A heat dissipation base with an air duct

Abstract

The utility model relates to radiator technical field especially is a kind of radiator base with air duct, including lower cover, upper cover, sealing cover, turbine fan and circuit board, sealing cover is provided with air inlet, annular air duct plate and two airflow cavities, one air outlet is set up in the both sides of annular air duct plate, one airflow cavity is communicated with the inner chamber of annular air duct plate via one air outlet, turbine fan is located in annular air duct plate, air inlet is correspondingly set with the air inlet end of turbine fan, the bottom surface of lower cover is set with the through-hole for corresponding intercommunication with air inlet, dust cover is detachably installed at through-hole, upper cover is set with two groups of air outlet groups, two groups of air outlet groups are respectively communicated with two airflow cavities one-to-one, and each group of air outlet group includes multiple air outlets. The structure of the application is simple, the volume is thin and flat, the air volume is large, the heat dissipation effect is good, and the universality is good, can be used for electric game special notebook computer and general notebook computer.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a heat dissipation base with airflow channels. Background Technology

[0002] The most popular products at present are information AI products and information 3C products. 3C products refer to computer, communication and consumer electronics products. Among them, notebook computers are widely favored by computer users around the world because of their lightweight and portable features, multi-functionality, large digital storage capacity and long battery life.

[0003] Notebook computers are very suitable for use as portable or desktop personal computers due to their light weight and small size. However, due to the size and structure of notebook computers, their heat dissipation is far less efficient than that of larger PC personal computer mainframes.

[0004] While short-term use of a regular laptop usually doesn't pose a problem for heat dissipation, prolonged use can easily lead to overheating. Overheating can damage the hard drive or other components of the computer, and even pose a hazard to people. This is especially true now that popular e-sports and video games are widely used on laptops, leading to the development of dedicated gaming laptops. However, their high processing speed results in more noticeable heat generation. Furthermore, to meet the visual, audio, and stimulating demands of e-sports and video games, their screens are typically much larger than those of regular laptops. To ensure that the internal heat-generating components can directly contact cool air for improved heat dissipation, dedicated gaming laptops differ from regular laptops in that they feature convection vents on the bottom panel and corresponding locations to enhance airflow and cooling.

[0005] Conversely, smaller notebook computers, besides having smaller screens, usually do not have vents on the bottom or corresponding area of ​​the computer. Instead, they have a cooling fan fixed inside the main body. The cooling fan blows air through the narrow gap between the screen and the main body axis, which can only barely remove some of the air and heat.

[0006] Therefore, the heat dissipation requirements for gaming laptops are obviously higher than those for regular laptops. In other words, the heatsinks designed for gaming laptops are not only larger in size, but also suitable for high-speed and high-airflow turbine fans. Furthermore, the upper edge of the groove on the heatsink is in close contact with the bottom surface of the gaming laptop.

[0007] Continuing from the above, the airflow from the turbine fan inside the groove of the heatsink is powerfully directed towards the bottom of the gaming laptop. The airflow is then directed through the air vents on the bottom of the laptop to deliver cool air into the laptop and blow on the heat-generating components before being effectively exhausted and cooled through the corresponding exhaust vents. However, if a smaller laptop is placed on this larger heatsink (heatsink base), it will not only fail to make a tight fit, but the air will also be unable to be effectively released and cooled due to the lack of air vents on the bottom. In addition, the high-speed, large airflow generated by the turbine fan will cause serious annoying noise and cause the laptop to float slightly, resulting in instability.

[0008] Furthermore, users of gaming laptops usually also own regular or smaller laptops. Therefore, the cooling pads for gaming laptops are not compatible with regular or smaller laptops. If you want to use both, you must buy two different cooling pads for laptops.

[0009] Among existing patents, the notebook cooling base disclosed in Chinese utility model patent CN 220509392U has been found to have a complex structure after research and analysis. It includes a connecting base for the first and second noise reduction components and a third noise reduction component with several air guide plates. It is attached to the noise reduction system by means of external addition. As a result, its multiple combination structure leads to major defects such as increased components, structural complexity, significant increase in volume, and damage to the overall appearance. Utility Model Content

[0010] In order to solve the above-mentioned technical problems, the purpose of this utility model is to provide a heat dissipation base with air duct.

