Spraying system

Abstract

The application discloses a spraying system, which comprises a conveying line and at least one spraying mechanism. The conveying line is configured to convey silicon wafers. The spraying mechanism comprises a first detection member and a spraying member. The first detection member is configured to take pictures of the silicon wafers conveyed by the conveying line, and a processor is configured to obtain silicon wafer parameters from the pictures of the silicon wafers, wherein the silicon wafer parameters do not include position parameters of the silicon wafers. The spraying member is configured to spray the silicon wafers according to preset silicon wafer parameters. The processor is further configured to determine spraying parameters according to the silicon wafer parameters. The spraying system detects the silicon wafers before spraying by the first detection member and determines the silicon wafer parameters of the silicon wafers before spraying by the processor, thereby improving the spraying reliability of the spraying member and reducing the spraying error rate. The spraying member sprays corresponding silicon wafers according to the silicon wafer parameters of the silicon wafers, thereby realizing that one device can complete the coating of multiple silicon wafers and improving the compatibility.

Description

Technical Field

[0001] This application relates to battery cell manufacturing technology, and more particularly to a coating system. Background Technology

[0002] In the photovoltaic cell manufacturing industry, production lines that produce coatings using wet spraying methods typically only produce coatings for silicon wafers with a single type of silicon wafer parameter, making it difficult to meet the demand for producing coatings for multiple types of silicon wafers simultaneously. Utility Model Content

[0003] In view of this, it is necessary to provide a spraying system that can simultaneously fabricate coatings on silicon wafers that meet various silicon wafer parameters.

[0004] Some embodiments of this application provide a coating system including a transmission line and at least one coating mechanism. The transmission line is configured to transport a silicon wafer. The coating mechanism includes a first detection element and a coating element. The first detection element is configured to capture an image of the silicon wafer transported by the transmission line. A processor is configured to obtain silicon wafer parameters based on the image of the silicon wafer, the silicon wafer parameters excluding position parameters of the silicon wafer. The coating element is configured to coat the silicon wafer according to preset silicon wafer parameters. The processor is also configured to determine coating parameters based on the silicon wafer parameters.

[0005] The aforementioned coating system uses a first detection element to inspect the silicon wafer before coating, and a processor to determine the wafer parameters before coating, improving the coating reliability and reducing the error rate. The coating unit then coats the corresponding silicon wafer according to its parameters, enabling a single device to simultaneously fabricate coatings on multiple silicon wafers, thus enhancing compatibility.

[0006] According to some embodiments of this application, the silicon wafer parameters include one or more of the following: size, shape, color, pattern, and material of the silicon wafer.

[0007] In the above embodiments, different silicon wafers can be distinguished based on one or more of their size, shape, color, pattern, and material, making it convenient to determine the corresponding spraying parameters for the sprayed parts based on the silicon wafer parameters of different silicon wafers.

[0008] According to some embodiments of this application, the number of spraying mechanisms is not less than two, and the processor is configured to control the silicon wafer to enter different spraying mechanisms via the transmission line according to the silicon wafer parameters, and the spraying parameters of the sprayed parts of different spraying mechanisms can be set separately.

[0009] In the above embodiments, each spraying part is sprayed with a silicon wafer of one silicon wafer parameter. The spraying part does not need to switch to spray silicon wafers with different silicon wafer parameters, which is beneficial to improve spraying efficiency and also to the unloading and storage of the sprayed silicon wafers.

[0010] According to some embodiments of this application, the spraying mechanism further includes a second detection element, which is configured to detect the relative position of the silicon wafer to the transmission line before it enters the spraying area of ​​the spraying component, and the spraying component adjusts the initial spraying position according to the position information.

[0011] In the above embodiment, the second detection element detects the position of the silicon wafer relative to the transmission line in the spraying area of ​​each component about to enter the spraying part, and obtains more accurate relative position information between the silicon wafer about to be sprayed and the transmission line. The component adjusts the initial position of the spraying part according to the position information, which is beneficial to improving the spraying accuracy.

[0012] According to some embodiments of this application, the transmission line includes a first conveyor and a second conveyor, which respectively convey silicon wafers. The conveying accuracy of the second conveyor is higher than that of the first conveyor. The spraying mechanism also includes a positioning member, which is configured to drive the silicon wafer conveyed by the first conveyor to a set position on the second conveyor. The second conveyor is configured to convey the positioned silicon wafer through the spraying area of ​​the spraying member.

