An inverter and photovoltaic power generation system

Abstract

The embodiment of the application discloses an inverter and a photovoltaic power generation system, wherein the inverter can be applied to a photovoltaic scene, a vehicle-mounted scene and the like. The inverter comprises a shell, a device group and an infrared temperature measurement component. The device group and the infrared temperature measurement component are arranged in the shell, wherein the infrared temperature measurement component is used for temperature monitoring of the device group. The infrared temperature measurement component is a non-contact temperature measurement component, has a wide measurement range, can simultaneously perform temperature detection on multiple devices, can greatly improve the comprehensiveness of temperature detection, and can reduce the situation that some devices are missed in monitoring, for example, a bus capacitor, a conductive copper bar and the like.

Description

Technical Field

[0001] This application relates to the field of electronic power technology, and in particular to an inverter and a photovoltaic power generation system. The inverter may specifically be a photovoltaic inverter or an inverter used in vehicle scenarios. Background Technology

[0002] Inverters, also known as converters, are commonly used in renewable energy applications such as photovoltaics and in automotive applications. They convert direct current (DC) to alternating current (AC) to meet the needs of household appliances, industrial equipment, and other applications. Taking renewable energy applications as an example, as the scale of equipment continues to expand, the power of inverters is also increasing, and the number of internal components is constantly increasing. Accidents such as burnout and explosions due to component overheating are frequent, making it difficult to guarantee the safe use of inverters. Utility Model Content

[0003] This application provides an inverter and a photovoltaic power generation system, wherein the inverter is equipped with an infrared temperature measurement component, which can monitor the temperature of as many components as possible in the internal component group of the inverter, so as to improve the comprehensiveness of temperature monitoring.

[0004] Firstly, embodiments of this application provide an inverter, specifically applicable to photovoltaic or automotive applications, comprising a housing, a device group, and an infrared temperature measurement component. The device group includes multiple devices. Both the device group and the infrared temperature measurement component are housed within the housing, wherein the infrared temperature measurement component is used for temperature monitoring of the device group.

[0005] The inverter provided in this application embodiment can monitor the temperature of devices within the inverter using an infrared temperature measuring component. This infrared temperature measuring component is a non-contact type, its installation position is largely unaffected by the device being monitored, and it has a wide measurement range, allowing simultaneous temperature detection of multiple devices. This significantly improves the comprehensiveness of temperature detection; for example, devices that would not be monitored in related technologies, such as bus capacitors and conductive copper busbars, can also be monitored in this application embodiment, reducing the possibility of missed monitoring. Furthermore, due to the wide measurement range of this infrared temperature measuring component, a smaller number of components are sufficient to meet the temperature monitoring requirements, thus reducing costs. Simultaneously, because the number of infrared temperature measuring components is small, the structure of the additional signal acquisition circuit and other components can be relatively simple.

[0006] By setting up infrared temperature measurement components to monitor the temperature of the device group, the temperature status of the corresponding devices in the device group can be grasped in a timely manner. Once the temperature of a device in the device group rises abnormally, staff can intervene in time, which can largely avoid more dangerous accidents such as device burnout or explosion, and is more conducive to ensuring the safe use of the inverter.

[0007] The number of infrared temperature measuring components can be one, or at least two. In this case, the infrared temperature measuring components can be arranged alternately in the inverter housing. The infrared temperature measuring components can be infrared array temperature sensors to provide a larger monitoring angle, or other types of infrared temperature sensors can be used. There are no restrictions here, as long as they meet the requirements of use.

[0008] In one possible implementation, the device group includes a first circuit board and a first chip, with both the first chip and the infrared temperature sensing component mounted on the first circuit board. The infrared temperature sensing component can communicate with the first chip, meaning the real-time temperature information measured by the infrared temperature sensing component can be directly received by the chip inside the inverter, and this real-time temperature information can be used to determine whether any device in the device group inside the housing is overheating. This results in a relatively short signal transmission path for the infrared temperature sensing component, and the signal acquisition circuit for the infrared temperature sensing component can be relatively simple.

