A sensor package structure

Abstract

The application relates to the technical field of semiconductors and discloses a sensor packaging structure, which comprises a substrate, a photosensitive chip arranged on a first surface of the substrate and electrically connected with the substrate, a first surface of the photosensitive chip being provided with a photosensitive area, a light-emitting device arranged on the first surface of the substrate and electrically connected with the substrate, the light-emitting device being arranged at intervals from the photosensitive chip, a first surface of the light-emitting device being provided with a light-emitting area, a light-transmitting plastic packaging layer arranged on the first surface of the photosensitive chip and the first surface of the light-emitting device and covering the photosensitive area of the photosensitive chip and the light-emitting area of the light-emitting device, and a non-light-transmitting plastic packaging layer covering the first surface of the substrate, the surface of the photosensitive chip, the surface of the light-emitting device and the side surface of the light-transmitting plastic packaging layer, and exposing the upper surface of the light-transmitting plastic packaging layer, so that dust is avoided from being adsorbed on the surfaces of the photosensitive chip and the light-emitting device in a subsequent packaging process, and the detection effect and quality of the sensor are affected.

Description

Technical Field

[0001] This invention belongs to the technical field of semiconductors, and particularly relates to a sensor packaging structure. Background Technology

[0002] Traditional proximity sensors mainly consist of a sensor die, a light-emitting device, and a substrate. During operation, the sensor area on the surface of the sensor die receives light emitted by the light-emitting device and reflected back. To prevent light from directly illuminating the sensor area, an opaque housing is used to separate the sensor area from the light-emitting device, creating two spaced-apart cavities above the substrate. The light-emitting device and the sensor area of ​​the sensor die are respectively housed within these cavities. To protect the sensor area and improve the efficiency of the sensor die, glass or glass with a filter coating is typically placed on the surface of the sensor area receiving reflected light. This glass or glass with a filter coating is fixed to the sensor area surface using a transparent adhesive or glue.

[0003] However, the aforementioned conventional proximity sensors have some drawbacks. For example, their manufacturing cost is relatively high because the non-transparent housing is made of materials such as plastic, metal, or ceramic, and requires alignment, gluing, and bonding steps during the manufacturing process. Furthermore, since the cavity is not sealed, dust and other contaminants may be introduced during subsequent assembly or use, which can easily lead to proximity sensor detection malfunctions. Utility Model Content

[0004] The purpose of this invention is to solve at least one problem of the prior art and to propose a sensor packaging structure.

[0005] To achieve the above objectives, this utility model proposes a sensor packaging structure, comprising:

[0006] substrate;

[0007] A photosensitive chip is disposed on a first surface of a substrate and electrically connected to the substrate, and a photosensitive area is provided on the first surface of the photosensitive chip.

[0008] A light-emitting device is disposed on a first surface of a substrate and electrically connected to the substrate. The light-emitting device is disposed at a distance from a photosensitive chip. The first surface of the light-emitting device is provided with a light-emitting area.

[0009] A light-transmitting molding layer is disposed on the first surface of the photosensitive chip and the first surface of the light-emitting device, and covers the photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting device;

[0010] A non-transparent molding layer covers the first surface of the substrate, the surface of the photosensitive chip, the surface of the light-emitting device, and the side surface of the transparent molding layer, and the non-transparent molding layer exposes the upper surface of the transparent molding layer.

[0011] As an optional implementation, the substrate includes a first surface and a second surface disposed opposite to and electrically connected to the first surface, wherein the second surface of the substrate has a welding structure.

[0012] As an optional implementation, the light-transmitting encapsulation layer includes a first light-transmitting encapsulation layer located on the first surface of the photosensitive chip and a second light-transmitting encapsulation layer located on the first surface of the light-emitting device.

[0013] As an optional implementation, the upper surface of the first light-transmitting plastic sealant is flush with the upper surface of the non-light-transmitting plastic sealant, or the upper surface of the second light-transmitting plastic sealant is flush with the upper surface of the non-light-transmitting plastic sealant, or the upper surfaces of the first light-transmitting plastic sealant, the second light-transmitting plastic sealant, and the non-light-transmitting plastic sealant are flush with each other.

[0014] As an optional implementation, the first and second light-transmitting plastic sealant layers are made of the same material and have the same thickness.

[0015] As an optional implementation, the sensor packaging structure further includes a third light-transmitting plastic sealant layer, which is located on the surface of the first light-transmitting plastic sealant layer or the second light-transmitting plastic sealant layer.

