Ultra-thin FPC function test fixture

Abstract

The utility model discloses a kind of ultra-thin FPC function test fixture, specifically related to FPC test technical field, comprising: lower mould, the lower mould is provided with the placement area matched with FPC appearance on, the edge of the placement area is equipped with multiple positioning pins;Upper mould, the upper mould is located above lower mould;FPC connects flat cable, one end of the FPC connecting flat cable is connected with test mainboard, the other end of the FPC connecting flat cable is equipped with the contact PAD corresponding with FPC gold finger.The utility model is provided with lower mould, upper mould and FPC connecting flat cable, FPC is fixed on lower mould, one end of FPC connecting flat cable is connected with test mainboard, the contact PAD of the other end is contacted with FPC gold finger under the pressing of upper mould, solve the gold surface pressure point problem caused by FPC and fixture direct plug, simultaneously avoid repeatedly plugging connection to cause test mainboard damaged.

Description

Technical Field

[0001] This utility model relates to the field of FPC testing technology, specifically to an ultra-thin FPC functional testing fixture. Background Technology

[0002] Flexible printed circuit boards (FPCs), also known as flexible boards or simply "flexible boards," are printed circuit boards made of flexible insulating substrates. They offer many advantages that rigid printed circuit boards lack. FPCs provide excellent electrical performance, meet the design needs for smaller and higher-density installations, and also help reduce assembly steps and enhance reliability.

[0003] Traditional FPC testing methods require physical plugging and unplugging of the FPC to the test motherboard. This not only easily damages the pressure points of the FPC's gold fingers but may also cause product creases. Furthermore, the test motherboard, being a consumable component, needs periodic replacement, increasing maintenance costs. Utility Model Content

[0004] The purpose of this invention is to provide an ultra-thin FPC functional testing fixture to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an ultra-thin FPC functional testing fixture, comprising:

[0006] The lower mold has a placement area that matches the shape of the FPC. The edge of the placement area is provided with multiple positioning pins. The lower mold has a positioning area corresponding to the position of the FPC gold fingers. Positioning pins are fixed at both ends of the positioning area.

[0007] The upper mold is located above the lower mold;

[0008] The FPC connection cable has one end connected to the test motherboard and the other end of the FPC connection cable has a contact PAD corresponding to the FPC gold fingers. The end of the FPC connection cable away from the test motherboard has a positioning hole corresponding to the position of the two positioning pins.

[0009] Furthermore, the two positioning pins are located on both sides of the FPC gold finger, and the two positioning holes are located on both sides of the contact PAD.

[0010] Furthermore, the lower mold has insertion holes corresponding to the positions of each positioning pin, and the bottom end of each positioning pin is fixed with a plug. The plug is connected to the insertion hole, which realizes the quick installation and removal of the positioning pin, and allows for quick replacement of the FPC or maintenance.

[0011] Furthermore, the positioning pin and the plug are integrally formed using an elastic material, giving the positioning pin a certain degree of elasticity, which allows it to automatically adjust to adapt to the slight deformation of the FPC when fixing it.

[0012] Furthermore, the outer side of the positioning pin is fixedly wrapped with a silicone layer to prevent damage to the FPC during the fixing process.

[0013] Furthermore, a handle is provided on the top of the side wall of the upper mold, making the operation of the upper mold more convenient.

[0014] Furthermore, a silicone strip is fixed to the bottom of the upper mold, which effectively prevents the upper mold from damaging the FPC gold fingers and protects the FPC gold fingers.

[0015] Furthermore, the FPC connection cable is plugged into the test motherboard, making the connection simple and facilitating the replacement of the test motherboard later.

[0016] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0017] 1. By setting up a lower mold, an upper mold, and an FPC connection cable, the FPC is fixed on the lower mold. One end of the FPC connection cable is connected to the test motherboard, and the other end of the contact PAD makes contact with the gold fingers of the FPC under the pressure of the upper mold. This solves the problem of gold surface pressure caused by direct plugging and unplugging of the FPC and the fixture, and avoids damage to the test motherboard caused by repeated plugging and unplugging.

[0018] 2. By setting a placement area on the lower mold that matches the shape of the FPC and multiple positioning pins, the stability and accuracy of the FPC during the testing process can be ensured.

[0019] 3. By fixing positioning pins at both ends of the positioning area, and opening positioning holes at the end of the FPC connection cable away from the test motherboard corresponding to the two positioning pins, the two positioning holes are located on both sides of the contact PAD, which can ensure the accuracy of the contact between the contact PAD and the FPC gold fingers.

[0020] 4. The elastic positioning pins and plugs are manufactured in one piece, which can automatically adjust to adapt to the slight deformation of the FPC when fixing it. The outer side of the positioning pin is covered with a silicone layer to prevent damage to the FPC during the fixing process. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the lower mold structure of this utility model;

[0024] Figure 3 This is a schematic diagram of the positioning pin structure of this utility model;

[0025] Figure 4 This is a schematic diagram of the upper mold structure of this utility model;

[0026] Figure 5 This is a schematic diagram showing the connection between the FPC connection cable of this utility model and the test motherboard.