[0009] In addition to the above, in some other implementations of this application, an external controller can be set outside the inverter, and then the external controller is connected to the infrared temperature measuring component. The external controller then receives the real-time temperature information measured by the infrared temperature measuring component and determines whether the device group has an over-temperature problem based on the real-time temperature information. In this implementation, since the external controller is located outside the inverter, it is not affected by the internal environment of the inverter, and the acquisition and judgment of real-time temperature information can be more accurate, with relatively better anti-interference capabilities.

[0010] Alternatively, a controller can be integrated into the infrared temperature measurement component; this controller can be called an internal controller. This internal controller can then receive and analyze the real-time temperature information collected by the infrared temperature measurement component, which is also feasible.

[0011] In one possible implementation, the first circuit board has a receiving slot, in which the infrared temperature measuring component is mounted. Specifically, the infrared temperature measuring component may have a connector, the outer contour of which may match the inner contour of the receiving slot. The infrared temperature measuring component can be inserted into the receiving slot through the connector to achieve reliable mounting of the infrared temperature measuring component on the first circuit board. A certain interference fit may exist between the connector and the receiving slot to ensure a relatively stable connection between them.

[0012] In addition to the above-mentioned plug-in connection scheme, the infrared temperature measuring component and the first circuit board can also be connected by other connection methods such as welding, bonding, snap-fitting, and screw connection. In short, as long as the reliability requirements of the connection can be guaranteed, it is acceptable.

[0013] In one possible implementation, the first circuit board is provided with a connector, which may contain a matching gold finger. The infrared temperature measuring component includes a temperature sensor body and a connecting circuit board, wherein the temperature sensor body is mainly used to implement the temperature measuring function of the infrared temperature measuring component. The temperature sensor body can be mounted on the connecting circuit board and can communicate with the connecting circuit board. The connecting circuit board has a matching gold finger. In specific installation, the connecting circuit board can be plugged into the connector, and the matching gold finger and the matching gold finger can be connected. In this way, not only can the infrared temperature measuring component be mounted and fixed on the first circuit board, but also the communication connection between the infrared temperature measuring component and the first chip can be realized simultaneously.

[0014] In one possible implementation, a position adjustment mechanism is also included. The infrared temperature measuring component is mounted on the position adjustment mechanism, which is used to adjust the position of the infrared temperature measuring component within the housing, thereby adjusting the monitoring direction of the infrared temperature measuring component. This increases the adjustability of the infrared temperature measuring component in this embodiment during use, better meeting the requirements of use.

[0015] The aforementioned position adjustment mechanism may be mounted on the first circuit board. Alternatively, the aforementioned position adjustment mechanism may also be mounted in other locations inside the housing.

[0016] In one possible implementation, the position adjustment mechanism includes a first drive unit, which drives the infrared temperature measuring component to rotate, thereby adjusting the monitoring direction of the infrared temperature measuring component. Specifically, the first drive unit can be a rotary drive element capable of outputting rotational displacement, such as a motor or a rotary cylinder.

[0017] In one possible implementation, the position adjustment mechanism includes a second drive unit for driving the infrared temperature measuring component to perform linear displacement. This also allows for adjustment of the installation position of the infrared temperature measuring component, thereby regulating its monitoring range.

[0018] In one possible implementation, the second driving unit includes at least one of a first driving component, a second driving component, and a third driving component. The first driving component is used to drive the infrared temperature measuring component to perform linear displacement along a first direction. The second driving component is used to drive the infrared temperature measuring component to perform linear displacement along a second direction. The third driving component is used to drive the infrared temperature measuring component to perform linear displacement along a third direction. Any two of the first direction, the second direction, and the third direction are arranged at an included angle.

[0019] Taking the first driving component as an example, in one example, the first driving component can be a linear drive element that can directly output linear displacement, such as a linear cylinder or a linear hydraulic cylinder; in another example, the first driving component can be a rotary drive element that can directly output rotary displacement, such as a motor or a rotary cylinder. In this case, the first driving component can also include a displacement conversion structure in the form of a gear and rack structure, a lead screw structure, a pulley structure, etc., so as to convert the rotary displacement directly output by the rotary drive element into the linear displacement required by the first driving component.