[0011] To achieve the above objectives, the present invention adopts the following technical solution:

[0012] A heat dissipation base with an air duct includes a lower cover, an upper cover that covers the lower cover, a sealing cover installed inside the lower cover and sandwiched between the upper and lower covers, a turbine fan installed in the sealing cover, and a circuit board installed between the upper and lower covers and electrically connected to the turbine fan. The sealing cover is provided with an air inlet, an annular air duct plate, and two airflow chambers located on both sides of the annular air duct plate. An air outlet is opened on both sides of the annular air duct plate. One airflow chamber is connected to the inner cavity of the annular air duct plate through one air outlet. The turbine fan is located inside the annular air duct plate, and the air inlet is located inside the annular air duct plate and is correspondingly arranged to the air inlet end of the turbine fan. The bottom surface of the lower cover is provided with a through hole for corresponding communication with the air inlet. A dust cover is detachably installed at the through hole. The upper cover is provided with two sets of air outlets, which are respectively connected to the two airflow chambers one by one. Each set of air outlets includes multiple air outlet holes.

[0013] Furthermore, the bottom surface of the lower cover is recessed upward to form a receiving cavity. One side of the receiving cavity is provided with an insertion hole, and the other side of the receiving cavity is provided with a snap-fit ​​hole. One side of the dust cover is provided with an insertion block, and the other side of the dust cover is provided with a snap-fit ​​element. The dust cover is housed in the receiving cavity, the insertion block is inserted into the insertion hole, and the snap-fit ​​element is engaged with the snap-fit ​​hole. The through hole is formed by recessing from the bottom wall of the receiving cavity.

[0014] Furthermore, the top surface of the cover is provided with an annular sealing memory foam, and two sets of air outlets are located inside the annular sealing memory foam.

[0015] Furthermore, the top surface of the front part of the cover is recessed with a front storage hole, and a stop is rotatably connected inside the front storage hole. The stop can be stored inside the front storage hole or can extend out of the front storage hole.

[0016] Furthermore, a rear storage hole is recessed on the top rear surface of the top cover, and a support block is rotatably connected inside the rear storage hole. The support block can be stored inside the rear storage hole or can extend out of the rear storage hole.

[0017] Furthermore, the bottom rear surface of the lower cover is recessed with a bottom storage hole, and a support foot is rotatably connected inside the bottom storage hole. The support foot can be stored inside the bottom storage hole or can extend out of the bottom storage hole.

[0018] Furthermore, the top surface of the cover is provided with multiple arc-shaped air guide plates arranged in a ring array, which extend to the air outlet.

[0019] The beneficial effects of this invention are as follows: In practical applications, the laptop is placed on the top cover, and the two sets of air outlets are aligned with the laptop's heat dissipation vents. The circuit board controls the turbine fan to start, and the turbine fan blades rotate, generating airflow along the annular air duct plate. The airflow enters the airflow chamber through the air outlets, and the airflow in the airflow chamber is blown towards the laptop's heat dissipation vents through multiple air outlets of the air outlets, thereby accelerating the efficiency and effectiveness of heat dissipation for the laptop. In addition, the dust cover blocks dust and other foreign objects, playing a dustproof role, and can be removed for cleaning, making cleaning convenient. This invention has a simple structure, a slim and flat size, a large air volume, and the two sets of air outlets blowing air directly into the laptop's heat dissipation vents, resulting in high heat dissipation efficiency and good effect. It is easy to remove and clean the dust cover, and has good versatility, suitable for both gaming laptops and general laptops.

[0020] This application adopts a single-layer structure and airflow cavity design, without too many air slots, which obviously reduces wind noise and noise. Compared with the existing patents where the airflow goes through multiple turns before blowing into the laptop, the air pressure and air cooling will inevitably decrease, thus reducing the heat dissipation effect. This application blows the cool air directly without too much resistance, resulting in better heat dissipation. The structure of this application is simplified, adopting a single-layer structure. From the overall structure, the thickness is reduced, and the appearance is more aesthetically pleasing. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the present invention in use.

