Contact structure for testing of a semiconductor module

Abstract

The application provides a detection contact connection structure for automatic testing of a semiconductor module, comprising a support plate and a contact structure assembly, the support plate being provided with an array of a plurality of threaded holes; the contact structure assembly comprising a plurality of contact connectors, each of the contact connectors comprising a support member provided with an adjusting waist-shaped hole, and a detection contact docking member arranged on the support member; the support member being selectively connected in one or two of the plurality of threaded holes by means of a screw passing through the adjusting waist-shaped hole, so as to adjust the position of the detection contact. The detection point electrical connection structure in the prior art can only be used for special semiconductor modules and cannot be applied to detection of semiconductor modules of different specifications.

Description

Technical Field

[0001] This application relates to the field of semiconductor module testing technology, and more specifically, to a testing contact connection structure for automated testing of semiconductor modules. Background Technology

[0002] A power semiconductor module is a combination of components configured with specific functions and modes. It consists of high-power electronic devices combined and encapsulated into a single unit. Power semiconductor modules can achieve different functions depending on the packaged components, such as semiconductor field-effect transistors, insulated-gate bipolar transistors, and power integrated circuits.

[0003] Existing module test fixtures are mainly designed for modules with conductive sheets parallel to the base plate. During testing, the semiconductor module is usually placed in the fixture for positioning. The fixture has electrical connection structures for detection points. However, these electrical connection structures are usually fixed to the fixture and distributed for a specific type of semiconductor module. As a result, these electrical connection structures can only be used for specific semiconductor modules and cannot be used to test semiconductor modules of different specifications, thus lacking versatility.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] The purpose of this application is to provide a detection contact connection structure for automated testing of semiconductor modules, which solves the problem that the detection point electrical connection structure in the prior art can only be used for semiconductor modules and cannot be applied to semiconductor modules of different specifications for testing.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] This application provides a detection contact connection structure for automated testing of semiconductor modules, including: a support plate and a contact structure assembly, wherein the support plate has an array of multiple threaded holes;

[0008] The contact structure assembly includes multiple contact connectors, each of which includes:

[0009] Support component, which is provided with adjustment waist-shaped holes;

[0010] The detection contact mating parts are mounted on the support.

[0011] The support is selectively connected to one or two of a plurality of threaded holes by means of screws passing through the oblong holes to adjust the position of the detection contact.

[0012] In an optional embodiment, the support includes: a base plate, with an adjustment slot disposed on the base plate;

[0013] The upright plate is vertically mounted on the base plate.

[0014] The support plate is set at the end of the upright plate away from the base plate and is parallel to the base plate. The detection contact docking parts are set on the support plate.

[0015] In an optional embodiment, the upright plate has a wire hole for passing a cable that connects to the detection contact mating member.

[0016] In an optional embodiment, a mounting hole is provided through the carrier plate, and the detection contact mating part passes through the mounting hole.

[0017] In an optional embodiment, the detection contact mating component includes: a mating terminal and a conductive connector extending through the mating terminal;

[0018] The connector includes a plug and a protrusion. An installation step is formed between the plug and the protrusion. The plug is inserted into the mounting hole, and the protrusion is positioned and connected to the support plate through the installation step.

[0019] In an optional embodiment, anti-slip elements are provided on the mounting hole and the plug post to ensure that the plug post is oriented and inserted into the mounting hole.

[0020] In an optional embodiment, the conductive connector has a mating groove and a clearance groove is formed on the side wall of the conductive connector, so that the opening side of the mating groove forms an elastic opening.

[0021] In an optional embodiment, the support is provided with one or two detection contact mating parts.

[0022] In one optional embodiment, the array has two lines, which are spaced apart.

[0023] Each array has four rows of threaded holes.

[0024] In an optional embodiment, a guide rail is provided at the bottom of the support plate, and the support plate is slidably mounted on the guide rail.