[0016] As an optional implementation, when the third light-transmitting molding layer is located on the surface of the first light-transmitting molding layer, the upper surface of the third light-transmitting molding layer, the upper surface of the second light-transmitting molding layer, and the upper surface of the non-light-transmitting molding layer are flush; when the third light-transmitting molding layer is located on the surface of the second light-transmitting molding layer, the upper surface of the third light-transmitting molding layer, the upper surface of the first light-transmitting molding layer, and the upper surface of the non-light-transmitting molding layer are flush.

[0017] As an optional implementation, the sensor packaging structure further includes a third light-transmitting molding layer, which covers the upper surface of the non-light-transmitting molding layer, the upper surface of the first light-transmitting molding layer, and the upper surface of the second light-transmitting molding layer.

[0018] As an optional implementation, the sensor packaging structure further includes a chip encapsulation structure that encapsulates the sidewalls and top of the photosensitive chip. The chip encapsulation structure exposes a light-transmitting encapsulation layer on the surface of the photosensitive chip. The non-light-transmitting encapsulation layer covers the first surface of the substrate and the side surface of the chip encapsulation structure, and exposes the light-transmitting encapsulation layer on the surface of the chip encapsulation structure and the photosensitive chip.

[0019] As an optional implementation, the sensor packaging structure further includes a chip encapsulation structure that encapsulates the sidewalls and top of the light-emitting device. The chip encapsulation structure exposes a light-transmitting encapsulation layer on the surface of the photosensitive chip. The non-light-transmitting encapsulation layer covers the first surface of the substrate and the side surface of the chip encapsulation structure, and exposes the light-transmitting encapsulation layer on the surface of the chip encapsulation structure and the light-emitting device.

[0020] As an optional implementation, the substrate is at least one of an organic substrate, a ceramic substrate, a glass substrate, and a silicon substrate.

[0021] As an optional implementation, the first surface of the substrate is electrically connected to the photosensitive chip and the light-emitting device via flip-chip bonding or wire bonding.

[0022] As an optional implementation, the size of the light-transmitting molding layer does not exceed the first surface size of the photosensitive chip and light-emitting device corresponding to it.

[0023] As an optional implementation, the light-transmitting molding layer is one of the following: a light-transmitting epoxy resin molding layer, a light-transmitting polyimide resin molding layer, a light-transmitting benzocyclobutene resin molding layer, or a light-transmitting polybenzoxazole resin molding layer.

[0024] As an optional implementation, the light-transmitting sealing layer is a light-filtering and light-transmitting sealing layer.

[0025] As an optional implementation, the first surface of the photosensitive chip and the light-emitting device is provided with electrodes, the second surface of the photosensitive chip and the light-emitting device is provided with an electrical connection region, and the photosensitive chip and the light-emitting device are provided with a through-silicon via structure for electrically connecting the electrodes and the electrical connection region.

[0026] The beneficial effects of this utility model are:

[0027] This invention uses a non-transparent plastic sealant layer to seal the photosensitive chip, the light-emitting device, and the substrate, so that the photosensitive chip and the light-emitting device are sealed separately. Furthermore, a transparent plastic sealant layer is provided on the upper surface of the photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting device, so that dust is avoided from adhering to the surface of the photosensitive chip and the light-emitting device during subsequent packaging process, which would affect the detection effect and quality of the sensor.

[0028] The features and advantages of this utility model will be described in detail through embodiments and accompanying drawings. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a sensor packaging structure using a single-layer transparent plastic seal, according to an embodiment of the present invention.

[0030] Figure 2This is a schematic diagram of a sensor packaging structure using a double-layer transparent plastic seal, according to an embodiment of the present invention.

[0031] Figure 3 This is a schematic diagram of a sensor packaging structure using a double-layer transparent plastic seal, according to an embodiment of the present invention.

[0032] Figure 4 This is a schematic diagram of the sensor packaging structure according to another embodiment of the present invention.

[0033] Figure 5 This is a schematic diagram of the photosensitive chip packaging structure according to an embodiment of the present invention.

[0034] Figure 6 This is a schematic diagram of the photosensitive chip packaging structure according to an embodiment of the present invention.

[0035] Figure 7 This is a schematic diagram of the sensor packaging structure according to another embodiment of the present invention.

[0036] Figure 8 This is a schematic diagram of the packaging structure of the light-emitting device according to an embodiment of the present invention.

