Electroplating rack for semiconductor package device
By designing an electroplating fixture that includes a hanger, hook, positioning hook, fixing rod, and pressure claw strip, the problem of not being able to simultaneously contact the pins and heat sink in the existing technology is solved, and effective electroplating of semiconductor packaging devices is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANTOU HUSN ELECTRONICS DEVICES
- Filing Date
- 2025-08-18
- Publication Date
- 2026-06-23
AI Technical Summary
Existing electroplating racks cannot simultaneously contact the pins and heat sinks of semiconductor packaged devices, resulting in ineffective electroplating of internally insulated products.
An electroplating fixture was designed, comprising a hanger, hook, positioning hook, fixing rod, limiting strip, and pressure claw strip. The positioning hook holds the pin, the pressure claw strip presses against the heat sink, and the fixing rod connects to the hanger to ensure simultaneous contact between the pin and the heat sink.
It enables effective electroplating of the pins and heat sinks of semiconductor packaged devices, solving the problem that internal insulation products cannot be electroplated, and ensuring good conductivity.
Smart Images
Figure CN224395093U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to electroplating racks, and more particularly to an electroplating rack for semiconductor packaging devices. Background Technology
[0002] Due to their unique structure, semiconductor-packaged insulated products have leads that are insulated from the heat sink after packaging. The heat sink is encapsulated within the resin body and remains flush with it. Therefore, the plating rack used during electroplating must simultaneously contact both the leads and the heat sink to ensure good conductivity and proper tin plating. However, existing racking and clamping types cannot simultaneously contact the leads and heat sink when mounting the product, directly hindering effective plating. Utility Model Content
[0003] The purpose of this invention is to provide an electroplating fixture that is simple to operate and accurately positions products, which can simultaneously contact the pins and heat sink of semiconductor packaged devices, thereby effectively solving the problem that internally insulated products cannot be electroplated.
[0004] To achieve the above objectives, the present invention adopts the following technical solution:
[0005] An electroplating fixture for semiconductor packaging devices includes a bracket with a hook at its upper end. The bracket also includes a positioning hook, a fixing rod, a limiting strip, and a pressure claw strip. The positioning hook is located at the upper end of the limiting strip, the fixing rod is located at the lower end of the limiting strip, and both ends of the pressure claw strip are connected to the fixing rod.
[0006] Preferably, the pressure claw strip includes a central rod and an elastic pressure claw, the central rod is connected to a fixed rod, and the front end of the elastic pressure claw contacts the limiting strip.
[0007] Preferably, the upper end of the hook is provided with a locking screw.
[0008] Preferably, the front end of the fixing rod is provided with an elastic buckle, and both ends of the central rod are locked in the elastic buckle.
[0009] This invention has a simple structure and can stably position semiconductor packaged devices on the mounting bracket, enabling the bracket to simultaneously contact the pins and heat sink of the semiconductor packaged device, effectively solving the problem of electroplating in internally insulated products. Attached Figure Description
[0010] Figure 1 This is a schematic diagram of the structure of this utility model.
[0011] Figure 2 This is a structural diagram of the hanger.
[0012] Figure 3This is a structural diagram of the hook, limit strip, and fixing rod.
[0013] Figure 4 This is a schematic diagram of the pressure claw bar.
[0014] Figure 5 This is a schematic diagram of the connection between the pressure claw strip and the hanger.
[0015] Figure 6 This is a schematic diagram of the combination of a semiconductor device and the present invention.
[0016] Figure 7 This is a schematic diagram of the structure of the hook and semiconductor device combination.
[0017] Figure 8 This is a schematic diagram of the structure of a semiconductor device fixed on a mounting bracket.
[0018] Figure 9 This is a schematic diagram of a fixed semiconductor device.
[0019] In the diagram: 1-Hook, 2-Locking screw, 3-Hanging bracket, 4-Pressure claw strip, 5-Positioning hook, 6-Fixing rod, 7-Limiting strip, 8-Center rod, 9-Elastic pressure claw, 10-Semiconductor device, 11-Elastic buckle. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0021] Reference Figures 1-9 An electroplating fixture for semiconductor packaging devices includes a bracket 3. The bracket 3 has a hook 1 at its upper end, and a positioning hook 5, a fixing rod 6, a limiting strip 7, and a pressure claw strip 4. The positioning hook 5 is located at the upper end of the limiting strip 7, and the fixing rod 6 is located at the lower end of the limiting strip 7. The front end of the fixing rod 6 has an elastic buckle 11. The pressure claw strip 4 includes a central rod 8 and elastic pressure claws 9. Both ends of the central rod 6 are engaged with the elastic buckle 11, and the front end of the elastic pressure claws 9 contacts the limiting strip 7. A locking screw 2 is located at the upper end of the bracket 3, which locks the fixture to the electroplating flybar, ensuring good electrical conductivity between the fixture and the flybar.
[0022] like Figure 7-9As shown: the pressure claw strip 4 mainly serves to press and contact the semiconductor package device 10. The elastic pressure claw 9 at the upper end of the pressure claw strip 4 presses against the heat sink of the semiconductor package device 10 and is connected to the bracket 3 through the fixing rod 6, ensuring good conductivity between the heat sink of the semiconductor package device 10 and the bracket. The positioning hook 5 hooks onto the pin position of the semiconductor package device 10, positioning it and ensuring good conductivity with the bracket 3. The limiting strip 7 presses against the back of the semiconductor package device 10, allowing the elastic pressure claw 9 and the heat sink of the semiconductor package device 10 to make tight contact, further ensuring good conductivity. The above structure allows the bracket to contact both the pin and the heat sink of the semiconductor package device simultaneously, enabling electroplating of the insulating products inside the semiconductor package.
[0023] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. An electroplating fixture for semiconductor packaging devices, comprising a bracket, wherein the upper end of the bracket is provided with a hook, characterized in that: The hanger is equipped with a positioning hook, a fixing rod, a limiting strip, and a pressure claw strip. The positioning hook is located at the upper end of the limiting strip, the fixing rod is located at the lower end of the limiting strip, and the two ends of the pressure claw strip are connected to the fixing rod.
2. The electroplating fixture for semiconductor packaging devices as described in claim 1, characterized in that: The pressure claw strip includes a central rod and an elastic pressure claw. The central rod is connected to a fixed rod, and the front end of the elastic pressure claw contacts the limiting strip.
3. The electroplating fixture for semiconductor packaging devices as described in claim 1, characterized in that: The hook is equipped with a locking screw at its upper end.
4. The electroplating fixture for semiconductor packaging devices as described in claim 2, characterized in that: The front end of the fixing rod is provided with an elastic buckle, and both ends of the center rod are locked in the elastic buckle.