[0013] In the above embodiments, the transmission line along the silicon wafer conveying direction includes a first conveyor and a second conveyor with increasing precision, which reduces the cost of the transmission line and improves the coating accuracy of the silicon wafer conveyed by the second conveyor.

[0014] According to some embodiments of this application, there are multiple second conveying components and multiple spraying mechanisms. The multiple second conveying components are arranged sequentially along a first direction, which is perpendicular to the direction in which the second conveying components transport silicon wafers. Each spraying mechanism sprays silicon wafers on a corresponding second conveying component. The spraying system also includes a first transfer component, which is configured to transfer multiple silicon wafers on the first conveying component to multiple second conveying components respectively.

[0015] In the above embodiments, the first transfer member conveys multiple silicon wafers to multiple second transfer members arranged along the first direction, enabling multiple spraying members corresponding to the multiple second transfer members to perform spraying operations simultaneously, which is beneficial to improving spraying efficiency. Furthermore, the first transfer member can convey multiple silicon wafers on the first transfer member according to their silicon wafer parameters, and then transfer silicon wafers of the same silicon wafer parameter to the same second transfer member. Each spraying member sprays silicon wafers of one silicon wafer parameter, eliminating the need for the spraying members to switch spraying parameters to spray silicon wafers of different parameters, thus improving spraying efficiency and facilitating the unloading and storage of the sprayed silicon wafers.

[0016] According to some embodiments of this application, the first transporter includes a plurality of sub-transporters arranged along a first direction, each sub-transporter being configured to transport a silicon wafer.

[0017] In the above embodiments, the first conveying component is arranged with two sub-conveyors along the first direction, which is beneficial to improve the conveying efficiency of the first conveying component and facilitates the separate spraying of multiple silicon wafers with different silicon wafer parameters.

[0018] According to some embodiments of this application, the spraying system further includes a second transfer member, and the transmission line further includes a third transfer member, the third transfer member being located on the side of the plurality of second transfer members opposite to the first transfer member, the transfer accuracy of the second transfer members being greater than the transfer accuracy of the third transfer member, and the second transfer member being configured to transfer silicon wafers on the plurality of second transfer members to the third transfer member.

[0019] In the above embodiments, the third conveyor concentrates the silicon wafers conveyed by the multiple second conveyors after the coating is completed, which helps to improve the wafer unloading efficiency.

[0020] According to some embodiments of this application, the conveyor line includes a plurality of second conveying components and a plurality of spraying mechanisms. The plurality of second conveying components are arranged sequentially along a second direction, which is parallel to the direction in which the second conveying components transport silicon wafers. Each spraying mechanism sprays a silicon wafer onto the corresponding second conveying component. Along the second direction, silicon wafers can be transported between two adjacent second conveying components.

[0021] In the above embodiments, multiple second conveying components arranged along the second direction enable multiple spraying components to spray the same silicon wafer sequentially, which helps to reduce the spraying parameters of a single spraying component and improves spraying efficiency by spraying in stages as needed.

[0022] According to some embodiments of this application, the spraying system further includes a first removal mechanism. The first removal mechanism and the spraying mechanism are arranged sequentially along the direction of transporting silicon wafers on the transmission line. The first removal mechanism includes a first removal detection element and a first removal element. The first removal detection element is configured to detect whether there are stacked silicon wafers on the transmission line, and the first removal element is configured to remove the stacked silicon wafers from the transmission line.

[0023] In the above embodiments, the first removal component removes the stacked silicon wafers from the transmission line, reducing the risk of missed silicon wafers being sprayed in the coating system.

[0024] According to some embodiments of this application, the spraying system further includes a second removal mechanism. The second removal mechanism and the spraying mechanism are arranged sequentially along the direction of transporting the silicon wafer along the transmission line. The second removal mechanism includes a second removal detection element and a second removal element. The second removal detection element is configured to detect whether the silicon wafer meets the pre-spraying setting requirements. The second removal element is configured to remove the silicon wafer that does not meet the pre-spraying setting requirements from the transmission line.