[0037] In the figure: 1. Substrate; 2. Non-transparent molding layer; 3. Photosensitive chip; 4. Light-emitting device; 5. First transparent molding layer; 6. Chip molding structure; 7. Second transparent molding layer; 8. Third transparent molding layer; 9. Light-emitting device molding structure; 30. Through-silicon via structure; 31. Photosensitive area; 32. Electrode; 33. Electrical connection area; 41. Light-emitting area. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. In the description of this application, it should be noted that the terms "inner," "outer," etc., indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0039] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] The present invention will now be described in detail with reference to the accompanying drawings.

[0041] See Figures 1 to 8 This embodiment provides a sensor packaging structure, including:

[0042] substrate1;

[0043] Photosensitive chip 3 is disposed on the first surface of substrate 1 and electrically connected to substrate 1. The first surface of photosensitive chip 3 is provided with photosensitive area 31.

[0044] Light-emitting device 4 is disposed on the first surface of substrate 1 and electrically connected to substrate 1. Light-emitting device 4 is disposed at intervals from photosensitive chip 3. Light-emitting area 41 is provided on the first surface of light-emitting device 4.

[0045] A light-transmitting molding layer is disposed on the first surface of the photosensitive chip 3 and the first surface of the light-emitting device 4, and covers the photosensitive area 31 of the photosensitive chip 3 and the light-emitting area 41 of the light-emitting device 4;

[0046] A non-transparent molding layer 2 covers the first surface of the substrate 1, the surface of the photosensitive chip 3, the surface of the light-emitting device 4, and the side surface of the transparent molding layer, and the non-transparent molding layer 2 exposes the upper surface of the transparent molding layer.

[0047] Specifically, substrate 1 can be any one or a combination of organic substrate, ceramic substrate, glass substrate, and silicon substrate. Substrate 1 has a first surface and a second surface that are electrically connected to each other, with the second surface opposite the first surface. The second surface of substrate 1 has a welding structure.

[0048] In this embodiment, the first surface of the substrate 1 and the flip-chip photosensitive chip 3 and the light-emitting device 4 are electrically connected by conductive lines or welded parts formed using bump technology.

[0049] The welded parts are of the solder ball structure. The solder balls can be one or more of the following: tin, indium, titanium, copper, aluminum, silver, palladium, gold, thallium, tin, and nickel. For example, tin solder balls, tin-lead solder balls, tin-silver solder balls, tin-silver-copper solder balls, or copper solder balls, etc.

[0050] In other embodiments, the first surface of the substrate 1 is electrically connected to the photosensitive chip 3 and the light-emitting device 4 via wire bonding.

[0051] The light-emitting device 4 can be one of the following: an infrared radiation light-emitting device, a light-emitting diode, or a vertical cavity surface-emitting laser.

[0052] In this embodiment, refer to Figure 8 The light-emitting device 4 has a first surface and a second surface opposite to the first surface. The first surface of the light-emitting device 4 is provided with a light-emitting area 41, and the second surface of the light-emitting device 4 is provided with an electrical connection area. The light-emitting device 4 and the substrate 1 are electrically connected by the electrical connection area.

[0053] The first surface of the light-emitting device 4 is provided with an electrode, and the light-emitting device 4 is provided with a through-silicon via structure for electrically connecting the electrode and the electrical connection area.

[0054] The photosensitive chip 3 is used to detect the light source signal emitted by the light-emitting device 4 or the light source signal emitted by an external light source. The photosensitive chip 3 has a first surface and an opposite second surface. The first surface of the photosensitive chip 3 is provided with a photosensitive area 31, and the second surface of the photosensitive chip 3 is provided with an electrical connection area. The photosensitive chip 3 and the substrate 1 are electrically connected by the electrical connection area on the second surface of the photosensitive chip 3.

[0055] In one embodiment, see Figure 5 The first surface of the photosensitive chip 3 is provided with an electrode 32 and a photosensitive area 31, the second surface of the photosensitive chip 3 is provided with an electrical connection area 33, and the photosensitive chip 31 is provided with a through-silicon via structure 30 for electrically connecting the electrode 32 and the electrical connection area 33.

[0056] Because the through-silicon via (TSV) structure allows direct electrical connection between the electrodes on the first surface of the photosensitive chip 3 and the electrical connection area on the second surface of the light-emitting device 4, without the need for wire bonding, the problem of the mold having to be far away from the metal leads is not required when forming the opaque plastic seal. This improves the flexibility and freedom of packaging structure manufacturing, and allows for the pursuit of the optical performance of the packaging structure to the maximum extent.