[0020] In one possible implementation, the inverter also includes an alarm component, located inside or outside the housing. The alarm component and the infrared temperature measurement component can be directly or indirectly connected in communication. When the infrared temperature measurement component detects an over-temperature problem within the device group, the alarm component can be activated under control to issue an alarm message, thereby alerting personnel. Specifically, the alarm component can be a light alarm, an audible-visual alarm, or a sound alarm, etc.

[0021] Secondly, embodiments of this application also provide a photovoltaic power generation system, including photovoltaic modules and an inverter, wherein the inverter is the inverter involved in the first aspect and any of the implementations of the first aspect.

[0022] Because the inverter is equipped with an infrared temperature measurement component, it can effectively monitor the temperature of the internal components, which can greatly reduce the risk of burnout or explosion of components, thus ensuring the safe and reliable use of the inverter. Consequently, it can also ensure the safe and reliable use of the photovoltaic power generation system, thereby improving the efficiency of photovoltaic power generation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a photovoltaic power generation system provided in an embodiment of this application;

[0024] Figure 2 This is an internal structure diagram of an inverter provided in an embodiment of this application;

[0025] Figure 3 This is a connection structure diagram of an infrared temperature measuring component and a first circuit board.

[0026] Figure 4 This is an alternative connection structure diagram between the infrared temperature measurement component and the first circuit board;

[0027] Figure 5 This is a connection structure diagram of the first drive unit and the infrared temperature measurement component;

[0028] Figure 6 This is a connection structure diagram of the second drive unit and the infrared temperature measurement component.

[0029] Figure label:

[0030] 100 - Photovoltaic power generation system; 110 - Photovoltaic module; 120 - Inverter;

[0031] 200-Power Grid;

[0032] 1000 - Housing;

[0033] 2000 - Component group; 2100 - First circuit board; 2110 - Receiving slot; 2120 - Interlocking position; 2200 - First chip; 2300 - Second circuit board; 2400 - Capacitor;

[0034] 3000 - Infrared temperature measurement component; 3100 - Temperature sensor body; 3200 - Connecting circuit board; 3300 - Connector;

[0035] 4000 - Position adjustment mechanism; 4100 - First drive unit; 4200 - Second drive unit; 4210 - First drive component; 4220 - Second drive component; 4230 - Third drive component; 4240 - First slide rail; 4250 - Second slide rail; 4260 - Third slide rail. Detailed Implementation

[0036] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] In the description of the embodiments of this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," and "third" may explicitly or implicitly include one or more of that feature.

[0038] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0039] The directional terms mentioned in the embodiments of this application, such as "inner" and "outer", are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0040] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0041] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a photovoltaic power generation system provided in an embodiment of this application.

[0042] like Figure 1 As shown in the figure, this application provides a photovoltaic power generation system 100, including a photovoltaic module 110 and an inverter 120.

[0043] The photovoltaic module 110 includes photovoltaic panels, which can be made of semiconductor materials. These panels utilize the photovoltaic effect that occurs under sunlight to directly convert solar energy into electrical energy. In practical applications, multiple photovoltaic modules 110 are typically arranged to form a photovoltaic array, thereby improving the efficiency of solar energy utilization and increasing photovoltaic power generation. It should be understood that the photovoltaic module 110 in this embodiment can be a terrestrial photovoltaic module applied on land, or a floating photovoltaic module applied in lakes, oceans, etc., and is not limited thereto.

[0044] The photovoltaic module 110 has an output port that can be connected to the input terminal of the inverter 120, and the output terminal of the inverter 120 can be connected to the input terminal of the power grid 200. The photovoltaic module 110 is used to generate direct current (DC), and the inverter 120 is used to invert the DC to convert it into alternating current (AC) and input it into the power grid 200 to achieve grid-connected photovoltaic power.

