Laser processing device

Abstract

The utility model discloses a kind of laser processing devices, including laser, first light splitting component, second light splitting component, first processing head component and second processing head component, laser, first light splitting component and second light splitting component are sequentially arranged in the propagation direction of light, in the height direction of laser processing device, second processing head component is below first processing head component;Among them, first light splitting component is used to divide the laser beam generated by laser into two laser beams and enter second light splitting component, second light splitting component is used to propagate two laser beams to first processing head component and second processing head component respectively, first processing head component and second processing head component can be marked by even laser beam to the two sides of product or two products respectively, can improve marking efficiency while ensuring low cost.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a laser processing device. Background Technology

[0002] Laser marking technology uses a high-energy-density laser beam to irradiate the surface of a workpiece, causing physical or chemical changes in the material's surface layer, thereby achieving permanent marking. Under current technological conditions, a single laser device can only complete the marking of one side of a single product in a single burst of light, resulting in limited production efficiency. Utility Model Content

[0003] In view of the shortcomings of the prior art, this application provides a laser processing device that can solve the problem that a single laser device can only complete the marking operation on one side of a single product in a single laser output, resulting in limited production efficiency.

[0004] The following technical solution is adopted in this embodiment:

[0005] A laser processing apparatus includes a laser, a first beam splitter, a second beam splitter, a first processing head assembly, and a second processing head assembly. The laser, the first beam splitter, and the second beam splitter are arranged sequentially in the direction of light propagation. In the height direction of the laser processing apparatus, the second processing head assembly is located below the first processing head assembly.

[0006] The first beam splitter is used to split the laser beam generated by the laser into two laser beams and send them into the second beam splitter. The second beam splitter is used to propagate the two laser beams to the first processing head assembly and the second processing head assembly, respectively.

[0007] Furthermore, in the laser processing apparatus, the second beam splitting component includes a first polarizer and a first reflector. The first polarizer is used to propagate one laser beam to the first processing head assembly and to reflect another laser beam to the second processing head assembly via the first reflector.

[0008] Furthermore, in the laser processing apparatus, the second beam splitting component further includes a first sub-shell, a light guide sleeve, and a second sub-shell. The first sub-shell connects the first beam splitting component and the first processing head assembly. One end of the light guide sleeve is connected to the first sub-shell and the other end is connected to the second sub-shell. The second sub-shell is connected to the second processing head assembly. The first polarizer is disposed on the first sub-shell and the first reflector is disposed on the second sub-shell. One laser beam enters the first processing head assembly from the first sub-shell, and the other laser beam passes through the light guide sleeve and is reflected by the first reflector to the second processing head assembly.

[0009] Furthermore, in the laser processing apparatus, in the height direction of the laser processing apparatus, the second sub-shell is located below the first sub-shell, one end of the light guide sleeve is connected to the first sub-shell, and the other end extends vertically to be connected to the second sub-shell.

[0010] Furthermore, in the laser processing device, the first beam splitting component includes a beam expander and a half-glass plate. The beam expander expands the laser beam and directs it into the half-glass plate. The half-glass plate splits the expanded laser beam into two laser beams and directs them into the second beam splitting component.

[0011] Furthermore, in the laser processing apparatus, the first beam splitting component package also includes a second housing, the second housing and the laser are disposed adjacent to each other, one end of the second housing is aligned with the laser, the second beam splitting component is connected to the other end of the second housing, and the beam expander and the half glass plate are disposed inside the second housing from one end to the other end.

[0012] Furthermore, in the laser processing apparatus, the laser processing apparatus also includes a first refractive cavity assembly, which is connected between the laser and the first beam splitting assembly, and is used to refract the laser beam generated by the laser to the first beam splitting assembly.

[0013] Furthermore, in the laser processing apparatus, the first refractive cavity assembly includes a second reflector and a third reflector. The second reflector is used to refract the laser beam generated by the laser to the third reflector, and the third reflector is used to reflect the laser beam to the first beam splitter.

[0014] Furthermore, in the laser processing device, the first refractive cavity assembly further includes a third housing, the first beam splitting assembly and the laser are arranged adjacent to each other and their ends are aligned, one end of the third housing is connected to the end of the laser and the other end is connected to the end of the first beam splitting assembly, the second reflector is disposed inside the third housing at a position corresponding to the end of the laser, and the third reflector is disposed inside the third housing at a position corresponding to the end of the first beam splitting assembly.