[0057] In other embodiments, wire bonding can also be used to electrically connect the electrodes on the first surface of the photosensitive chip and the light-emitting device to the substrate.

[0058] In this embodiment, refer to Figure 1 The light-transmitting plastic sealant includes a first light-transmitting plastic sealant 5 located on the first surface of the photosensitive chip 3 and a second light-transmitting plastic sealant 7 located on the first surface of the light-emitting device 4.

[0059] The material of the light-transmitting plastic seal is a light-transmitting resin, such as light-transmitting epoxy resin, light-transmitting polyimide resin, light-transmitting benzocyclobutene resin, or light-transmitting polybenzoxazole resin. The light-transmitting plastic seal can be formed by injection molding, compression molding, or transfer molding.

[0060] In one embodiment, the light-transmitting sealing layer is a non-filtering light-transmitting sealing layer.

[0061] In other embodiments, depending on the encapsulation requirements, the light-transmitting plastic sealant is a light-filtering and light-transmitting plastic sealant, and the light-transmitting resin is doped with an optical absorber, such as a blue light optical absorber, a green light optical absorber, etc.

[0062] In this embodiment, the first light-transmitting molding layer 5 and the second light-transmitting molding layer 7 are made of the same material and have the same thickness. The first light-transmitting molding layer 5 and the second light-transmitting molding layer 7 can be formed together, or they can be formed separately on the surfaces of the photosensitive chip 3 and the light-emitting device 4.

[0063] In other embodiments, the materials and thicknesses of the first light-transmitting plastic sealant 5 and the second light-transmitting plastic sealant 7 may also be different.

[0064] The material of the non-transparent plastic seal 2 is an opaque resin, such as opaque epoxy resin, opaque polyimide resin, opaque benzocyclobutene resin or opaque polybenzoxazole resin. The non-transparent plastic seal can be formed by injection molding, compression molding or transfer molding.

[0065] Since the opaque plastic encapsulation layer 2 is opaque, the light-emitting device and the photosensitive device are isolated by the opaque plastic encapsulation layer 2, without the need for an additional opaque outer shell, which saves packaging costs, is compatible with existing packaging processes, and the final sensor packaging structure has a small thickness, which is conducive to improving the freedom and flexibility of packaging structure manufacturing.

[0066] The bottom surface of the first light-transmitting plastic sealant 5 is not less than the upper surface of the photosensitive area 31 of the photosensitive chip 3, and the bottom surface of the second light-transmitting plastic sealant 7 is not less than the upper surface of the light-emitting area 41 of the light-emitting device 4.

[0067] The dimensions of the bottom surface of the light-transmitting plastic seal layer do not exceed the first surface dimensions of the photosensitive chip 3 and the light-emitting device 4 that are correspondingly sealed.

[0068] For example, during the encapsulation process, the size of the first transparent plastic encapsulation layer 5 is smaller than the first surface size of the photosensitive chip 3 but larger than the size of the upper surface of the photosensitive area 31, and the size of the second transparent plastic encapsulation layer 7 is equal to the first surface size of the light-emitting device 4 but larger than the size of the upper surface of the light-emitting area 41.

[0069] Alternatively, the size of the first transparent plastic sealant 5 is equal to the first surface size of the photosensitive chip 3 and greater than the size of the upper surface of the photosensitive area 31, and the size of the second transparent plastic sealant 7 is equal to the first surface size of the light-emitting device 4 and greater than the size of the upper surface of the light-emitting area 41.

[0070] Alternatively, the size of the first transparent plastic sealant is smaller than the first surface size of the photosensitive chip 3 and larger than the size of the upper surface of the photosensitive area 31, and the size of the second transparent plastic sealant 7 is smaller than the first surface size of the light-emitting device 4 and larger than the size of the upper surface of the light-emitting area 41.

[0071] Alternatively, the size of the first transparent plastic sealant 5 is smaller than the first surface size of the photosensitive chip 3 and equal to the size of the upper surface of the photosensitive area 31, and the size of the second transparent plastic sealant 7 is smaller than the first surface size of the light-emitting device 4 and equal to the size of the upper surface of the light-emitting area 41.

[0072] See Figure 1 The upper surface of the first transparent plastic sealant 5, the upper surface of the second transparent plastic sealant 7, and the upper surface of the non-transparent plastic sealant 2 are flush.