[0025] In the above embodiments, the second removal component is configured to remove silicon wafers that do not meet the pre-spraying requirements from the transmission line. Removing unqualified silicon wafers before spraying reduces the waste of spraying energy.

[0026] According to some embodiments of this application, the coating system further includes a third removal mechanism located behind the coating mechanism along the silicon wafer conveying direction. The third removal mechanism includes a third removal detection element and a third removal element. The third removal detection element is configured to detect whether the coating quality of the silicon wafer meets the requirements, and the third removal element is configured to remove silicon wafers whose coating quality does not meet the requirements from the transmission line.

[0027] In the above embodiments, the third removal component removes silicon wafers that do not meet the coating quality requirements from the transmission line, reducing the risk of unqualified silicon wafers flowing into the unloading silicon wafers and improving the pass rate of the coated silicon wafers output by the coating system. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope.

[0029] Figure 1 This is a schematic diagram of the structure of a spraying system according to an embodiment of this application.

[0030] Figure 2 for Figure 1 The diagram shows an enlarged view of the spraying system at point A.

[0031] Figure 3 for Figure 1 The diagram shows an enlarged view of the spraying system at point B.

[0032] Figure 4 for Figure 1 The diagram shows an enlarged view of the spraying system at point C.

[0033] Figure 5 for Figure 1 The diagram shows an enlarged view of the spraying system at point D.

[0034] Key component symbols: 100, Spraying system; 10, Conveyor line; 11, First conveyor; 111, Sub-conveyor; 13, Second conveyor; 15, Third conveyor; 20, Spraying mechanism; 21, First detection component; 23, Spraying component; 25, Second detection component; 27, Positioning component; 30, First transfer component; 40, Second transfer component; 50, First removal mechanism; 51, First removal detection component; 53, First removal component; 60, Second removal mechanism; 61, Second removal detection component; 70, Third removal mechanism; 71, Third removal detection component; 73, Third removal component; 80, Loading component; X, First direction; Y, Second direction; 200, Silicon wafer. Detailed Implementation

[0035] The implementation of this application will now be described with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0037] This application provides, in several embodiments, a coating system comprising a transmission line and at least one coating mechanism. The transmission line is configured to transport a silicon wafer. The coating mechanism includes a first detection element and a coating element. The first detection element is configured to image the silicon wafer transported by the transmission line. A processor is configured to obtain silicon wafer parameters based on the image of the silicon wafer, the silicon wafer parameters excluding positional parameters of the silicon wafer. The coating element is configured to coat the silicon wafer according to preset silicon wafer parameters. The processor is further configured to determine coating parameters based on the silicon wafer parameters.

[0038] The aforementioned coating system uses a first detection element to inspect the silicon wafer before coating and a processor to determine the wafer's parameters before coating, thus improving the coating reliability and reducing the error rate. The coating unit then coats the corresponding silicon wafer according to its parameters, enabling a single device to simultaneously fabricate coatings on multiple silicon wafers, thereby enhancing compatibility.

[0039] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0040] Please see Figure 1 and Figure 2 One embodiment of this application provides a spraying system 100. The spraying system 100 is used to fabricate coatings for photovoltaic cells, such as perovskite coatings. The spraying system 100 can also be applied to other structures fabricated using spraying methods, such as using the spraying system 100 to spray adhesive liquid to form a film.

[0041] The coating system 100 includes a transmission line 10 and at least one coating mechanism 20. The transmission line 10 is configured to transport a silicon wafer 200. The coating mechanism 20 coats the silicon wafer 200 with a new coating. The coating system also includes a processor (not shown). The coating mechanism 20 includes a first detection element 21 and a coating element 23. The transmission line 10 transports the silicon wafer 200 past the coating element 23, allowing the coating element 23 to complete the coating operation on the silicon wafer 200. The first detection element 21 is configured to photograph the silicon wafer 200 on the transmission line 10. The processor determines the silicon wafer parameters of the silicon wafer 200 based on the image photographed by the first detection element 21. The silicon wafer parameters differ for silicon wafers 200 with different structures. The silicon wafer parameters do not include the positional parameters of the silicon wafer 200. The processor photographs the silicon wafer 200 based on the first detection element 21 primarily to distinguish different silicon wafers and perform corresponding coating operations on them.