[0022] Figure 2 This is a three-dimensional structural diagram of the present invention in its normal state.

[0023] Figure 3 This is an exploded view of the present invention.

[0024] Figure 4 This is another exploded view of the present invention.

[0025] Figure 5 This is a three-dimensional structural diagram of the sealing cover and turbine fan of this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1. Bottom cover; 2. Top cover; 3. Sealing cover; 4. Turbine fan; 5. Circuit board; 6. Air inlet; 7. Annular air duct plate; 8. Airflow chamber; 9. Air outlet; 10. Through hole; 11. Dust cover; 12. Air outlet assembly; 13. Air outlet hole; 14. Receiving cavity; 15. Insertion hole; 16. Snap-on hole; 17. Insert block; 18. Snap-on component; 19. Annular sealing memory foam; 20. Front storage hole; 21. Stop component; 22. Rear storage hole; 23. Support block; 24. Bottom storage hole; 25. Support foot; 26. Arc-shaped air guide plate; 27. Laptop computer. Detailed Implementation

[0028] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0029] like Figures 1 to 5As shown, this utility model provides a heat dissipation base with an air duct, which includes a lower cover 1, an upper cover 2 that covers the lower cover 1, a sealing cover 3 installed inside the lower cover 1 and sandwiched between the upper cover 2 and the lower cover 1, a turbine fan 4 installed in the sealing cover 3, and a circuit board 5 installed between the upper cover 2 and the lower cover 1 and electrically connected to the turbine fan 4. The sealing cover 3 is provided with an air inlet 6, an annular air duct plate 7, and two airflow chambers 8 located on both sides of the annular air duct plate 7. An air outlet 9 is opened on both sides of the annular air duct plate 7. One airflow chamber 8 is connected to the annular air duct plate 7 through one air outlet 9. The inner cavity is connected, the turbine fan 4 is located inside the annular air duct plate 7, the air inlet 6 is located inside the annular air duct plate 7 and is set corresponding to the air inlet end of the turbine fan 4, the bottom surface of the lower cover 1 is provided with a through hole 10 for corresponding communication with the air inlet 6, and a dust cover 11 is detachably installed at the through hole 10. The upper cover 2 is provided with two sets of air outlet groups 12, and the two sets of air outlet groups 12 are respectively connected to two airflow chambers 8 one by one. Each set of air outlet groups 12 includes multiple air outlet holes 13; specifically, the through hole 10, the air inlet 6, the annular air duct plate 7, the air outlet 9, the airflow chamber 8 and the air outlet holes 13 form an air duct.

[0030] In practical applications, the laptop 27 is placed on the top cover 2, and two sets of air outlets 12 are aligned with the heat dissipation holes of the laptop 27. The circuit board 5 controls the turbine fan 4 to start, and the turbine fan 4 rotates and generates airflow along the annular air duct plate 7. The airflow enters the airflow chamber 8 through the air outlet 9, and the airflow in the airflow chamber 8 is blown towards the heat dissipation holes of the laptop 27 through multiple air outlets 13 of the air outlets 12, thereby accelerating the efficiency and effectiveness of heat dissipation for the laptop 27. In addition, the dust cover 11 blocks dust and other foreign objects, playing a dustproof role, and can be removed for cleaning, making cleaning convenient. This utility model has a simple structure, a flat and thin size, a large air volume and low noise. The two sets of air outlets 12 blow air towards the heat dissipation holes of the laptop 27, resulting in high heat dissipation efficiency and good effect. The dust cover 11 is easy to remove and clean, has low manufacturing cost, and good versatility, and can be used with both gaming-specific laptops and general laptops.

[0031] This application adopts a single-layer structure and an airflow cavity 8 design, without too many air ducts, which obviously reduces wind noise and noise. Compared with the existing patents where the airflow goes through multiple turns before blowing into the laptop 27, the air pressure and air cooling will inevitably decrease, thus reducing the heat dissipation effect. This application directly blows the cool air without too much resistance, resulting in better heat dissipation. The structure of this application is simplified, adopting a single-layer structure. From the overall structure, the thickness is reduced, and the appearance is more aesthetically pleasing.