[0073] Since the thicknesses of the light-emitting device 4 and the photosensitive chip 3 are often different, the heights of the upper surfaces of the first light-transmitting plastic sealant 5 and the second light-transmitting plastic sealant 7 may also be different. For example, the upper surface of the first light-transmitting plastic sealant 5 may be flush with the upper surface of the non-light-transmitting plastic sealant 2, but the upper surfaces of the first light-transmitting plastic sealant 5 and the second light-transmitting plastic sealant 7 may have a height difference, or the upper surface of the second light-transmitting plastic sealant 7 may be flush with the upper surface of the non-light-transmitting plastic sealant 2, but the upper surfaces of the first light-transmitting plastic sealant 5 and the second light-transmitting plastic sealant 7 may have a height difference.

[0074] In some other embodiments, the sensor packaging structure further includes a third light-transmitting plastic sealant 8, which is located on the upper surface of the first light-transmitting plastic sealant 5 or the second light-transmitting plastic sealant 7.

[0075] For details, please refer to Figure 3 When the upper surface of the first light-transmitting plastic sealant 5 is flush with the upper surface of the non-light-transmitting plastic sealant 2, but the upper surface of the second light-transmitting plastic sealant 7 is lower than the upper surface of the first light-transmitting plastic sealant 2, the upper surface of the second light-transmitting plastic sealant 7 also has a third light-transmitting plastic sealant 8, forming a double-layer light-transmitting plastic sealant on the upper surface of the light-emitting device 4, so that the upper surfaces of the third light-transmitting plastic sealant 8, the first light-transmitting plastic sealant 5, and the non-light-transmitting plastic sealant 2 are flush.

[0076] In other embodiments, the upper surface of the second light-transmitting plastic sealant 7 may be flush with the upper surface of the non-light-transmitting plastic sealant 2, but the upper surface of the first light-transmitting plastic sealant 5 may be lower than the upper surface of the second light-transmitting plastic sealant 7. The upper surface of the second light-transmitting plastic sealant 7 may also have a third light-transmitting plastic sealant 5, forming a double-layer light-transmitting plastic sealant on the upper surface of the sensing chip 3, so that the upper surfaces of the third light-transmitting plastic sealant 8, the second light-transmitting plastic sealant 7, and the non-light-transmitting plastic sealant 2 are flush.

[0077] In other embodiments, please refer to Figure 2 The third light-transparent molding layer 8 covers the upper surface of the non-light-transparent molding layer 2 and the upper surface of the light-transparent molding layer.

[0078] Specifically, the third light-transmitting plastic sealant 8 covers the upper surface of the non-light-transmitting plastic sealant 2, the upper surface of the first light-transmitting plastic sealant 5, and the upper surface of the second light-transmitting plastic sealant 7.

[0079] Since the thicknesses of the light-emitting device 4 and the photosensitive chip 3 are often different, the heights of the upper surfaces of the first transparent plastic sealant layer 5 and the second transparent plastic sealant layer 7 may also be different. During the encapsulation process of the non-transparent plastic sealant layer 2, the non-transparent plastic sealant layer 2 will cover the thinner transparent plastic sealant layer on the surface of the light-emitting device 4 and the photosensitive chip 3. Therefore, it is necessary to expose the transparent plastic sealant layer on the surface of the light-emitting device 4 and the photosensitive chip 3 through a grinding process. However, this can easily lead to one of the transparent plastic sealant layers being ground too thin. Therefore, a third transparent plastic sealant layer 8 is formed on the upper surface of the non-transparent plastic sealant layer 2 and the upper surface of the transparent plastic sealant layer, which is beneficial to the normal operation of the sensor.

[0080] In one embodiment, the light-emitting device 4 and the photosensitive chip 3 are bare dies.

[0081] In another embodiment, the sensor packaging structure may also employ pre-packaged light-emitting device 4 and photosensitive chip 3, and further form a sensor packaging structure.

[0082] For details, please refer to Figures 4 to 6 The sidewalls and top of the photosensitive chip 3 are wrapped with a chip molding structure 6. The chip molding structure 6 exposes the first light-transmitting molding layer 5 on the surface of the photosensitive chip 3. The non-light-transmitting molding layer 2 covers the first surface of the substrate 1 and the side surface of the chip molding structure 6, and exposes the first light-transmitting molding layer 5 on the surface of the chip molding structure 6 and the photosensitive chip 3. It is electrically connected to the substrate through the electrical connection area on the second surface of the photosensitive chip 3.