[0042] In one embodiment, the silicon wafer 200 may have different dimensions, shapes, colors, patterns, or materials, resulting in different silicon wafer parameters. To reduce manufacturing difficulty or improve manufacturing efficiency, the silicon wafer 200 may be formed by dividing a large solar cell into two or more smaller wafers. The silicon wafer parameters of the two smaller wafers may be the same or different. The silicon wafer parameters of the silicon wafer 200 may include one or more of the following: size, shape, color, pattern, and material.

[0043] In one embodiment, the spraying system 100 sprays two types of silicon wafers 200 with different parameters. The two types of silicon wafers 200 are distinguished by locking points (not shown) on the silicon wafers 200. These locking points are structures on the silicon wafers 200 used for positioning and cooperating with a supporting structure (not shown). The different positions and numbers of the locking points on the two types of silicon wafers 200 result in different shapes of the two types of silicon wafers 200, and consequently, different silicon wafer parameters.

[0044] In one embodiment, the first detection element 21 is a vision camera, but it is not limited thereto. For example, in other embodiments, the first detection element 21 may also be a vision sensor or an ultrasonic sensor.

[0045] The processor determines the spraying parameters for the corresponding silicon wafer 200 based on the silicon wafer parameters. The spraying component 23 is configured to spray the silicon wafer 200 according to the spraying parameters. The spraying parameters generally include the shape of the spray and the thickness of the spray, etc., and the spraying parameters are set according to actual needs. This application does not limit them.

[0046] The processor detects the silicon wafer 200 based on the first detection element 21, and the result of the silicon wafer parameters is either the first type, the second type, or neither. When the first detection element 21 detects that the silicon wafer 200 transmitted from the transmission line 10 is the first type, the spraying element 23 sprays the silicon wafer 200 according to the spraying parameters of the first type of silicon wafer 200; when the first detection element 21 detects that the silicon wafer 200 transmitted from the transmission line 10 is the second type, the spraying element 23 sprays the silicon wafer 200 according to the spraying parameters of the second type of silicon wafer 200.

[0047] When the first detection element 21 detects that the silicon wafer parameters of the silicon wafer 200 are neither of the two, it may be because the transmission line 10 enters the spraying area without a silicon wafer 200 or is a silicon wafer 200 of other structures that has been placed incorrectly. In such cases, the spraying element 23 will not perform spraying, or the silicon wafer 200 will be removed before it enters the spraying area.

[0048] The number of spraying mechanisms 20 is not less than two. The processor is configured to control the silicon wafer 200 to enter different spraying mechanisms 20 via the transmission line 10 according to the silicon wafer parameters. The spraying parameters of the sprayed parts 23 of different spraying mechanisms 20 can be set separately.

[0049] It is understood that in other embodiments, the processor and the spraying component 23 may also be combined into a single structure, for example, into a spraying structure with a processing chip.

[0050] In one embodiment, there are multiple spraying mechanisms 20. Some of the multiple spraying mechanisms 20 spray silicon wafers 200 with a first type of silicon wafer parameter, while others spray silicon wafers 200 with a second type of silicon wafer parameter, but this is not limited to this. For example, there may also be only one spraying mechanism 20. The spraying component 23 of the spraying mechanism 20 sprays two types of silicon wafers 200, and the silicon wafers 200 with different silicon wafer parameters are classified and placed separately after being sprayed by a feeding structure (not shown).

[0051] The spraying system 100 detects the silicon wafer 200 before spraying using the first detection element 21. The processor can determine the silicon wafer parameters of the silicon wafer 200 before spraying, which improves the spraying reliability of the spraying component 23 and reduces the spraying error rate. The spraying component 23 sprays the corresponding silicon wafer 200 according to the silicon wafer parameters, realizing that one device can simultaneously complete the coating of multiple silicon wafers 200, thus improving compatibility.

[0052] When there are multiple spraying units 20, the transmission line 10 is usually quite long. If a silicon wafer 200 used for coating is removed from the transmission line 10 by human intervention, resulting in no silicon wafer 200 entering the spraying area, or silicon wafers 200 with different structures being misplaced, or the arrangement of silicon wafers 200 with different parameters being incorrect, the silicon wafer parameters of the silicon wafer 200 are determined by the first detection unit 21 before each spraying part 23 is sprayed, thereby improving the reliability of spraying.