[0032] In this embodiment, the bottom surface of the lower cover 1 is recessed with an accommodating cavity 14. One side of the accommodating cavity 14 has an insertion hole 15, and the other side has a snap-fit ​​hole 16. One side of the dust cover 11 has an insertion block 17, and the other side has a snap-fit ​​element 18. The snap-fit ​​element 18 is an elastic snap-fit. The dust cover 11 is housed within the accommodating cavity 14. The insertion block 17 is inserted into the insertion hole 15, and the snap-fit ​​element 18 engages with the snap-fit ​​hole 16. The through hole 10 is recessed from the bottom wall of the accommodating cavity 14. In practical applications, when assembling the dust cover 11, the insertion block 17 of the dust cover 11 is aligned and inserted into the insertion hole 15, and then the snap-fit ​​element 18 of the dust cover 11 is engaged with the snap-fit ​​hole 16 to achieve the assembly of the dust cover 11 and the lower cover 1. The dust cover 11 is housed within the accommodating cavity 14, and the structure of the dust cover 11 and the lower cover 1 is compact.

[0033] In this embodiment, the top surface of the top cover 2 is provided with an annular sealing memory foam 19, and two sets of air outlet groups 12 are located inside the annular sealing memory foam 19. In practical applications, the laptop 27 is placed on the top cover 2, with the bottom surface of the laptop 27 in close contact with the annular sealing memory foam 19. The heat dissipation holes on the bottom surface of the laptop 27 are located inside the annular sealing memory foam 19. The annular sealing memory foam 19 is used to seal the gap between the bottom surface of the laptop 27 and the top cover 2, so that the airflow blown out by the multiple air outlets 13 of the two sets of air outlet groups 12 can all enter the heat dissipation holes of the laptop 27, preventing air leakage and reducing the heat dissipation effect. In addition, the annular sealing memory foam 19 plays a buffering and protective role for the laptop 27, preventing the laptop 27 from undergoing hard impact collisions with the top cover 2.

[0034] In this embodiment, a front storage hole 20 is recessed on the top surface of the front part of the top cover 2. A stop member 21 is rotatably connected inside the front storage hole 20. The stop member 21 can be stored inside the front storage hole 20 or can extend out of the front storage hole 20. In normal operation, the stop member 21 is stored inside the front storage hole 20, making the structure of the stop member 21 and the top cover 2 compact, preventing the stop member 21 from being exposed, and making it easy to carry. In use, the stop member 21 is rotated outward so that the stop member 21 extends out of the front storage hole 20. When the laptop 27 is placed on the top cover 2, the stop member 21 blocks the front end of the laptop 27, preventing the laptop 27 from slipping and improving the stability of the laptop 27 during use.

[0035] In this embodiment, a rear storage hole 22 is recessed on the top rear surface of the top cover 2. A support block 23 is rotatably connected inside the rear storage hole 22. The support block 23 can be stored inside the rear storage hole 22 or can extend out of the rear storage hole 22. Normally, the support block 23 is stored inside the rear storage hole 22, making the structure of the support block 23 and the top cover 2 compact, preventing the support block 23 from being exposed, and making it easy to carry. When the bottom surface of the laptop 27 does not have heat dissipation holes, the support block 23 is rotated outward, so that the support block 23 extends out of the rear storage hole 22. When the laptop 27 is placed on the top cover 2, the support block 23 supports the rear bottom surface of the laptop 27, so that there is a heat dissipation gap between the bottom surface of the laptop 27 and the top cover 2, which is conducive to the exhaust of heat and prevents the laptop 27 from floating and shifting due to the inability to dissipate pressure in time.

[0036] In this embodiment, a bottom storage hole 24 is recessed on the rear bottom surface of the lower cover 1. A support foot 25 is rotatably connected inside the bottom storage hole 24. The support foot 25 can be stored inside the bottom storage hole 24 or can extend out of the bottom storage hole 24. Normally, the support foot 25 is stored inside the bottom storage hole 24, making the structure of the support foot 25 and the lower cover 1 compact and easy to carry. According to the user's usage needs (usage angle requirements), the support foot 25 can be rotated outward, so that the support foot 25 extends out of the bottom storage hole 24. The support foot 25 provides tilt support for the rear of the lower cover 1, and makes a gap between the lower cover 1 and the support surface (such as: desktop, etc.), which is conducive to the generation of airflow in this invention. The user can choose the best ergonomic angle according to their needs, and the air intake can be changed by changing the height of the rear bottom surface of the laptop 27 through the support foot 25.

