A circuit board punching machine

Abstract

A circuit board punching machine, the punching machine comprises a base body, a first feeding mechanism fixedly connected to the base body, the first feeding mechanism comprising a first magnetic attraction part and a first die located on the side of the first magnetic attraction part away from the base body, a second feeding mechanism fixedly connected to the base body, the second feeding mechanism comprising a second magnetic attraction part and a second die located on the side of the second magnetic attraction part away from the base body, wherein the first feeding mechanism and the second feeding mechanism are arranged side by side on the base body and are respectively electrically connected to the base body, after the base body is powered to the first feeding mechanism, the first magnetic attraction part adsorbs the first die, the first die is fixedly connected to the first magnetic attraction part, after the base body is powered to the second feeding mechanism, the second magnetic attraction part adsorbs the second die, and the second die is fixedly connected to the second magnetic attraction part.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing machinery, and in particular to a circuit board stamping machine. Background Technology

[0002] Circuit board stamping equipment is a key piece of equipment in the electronics manufacturing industry. Its core function is to process metal substrates or composite materials into precision shapes that meet circuit design requirements through mechanical stamping processes. Its working principle is based on pressure forming technology: a drive mechanism drives a punch to press down at high speed, applying instantaneous impact force to the circuit board substrate in conjunction with a pre-shaped die, achieving processes such as punching, cutting, and forming. This process must ensure stamping accuracy, material edge flatness, and production cycle time to meet the high-density and miniaturized requirements of circuit boards in consumer electronics, automotive electronics, and other fields.

[0003] Currently available PCB stamping machines often face significant efficiency bottlenecks in large-scale production. Traditional stamping machines employ a single fixed mold structure. When producing PCBs of different specifications, manual labor is typically required to complete more than ten processes, including mold disassembly, locating pin calibration, and pressure plate bolt tightening. This results in a single mold change taking an average of several minutes to tens of minutes, during which the equipment is completely shut down, leading to reduced capacity utilization. Furthermore, existing PCB stamping machines generally use a one-mold-one-process design, meaning each stamping machine can only complete a single stamping action. For complex PCBs such as multilayer boards or irregularly shaped boards, multiple machines need to be connected in series for step-by-step processing, resulting in frequent material transfers between machines and reducing overall stamping efficiency.

[0004] Therefore, it is necessary to provide a circuit board stamping machine that can avoid frequent transfer of circuit boards between multiple stamping machines and effectively improve the efficiency of mold changing. Utility Model Content

[0005] The purpose of this invention is to provide a circuit board stamping machine that can avoid frequent transfer of circuit boards between multiple stamping machines and effectively improve the efficiency of mold changing.

[0006] According to one aspect of this application, a circuit board stamping machine is provided, the stamping machine comprising:

[0007] Matrix

[0008] A first feeding mechanism is fixedly connected to the base. The first feeding mechanism includes a first magnetic suction part and a first mold located on the side of the first magnetic suction part away from the base.

[0009] The second feeding mechanism is fixedly connected to the base. The second feeding mechanism includes a second magnetic suction part and a second mold located on the side of the second magnetic suction part away from the base.

[0010] The first feeding mechanism and the second feeding mechanism are arranged side by side on the base and are electrically connected to the base respectively. After the base is energized to the first feeding mechanism, the first magnetic part attracts the first mold and the first mold is fixedly connected to the first magnetic part. After the base is energized to the second feeding mechanism, the second magnetic part attracts the second mold and the second mold is fixedly connected to the second magnetic part.

[0011] More preferably, the first feeding mechanism further includes:

[0012] The first substrate is fixedly connected to the base;

[0013] The first guide rail is fixedly connected to the first substrate and is located on the side of the first substrate away from the base.

[0014] More preferably, the first magnetic attraction part is slidably connected to the first guide rail and is located on the side of the first guide rail away from the first substrate.

[0015] More preferably, the first guide rail extends along a first direction parallel to the surface of the substrate, and after the substrate is energized to the first feeding mechanism, it drives the first magnetic suction part to slide along the first direction on the first guide rail.

[0016] More preferably, the second feeding mechanism further includes:

[0017] The second substrate is fixedly connected to the base body. When viewed along the first direction, the second substrate and the first substrate are arranged side by side.

[0018] The second guide rail is fixedly connected to the second substrate and is located on the side of the second substrate away from the base.

[0019] More preferably, the second magnetic attraction part is slidably connected to the second guide rail and is located on the side of the second guide rail away from the second substrate.

[0020] More preferably, the second guide rail also extends along the first direction, and after the substrate is energized to the second feeding mechanism, it drives the second magnetic suction part to slide on the second guide rail along the first direction.

[0021] More preferably, the stamping press further includes:

[0022] A first stamping mechanism is fixedly connected to the first substrate. The first stamping mechanism is provided with a first pneumatic part, a first guide shaft fixedly connected to the first substrate and located between the first substrate and the first pneumatic part, and a first pressure plate slidably connected to the first guide shaft and fixedly connected to the first pneumatic part.