[0053] In one embodiment, please refer to Figure 1 and Figure 3 The transmission line 10 includes a first conveyor 11 and a second conveyor 13. The first conveyor 11 and the second conveyor 13 respectively convey silicon wafers 200. The conveying accuracy of the second conveyor 13 is higher than that of the first conveyor 11. A spraying component 23 sprays the silicon wafers 200 conveyed by the second conveyor 13. The spraying mechanism 20 also includes a positioning component 27. The positioning component 27 is configured to drive the silicon wafers 200 conveyed from the first conveyor 11 to a predetermined position on the second conveyor 13, thereby improving the relative positional accuracy between the silicon wafers 200 and the second conveyor 13. As the second conveyor 13 conveys the silicon wafers 200 through the spraying area of ​​the spraying component 23, the spraying accuracy of the silicon wafers 200 by the spraying component 23 is thus improved.

[0054] In one embodiment, the second conveyor 13 conveys the silicon wafer 200 through the coating area at a constant speed, but is not limited thereto.

[0055] The transmission line 10 includes a first transmission element 11 and a second transmission element 13 with increasing precision along the transmission direction of the silicon wafer 200. This reduces the cost of the transmission line 10 and improves the coating accuracy of the coating element 23 on the silicon wafer 200 transmitted by the second transmission element 13.

[0056] In one embodiment, the spraying mechanism 20 further includes a second detection element 25, which is configured to detect the relative position of the silicon wafer 200 to the transmission line 10 before it enters the spraying area of ​​the spraying component 23. The processor adjusts the initial spraying position of the spraying component 23 according to the position information.

[0057] In one embodiment, the second detection element 25 detects the position of the silicon wafer 200 relative to the second conveyor 13 at a predetermined position before it enters the spraying area. For example, the second conveyor 13 conveys multiple silicon wafers 200 sequentially through the spraying area of ​​the spraying element 23. The second detection element 25 is located on the side of the spraying area facing the first conveyor 11, and the second detection element 25 detects the position of each silicon wafer 200 that has not yet entered the spraying area when it is a predetermined distance from the spraying area. That is, the second detection element 25 detects the position of each silicon wafer 200 about to enter the spraying area of ​​the spraying element 23 relative to the transmission line 10, thereby obtaining a more accurate relative position information between the silicon wafer 200 about to be sprayed and the transmission line 10. The processor adjusts the initial spraying position of the spraying element 23 according to the position information, which helps to improve the spraying accuracy.

[0058] The second conveyor 13 has higher conveying accuracy than the first conveyor 11. The cooperation between the second conveyor 13 and the second detection element 25 is more conducive to improving the spraying accuracy of the sprayed part 23. It can be understood that in other embodiments, the second conveyor 13 may also be omitted. The first conveyor 11 cooperates with the second detection element 25 to improve the spraying accuracy of the sprayed part 23.

[0059] In one embodiment, there are four second conveying members 13 and four spraying mechanisms 20. Two second conveying members 13 are arranged sequentially along a first direction X, which is perpendicular to the direction in which the second conveying members 13 transport silicon wafers 200. The other two second conveying members 13 are arranged sequentially along a second direction Y, which is parallel to the direction in which the second conveying members 13 transport silicon wafers 200. Along the second direction Y, silicon wafers 200 can be transported between adjacent second conveying members 13. Each spraying mechanism 20 sprays the silicon wafer 200 on the corresponding second conveying member 13.

[0060] Please see Figure 1 and Figure 2 In one embodiment, the spraying system 100 further includes a first transfer member 30. The first transfer member 30 is electrically connected to the processor. The processor controls the first transfer member 30 to transfer multiple silicon wafers 200 on the first transfer member 11 to two second transfer members 13 adjacent to the first transfer member 11. The first transfer member 30 transfers multiple silicon wafers 200 to multiple second transfer members 13 arranged along the first direction X, so that multiple spraying members 23 corresponding to the multiple second transfer members 13 can perform spraying operations simultaneously, which is beneficial to improving spraying efficiency. In addition, the first transfer member 30 can transfer multiple silicon wafers 200 with the same silicon wafer parameters from the first transfer member 11 to the same second transfer member 13, and each spraying member 23 sprays silicon wafers 200 with one silicon wafer parameter. The spraying member 23 does not need to switch to spray silicon wafers 200 with different silicon wafer parameters, which is beneficial to improving spraying efficiency and also facilitates the unloading and storage of the sprayed silicon wafers 200.