[0045] In related technologies, with the rapid development of the photovoltaic industry, the power of photovoltaic modules is getting larger and larger. Correspondingly, the power of inverters is also getting larger and larger, and there are more and more internal components in the inverters. This leads to the inverters generating more heat during use, which may cause the components to overheat and cause accidents such as component burnout or explosion, which is not conducive to safe production.

[0046] In response to this, some technical solutions exist that involve adding a negative temperature coefficient thermistor (NTC) to the inverter to monitor the temperature of heat-generating components such as chips and insulated gate bipolar transistor (IGBT) modules. This effectively monitors the temperature of these components to determine if there is a risk of overheating. If such a risk is detected, timely intervention, such as manual intervention, can largely prevent more dangerous accidents such as component burnout or explosion.

[0047] However, the temperature measurement principle of NTC requires it to be in direct contact with the device being monitored. This greatly limits the application range of NTC, meaning that only a portion of the devices in the inverter can be equipped with NTC for temperature monitoring, while other devices without NTC cannot be monitored, resulting in relatively poor comprehensiveness of temperature monitoring in the inverter. Furthermore, it also leads to a larger number of NTCs in the inverter, resulting in higher costs.

[0048] To address the aforementioned issues, this application provides an inverter that uses an infrared temperature measuring component to monitor the temperature of its components. This infrared temperature measuring component is a non-contact type, its installation location is largely unaffected by the monitored components, and it has a wide measurement range, allowing simultaneous temperature monitoring of multiple components. This significantly improves the comprehensiveness of temperature detection. For example, components that would not be monitored in other technologies, such as bus capacitors and conductive copper busbars, can be monitored in this embodiment, reducing the likelihood of missed monitoring. Furthermore, due to the wide measurement range of this infrared temperature measuring component, a smaller number of components are sufficient to meet the temperature monitoring requirements, reducing costs. Simultaneously, the smaller number of infrared temperature measuring components also simplifies the design of additional signal acquisition circuits and other structural elements.

[0049] For details, please refer to Figures 2-4 , Figure 2 This is an internal structure diagram of an inverter provided in an embodiment of this application; Figure 3 This is a connection structure diagram of an infrared temperature measuring component and a first circuit board. Figure 4 This is an alternative connection structure diagram of the infrared temperature measurement component and the first circuit board.

[0050] like Figure 2 As shown in the figure, this application provides an inverter, including a housing 1000, a device group 2000, and an infrared temperature measuring component 3000.

[0051] The housing 1000 is the external structure of the inverter. Other components, such as the device group 2000 and the infrared temperature measurement component 3000, can be directly or indirectly installed inside the housing 1000 for integrated assembly, facilitating the transportation and installation of the inverter provided in this embodiment. Furthermore, the housing 1000 can largely determine the overall shape of the inverter. In some implementations, the housing 1000 can be roughly rectangular. In other implementations, the housing 1000 can be cylindrical or other irregular shapes, etc., without limitation.

[0052] In some implementations, such as Figure 2 As shown, the device group 2000 may include a first circuit board 2100, a first chip 2200, a second circuit board 2300, and a capacitor 2400, etc.

[0053] Both the first circuit board 2100 and the second circuit board 2300 can be printed circuit boards (PCBs). The first chip 2200 can be mounted on the first circuit board 2100, and the first chip 2200 may include a processor. The core of the processor can be, for example, a central processing unit (CPU), or another application-specific integrated circuit (ASIC). The processor can also be other general-purpose processors, digital signal processors (DSPs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The capacitor 2400 can be mounted on the second circuit board 2300.

[0054] It is understood that the above description of the specific types of device groups 2000 is only a combination of the embodiments of this application. Figure 2 The exemplary descriptions provided are not intended to limit the scope of the inverter and photovoltaic power generation system provided in the embodiments of this application. In some other implementations of the embodiments of this application, the device group 2000 may also be compared to... Figure 2 The number of components can be increased or decreased, without limitation, and can be determined based on the specific needs of use. For example, component group 2000 may also include a greater number of circuit boards and chips. Furthermore, component group 2000 may also include magnetic components such as inductors, conductive copper busbars, connecting cables, etc.

