Semiconductor lead frame mold facilitating demolding
By employing a snap-fit structure of snap-fit sleeves and snap-fit posts in the semiconductor lead frame mold, the automatic demolding of the lead frame is achieved using the power of the upper mold base. This solves the problems of complex existing mold structures and high energy consumption, and achieves a simplified and energy-saving demolding effect.
CN224389832UActive Publication Date: 2026-06-23WUXI JIATAI PRECISION MOULD CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI JIATAI PRECISION MOULD CO LTD
- Filing Date
- 2025-07-21
- Publication Date
- 2026-06-23
AI Technical Summary
Technical Problem
Existing semiconductor lead frame molds require additional drive structures for ejection operations, resulting in complex structures and high energy consumption.
Method used
The system employs a snap-fit structure with snap-fit sleeves and snap-fit pins. The upper mold base is used to make the lifting plate rise synchronously, and the ejector pins lift the lead wire frame to achieve demolding, reducing the reliance on additional driving force.
Benefits of technology
The mold structure was simplified, energy consumption was reduced, and a convenient demolding process was achieved.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224389832U_ABST
Abstract
The utility model provides a kind of semiconductor lead frame mould convenient to demould, belong to lead frame mould technical field, including lower die seat and upper die seat, the lower die seat is located below upper die seat;Cavity is opened in the inside of the lower die seat;Lower butt joint component is located in the inside of the cavity;Fixed in the guide column of the upper die seat bottom;Upper butt joint component is located in the guide column bottom;Wherein, the lower butt joint component includes: lift plate sliding in the inside wall of the cavity;Spring one is fixed between the bottom of the lift plate and the inside bottom of cavity;The utility model can use the power of the upper die seat to move upwards to make lift plate synchronous rising after the butt joint of clamping sleeve and clamping column is engaged, and then make demoulding ejector pin can eject lead frame in lead frame forming cavity, realize lead frame demoulding, without providing additional driving force for demoulding ejector pin, reduce the complexity of mould, reduce the consumption of energy.
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