[0015] Furthermore, in the laser processing apparatus, the laser processing apparatus further includes a second refractive cavity assembly, a third refractive cavity assembly, a first beam expander assembly, a second beam expander assembly, a first red light preview assembly, and a second red light preview assembly. The second refractive cavity assembly, the first beam expander assembly, and the first red light preview assembly are sequentially arranged between the second beam splitter assembly and the first processing head assembly in the light propagation direction. The third refractive cavity assembly, the second beam expander assembly, and the second red light preview assembly are sequentially arranged between the second beam splitter assembly and the second processing head assembly in the light propagation direction.

[0016] Compared to existing technologies, this application provides a laser processing apparatus, including a laser, a first beam splitter, a second beam splitter, a first processing head assembly, and a second processing head assembly. The laser, the first beam splitter, and the second beam splitter are arranged sequentially in the light propagation direction. In the height direction of the laser processing apparatus, the second processing head assembly is located below the first processing head assembly. The first beam splitter splits the laser beam generated by the laser into two beams, which are then directed into the second beam splitter. The second beam splitter propagates the two laser beams to the first and second processing head assemblies, respectively. The first and second processing head assemblies can simultaneously mark two sides of a product or two products with uniform laser beams. This design allows the laser processing apparatus to simultaneously mark two sides of a product or two products with uniform laser beams, improving marking efficiency while maintaining low cost. Attached Figure Description

[0017] Figure 1 A schematic diagram of the overall structure of a specific embodiment of the laser processing apparatus provided in this application. Figure 1 .

[0018] Figure 2 A schematic diagram of the overall structure of a specific embodiment of the laser processing apparatus provided in this application. Figure 2 .

[0019] Figure 3 Structural diagram of the omitted parts of the structure in a specific embodiment of the laser processing apparatus provided in this application. Figure 1 .

[0020] Figure 4 Structural diagram of the omitted parts of the structure in a specific embodiment of the laser processing apparatus provided in this application. Figure 2 .

[0021] Among them, 10-laser; 20-first beam splitter; 21-beam expander; 22-half glass; 23-second housing; 30-second beam splitter; 31-first polarizer; 32-first reflector; 33-first sub-housing; 34-second sub-housing; 35-light guide sleeve; 40-first processing head assembly; 50-second processing head assembly; 60-first refractive cavity assembly; 61-second reflector; 62-third reflector; 63-third housing; 70-second refractive cavity assembly; 80-third refractive cavity assembly; 90-first beam expander; 100-second beam expander; 110-first red light preview assembly; 120-second red light preview assembly; 130-base plate; 140-side plate; 150-support plate. Detailed Implementation

[0022] To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description of this application is provided with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining this application and are not intended to limit this application. Unless further described, elements, structures, and features in one embodiment may be advantageously combined with other embodiments.

[0023] It should be noted that when a metastructure is referred to as "fixed to" or "set on" another metastructure, it can be directly on or indirectly on that other metastructure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0024] The terms “length”, “width”, “upper”, “lower”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation.

[0025] Please refer to the following: Figures 1 to 4The laser processing apparatus provided in this application includes a laser 10, a first beam splitter 20, a second beam splitter 30, a first processing head assembly 40, and a second processing head assembly 50. The laser 10, the first beam splitter 20, and the second beam splitter 30 are arranged sequentially in the light propagation direction. In the height direction H of the laser processing apparatus, the second processing head assembly 50 is located below the first processing head assembly 40. The first beam splitter 20 splits the laser beam generated by the laser 10 into two laser beams, which are then directed into the second beam splitter 30. The second beam splitter 30 propagates the two laser beams to the first processing head assembly 40 and the second processing head assembly 50, respectively. The first processing head assembly 40 and the second processing head assembly 50 can respectively perform uniform laser beam marking on two sides of a product or on two separate products. With this design, the laser processing apparatus can simultaneously perform uniform laser beam marking on two sides of a product or on two separate products, improving marking efficiency while maintaining low cost.

[0026] In some embodiments, in order for the second beam splitter 30 to propagate two laser beams to the first processing head assembly 40 and the second processing head assembly 50 respectively, the second beam splitter 30 may include a first polarizer 31 and a first reflector 32. The first polarizer 31 is used to propagate one laser beam to the first processing head assembly 40 and to reflect the other laser beam to the second processing head assembly 50 via the first reflector 32.