[0025] The beneficial effects of the detection contact connection structure for automated testing of semiconductor modules provided in this application are at least as follows: By providing an array of multiple threaded holes on the support plate, multiple contact connectors in the contact structure assembly can be connected to different threaded holes, thereby allowing the positions of the multiple contact connectors to be adjusted according to the specifications of the semiconductor module to be tested. Furthermore, a detection contact mating part is connected to the support of each contact connector. The support is selectively connected to one or two of the multiple threaded holes by screws passing through adjusting oblong holes, thereby adjusting the position of the detection contact and aligning the detection contact mating part with the position of the detection contact of the semiconductor module to be tested, thus achieving mating. This allows for adaptive adjustment of the position of each contact connector according to different specifications of semiconductor modules, enabling the detection contact connection structure to adapt to different specifications of semiconductor modules, achieving testing of semiconductor modules of different specifications, improving versatility, and increasing practicality. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic diagram of the detection contact connection structure for automated testing of a semiconductor module provided in this application embodiment when connecting the semiconductor module;

[0028] Figure 2 A schematic diagram of a detection contact connection structure for automated testing of a semiconductor module provided in an embodiment of this application;

[0029] Figure 3 A schematic diagram of a contact connector for an automated testing contact connection structure of a semiconductor module provided in an embodiment of this application;

[0030] Figure 4 An exploded cross-sectional view of a contact connector of a detection contact connection structure for automated testing of a semiconductor module provided in this application embodiment;

[0031] Figure 5 An exploded view of the detection contact connection structure for automated testing of a semiconductor module provided in an embodiment of this application.

[0032] The following are the labeling elements in the figure:

[0033] 10. Semiconductor module; 100. Support plate; 110. Threaded hole; 120. Guide rail; 200. Contact structure assembly; 210. Contact connector; 220. Support component; 221. Adjustment slot; 222. Base plate; 223. Vertical plate; 224. Bearing plate; 225. Wire hole; 226. Mounting hole; 230. Detection contact mating component; 240. Plug platform; 241. Plug post; 242. Protrusion platform; 243. Mounting step; 244. Anti-slip component; 250. Conductive connector; 251. Connecting groove; 252. Clearance groove; 253. Chamfer. Detailed Implementation

[0034] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0035] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0036] like Figure 1 As shown, this embodiment proposes a detection contact connection structure for automated testing of a semiconductor module. This structure can be mounted on an external fixture and used to test the semiconductor module 10 positioned on the fixture. After the semiconductor module 10 is positioned on the fixture, its detection contacts are electrically connected to this detection contact connection structure to detect whether the semiconductor module 10 is functioning correctly. For ease of description, the structure is illustrated using the orientation of the semiconductor module 10 during testing as an example. The long side of the semiconductor module 10 is positioned along the front-back direction, and the wide side is positioned along the left-right direction. All components in this embodiment are described with reference to the above orientation.

[0037] like Figure 1 , Figure 2 , Figure 3As shown, the detection head structure of this embodiment specifically includes: a support plate 100 and a contact structure assembly 200. The support plate 100 has an array of multiple threaded holes 110, which are arranged in an orderly manner and can be in various arrangements. The contact structure assembly 200 includes multiple contact connectors 210, each of which includes: a support member 220 and a detection contact mating member 230. The detection contact mating member 230 is disposed on the support member 220, which mainly supports the detection contact mating member 230 and detachably connects it to the support plate 100. The support member 220 is provided with an adjustment slot 221, which allows the support member 220 to be selectively connected to one or two of the multiple threaded holes 110 by screws passing through the adjustment slot 221, thereby adjusting the position of the detection contact.

[0038] like Figure 1 , Figure 2 , Figure 3 As shown, this embodiment of an automated testing semiconductor module detection contact connection structure utilizes an array of multiple threaded holes 110 on a support plate 100. This allows multiple contact connectors 210 in the contact structure assembly 200 to connect to different threaded holes 110, thereby adjusting the position of the multiple contact connectors 210 according to the specifications of the semiconductor module 10 to be tested. Furthermore, a detection contact mating member 230 is connected to the support member 220 of each contact connector 210. The support member 220 is selectively connected to one or two of the multiple threaded holes 110 via screws passing through adjusting oblong holes 221, adjusting the position of the detection contact. This allows the detection contact mating member 230 to be adjusted relative to the position of the detection contact of the semiconductor module 10 to be tested, thus achieving mating. This allows for adaptive adjustments to the positions of each contact connector 210 based on different specifications of semiconductor modules 10, enabling the detection contact connection structure to be adapted to different specifications of semiconductor modules 10, thus achieving detection of semiconductor modules 10 of different specifications, improving versatility and increasing practicality.

