Circuit board structure
CN224385780UActive Publication Date: 2026-06-19HONG FU JIN PRECISION IND (WUHAN) CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HONG FU JIN PRECISION IND (WUHAN) CO LTD
- Filing Date
- 2025-04-28
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
When setting screw holes on a PCB, existing technologies require designing multiple pad structures based on the number of stacked layers and power layer layout, which affects manufacturing efficiency.
Method used
The circuit board structure design includes a top layer, a bottom layer, and internal layers. The internal layers include a power layer, a signal layer, and a ground layer. It features connection holes and vias, and conductive rings are placed around the vias on the signal layers to enable current conduction, thus avoiding the need for additional inner layer stack-up.
Benefits of technology
It improves the efficiency of PCB manufacturing and avoids the problem of reduced manufacturing efficiency caused by the design of screw holes.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224385780U_ABST
Abstract
The application provides a circuit board structure, comprising a top plate layer, a bottom plate layer and at least one internal layer, the at least one internal layer is arranged between the top plate layer and the bottom plate layer; the internal layer comprises a power supply layer, a signal layer and a ground wire layer arranged in sequence, the internal layer is provided with a connecting hole and a plurality of through holes, the connecting hole is provided for a fastener, the plurality of through holes are arranged around the connecting hole, and the connecting hole and the plurality of through holes penetrate the power supply layer, the signal layer and the ground wire layer; the signal layer is provided with a first conductive ring and a plurality of second conductive rings, the first conductive ring is arranged around the outer periphery of the plurality of through holes, the plurality of second conductive rings are arranged correspondingly to the plurality of through holes, the outer periphery of any one of the plurality of through holes is provided with a second conductive ring, and one of the plurality of second conductive rings is electrically coupled to the first conductive ring.
Need to check novelty before this filing date? Find Prior Art