[0037] In this embodiment, the top surface of the upper cover 2 is provided with multiple arc-shaped air guide plates 26 arranged in a ring array, and the arc-shaped air guide plates 26 extend to the air outlet group 12. The airflow blown out by the multiple air outlet holes 13 of the air outlet group 12 is split and blown out along the multiple arc-shaped air guide plates 26, so that the airflow coverage area is large.

[0038] All technical features in this embodiment can be freely combined according to actual needs.

[0039] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A heat sink base with an air duct, characterized by: Includes a lower cover (1), an upper cover (2) that covers the lower cover (1), a sealing cover (3) installed inside the lower cover (1) and sandwiched between the upper cover (2) and the lower cover (1), a turbine fan (4) installed in the sealing cover (3), and a circuit board (5) installed between the upper cover (2) and the lower cover (1) and electrically connected to the turbine fan (4). The sealing cover (3) is provided with an air inlet (6), an annular air duct plate (7), and two airflow chambers (8) located on both sides of the annular air duct plate (7). An air outlet (9) is opened on both sides of the annular air duct plate (7). One airflow chamber (8) passes through a... An air outlet (9) is connected to the inner cavity of the annular air duct plate (7). The turbine fan (4) is located inside the annular air duct plate (7). The air inlet (6) is located inside the annular air duct plate (7) and is set corresponding to the air inlet end of the turbine fan (4). The bottom surface of the lower cover (1) is provided with a through hole (10) for corresponding communication with the air inlet (6). A dust cover (11) is detachably installed at the through hole (10). The upper cover (2) is provided with two sets of air outlet groups (12). The two sets of air outlet groups (12) are respectively connected to two airflow chambers (8). Each set of air outlet groups (12) includes multiple air outlet holes (13).

2. The heat dissipation base with air duct according to claim 1, characterized in that: The bottom surface of the lower cover (1) is recessed upward to form a receiving cavity (14). One side of the receiving cavity (14) is provided with an insertion hole (15), and the other side of the receiving cavity (14) is provided with a snap-fit ​​hole (16). One side of the dust cover (11) is provided with an insertion block (17), and the other side of the dust cover (11) is provided with a snap-fit ​​element (18). The dust cover (11) is housed in the receiving cavity (14). The insertion block (17) is inserted into the insertion hole (15), and the snap-fit ​​element (18) is engaged with the snap-fit ​​hole (16). The through hole (10) is recessed from the bottom wall of the receiving cavity (14).

3. The heat sink base with air duct according to claim 1, wherein: The top surface of the cover (2) is provided with an annular sealing memory foam (19), and two sets of air outlets (12) are located inside the annular sealing memory foam (19).

4. The heat sink base with air duct according to claim 1, wherein: The top surface of the front part of the cover (2) is recessed with a front storage hole (20), and a stop (21) is rotatably connected inside the front storage hole (20). The stop (21) can be stored inside the front storage hole (20) or can extend out of the front storage hole (20).

5. The heat sink base with air duct according to claim 1, wherein: The rear top surface of the cover (2) is recessed with a rear storage hole (22), and a support block (23) is rotatably connected inside the rear storage hole (22). The support block (23) can be stored inside the rear storage hole (22) or can extend out of the rear storage hole (22).

6. A heat dissipation base with an air duct according to claim 1, characterized in that: The bottom surface of the lower cover (1) is recessed with a bottom storage hole (24), and a support foot (25) is rotatably connected inside the bottom storage hole (24). The support foot (25) can be stored inside the bottom storage hole (24) or can extend out of the bottom storage hole (24).

7. A heat dissipation base with an air duct according to claim 1, characterized in that: The top surface of the cover (2) is provided with multiple arc-shaped air guide plates (26) arranged in a ring array, and the arc-shaped air guide plates (26) extend to the air outlet group (12).

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