[0039] like Figure 2 , Figure 3 , Figure 4As shown, the support member 220 in this embodiment further includes a base plate 222, a vertical plate 223, and a support plate 224. The base plate 222 is horizontally arranged, and an adjustment slot 221 is provided on the base plate 222, so that it can be adjusted and fixed to the support plate 100 by screws or pins. The vertical plate 223 is vertically arranged on the base plate 222, so that the vertical plate 223 extends vertically. The support plate 224 is provided at one end of the vertical plate 223 away from the base plate 222 and is parallel to the base plate 222, so that the support plate 224 is supported by the vertical plate 223. The detection contact docking member 230 is provided on the support plate 224, so that the detection contact docking member 230 can be raised so that the detection contact docking member 230 can abut against the detection contact of the semiconductor module 10 in the vertical direction. In the specific structure, the base plate 222, the upright plate 223 and the support plate 224 form a "Z" shape. This leaves the space under the support plate 224 open, and the space under the support plate 224 is relatively large, so that the detection contact docking part 230 has enough space to be installed.

[0040] like Figure 2 , Figure 3 , Figure 4 As shown, in this embodiment, the upright plate 223 is further provided with a wire-passing hole 225 for the cable connecting the detection contact connector 230 to pass through. The detection contact connector 230 is connected to an external testing device via a cable. The external testing device transmits signals to the semiconductor module 10 under test through the detection contact connector 230, thereby realizing the detection function. Therefore, the wire-passing hole 225 limits the cable, making the cable better constrained and less prone to tangling and messy wiring.

[0041] like Figure 2 , Figure 3 , Figure 4 As shown, in this embodiment, a mounting hole 226 is provided through the support plate 224, and the detection contact connector 230 passes through the mounting hole 226. The detection contact connector 230 can be directly installed in the mounting hole 226, which simplifies the installation structure and makes adjustment more convenient.

[0042] like Figure 2 , Figure 3 , Figure 4 As shown, the detection contact docking component 230 of this embodiment specifically includes: a plug-in platform 240 and a conductive connector 250 passing through the plug-in platform 240; the plug-in platform 240 is used to dock with the mounting hole 226, so that the conductive connector 250 can be stably fixed on the support 220.

[0043] like Figure 2 , Figure 3 , Figure 4As shown, the insertion platform 240 in this embodiment specifically includes an insertion post 241 and a protruding platform 242. A mounting step 243 is formed between the insertion post 241 and the protruding platform 242. The insertion post 241 is inserted into the mounting hole 226, and the protruding platform 242 is positioned and connected to the support plate 224 by the mounting step 243. The diameter of the protruding platform 242 is larger than the diameter of the insertion post 241, thus forming the mounting step 243 between them. When the insertion post 241 is inserted into the mounting hole 226, the lower surface of the protruding platform 242 abuts against the upper surface of the support plate 224.

[0044] like Figure 2 , Figure 3 , Figure 4 As shown, in another structure, anti-slip elements 244 are fitted onto the mounting hole 226 and the insertion post 241 to ensure that the insertion post 241 is oriented and inserted into the mounting hole 226. The anti-slip element 244 primarily serves to secure the insertion post 241 more firmly into the mounting hole 226, preventing it from rotating arbitrarily in the circumferential direction. Therefore, the anti-slip element 244 can be a rubber layer, adhered to the inner wall of the mounting hole 226. When the insertion post 241 is inserted into the mounting hole 226, it contacts the rubber layer, and the mutual compression increases friction, making the insertion post 241 more stable. The anti-slip element 244 can also be a foolproof structure, for example, by creating grooves on the inner wall of the mounting hole 226 and providing splines on the corresponding insertion post 241, which also ensures the insertion post 241 is stably fixed in the mounting hole 226.

[0045] like Figure 2 , Figure 3 , Figure 4 As shown, in this embodiment, the conductive connector 250 is provided with a mating groove 251, and a clearance groove 252 is provided on the side wall of the conductive connector 250, so that the opening side of the mating groove 251 forms an elastic opening. Specifically, some semiconductor modules 10 have needle-shaped detection contacts. When mating, the needle-shaped contacts can be directly inserted into the mating groove 251. Since the conductive connector 250 is made of a metal tube, the clearance groove 252 allows multiple spring pieces to form at the opening end of the conductive connector 250. These spring pieces are arranged around the central axis of the conductive connector 250, thus providing elasticity and forming an elastic opening on the opening side of the mating groove 251. The needle-shaped contacts can be clamped through the elastic opening, achieving stable mating.