[0061] In one embodiment, the first conveying member 11 includes multiple sub-conveyors 111 arranged along a first direction X. Each sub-conveyor 111 is configured to convey a silicon wafer 200. The two sub-conveyors 111 convey silicon wafers 200 with two different silicon wafer parameters respectively. The two sub-conveyors 111 and the two second conveyors 13 correspond one-to-one along the first direction X. The distance between the two second conveyors 13 along the first direction X is greater than the distance between the two sub-conveyors 111 along the first direction X, to facilitate the arrangement of the two spraying members 23 arranged along the first direction X, but is not limited thereto. The first transfer member 30 transfers the silicon wafers 200 on the sub-conveyors 111 to the corresponding second conveyors 13 respectively. The arrangement of two sub-conveyors 111 along the first direction X of the first conveying member 11 is beneficial to improving the conveying efficiency of the first conveying member 11 and facilitates the separate spraying of multiple silicon wafers 200 with different silicon wafer parameters.

[0062] It is understood that in other embodiments, the number of sub-transmitters 111 may also be three, four, or other numbers. The number of second conveyors 13 arranged along the first direction X may also be three, four, five, six, or other numbers. The number of sub-transmitters 111 and the number of second conveyors 13 may also be different. For example, one sub-transmitter 111 transmits multiple silicon wafers 200 of one silicon wafer parameter, and the first transfer member 30 transfers the silicon wafers 200 of the first silicon wafer parameter to two second conveyors 13 respectively.

[0063] It is understood that in other embodiments, the spraying system 100 can also spray silicon wafers 200 with the same silicon wafer parameters. The first detection element 21 detects the silicon wafers 200, which helps to detect silicon wafers 200 with different structures mixed in the transmission line 10, reduce the failure rate of spraying, and reduce the consumption of spraying (consumption of spraying liquid, consumption of spraying driving energy, etc.).

[0064] In one embodiment, the coating system 100 further includes a loading component 80. The loading component 80 is located at the initial end of the transmission line 10 and configured to load multiple silicon wafers 200 onto the transmission line 10. When the coating system 100 loads multiple silicon wafers 200 onto the multiple sub-transfer components 111 of the transmission line 10 via the loading component 80, it categorizes and places the multiple silicon wafers 200 onto different sub-transfer components 111. If different types of silicon wafers 200 are mistakenly placed on the same sub-transfer component 111, this can be detected by a first detection component 21, and the silicon wafers 200 can be corrected and placed onto the corresponding second transfer component 13 by a first transfer component 30.

[0065] In every pair of spraying mechanisms 20 arranged along the second direction Y, the two spraying elements 23 can spray the same silicon wafer 200 successively according to the same or different requirements. For example, when the thickness of the silicon wafer 200 is insufficient after one spraying, the final thickness requirement can be achieved by spraying the same thickness twice successively by the two spraying elements 23 arranged along the second direction Y. For another example, when the width of the silicon wafer 200 is greater than the spraying width of one spraying element 23, different width areas can be sprayed by the two spraying elements 23 arranged along the second direction Y to complete the overall spraying of the silicon wafer 200. For yet another example, different patterns can be sprayed successively by the two spraying elements 23 arranged along the second direction Y to form the final pattern required for the silicon wafer 200.

[0066] It is understood that in other embodiments, the second conveyor 13 arranged along the second direction Y may also be three, four, or other quantities.

[0067] Multiple second conveyor elements 13 arranged along the second direction Y enable multiple spraying elements 23 to spray the same silicon wafer 200 sequentially, which helps to reduce the spraying requirements of a single spraying element 23 and can improve spraying efficiency by spraying in stages as needed.

[0068] Please see Figure 1 and Figure 4 The coating system 100 also includes a second transfer member 40. The second transfer member 40 is electrically connected to the processor. The transmission line 10 also includes a third transfer member 15. In one embodiment, the third transfer member 15 has a similar structure to the first transfer member 11, and is located on the side of the plurality of second transfer members 13 opposite to the first transfer member 11. The transfer accuracy of the second transfer members 13 is greater than that of the third transfer member 15. The processor is also configured to control the second transfer member 40 to transfer the silicon wafers 200 on the plurality of second transfer members 13 to the third transfer member 15. The third transfer member 15 concentrates the silicon wafers 200 transferred by the plurality of second transfer members 13 after coating, which helps to improve the unloading efficiency of the silicon wafers 200.