[0055] The number of infrared temperature measuring components 3000 can be one. In this case, the infrared temperature measuring component 3000 can have a relatively large monitoring angle, that is, a wide-angle infrared temperature measuring component 3000 can be used, so that the single infrared temperature measuring component 3000 can monitor the temperature of as many devices as possible in the device group 2000. Here, the embodiments of this application do not limit the monitoring angle of the infrared temperature measuring component 3000. In specific implementations, those skilled in the art can select according to actual needs, as long as the requirements are met. For example, the infrared temperature measuring component 3000 can be an infrared array temperature sensor, and its monitoring angle can be 110° × 75°, etc.

[0056] Alternatively, the number of infrared temperature measuring components 3000 can be at least two. In this case, each infrared temperature measuring component 3000 can be arranged at intervals within the housing 1000 to detect the temperature of the device group 2000 in different areas within the housing 1000, thereby improving the comprehensiveness of temperature monitoring of the device group 2000 within the housing 1000.

[0057] In some implementations, the infrared temperature measuring component 3000 can communicate with the first chip 2200. This means the real-time temperature information measured by the infrared temperature measuring component 3000 can be directly received by the chip inside the inverter, and this real-time temperature information can be used to determine whether any device in the internal component group 2000 of the housing 1000 is overheating. In this way, the signal transmission path of the infrared temperature measuring component 3000 is relatively short, and the signal acquisition circuit of the infrared temperature measuring component 3000 can be relatively simple.

[0058] Alternatively, in some other implementations of this application, an external controller can be installed outside the inverter, and then connected to the infrared temperature measuring component 3000. The external controller receives the real-time temperature information measured by the infrared temperature measuring component 3000 and uses this information to determine whether the device group 2000 has an overheating problem. In this implementation, because the external controller is located outside the inverter, it is not affected by the internal environment of the inverter, and the acquisition and judgment of real-time temperature information can be more accurate, providing relatively better anti-interference capabilities. The external controller and the infrared temperature measuring component 3000 can be connected by a cable or wirelessly via Bluetooth; in short, any method that enables signal transmission between the external controller and the infrared temperature measuring component 3000 is acceptable.

[0059] Alternatively, in some other implementations of the embodiments of this application, the infrared temperature measuring component 3000 may also integrate a controller (hereinafter referred to as an internal controller) so that the internal controller can receive and analyze the real-time temperature information collected by the infrared temperature measuring component 3000, which is also feasible.

[0060] It should be understood that the aforementioned real-time temperature information is image information, specifically a real-time temperature field image of the device group 2000 inside the housing 1000. The first chip 2200, the external controller, or the internal controller can pre-store fault-free temperature field images. By comparing the real-time temperature field image and the fault-free temperature field image, it is possible to determine which specific devices in the device group 2000 inside the housing 1000 have excessively high temperatures, and the temperature increase value of these devices can be calculated. Then, the temperature increase value can be compared with the preset value. In this way, it is possible to accurately determine whether these devices have overheating problems and accurately locate the devices with overheating problems. Here, the embodiments of this application do not limit the comparison method between the real-time temperature field image and the fault-free temperature field image. In practical applications, those skilled in the art can determine it according to specific needs, as long as it meets the requirements of use.

[0061] In some implementations, the infrared temperature measuring component 3000 can be mounted on the first circuit board 2100. This facilitates communication between the infrared temperature measuring component 3000 and the first chip 2200.

[0062] Combination Figure 3 In one embodiment, the first circuit board 2100 may be provided with a receiving groove 2110, and the infrared temperature measuring component 3000 may be installed in the receiving groove 2110. Specifically, the infrared temperature measuring component 3000 may be provided with a plug-in portion 3300, the outer contour of the plug-in portion 3300 and the inner contour of the receiving groove 2110 may be consistent, and the infrared temperature measuring component 3000 may be inserted into the receiving groove 2110 through the plug-in portion 3300, so as to achieve reliable installation of the infrared temperature measuring component 3000 on the first circuit board 2100.

