a novel shell-less encapsulated thin-film capacitor structure proposed in this utility model.

[0029] Figure 4 This is a schematic diagram of the support plate of a novel shell-less encapsulated film capacitor proposed in this utility model.

[0030] Figure 5 This is a schematic diagram of the lead electrode structure of a novel shell-less encapsulated thin-film capacitor proposed in this utility model.

[0031] Figure 6 This is a schematic diagram of the capacitor core of a novel shell-less encapsulated film capacitor proposed in this utility model.

[0032] Figure 7 This is a schematic diagram of the fixing block of a novel type of unencapsulated thin-film capacitor proposed in this utility model.

[0033] Legend:

[0034] 1. Encapsulation mold; 2. Mold sealing top; 3. U-shaped clamping block; 4. Fixing clamping block; 5. Encapsulating material; 6. Positioning mounting block; 7. Capacitor core; 8. Support plate; 9. Wire positioning shell; 10. Rubber block; 11. Lead-out electrode; 12. Fixing buckle. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] Reference Figure 1 , Figure 2 , Figure 4 and Figure 7 The present invention provides an embodiment of a novel thin-film capacitor without a shell, comprising a potting compound 5, a mold assembly disposed on the outside of the potting compound 5, positioning assemblies fixedly connected to the inner sides of both ends of the potting compound 5, and fixing buckle assemblies installed on the top of both ends of the potting compound 5.

[0037] The mold assembly includes an encapsulation mold 1, which is installed on the outside of the potting compound 5. A mold sealing top 2 is installed on the top of the encapsulation mold 1. The encapsulation mold 1, installed on the outside of the potting compound 5, serves as the foundation of the entire capacitor's external protective structure, providing a preliminary physical protective barrier for the internal components. U-shaped clips 3 are fixedly connected to the inner sides of both ends of the mold sealing top 2. Two fixing clips 12 are slidably connected to the inner sides of the two U-shaped clips 3, and two fixing clips 4 are slidably connected to the outer sides of the two U-shaped clips 3. There is a clever sliding connection between the U-shaped clips 3 on the inner sides of both ends of the mold sealing top 2 and the fixing clips 12 and 4. The fixing clips 12 slide inside the U-shaped clips 3. When an external force attempts to displace the mold sealing top 2 relative to other components, such as during handling or installation when subjected to external pulling or pushing, the fixing clips 12 slide along the U-shaped clips 3. Through friction and the mutual restraint between structures, the external force is dispersed, preventing excessive local stress that could lead to structural damage. Multiple positioning mounting blocks 6 are fixedly connected to the inner side of the mold sealing top 2, and the bottom of each positioning mounting block 6 is installed on the inner top of the packaging mold 1. The positioning mounting blocks 6, with their firm connection to the packaging mold 1, prevent excessive displacement of the mold sealing top 2, ensuring a tight fit between the mold sealing top 2 and the packaging mold 1, and maintaining the sealing and stability of the entire protective structure.

[0038] Reference Figure 4and Figure 5 The positioning assembly includes multiple rubber blocks 10, all of which are fixedly connected to the inner side of the potting compound 5. A wire positioning shell 9 is fixedly connected to the top of each of the potting compounds 5. A support plate 8 is fixedly connected to the top side of the middle of the wire positioning shell 9, and the top of the support plate 8 is fixedly connected to the inner top of the potting compound 5. The wire positioning shell 9 is located on top of the potting compound 5 and works in conjunction with the support plate 8. The main function of the wire positioning shell 9 is to position and protect the wires connected to the capacitor core 7, ensuring that the wires have accurate routing and fixed positions inside the capacitor, avoiding problems such as tangled wires and poor contact with other components, and ensuring that current can flow smoothly into or out of the capacitor core 7 through the wires. Multiple capacitor cores 7 are fixedly connected to the inner side of the potting compound 5, and the outer ends of each capacitor core 7 are fixedly connected to the inner side of the multiple rubber blocks 10. The rubber blocks 10 play a crucial positioning and buffering role in the entire structure. Since the rubber blocks 10 are all firmly fixed to the inside of the potting compound 5, and the outer sides of both ends of the capacitor core 7 are tightly connected to the inside of the rubber blocks 10, the rubber blocks 10 can limit the position of the capacitor core 7 in the lateral direction.

[0039] Reference Figure 5 , Figure 6 and Figure 7 The fixing buckle assembly includes a fixing buckle 12, the bottom side of which is fixedly connected to the top side of the end of the support plate 8. A fixing block 4 is engaged with the inner side of the fixing buckle 12. Lead-out electrodes 11 are fixedly connected to the top sides of the ends of both support plates 8, and both fixing buckles 12 are installed on the outer sides of the two lead-out electrodes 11. The fixing buckle 12 plays a crucial role in fixing and supporting. Its bottom side is fixedly connected to the top side of the end of the support plate 8, and through this stable connection, the fixing buckle 12 provides a reliable lateral support structure for the lead-out electrodes 11. Fixing blocks 4 are installed on the inner sides of the tops of both lead-out electrodes 11. The fixing blocks 4 engage with the inner sides of the fixing buckles 12 and are also installed on the inner sides of the tops of the lead-out electrodes 11. This structural design achieves multiple reinforcement functions.

