A circuit board high-temperature tin melting disassembling device

Abstract

The utility model discloses a circuit board high temperature tin melting dismounting device, including dismounting mechanism, purification mechanism and cleaning mechanism, the dismounting mechanism includes dismounting cylinder, two cylinder covers of inserting in the both ends of the dismounting cylinder. In the utility model, when the filter screen board reaches the dust accumulation threshold, start the cylinder drive two groups of U-shaped board along the slide rail and insert the purification chamber, through the wedge cooperation structure of U-shaped board and the inner wall of purification chamber, can accurate plugging the dust -receiving surface of filter screen board forms the closed cavity, when the trachea interface accesses the external high pressure gas source, the synchronous opening solenoid valve makes the shunt pipe and divide the high pressure gas to the leeward surface of two groups of filter screen board, 0.6MPa's high pressure gas passes through the filter screen aperture reverse impact, makes the tin dust of inboard embedding and separates the filter material surface, and under the action of gravity, falls into the bottom cloth bag and completes the collection, after the dust removal process ends, control each part returns to the initial state, and the filter screen board restores the filtering function, keeps the flue gas purification effect.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a high-temperature solder melting and disassembly device for circuit boards. Background Technology

[0002] Circuit boards are named as follows: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board (copper etching technology), etc. Circuit boards make circuits miniaturized and intuitive, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout.

[0003] Application number CN202122676010.5 discloses a device for dismantling waste circuit boards of electronic products, belonging to the field of electronic product technology. Its key technical solution includes structures such as a support frame, solving the problem that existing dismantling devices melt the solder on waste circuit boards at high temperatures, causing electrical components to detach. This high-temperature melting generates a large amount of fumes, which are directly emitted without treatment, affecting environmental quality and easily inhaled by workers, causing harm and impacting the device's effectiveness. In practical use, this application utilizes two filter plates to purify the fumes, but the purification effect weakens over time due to the lack of cleaning methods. This leads to increasingly severe clogging of the filter plates' pores with prolonged use, eventually preventing fumes from passing through. Utility Model Content

[0004] This utility model aims to solve one of the technical problems existing in the prior art or related technologies.

[0005] Therefore, the technical solution adopted by this utility model is as follows:

[0006] A high-temperature solder melting disassembly device for circuit boards includes a disassembly mechanism, a purification mechanism, and a cleaning mechanism. The disassembly mechanism includes a disassembly cylinder, two cylinder covers inserted at both ends of the disassembly cylinder, and a heating wire connected to the inner wall of the disassembly cylinder. The purification mechanism includes a smoke outlet pipe connected and communicating with the disassembly cylinder, a purification chamber sleeved at the outer end of the smoke outlet pipe, two U-shaped plates movably inserted into the bottom of the smoke outlet pipe, two filter plates installed inside the purification chamber, and an air pipe connected and communicating with the purification chamber. The cleaning mechanism includes a diversion pipe connected between the purification chamber and the air pipe, a solenoid valve installed on the diversion pipe, a cloth bag connected to the bottom of the U-shaped plates, and a cylinder penetrating the top of the disassembly cylinder and connected between the two U-shaped plates.

[0007] By adopting the above technical solution, when the filter plate reaches the dust accumulation threshold, the cylinder is activated to drive two sets of U-shaped plates to be inserted into the purification chamber along the slide rail. Through the wedge-shaped fit structure between the U-shaped plates and the inner wall of the purification chamber, the dust-facing surface of the filter plate can be precisely sealed to form a sealed cavity. At this time, an external high-pressure air source is connected to the air pipe interface, and the solenoid valve is opened simultaneously to make the diverter pipe evenly distribute the high-pressure gas to the leeward side of the two sets of filter plates. The 0.6MPa high-pressure gas impacts in the reverse direction through the filter mesh, causing the tin dust embedded in the plate to detach from the filter material surface and fall into the bottom cloth bag under the action of gravity to complete the collection. After the dust removal process is completed, the control of each part returns to the initial state, the filter plate restores the filtration function, and maintains the flue gas purification effect.