[0063] Here, the embodiments of this application do not limit the specific shape of the outer contour of the plug-in portion 3300 and the inner contour of the receiving groove 2110. In practical applications, those skilled in the art can make selections according to specific needs, as long as the requirements of use are met. For example, the plug-in portion 3300 can be a cylindrical structure, and the receiving groove 2110 can be a circular hole. With this configuration, when the plug-in portion 3300 is inserted into the receiving groove 2110, the monitoring direction of the infrared temperature measuring component 3000 can be adjusted by rotating it, thereby increasing the adjustability of the infrared temperature measuring component 3000 in use in this embodiment of the application, and thus better meeting the requirements of use.

[0064] The number of the aforementioned receiving slots 2110 can be one, in which case the mounting position of the infrared temperature measuring component 3000 on the first circuit board 2100 is relatively unique. Or, as... Figure 3 As shown, the number of the above-mentioned receiving slots 2110 can also be at least two, and each receiving slot 2110 can be respectively set at different positions of the first circuit board 2100. At this time, by adjusting the position of the insertion part 3300 inserted into the receiving slot 2110, the installation position of the infrared temperature measuring component 3000 on the first circuit board 2100 can also be adjusted.

[0065] It should be noted that, Figure 3 The illustrated solution only achieves the mounting and fixing of the infrared temperature measuring component 3000 on the first circuit board 2100, but it cannot achieve a communication connection between the infrared temperature measuring component 3000 and the first chip 2200. In practice, a dedicated wiring connection structure can be set up to establish the signal transmission relationship between the infrared temperature measuring component 3000 and the first chip 2200. For example, connecting components in the form of connecting cables, flexible printed circuit boards (FPCs), etc., can be configured to connect the infrared temperature measuring component 3000 and the first chip 2200 through these connecting components. Alternatively, conductive material can be laid on the surface of the first circuit board 2100, or conductive material can be embedded inside the first circuit board 2100. This conductive material can be connected to the infrared temperature measuring component 3000 through welding, crimping, spring contact connections, etc.

[0066] Combination Figure 4 In another embodiment, the first circuit board 2100 may be provided with a plug-in position 2120, and the plug-in position 2120 is provided with a matching gold finger (not shown in the figure). The infrared temperature measuring component 3000 may include a temperature sensor body 3100 and a connecting circuit board 3200. The temperature sensor body 3100 is mainly used to realize the temperature measuring function of the infrared temperature measuring component 3000. The connecting circuit board 3200 can be a PCB, FPC, etc., which can communicate with the temperature sensor body 3100, and the connecting circuit board 3200 may be provided with a matching gold finger (not shown in the figure). In specific assembly, the connecting circuit board 3200 can be plugged into the plug-in position 2120, and the matching gold finger and the matching gold finger can be connected. In this way, not only can the infrared temperature measuring component 3000 be installed and fixed on the first circuit board 2100, but also the communication connection between the infrared temperature measuring component 3000 and the first chip 2200 can be realized simultaneously.

[0067] In addition to the two solutions mentioned above, in some other solutions of this application embodiment, the infrared temperature measuring component 3000 and the first circuit board 2100 can also be integrally molded, for example, the infrared temperature measuring component 3000 can be integrally molded by insert injection molding, which is also feasible.

[0068] In some implementations, the inverter provided in this application embodiment may also include an alarm component (not shown in the figure).

[0069] The alarm component can be located on the outside of the housing 1000, or it can be located on the inside of the housing 1000. The alarm component can communicate directly or indirectly with the infrared temperature measuring component 3000. When the infrared temperature measuring component 3000 detects an overheating problem in a device within the device group 2000, the alarm component can be activated under control to send an alarm message, thereby alerting personnel. The alarm component can be a light alarm, an audible-visual alarm, or a sound alarm, etc.

[0070] Please refer to Figure 5 and Figure 6 , Figure 5 This is a connection structure diagram of the first drive unit and the infrared temperature measurement component; Figure 6 This is a connection structure diagram of the second drive unit and the infrared temperature measurement component.