[0083] The photosensitive chip 3, the chip encapsulation structure 6, and the light-transmitting encapsulation layer 5 located on the first surface of the photosensitive chip 3 can be prepared in advance in other packaging processes. The photosensitive chip 3, the chip encapsulation structure 6, and the light-transmitting encapsulation layer 5 located on the first surface of the photosensitive chip 3 constitute a photosensitive chip pre-packaged structure.

[0084] In the fabrication of the photosensitive chip pre-packaged structure, the chip encapsulation structure 6 may cover the side surface of the photosensitive chip 3, the upper surface of the photosensitive chip 3 exposed outside the first transparent encapsulation layer 5, and the side surface of the first transparent encapsulation layer 5. The non-transparent encapsulation layer 2 may cover the outer side surface and bottom surface of the chip encapsulation structure 6, as well as the bottom surface of the photosensitive chip 3 and the first surface of the substrate 1. Alternatively, the chip encapsulation structure 6 may cover the side surface and bottom surface of the photosensitive chip 3 and the side surface of the first transparent encapsulation layer 5, while the non-transparent encapsulation layer 2 may cover the outer side surface of the chip encapsulation structure 6 and the remaining upper surface of the substrate 1.

[0085] In other embodiments, see Figure 7 and Figure 8 The light-emitting device 4 has a light-emitting device encapsulation structure 9 on its sidewall and top. The light-emitting device encapsulation structure 9 exposes a second light-transmitting encapsulation layer 7 on the surface of the light-emitting device 4. The non-light-transmitting encapsulation layer 2 covers the first surface of the substrate 1 and the side surface of the light-emitting device 4, and exposes the light-emitting device encapsulation structure 9 and the second light-transmitting encapsulation layer 7 on the surface of the light-emitting device 4.

[0086] The light-emitting device 4, the light-emitting device encapsulation structure 9, and the second light-transmitting encapsulation layer 7 on the surface of the light-emitting device 4 can be prepared in advance in other packaging processes. The light-emitting device 4, the light-emitting device encapsulation structure 9, and the second light-transmitting encapsulation layer 7 on the surface of the light-emitting device 4 constitute a pre-encapsulated structure for the light-emitting device.

[0087] The light-emitting device encapsulation structure 9 can be configured to cover the side surface of the light-emitting device 4, the upper surface of the light-emitting device 4 exposed outside the second transparent encapsulation layer 7, and the side surface of the second transparent encapsulation layer 7. The non-transparent encapsulation layer 2 can cover the outer side surface and bottom surface of the light-emitting device encapsulation structure, the bottom surface of the light-emitting device 4, and the first surface of the substrate 1. Alternatively, the light-emitting device encapsulation structure 9 can cover the side surface and bottom surface of the light-emitting device 4 and the side surface of the second transparent encapsulation layer 7, while the non-transparent encapsulation layer 2 can cover the outer side surface of the light-emitting device encapsulation structure and the remaining upper surface of the substrate 1.

[0088] In other embodiments, the light-emitting device 4 adopts a pre-packaged structure, and the photosensitive chip 3 adopts a pre-packaged structure.

[0089] The chip encapsulation structure 6 and the light-emitting device encapsulation structure 9 are made of opaque resin, such as opaque epoxy resin, opaque polyimide resin, opaque benzocyclobutene resin, or opaque polybenzoxazole resin. The chip encapsulation structure 6 and the light-emitting device encapsulation structure 9 can be formed by injection molding, compression molding, or transfer molding.

[0090] The above embodiments are illustrative of the present invention and are not intended to limit the present invention. Any simple modifications to the present invention are within the protection scope of the present invention.

Claims

1. A sensor package structure, characterized by ,include: substrate; A photosensitive chip is disposed on a first surface of a substrate and electrically connected to the substrate, and a photosensitive area is provided on the first surface of the photosensitive chip. A light-emitting device is disposed on a first surface of a substrate and electrically connected to the substrate. The light-emitting device is disposed at a distance from a photosensitive chip. The first surface of the light-emitting device is provided with a light-emitting area. A light-transmitting molding layer is disposed on the first surface of the photosensitive chip and the first surface of the light-emitting device, and covers the photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting device; A non-transparent molding layer covers the first surface of the substrate, the surface of the photosensitive chip, the surface of the light-emitting device, and the side surface of the transparent molding layer, and the non-transparent molding layer exposes the upper surface of the transparent molding layer.