[0027] Furthermore, in order to achieve the installation and fixation of the first polarizer 31 and the first reflector 32, the second beam splitter 30 may also include a first sub-housing 33, a light guide sleeve 35, and a second sub-housing 34. The first sub-housing 33 is connected to the first beam splitter 20 and the first processing head assembly 40. One end of the light guide sleeve 35 is connected to the first sub-housing 33 and the other end is connected to the second sub-housing 34. The second sub-housing 34 is connected to the second processing head assembly 50. The first polarizer 31 is disposed in the first sub-housing 33 and the first reflector 32 is disposed in the second sub-housing 34. One laser beam enters the first processing head assembly 40 from the first sub-housing 33, and another laser beam passes through the light guide sleeve 35 and is reflected by the first reflector 32 to the second processing head assembly 50.

[0028] As can be seen from the above, in the height direction H of the laser processing device, the second processing head assembly 50 is located below the first processing head assembly 40. Therefore, in the height direction of the laser processing device, the second sub-housing 34 is located below the first sub-housing 33. One end of the light guide sleeve 35 is connected to the first sub-housing 33, and the other end extends vertically to be connected to the second sub-housing 34.

[0029] In some embodiments, in order to split the laser beam refracted by the first refractive cavity assembly 60 into two laser beams, the first beam splitting assembly 20 may include a beam expander 21 and a half-glass plate 22. The beam expander 21 expands the laser beam and directs it into the half-glass plate 22, and the half-glass plate 22 splits the expanded laser beam into two laser beams and directs them into the second beam splitting assembly 30.

[0030] Furthermore, to facilitate the mounting and fixing of the beam expander 21 and the half-glass plate 22, the first beam splitter assembly 20 may also include a second housing 23. The second housing 23 is disposed adjacent to the laser 10, with one end of the second housing 23 aligned with the laser 10. The second beam splitter assembly 30 is connected to the other end of the second housing 23, and the beam expander 21 and the half-glass plate 22 are disposed within the second housing 23 from one end to the other. This design allows for a more compact structure of the entire first beam splitter assembly 20.

[0031] In some embodiments, the laser processing apparatus may further include a first refractive cavity assembly 60, which is disposed between the laser 10 and the first beam splitter 20 in the direction of light propagation, for refracting the laser beam generated by the laser 10 to the first beam splitter 20.

[0032] Furthermore, in order to refract the laser beam of the laser 10 to the first beam splitting assembly 20, the first refractive cavity assembly 60 may include a second reflector 61 and a third reflector 62. The second reflector 61 is used to refract the laser beam generated by the laser 10 to the third reflector 62, and the third reflector 62 is used to reflect the laser beam to the first beam splitting assembly 20.

[0033] Furthermore, to facilitate the mounting and fixing of the second reflector 61 and the third reflector 62, the first refracting cavity assembly 60 may also include a third housing 63. The first beam splitting assembly 20 and the laser 10 are arranged adjacent to each other and aligned at their ends. One end of the third housing 63 is connected to the end of the laser 10, and the other end is connected to the end of the first beam splitting assembly 20. The second reflector 61 is disposed within the third housing 63 at a position corresponding to the end of the laser 10, and the third reflector 62 is disposed within the third housing 63 at a position corresponding to the end of the first beam splitting assembly 20. This design allows for a more compact structure of the laser 10, the first refracting cavity assembly 60, and the first beam splitting assembly 20.

[0034] In some embodiments, the laser processing apparatus may further include a second refractive cavity assembly 70, a first beam expander assembly 90, and a first red light preview assembly 110, which are sequentially arranged between the second beam splitter assembly 30 and the first processing head assembly 40 in the direction of light propagation. The second refractive cavity assembly 70 is used to straighten the laser beam, the first beam expander assembly 90 is used to expand the laser beam, and the first red light preview assembly 110 is used to adjust the laser beam into visible light, so that the first processing head assembly 40 emits visible light.

[0035] Similarly, the laser processing device may also include a third refracting cavity assembly 80, a second beam expander assembly 100 and a second red light preview assembly 120, which are arranged sequentially between the second beam splitter assembly 30 and the second processing head assembly 50 in the direction of light propagation.

[0036] In some embodiments, in order to install and fix the laser 10, the first refractive cavity assembly 60, the first beam splitting assembly 20 and the second beam splitting assembly 30, the laser processing apparatus may further include a base plate 130 and a side plate 140. The laser 10, the first refractive cavity assembly 60 and the first beam splitting assembly 20 are all fixed on the base plate 130, the side plate 140 is fixed to the side wall of the first beam splitting assembly 20 and the base plate 130, and the second beam splitting assembly 30 is fixed on the side plate 140.