[0008] In a preferred embodiment, this utility model can be further configured such that two filter plates and two U-shaped plates are staggered, and the purification chamber and the U-shaped plates are both made of high-temperature resistant materials.

[0009] In a preferred embodiment, the present invention can be further configured such that: a locking assembly is provided on the outside of the disassembly cylinder, the locking assembly includes two triangular sleeves sleeved at both ends of the disassembly cylinder, two clamps provided on the front and rear sides of the disassembly cylinder and connected to the triangular sleeves, and a rod body movably engaged with the clamps, the rod body being fixedly connected to the cylinder cover.

[0010] In a preferred embodiment, the present invention can be further configured as follows: a horizontal plate is connected between the two triangular sleeves, the horizontal plate is suspended above the disassembly cylinder, the smoke outlet pipe body vertically penetrates the top of the horizontal plate, the bottom of the purification chamber is fixedly connected to the top of the horizontal plate, and both U-shaped plates vertically move through the horizontal plate.

[0011] In a preferred embodiment, the present invention can be further configured such that the diversion pipe is located at the rear of the cleanroom, and the diameter of the diversion pipe is smaller than the diameter of the air pipe.

[0012] In a preferred embodiment, the present invention can be further configured such that a gap is formed between the U-shaped plate and the filter plate near the vertical center plane of the clean room, and the end of the diversion pipe is connected to the interior of the gap.

[0013] By adopting the above technical solution, the beneficial effects achieved by this utility model are as follows:

[0014] 1. In this utility model, when the filter plate reaches the dust accumulation threshold, the cylinder is activated to drive two sets of U-shaped plates to be inserted into the purification chamber along the slide rail. Through the wedge-shaped fit structure between the U-shaped plates and the inner wall of the purification chamber, the dust-facing surface of the filter plate can be precisely sealed to form a sealed cavity. At this time, an external high-pressure air source is connected to the air pipe interface, and the solenoid valve is opened simultaneously to make the diversion pipe evenly distribute the high-pressure gas to the leeward side of the two sets of filter plates. The 0.6MPa high-pressure gas impacts in the reverse direction through the filter mesh, causing the tin dust embedded in the plate to detach from the surface of the filter material and fall into the bottom cloth bag under the action of gravity to complete the collection. After the dust removal process is completed, the control of each part returns to the initial state, the filter plate restores the filtration function, and maintains the flue gas purification effect.

[0015] 2. In this utility model, the circuit board to be processed is placed inside the disassembly cylinder and the cylinder cover is resealed. Then, the heating wire is turned on to heat the circuit board, causing multiple circuit boards to melt solder at high temperature. The dust-laden fumes generated during this process are concentrated and directed to the purification chamber through the exhaust pipe. The double-layer filter screen filters the fumes in stages, and finally the clean gas is discharged through the gas pipe in compliance with standards, effectively avoiding environmental pollution. Attached Figure Description

[0016] Figure 1 This is a perspective view of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the disassembly mechanism of this utility model;

[0018] Figure 3 This is a schematic diagram of the purification mechanism of this utility model;

[0019] Figure 4 This utility model Figure 3 Enlarged view of the A-section structure;

[0020] Figure 5 This is a schematic diagram of the cleaning mechanism of this utility model;

[0021] Figure 6 This is a schematic diagram of the locking component of this utility model.

[0022] Figure label:

[0023] 100. Disassembly mechanism; 110. Disassembly cylinder; 120. Cylinder cover; 130. Heating wire;

[0024] 200. Purification mechanism; 210. Smoke exhaust pipe; 220. Purification chamber; 230. U-shaped plate; 240. Filter plate; 250. Air pipe;

[0025] 300. Cleaning mechanism; 310. Diverter pipe; 320. Solenoid valve; 330. Cloth bag; 340. Cylinder;

[0026] 400. Locking assembly; 410. Triangular sleeve; 420. Clamp; 430. Rod body. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features of the present utility model can be combined with each other.

[0028] It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this invention.

[0029] The following describes, with reference to the accompanying drawings, some embodiments of a circuit board high-temperature solder melting and disassembly device provided by this utility model.