[0069] It is understood that in other embodiments, the first transporter 11 and the third transporter 15 may also be single-track transport. For example, the first transporter 11 may include a sub-transporter 111.

[0070] Please see Figure 1 and Figure 2 In one embodiment, the coating system 100 further includes a first removal mechanism 50. The first removal mechanism 50 and the coating mechanism 20 are sequentially arranged along the direction of transporting the silicon wafer 200 along the transmission line 10. The first removal mechanism 50 includes a first removal detection element 51 and a first removal element 53. The first removal detection element 51 is configured to detect whether there are stacked silicon wafers 200 on the transmission line 10. The processor is also configured to control the first removal element 53 to remove the stacked silicon wafers 200 from the transmission line 10. If stacked silicon wafers 200 enter the coating area, only the top layer of the stacked silicon wafers 200 can be coated. The first removal mechanism 50 reduces the risk of missed coating of silicon wafers 200 by the coating system 100.

[0071] The stacked silicon wafers 200 removed by the first removal unit 53 can be re-entered into the transmission line 10 and conveyed to the coating mechanism 20 by the transmission line 10.

[0072] It is understood that in other embodiments, the first removal mechanism 50 may also be omitted. Alternatively, the first removal member 53 may be able to remove the upper silicon wafer 200 from the stacked silicon wafers 200, leaving the bottom silicon wafer 200 on the transmission line 10.

[0073] In one embodiment, the coating system 100 further includes a second removal mechanism 60. The second removal mechanism 60 includes a second removal detection element 61 and a second removal element. The second removal element is a first transfer element 30. The second removal detection element 61 is configured to detect whether the silicon wafer 200 meets the pre-coating setting requirements, such as detecting whether the silicon wafer 200 has structural defects, such as incorrect number and position of jamming points; or detecting whether the size or surface of the silicon wafer 200 is damaged. The pre-coating setting requirements for the silicon wafer 200 are set according to requirements, and this application does not limit them.

[0074] The processor is also configured to control the second removal unit to remove silicon wafers 200 that do not meet the pre-spraying settings from the transmission line 10, thereby reducing the waste of spraying energy by removing unqualified silicon wafers 200 before spraying.

[0075] It is understood that in other embodiments, the second removal member and the first transfer member 30 may also be two separate structures.

[0076] In one embodiment, please refer to Figure 5 The coating system 100 also includes a third removal mechanism 70. The coating mechanism 20 and the third removal mechanism 70 are arranged sequentially along the conveying direction of the silicon wafer 200. The third removal mechanism 70 includes a third removal detection element 71 and a third removal element 73. The third removal detection element 71 is configured to detect whether the coating quality of the silicon wafer 200 meets the requirements. The processor is also configured to control the third removal element 73 to remove silicon wafers 200 with unsatisfactory coating quality from the transmission line 10, reducing the risk of unqualified silicon wafers 200 flowing into the unloading silicon wafers 200 and improving the pass rate of the coated silicon wafers 200 output by the coating system 100.

[0077] It is understood that in other embodiments, the first transfer member 30, the second transfer member 40, the first removal member 53, the second removal member, and the third removal member 73 are not connected to the processor, but control the actions through their own settings and processing chips.

[0078] The above-mentioned spraying system 100 detects the silicon wafer 200 before spraying by the first detection element 21, which can determine the silicon wafer parameters of the silicon wafer 200 before spraying. The spraying element 23 sprays the silicon wafer 200 according to the silicon wafer parameters, which improves the spraying reliability of the spraying element 23, reduces the spraying error rate, and enables one device to simultaneously complete the coating of multiple silicon wafers 200, thereby improving the compatibility of the spraying system 100.

[0079] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and substance of the technical solutions of this application.