[0037] Furthermore, the laser processing apparatus may also include a support plate 150, the top of which is fixed to the bottom surface of the base plate 130, and the sides of which are fixed to the side walls of the side plate 140. This design allows the support plate 150 to support the base plate 130 and also improves the stability of the structural connection between the base plate 130 and the side plate 140.

[0038] It is understood that those skilled in the art can make equivalent substitutions or changes based on the technical solution and concept of this application, and all such substitutions or changes should fall within the protection scope of the appended claims.

Claims

1. A laser processing apparatus, characterized in that, The device includes a laser, a first beam splitter, a second beam splitter, a first processing head assembly, and a second processing head assembly. The laser, the first beam splitter, and the second beam splitter are arranged sequentially in the direction of light propagation. In the height direction of the laser processing device, the second processing head assembly is located below the first processing head assembly. The first beam splitter is used to split the laser beam generated by the laser into two laser beams and send them into the second beam splitter. The second beam splitter is used to propagate the two laser beams to the first processing head assembly and the second processing head assembly, respectively.

2. The laser processing apparatus according to claim 1, characterized in that, The second beam splitter includes a first polarizer and a first reflector. The first polarizer is used to propagate one of the laser beams to the first processing head assembly and to reflect another of the laser beams to the second processing head assembly via the first reflector.

3. The laser processing apparatus according to claim 2, characterized in that, The second beam splitter further includes a first sub-shell, a light guide sleeve, and a second sub-shell. The first sub-shell connects the first beam splitter and the first processing head assembly. One end of the light guide sleeve is connected to the first sub-shell and the other end is connected to the second sub-shell. The second sub-shell is connected to the second processing head assembly. The first polarizer is disposed on the first sub-shell and the first reflector is disposed on the second sub-shell. One of the laser beams enters the first processing head assembly from the first sub-shell, and the other laser beam passes through the light guide sleeve and is reflected by the first reflector to the second processing head assembly.

4. The laser processing apparatus according to claim 3, characterized in that, In the height direction of the laser processing device, the second sub-shell is located below the first sub-shell, one end of the light guide sleeve is connected to the first sub-shell, and the other end extends vertically to be connected to the second sub-shell.

5. The laser processing apparatus according to claim 1, characterized in that, The first beam splitter includes a beam expander and a half-glass plate. The beam expander expands the laser beam and directs it into the half-glass plate. The half-glass plate splits the expanded laser beam into two laser beams and directs them into the second beam splitter.

6. The laser processing apparatus according to claim 5, characterized in that, The first beam splitter assembly also includes a second housing, which is disposed adjacent to the laser. One end of the second housing is aligned with the laser. The second beam splitter assembly is connected to the other end of the second housing. The beam expander and the half-glass slide are disposed inside the second housing from one end to the other.

7. The laser processing apparatus according to any one of claims 1 to 6, characterized in that, The laser processing apparatus further includes a first refractive cavity assembly, which is connected between the laser and the first beam splitter assembly, and is used to refract the laser beam generated by the laser to the first beam splitter assembly.

8. The laser processing apparatus according to claim 7, characterized in that, The first refractive cavity assembly includes a second reflector and a third reflector. The second reflector is used to refract the laser beam generated by the laser to the third reflector, and the third reflector is used to reflect the laser beam to the first beam splitter.

9. The laser processing apparatus according to claim 8, characterized in that, The first refractive cavity assembly further includes a third housing. The first beam splitting assembly and the laser are arranged adjacent to each other and aligned at their ends. One end of the third housing is connected to the end of the laser and the other end is connected to the end of the first beam splitting assembly. The second reflector is disposed inside the third housing at a position corresponding to the end of the laser, and the third reflector is disposed inside the third housing at a position corresponding to the end of the first beam splitting assembly.

10. The laser processing apparatus according to any one of claims 1 to 6, characterized in that, The laser processing apparatus further includes a second refractive cavity assembly, a third refractive cavity assembly, a first beam expander assembly, a second beam expander assembly, a first red light preview assembly, and a second red light preview assembly. The second refractive cavity assembly, the first beam expander assembly, and the first red light preview assembly are sequentially arranged between the second beam splitter assembly and the first processing head assembly in the direction of light propagation. The third refractive cavity assembly, the second beam expander assembly, and the second red light preview assembly are sequentially arranged between the second beam splitter assembly and the second processing head assembly in the direction of light propagation.

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