[0027] Explanation of reference numerals in the attached figures:

[0028] 10. Lower mold; 11. Placement area; 12. Positioning pin; 13. Positioning area; 14. Positioning pin; 15. Plug;

[0029] 20. Upper mold; 21. Silicone strip; 22. Handle;

[0030] 30. FPC connection cable; 31. Contact pad; 32. Positioning hole;

[0031] 40. Test the motherboard. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0033] This utility model provides, for example Figures 1 to 5 The ultra-thin FPC functional test fixture shown includes:

[0034] The lower mold 10 has a placement area 11 that matches the shape of the FPC. The edge of the placement area 11 is provided with multiple positioning pins 12. The lower mold 10 has a positioning area 13 corresponding to the position of the FPC gold fingers. Positioning pins 14 are fixed at both ends of the positioning area 13.

[0035] Upper mold 20 is located above lower mold 10;

[0036] FPC connection cable 30, one end of FPC connection cable 30 is connected to test motherboard 40, the other end of FPC connection cable 30 is provided with contact PAD 31 corresponding to FPC gold fingers, and the end of FPC connection cable 30 away from test motherboard 40 is provided with positioning hole 32 corresponding to the position of two positioning pins 14.

[0037] Two positioning pins 14 are located on both sides of the FPC gold fingers, and two positioning holes 32 are located on both sides of the contact PAD 31.

[0038] The lower mold 10 has insertion holes corresponding to the positions of each positioning pin 12. The bottom end of the positioning pin 12 is fixed with a plug 15, which is connected to the insertion hole, realizing the quick installation and removal of the positioning pin 12, and allowing for quick replacement of FPC or maintenance.

[0039] A handle 22 is provided on the top of the side wall of the upper mold 20, making the operation of the upper mold 20 more convenient.

[0040] The FPC connection cable 30 is plugged into the test motherboard 40, making the connection simple and facilitating the replacement of the test motherboard 40 later.

[0041] In this invention, the FPC is placed in the placement area 11 on the lower mold 10, and then multiple positioning pins 12 are inserted into the upper mold 20. The multiple positioning pins 12 are distributed on the edge of the FPC to limit and fix the FPC. The FPC gold fingers are placed in the positioning area 13 on the lower mold 10, and then one end of the FPC connection cable 30 is connected to the test motherboard 40. The two positioning holes 32 at the other end of the FPC connection cable 30 correspond to the two positioning pins 14 on the positioning area 13, so that the contact PAD 31 on the FPC connection cable 30 is aligned with the FPC gold fingers. Then, the upper mold 20 is used to press the contact PAD 31 so that the contact PAD 31 contacts the FPC gold fingers, and the test is completed. The operation is simple and convenient, and solves the problem of gold surface pressure caused by direct plugging and unplugging of FPC and fixture.

[0042] After the FPC connection cable 30 is plugged into the test motherboard 40, if the test motherboard 40 or the FPC connection cable 30 is not damaged and does not need to be replaced, there is no need to separate the FPC connection cable 30 from the test motherboard 40, thus avoiding the problem of damage to the test motherboard 40 caused by repeated plugging and unplugging.

[0043] like Figure 3 and Figure 4 As shown, the positioning pin 12 and the plug 15 are integrally formed using elastic material.

[0044] The outer side of the positioning pin 12 is fixedly wrapped with a silicone layer, and the bottom of the upper mold 20 is fixed with a silicone strip 21.

[0045] In this utility model, the positioning pin 12 is made of elastic material, which gives the positioning pin 12 a certain elasticity and can automatically adjust to adapt to the slight deformation of the FPC when fixing the FPC. The outer side of the positioning pin 12 is fixedly wrapped with a silicone layer to prevent damage to it during the fixing process of the FPC. The bottom of the upper mold 20 is fixed with a silicone strip 21, which effectively prevents the upper mold 20 from damaging the FPC gold fingers and protects the FPC gold fingers.

[0046] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A functional testing fixture for ultra-thin FPCs, characterized in that, include: The lower mold (10) is provided with a placement area (11) that matches the shape of the FPC. The edge of the placement area (11) is provided with multiple positioning pins (12). The lower mold (10) is provided with a positioning area (13) corresponding to the position of the gold finger of the FPC. Positioning pins (14) are fixed at both ends of the positioning area (13). The upper mold (20) is located above the lower mold (10); FPC connection cable (30), one end of which is connected to test motherboard (40), and the other end of which is provided with contact PAD (31) corresponding to FPC gold fingers. The end of FPC connection cable (30) away from test motherboard (40) is provided with positioning hole (32) corresponding to the position of the two positioning pins (14).

2. The ultra-thin FPC functional testing fixture according to claim 1, characterized in that: The two positioning pins (14) are located on both sides of the FPC gold finger, and the two positioning holes (32) are located on both sides of the contact PAD (31).

3. The ultra-thin FPC functional testing fixture according to claim 1, characterized in that: The lower mold (10) has a socket hole corresponding to each of the positioning pins (12). The bottom end of the positioning pin (12) is fixed with a plug (15), and the plug (15) is connected to the socket hole.

4. The ultra-thin FPC functional testing fixture according to claim 3, characterized in that: The positioning pin (12) and the plug (15) are integrally formed using elastic material.

5. The ultra-thin FPC functional testing fixture according to claim 1, characterized in that: The outer side of the positioning pin (12) is fixedly wrapped with a silicone layer.

6. The ultra-thin FPC functional testing fixture according to claim 1, characterized in that: The upper mold (20) has a handle (22) on the top of its side wall.

7. The ultra-thin FPC functional testing fixture according to claim 1, characterized in that: A silicone strip (21) is fixed to the bottom of the upper mold (20).

8. The ultra-thin FPC functional testing fixture according to claim 1, characterized in that: The FPC connection cable (30) is plugged into and connected to the test motherboard (40).

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