[0030] Example 1:

[0031] Combination Figure 1-6 As shown, the present invention provides a circuit board high-temperature solder melting disassembly device, including a disassembly mechanism 100, a purification mechanism 200 and a cleaning mechanism 300. The disassembly mechanism 100 includes a disassembly cylinder 110, two cylinder covers 120 inserted into both ends of the disassembly cylinder 110, and a heating wire 130 connected to the inner wall of the disassembly cylinder 110.

[0032] Purification mechanism 200 includes a smoke outlet pipe 210 connected and communicating with the disassembly cylinder 110, a purification chamber 220 sleeved on the outer end of the smoke outlet pipe 210, two U-shaped plates 230 movably inserted into the bottom of the smoke outlet pipe 210, two filter plates 240 installed inside the purification chamber 220, and an air pipe 250 connected and communicating with the purification chamber 220.

[0033] The cleaning mechanism 300 includes a diversion pipe 310 connected between the purification chamber 220 and the air pipe 250, a solenoid valve 320 installed on the diversion pipe 310, a cloth bag 330 connected to the bottom of the U-shaped plate 230, and a cylinder 340 passing through the top of the disassembly cylinder 110 and connected between the two U-shaped plates 230.

[0034] Furthermore, the diversion pipe 310 is located at the rear of the purification chamber 220. The diameter of the diversion pipe 310 is smaller than the diameter of the gas pipe 250. The size design of the diversion pipe 310 ensures that there will be no leakage when the high-pressure gas in the gas pipe 250 is diverted.

[0035] Furthermore, a gap is formed between the U-shaped plate 230 and the filter plate 240 near the vertical center plane of the purification chamber 220. The end of the diversion pipe 310 is connected to the inside of the gap. The gap is set to ensure that the high-pressure gas flowing out of the diversion pipe 310 can accurately act on the filter plate 240 near the smoke outlet pipe 210, thus ensuring the cleaning effect of the filter plate 240.

[0036] Example 2:

[0037] Combination Figures 3-5 As shown, based on Embodiment 1, two filter plates 240 and two U-shaped plates 230 are arranged alternately. The purification chamber 220 and the U-shaped plates 230 are both made of high-temperature resistant materials. The use of high-temperature resistant materials improves the resistance of the purification chamber 220 and the U-shaped plates 230 to high-temperature smoke and dust.

[0038] Example 3:

[0039] Combination Figure 1 and Figure 6 As shown in the above embodiment, a locking assembly 400 is provided on the outside of the disassembly cylinder 110. The locking assembly 400 includes two triangular sleeves 410 sleeved at both ends of the disassembly cylinder 110, two clamps 420 provided on the front and rear sides of the disassembly cylinder 110 and connected to the triangular sleeves 410, and a rod 430 movably engaged with the clamps 420. The rod 430 is fixedly connected to the cylinder cover 120. The two triangular sleeves 410 cooperate to make the disassembly cylinder 110 horizontally and stably placed. Then, the clamps 420 cooperate with the rod 430 to make the cylinder cover 120 and the disassembly cylinder 110 firmly connected, ensuring the stability of the solder melting operation.

[0040] Furthermore, a horizontal plate is connected between the two triangular sleeves 410. The horizontal plate is suspended above the disassembly cylinder 110. The smoke outlet pipe 210 extends vertically through the top of the horizontal plate. The bottom of the purification chamber 220 is fixedly connected to the top of the horizontal plate. Both U-shaped plates 230 extend vertically through the horizontal plate. The horizontal plate provides conditions for fixing the purification chamber 220.

[0041] The working principle and usage process of this utility model are as follows: After opening the cover 120 of the disassembly cylinder 110, the circuit board to be processed is placed inside the disassembly cylinder 110 and the cover 120 is resealed. Then, the heating wire 130 is turned on to heat the circuit board, causing multiple circuit boards to melt solder at high temperature. The dust-laden fumes generated during this process are concentrated and directionally transported to the cleanroom 220 through the exhaust pipe 210. The double-layer filter plate 240 performs stepwise filtration of the fumes and dust, and finally, the clean gas is discharged through the gas pipe 250 in compliance with standards, effectively avoiding environmental pollution.