[0071] In some implementations, the inverter provided in this application embodiment may further include a position adjustment mechanism 4000, and the infrared temperature measuring component 3000 may be installed in the position adjustment mechanism 4000. The position adjustment mechanism 4000 is used to adjust the position of the infrared temperature measuring component 3000 within the housing 1000, thereby adjusting the monitoring direction of the infrared temperature measuring component 3000, increasing the adjustability of the infrared temperature measuring component 3000 during use in this application embodiment, and thus better meeting the requirements of use.

[0072] In one scheme, such as Figure 5 As shown, the position adjustment mechanism 4000 may include a first drive unit 4100. The first drive unit 4100 is used to drive the infrared temperature measuring component 3000 to rotate, thereby adjusting the monitoring direction of the infrared temperature measuring component 3000. Specifically, the first drive unit 4100 may be a rotary drive element capable of outputting rotational displacement, such as a motor or a rotary cylinder. In some detailed examples, the first drive unit 4100 may also include a transmission structure in the form of a gear structure, a pulley structure, or a sprocket structure, so as to adjust the transmission ratio between the rotary drive element and the infrared temperature measuring component 3000.

[0073] In another embodiment, the position adjustment mechanism 4000 may include a second drive unit 4200. The second drive unit 4200 is used to drive the infrared temperature measuring component 3000 to perform linear displacement, thereby adjusting the installation position of the infrared temperature measuring component 3000 to adjust its monitoring range.

[0074] For ease of description, embodiments of this application may define a first direction X, a second direction Y, and a third direction Z. Any two of the first direction X, the second direction Y, and the third direction Z may be set at an angle, such as 90 degrees.

[0075] In a detailed example, such as Figure 6 As shown, the second drive unit 4200 may include a first drive component 4210, a second drive component 4220, a third drive component 4230, a first slide rail 4240, a second slide rail 4250, and a third slide rail 4260. The first slide rail 4240 may extend along a first direction X, the second slide rail 4250 may extend along a second direction Y, and the third slide rail 4260 may extend along a third direction Z. The first drive component 4210 and the third slide rail 4260 may both be mounted on the first slide rail 4240, and the first drive component 4210 and the third slide rail 4260 are connected to drive the third slide rail 4260 to move along the first direction X. The second drive component 4220 and the first slide rail 4240 may both be mounted on the second slide rail 4250, and the second drive component 4220 may be connected to the first slide rail 4240 to drive the first slide rail 4240 to move along the second direction Y. Both the third drive component 4230 and the infrared temperature measuring component 3000 can be mounted on the third slide rail 4260. The third drive component 4230 can be connected to the infrared temperature measuring component 3000 to drive the infrared temperature measuring component 3000 to move along the third direction Z. With this configuration, the infrared temperature measuring component 3000 has displacement freedom in three directions: the first direction X, the second direction Y, and the third direction Z. This allows for better adjustment of the installation position of the infrared temperature measuring component 3000 within the housing 1000, thereby adjusting the monitoring range of the infrared temperature measuring component 3000.

[0076] The first driving component 4210, the second driving component 4220, and the third driving component 4230 described above can all output linear displacement. Taking the first driving component 4210 as an example, in one example, the first driving component 4210 can be a linear drive element that can directly output linear displacement, such as a linear cylinder or a linear hydraulic cylinder; in another example, the first driving component 4210 can be a rotary drive element that can directly output rotary displacement, such as a motor or a rotary cylinder. In this case, the first driving component 4210 can also include a displacement conversion structure in the form of a gear and rack structure, a lead screw structure, or a pulley structure, so as to convert the rotary displacement directly output by the rotary drive element into the linear displacement required to be output by the first driving component 4210.