[0046] It should also be noted that if the contacts are not needle-shaped, there will be corresponding solder joints at the detection contact positions of the semiconductor module 10, and these solder joints will also be protruding. Therefore, a chamfer 253 is provided on the inner edge of the elastic opening, making the elastic opening into an inverted cone shape. In this way, the elastic opening gradually decreases in size from top to bottom. When the protruding solder joints are pressed against the elastic opening, the chamfer 253 guides and compresses the spring piece, thereby allowing it to be stably embedded into the elastic opening.

[0047] like Figure 1 , Figure 2 , Figure 5 As shown, in this embodiment, the support member 220 is provided with one or two detection contact docking members 230. One or two detection contact docking members 230 can be provided on the support member 220, which can be adaptively set according to the distribution of detection contacts on the semiconductor module 10.

[0048] like Figure 1 , Figure 2 , Figure 5 As shown, in this embodiment, two arrays are provided, spaced apart; each array has four rows of threaded holes 110. The semiconductor module 10 typically has detection contacts on both the left and right sides, allowing multiple contact connectors 210 to be distributed in the threaded holes 110 of the arrays on both sides. This enables compatibility with most specifications of semiconductor modules 10, resulting in greater versatility.

[0049] like Figure 1 , Figure 2 , Figure 5 As shown, in this embodiment, the bottom of the support plate 100 is provided with a guide rail 120, and the support plate 100 is slidably disposed on the guide rail 120. This allows the support plate 100 to be movable, making it easy to pull out the detection contact connection structure as a whole, thereby facilitating the position adjustment of the multiple contact connectors 210 on it.

[0050] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A detection contact connection structure for automated testing of a semiconductor module, characterized in that, include: A support plate and a contact structure assembly, wherein the support plate has an array of multiple threaded holes; The contact structure assembly includes multiple contact connectors, each contact connector comprising: The support member is provided with an adjustment waist-shaped hole; A detection contact mating component is provided on the support component; The support member is selectively connected to one or two of the plurality of threaded holes by screws passing through the adjustment waist-shaped holes to adjust the position of the detection contact.

2. The detection contact connection structure for automated testing of semiconductor modules as described in claim 1, characterized in that, The support member includes: a base plate, and the adjusting waist-shaped hole is disposed on the base plate; A vertical plate is vertically mounted on a base plate; A support plate is disposed at one end of the upright plate away from the base plate and is parallel to the base plate. The detection contact docking component is disposed on the support plate.

3. The detection contact connection structure for automated testing of semiconductor modules as described in claim 2, characterized in that, The upright plate has a wire hole for passing through the cable that connects to the detection contact docking component.

4. The detection contact connection structure for automated testing of semiconductor modules as described in claim 3, characterized in that, The support plate has a through mounting hole, and the detection contact connector passes through the mounting hole.

5. The detection contact connection structure for automated testing of semiconductor modules as described in claim 4, characterized in that, The detection contact mating component includes: a plug-in platform and a conductive connector penetrating the plug-in platform; The insertion platform includes an insertion post and a protrusion, with an installation step formed between the insertion post and the protrusion. The insertion post is inserted into the installation hole, and the protrusion is positioned and connected to the support plate through the installation step.

6. The detection contact connection structure for automated testing of semiconductor modules as described in claim 5, characterized in that, The mounting hole and the plug are provided with anti-slip parts to ensure that the plug is oriented and inserted into the mounting hole.

7. The detection contact connection structure for automated testing of semiconductor modules as described in claim 5, characterized in that, The conductive connector has a mating groove, and the side wall of the conductive connector has a clearance groove, so that the opening side of the mating groove forms an elastic opening.

8. The detection contact connection structure for automated testing of semiconductor modules as described in claim 1, characterized in that, The support component is provided with one or two detection contact docking components.

9. The detection contact connection structure for automated testing of a semiconductor module as described in any one of claims 1-8, characterized in that, The array has two lines, and the two arrays are spaced apart. Each of the arrays is provided with four rows of threaded holes.

10. The detection contact connection structure for automated testing of a semiconductor module as described in claim 9, characterized in that, The bottom of the support plate is provided with a guide rail, and the support plate is slidably mounted on the guide rail.

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