[0042] When the filter plate 240 reaches the dust accumulation threshold, the cylinder 340 is activated to drive the two sets of U-shaped plates 230 to be inserted into the purification chamber 220 along the slide rail. Through the wedge-shaped fit structure between the U-shaped plates and the inner wall of the purification chamber, the dust-facing surface of the filter plate 240 can be precisely sealed to form a sealed cavity. At this time, an external high-pressure air source is connected to the air pipe 250 interface, and the solenoid valve 320 is opened simultaneously to make the diversion pipe 310 evenly distribute the high-pressure gas to the leeward side of the two sets of filter plates 240. The 0.6MPa high-pressure gas impacts in the reverse direction through the filter mesh, causing the tin dust embedded in the plate to detach from the filter material surface and fall into the bottom cloth bag 330 under the action of gravity to complete the collection.

[0043] After the dust removal process is completed, the high-pressure air source is first cut off and the solenoid valve 320 is closed. Then, the U-shaped plate 230 is retracted to the initial position by the cylinder 340 to ensure that the filter plate 240 restores its filtration function. The system adopts a modular design, and the dust removal process does not require disassembling the filter element, which not only ensures continuous purification efficiency, but also realizes closed-loop dust management and complies with industrial solid waste treatment standards.

[0044] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board high-temperature solder melting disassembly device, characterized in that, include: The disassembly mechanism (100) includes a disassembly cylinder (110), two cylinder caps (120) inserted into both ends of the disassembly cylinder (110), and an electric heating wire (130) connected to the inner wall of the disassembly cylinder (110). Purification mechanism (200) includes a smoke outlet pipe (210) connected and communicating with the disassembly cylinder (110), a purification chamber (220) sleeved on the outer end of the smoke outlet pipe (210), two U-shaped plates (230) movably inserted into the bottom of the smoke outlet pipe (210), two filter plates (240) installed inside the purification chamber (220), and an air pipe (250) connected and communicating with the purification chamber (220). The cleaning mechanism (300) includes a diversion pipe (310) connected between the purification chamber (220) and the air pipe (250), a solenoid valve (320) installed on the diversion pipe (310), a cloth bag (330) connected to the bottom of the U-shaped plate (230), and a cylinder (340) passing through the top of the disassembly cylinder (110) and connected between the two U-shaped plates (230).

2. The circuit board high-temperature solder melting disassembly device according to claim 1, characterized in that, Two filter plates (240) and two U-shaped plates (230) are staggered, and the purification chamber (220) and the U-shaped plates (230) are both made of high-temperature resistant materials.

3. The circuit board high-temperature solder melting disassembly device according to claim 1, characterized in that, The disassembly cylinder (110) is provided with a locking assembly (400) on the outside. The locking assembly (400) includes two triangular sleeves (410) sleeved at both ends of the disassembly cylinder (110), two clamps (420) provided on the front and rear sides of the disassembly cylinder (110) and connected to the triangular sleeves (410), and a rod (430) movably engaged with the clamps (420). The rod (430) is fixedly connected to the cylinder cover (120).

4. The circuit board high-temperature solder melting disassembly device according to claim 3, characterized in that, A horizontal plate is connected between the two triangular sleeves (410), the horizontal plate is suspended above the disassembly cylinder (110), the smoke outlet pipe (210) is vertically inserted through the top of the horizontal plate, the bottom of the purification chamber (220) is fixed to the top of the horizontal plate, and the two U-shaped plates (230) are vertically movable through the horizontal plate.

5. The circuit board high-temperature solder melting disassembly device according to claim 1, characterized in that, The diversion pipe (310) is located on the rear side of the cleanroom (220), and the diameter of the diversion pipe (310) is smaller than the diameter of the air pipe (250).

6. The circuit board high-temperature solder melting disassembly device according to claim 1, characterized in that, A gap is formed between the U-shaped plate (230) and the filter plate (240) near the vertical center plane of the clean room (220), and the end of the diversion pipe (310) is connected to the interior of the gap.

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