Claims

1. A spraying system, comprising: Transmission lines are configured to transmit silicon wafers; At least one spraying unit; The spraying mechanism is characterized by comprising: The first detection device is configured to photograph the silicon wafer transmitted via the transmission line; A processor is configured to obtain silicon wafer parameters based on an image of the silicon wafer, the silicon wafer parameters excluding the position parameters of the silicon wafer; The coating component is configured to coat the silicon wafer according to preset coating parameters; The processor is also configured to determine the coating parameters based on the silicon wafer parameters.

2. The spraying system as described in claim 1, characterized in that: The silicon wafer parameters include one or more of the following: size, shape, color, pattern, and material.

3. The spraying system as described in claim 1, characterized in that: The number of spraying mechanisms is not less than two, and the processor is configured to control the silicon wafer to enter different spraying mechanisms via the transmission line according to the silicon wafer parameters. The spraying parameters of the sprayed parts of different spraying mechanisms can be set separately.

4. The spraying system as described in claim 1, characterized in that: The spraying mechanism further includes a second detection element, which is configured to detect the relative position of the silicon wafer to the transmission line before it enters the spraying area of ​​the spraying component. The processor adjusts the initial spraying position of the spraying component based on the position information.

5. The spraying system as described in claim 1, characterized in that: The transmission line includes a first transmission element and a second transmission element, which respectively transmit the silicon wafer. The transmission accuracy of the second transmission element is higher than that of the first transmission element. The spraying mechanism further includes a positioning element configured to drive the silicon wafer conveyed by the first conveyor to a set position of the second conveyor, and the second conveyor configured to convey the positioned silicon wafer through the spraying area of ​​the spraying element.

6. The spraying system as described in claim 5, characterized in that: The number of the second conveying component and the number of the spraying mechanism are both multiple. The multiple second conveying components are arranged sequentially along a first direction, which is perpendicular to the direction in which the second conveying component conveys the silicon wafer. Each spraying mechanism sprays the silicon wafer on the corresponding second conveying component. The coating system further includes a first transfer member configured to transfer a plurality of silicon wafers on the first transfer member to a plurality of second transfer members.

7. The spraying system as described in claim 6, characterized in that: The first conveyor includes a plurality of sub-conveyors arranged along the first direction, each of the sub-conveyors being configured to convey the silicon wafer.

8. The spraying system as described in claim 6, characterized in that: The spraying system further includes a second transfer member, and the transmission line further includes a third transfer member. The third transfer member is located on the side of the plurality of second transfer members opposite to the first transfer member. The transfer accuracy of the second transfer members is greater than that of the third transfer member. The second transfer member is configured to transfer the silicon wafers on the plurality of second transfer members to the third transfer member.

9. The spraying system as claimed in claim 1, characterized in that: The transmission line includes a plurality of second conveying elements, which are arranged sequentially along a second direction, which is parallel to the direction in which the second conveying elements transport the silicon wafer; there are a plurality of spraying mechanisms, each of which sprays the silicon wafer on the corresponding second conveying element; along the second direction, the silicon wafer can be transported between two adjacent second conveying elements.

10. The spraying system according to any one of claims 1 to 8, characterized in that: The spraying system further includes a first removal mechanism, which and the spraying mechanism are arranged sequentially along the direction in which the silicon wafer is conveyed by the transmission line. The first removal mechanism includes a first removal detection element and a first removal element. The first removal detection element is configured to detect whether there are stacked silicon wafers on the transmission line, and the first removal element is configured to remove the stacked silicon wafers from the transmission line.

11. The spraying system according to any one of claims 1 to 8, characterized in that: The spraying system further includes a second removal mechanism, which is arranged sequentially with the spraying mechanism along the direction in which the silicon wafer is conveyed by the transmission line. The second removal mechanism includes a second removal detection element and a second removal element. The second removal detection element is configured to detect whether the silicon wafer meets the pre-spraying setting requirements, and the second removal element is configured to remove the silicon wafer that does not meet the pre-spraying setting requirements from the transmission line.

12. The spraying system according to any one of claims 1 to 8, characterized in that: The coating system further includes a third removal mechanism, wherein the coating mechanism and the third removal mechanism are arranged sequentially along the direction in which the silicon wafer is conveyed by the transmission line. The third removal mechanism includes a third removal detection element and a third removal element. The third removal detection element is configured to detect whether the coating quality of the silicon wafer meets the coating requirements, and the third removal element is configured to remove the silicon wafer that does not meet the coating requirements from the transmission line.

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