2. The sensor package structure of claim 1, wherein: The substrate includes a first surface and a second surface disposed opposite to and electrically connected to the first surface, wherein the second surface of the substrate has a welding structure.

3. The sensor package structure of claim 1, wherein: The light-transparent molding layer includes a first light-transparent molding layer located on the first surface of the photosensitive chip and a second light-transparent molding layer located on the first surface of the light-emitting device.

4. The sensor package structure of claim 3, wherein: The upper surface of the first light-transmitting plastic sealant is flush with the upper surface of the non-light-transmitting plastic sealant, or the upper surface of the second light-transmitting plastic sealant is flush with the upper surface of the non-light-transmitting plastic sealant, or the upper surfaces of the first light-transmitting plastic sealant, the second light-transmitting plastic sealant, and the non-light-transmitting plastic sealant are flush with each other.

5. The sensor package structure of claim 3, wherein: The first and second light-transmitting plastic sealant layers are made of the same material and have the same thickness.

6. The sensor package structure of claim 3, wherein: It also includes a third light-transmitting plastic sealant layer, which is located on the surface of the first light-transmitting plastic sealant layer or the second light-transmitting plastic sealant layer.

7. The sensor package structure of claim 6, wherein: When the third light-transmitting plastic sealant is located on the surface of the first light-transmitting plastic sealant, the upper surface of the third light-transmitting plastic sealant, the upper surface of the second light-transmitting plastic sealant, and the upper surface of the non-light-transmitting plastic sealant are flush; When the third light-transmitting plastic sealant is located on the surface of the second light-transmitting plastic sealant, the upper surface of the third light-transmitting plastic sealant, the upper surface of the first light-transmitting plastic sealant, and the upper surface of the non-light-transmitting plastic sealant are flush.

8. The sensor package structure of claim 3, wherein: It also includes a third light-transmitting molding layer, which covers the upper surface of the non-light-transmitting molding layer, the upper surface of the first light-transmitting molding layer, and the upper surface of the second light-transmitting molding layer.

9. The sensor package structure of claim 1, wherein: It also includes a chip encapsulation structure that encapsulates the sidewalls and top of the photosensitive chip, the chip encapsulation structure exposing a light-transmitting encapsulation layer on the surface of the photosensitive chip, and the non-light-transmitting encapsulation layer covering the first surface of the substrate, the side surface of the chip encapsulation structure, and exposing the light-transmitting encapsulation layer on the surface of the chip encapsulation structure and the photosensitive chip.

10. The sensor package structure of claim 1, wherein: It also includes a chip encapsulation structure that encapsulates the sidewalls and top of the light-emitting device. The chip encapsulation structure exposes a light-transmitting encapsulation layer on the surface of the photosensitive chip. The non-light-transmitting encapsulation layer covers the first surface of the substrate, the side surface of the chip encapsulation structure, and exposes the light-transmitting encapsulation layer on the surface of the chip encapsulation structure and the light-emitting device.

11. The sensor package structure of claim 1, wherein: The substrate is at least one of organic substrate, ceramic substrate, glass substrate and silicon substrate.

12. The sensor package structure of claim 1, wherein: The first surface of the substrate is electrically connected to the photosensitive chip and the light-emitting device via flip-chip bonding or wire bonding.

13. The sensor package structure of claim 1, wherein: The size of the light-transmitting plastic sealing layer is not more than the first surface size of the corresponding plastic-sealed photosensitive chip and light-emitting device.

14. The sensor package structure of claim 1, wherein: The light-transmitting plastic sealing layer is one of a light-transmitting epoxy resin plastic sealing layer, a light-transmitting polyimide resin plastic sealing layer, a light-transmitting benzocyclobutene resin plastic sealing layer, and a light-transmitting polybenzoxazole resin plastic sealing layer.

15. The sensor package structure of claim 1, wherein: The light-transmitting plastic sealing layer is a light-filtering light-transmitting plastic sealing layer.

16. The sensor package structure of claim 1, wherein: The first surface of the photosensitive chip and the light-emitting device is provided with an electrode, the second surface of the photosensitive chip and the light-emitting device is provided with an electrical connection area, and the photosensitive chip and the light-emitting device are provided with a through-silicon via structure for electrically connecting the electrode and the electrical connection area.

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