[0040] Working Principle: The core component of this film capacitor consists of multiple capacitor cores 7, which are fixed inside the potting compound 5. Positioning components are located on the inner sides of both ends of the potting compound 5, with rubber blocks 10 playing a crucial role. Multiple rubber blocks 10 are fixedly connected to the inner side of the potting compound 5, and the outer sides of both ends of the capacitor cores 7 are fixedly connected to the inner sides of the rubber blocks 10. The rubber blocks 10 not only fix the capacitor cores 7 but also buffer external mechanical impacts to a certain extent, protecting the capacitor cores 7 from damage. Simultaneously, the wire positioning shell 9 and the support plate 8 on the top of the potting compound 5 also participate in positioning. The support plate 8 is fixedly connected to the top side of the middle of the wire positioning shell 9 and the inner top of the potting compound 5. This structure provides a more stable positioning of the capacitor cores 7 within the potting compound 5, ensuring that they do not shift during operation and thus guaranteeing the normal operation of the capacitor.

[0041] The lead electrode 11 is located on the top side of the ends of the two support plates 8 and is a key part for connecting the capacitor to the external circuit. The fixing buckle assembly is designed around the lead electrode 11. The bottom side of the fixing buckle 12 is fixedly connected to the top side of the end of the support plate 8, and a fixing block 4 is engaged on the inner side. This buckle structure can firmly fix the lead electrode 11, and the two fixing buckles 12 are also installed on the outside of the lead electrode 11, which plays a dual role of protection and fixation.

[0042] The mold assembly mainly includes a packaging mold 1 and a mold sealing top 2. The packaging mold 1 is installed on the outside of the potting compound 5, providing initial packaging and protection. The mold sealing top 2 is installed on top of the packaging mold 1, with U-shaped locking blocks 3 on both inner sides cooperating with fixing buckles 12 and 4. The fixing buckles 12 are slidably connected to the inside of the U-shaped locking blocks 3, and the fixing blocks 4 are slidably connected to the outside of the U-shaped locking blocks 3. This structural design allows the mold sealing top 2 to be tightly integrated with the packaging mold 1. In addition, multiple positioning mounting blocks 6 on the inner side of the mold sealing top 2 are installed on the top inner side of the packaging mold 1, further enhancing the stability of the mold assembly.

[0043] The potting compound 5 is an important component of this capacitor, encapsulating the capacitor core 7. On one hand, the potting compound 5 fixes the position of the capacitor core 7, ensuring its stability during operation together with the positioning components. On the other hand, the potting compound 5 has insulating properties, preventing short circuits between capacitor cores 7 or between the capacitor core 7 and external structures. Simultaneously, the potting compound 5 also plays a role in heat dissipation, conducting away the heat generated by the capacitor core 7 during operation to ensure stable capacitor performance.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel type of thin-film capacitor without a casing, comprising potting compound (5), characterized in that: The potting compound (5) is provided with a mold assembly on its exterior, and positioning assemblies are fixedly connected to the inner sides of both ends of the potting compound (5). Fixing buckle assemblies are installed on the top of both ends of the potting compound (5). The mold assembly includes a packaging mold (1), which is installed on the outside of the potting compound (5), and a mold sealing top (2) is installed on the top of the packaging mold (1).

2. The novel thin-film capacitor with a shell-less encapsulation structure according to claim 1, characterized in that: The positioning component includes multiple rubber blocks (10), each of which is fixedly connected to the inner side of the potting compound (5). Each of the multiple potting compounds (5) is fixedly connected to a wire positioning shell (9). A support plate (8) is fixedly connected to the top side of the middle part of the wire positioning shell (9). The top of the support plate (8) is fixedly connected to the top inner side of the potting compound (5).

3. A novel thin-film capacitor with a shell-less encapsulation structure according to claim 1, characterized in that: The fixing buckle assembly includes a fixing buckle (12), the bottom side of the fixing buckle (12) is fixedly connected to the top side of the bracket plate (8), and a fixing block (4) is engaged inside the fixing buckle (12).

4. A novel thin-film capacitor with a shell-less encapsulation structure according to claim 2, characterized in that: Both of the support plates (8) are fixedly connected to the top side of the ends with lead-out electrodes (11), and both of the fixing buckles (12) are installed on the outside of the two lead-out electrodes (11).

5. A novel thin-film capacitor with a shell-less package according to claim 1, characterized in that: Multiple capacitor cores (7) are fixedly connected to the inner side of the potting compound (5), and the outer sides of both ends of the multiple capacitor cores (7) are fixedly connected to the inner side of multiple rubber blocks (10).

6. A novel thin-film capacitor with a shell-less encapsulation structure according to claim 3, characterized in that: The mold sealing top (2) has U-shaped clips (3) fixedly connected to the inner sides of both ends. The two fixing buckles (12) are slidably connected to the inner sides of the two U-shaped clips (3), and the two fixing blocks (4) are slidably connected to the outer sides of the two U-shaped clips (3).

7. A novel thin-film capacitor with a shell-less package according to claim 1, characterized in that: Multiple positioning mounting blocks (6) are fixedly connected to the inner side of the mold sealing top (2), and the bottom of the multiple positioning mounting blocks (6) are all installed on the top inner side of the packaging mold (1).

8. A novel thin-film capacitor with a shell-less encapsulation structure according to claim 4, characterized in that: A fixing block (4) is installed on the inner side of the top of each of the two lead-out electrodes (11).

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