[0077] It is understood that the above description of the structure of the second drive unit 4200 is only a combination of the embodiments of this application. Figure 6 This is an exemplary description and should not be construed as limiting the scope of the inverter and photovoltaic power generation system provided in the embodiments of this application. In some other implementations of the embodiments of this application, the second drive unit 4200 may also adopt other structural forms. For example, Figure 6 The positional relationships of the components shown can be adjusted to some extent. For example, the second slide rail 4250 can be slidably mounted on the first slide rail 4240 along the first direction X, and the third slide rail 4260 can be slidably mounted on the second slide rail 4250 along the second direction Y. Alternatively, the second drive unit 4200 may include only one or both of the first drive component 4210, the second drive component 4220, and the third drive component 4230. In this case, the second drive unit 4200 can control the infrared temperature measuring component 3000 to move in one or both directions.

[0078] In another embodiment, the position adjustment mechanism 4000 may include both the first drive unit 4100 and the second drive unit 4200 mentioned above, so that the infrared temperature measuring component 3000 can have greater adjustability.

[0079] In practical applications, as the inverter's lifespan changes, those skilled in the art can adjust the installation position of the infrared temperature measuring component 3000 within the housing 1000 using the aforementioned position adjustment mechanism 4000. This allows them to change the monitoring direction and range of the infrared temperature measuring component 3000, enabling adjustments to the object being monitored as needed. For example, during the initial use of the inverter, at least one infrared temperature measuring component 3000 can be controlled to monitor the temperature of high-heat-dissipation power devices such as the first chip 2200 in the device group 2000, minimizing the risk of overheating. Similarly, after a certain period of inverter use, components with relatively short lifespans, such as the capacitor 2400, are more prone to overheating damage. In this case, at least one infrared temperature measuring component 3000 can be controlled to monitor the temperature of these components.

[0080] It should also be noted that the above implementation methods are all illustrated using the application of inverters in photovoltaic power generation systems as an example. However, this does not mean that the inverters provided in this application embodiment can only be applied to photovoltaic power generation scenarios. They can also be applied to other scenarios, such as vehicle scenarios.

[0081] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An inverter, characterized in that, It includes a housing, a device group, and an infrared temperature measuring component. The device group and the infrared temperature measuring component are both disposed within the housing, and the infrared temperature measuring component is used to monitor the temperature of the device group.

2. The inverter according to claim 1, characterized in that, The device group includes a first circuit board and a first chip, and the first chip and the infrared temperature measuring component are both mounted on the first circuit board.

3. The inverter according to claim 2, characterized in that, The first circuit board is provided with a receiving groove, and the infrared temperature measuring component is installed in the receiving groove.

4. The inverter according to claim 2, characterized in that, The first circuit board is provided with a plug-in position. The infrared temperature measuring component includes a temperature sensor body and a connecting circuit board. The temperature sensor body is mounted on the connecting circuit board, and the connecting circuit board is plugged into the plug-in position. The connecting circuit board and the first circuit board are in communication connection.

5. The inverter according to claim 1, characterized in that, It also includes a position adjustment mechanism, on which the infrared temperature measuring component is mounted, and the position adjustment mechanism is used to adjust the position of the infrared temperature measuring component within the housing.

6. The inverter according to claim 5, characterized in that, The position adjustment mechanism includes a first drive unit, which is used to drive the infrared temperature measuring component to rotate.

7. The inverter according to claim 5, characterized in that, The position adjustment mechanism includes a second drive unit, which is used to drive the infrared temperature measuring component to perform linear displacement.

8. The inverter according to claim 7, characterized in that, The second driving unit includes at least one of a first driving component, a second driving component, and a third driving component. The first driving component is used to drive the infrared temperature measuring component to perform linear displacement along a first direction. The second driving component is used to drive the infrared temperature measuring component to perform linear displacement along a second direction. The third driving component is used to drive the infrared temperature measuring component to perform linear displacement along a third direction. Any two of the first direction, the second direction, and the third direction are set at an angle.

9. The inverter according to any one of claims 1-8, characterized in that, It also includes an alarm component, which is disposed on the inner or outer side of the housing, and the alarm component is communicatively connected to the infrared temperature measuring component.

10. A photovoltaic power generation system, characterized in that, It includes photovoltaic modules and inverters, wherein the inverter is the inverter described in any one of claims 1-9.

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