[0023] The second stamping mechanism is fixedly connected to the second substrate. The second stamping mechanism is provided with a second pneumatic part, a second guide shaft fixedly connected to the second substrate and located between the second substrate and the second pneumatic part, and a second pressure plate slidably connected to the second guide shaft and fixedly connected to the second pneumatic part.

[0024] More preferably, when viewed along the first direction, the first stamping mechanism and the second stamping mechanism are arranged side by side on the base.

[0025] The first guide shaft extends along a second direction perpendicular to the first direction, and the second guide shaft also extends along the second direction.

[0026] Even better,

[0027] The base drives the first mold to be located below the first pressure plate, and the first pneumatic part drives the first pressure plate to press down along the second direction to abut against the first mold;

[0028] The base drives the second mold to be located below the second pressure plate, and the second pneumatic unit drives the second pressure plate to press down along the second direction to abut against the second mold.

[0029] This utility model has the following beneficial effects:

[0030] After the substrate is energized by the first and second feeding mechanisms respectively, the first magnetic attraction part attracts and fixes the first mold, and the second magnetic attraction part attracts and fixes the second mold. This allows the molds on the stamping machine to be quickly assembled and disassembled by switching the power on and off on the magnetic attraction part of the electromagnet, effectively improving the mold replacement efficiency. Furthermore, the design of the stamping machine with a first feeding structure and a second feeding mechanism allows for the design of separate first and second molds according to the different stamping requirements of the circuit board, avoiding frequent transfer of the circuit board between multiple stamping machines and improving stamping efficiency. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 This is a three-dimensional structural diagram of the stamping machine described in one embodiment of this application;

[0033] Figure 2This is a schematic diagram of the planar structure of the base structure of the stamping machine as described in one embodiment of this application;

[0034] Explanation of reference numerals in the attached drawings: 100, stamping machine; 10, base; 20, first feeding mechanism; 21, first magnetic suction part; 22, first mold; 23, first substrate; 24, first guide rail; 30, second feeding mechanism; 31, second magnetic suction part; 32, second mold; 33, second substrate; 34, second guide rail; 40, first stamping mechanism; 41, first pneumatic part; 42, first guide shaft; 43, first pressure plate; 50, second stamping mechanism; 51, second pneumatic part; 52, second guide shaft; 53, second pressure plate; F1, first direction; F2, second direction. Detailed Implementation

[0035] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0036] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0038] Please refer to Figure 1 - Figure 2 One embodiment of this application provides a circuit board stamping machine 100, which includes: a base 10, a first feeding mechanism 20, and a second feeding mechanism 30.

[0039] The first feeding mechanism 20 is fixedly connected to the base 10. The first feeding mechanism 20 includes a first magnetic attraction part 21 and a first mold 22 located on the side of the first magnetic attraction part 21 opposite to the base 10. The second feeding mechanism 30 is fixedly connected to the base 10. The second feeding mechanism 30 includes a second magnetic attraction part 31 and a second mold 32 located on the side of the second magnetic attraction part 31 opposite to the base 10. The first feeding mechanism 20 and the second feeding mechanism 30 are arranged side by side on the base 10 and are electrically connected to the base 10. After the base 10 powers the first feeding mechanism 20, the first magnetic attraction part 21 attracts the first mold 22, and the first mold 22 is fixedly connected to the first magnetic attraction part 21. After the base 10 powers the second feeding mechanism 30, the second magnetic attraction part 31 attracts the second mold 32, and the second mold 32 is fixedly connected to the second magnetic attraction part 31.

[0040] The parallel arrangement of the first feeding mechanism 20 and the second feeding mechanism 30 significantly improves production efficiency. The two mechanisms can operate independently, achieving alternating or synchronous feeding, thus completing more stamping operations per unit time. This parallel processing effectively shortens the production cycle and meets the high-efficiency demands of modern manufacturing. Direct magnetic attraction between the magnetic part and the mold simplifies the mold replacement process. When mold replacement is needed, simply disconnecting the power to the corresponding magnetic part allows for easy removal of the old mold and installation of the new one, eliminating the need for complex mechanical fixing devices. This design not only increases the speed of mold replacement but also reduces operational difficulty, facilitating rapid mold changes and adapting to multi-variety, small-batch production models. The magnetic fixing method offers high positioning accuracy and stability. When energized, the magnetic part generates a uniform and powerful magnetic field, ensuring the mold maintains a stable position during stamping and reducing stamping errors caused by mold movement or wobbling. This is particularly important for circuit boards requiring high-precision machining, effectively improving product quality and consistency. This structural design also offers good scalability and compatibility. By adjusting the size and power of the magnetic suction part, it can adapt to molds of different specifications and weights. At the same time, the base 10, as a support and control system, can easily integrate other auxiliary equipment or functional modules, such as automated feeding systems and quality inspection devices, to further improve the overall performance and intelligence level of the stamping press 100.

[0041] More preferably, the first feeding mechanism 20 further includes a first substrate 23 and a first guide rail 24.

[0042] The first substrate 23 is fixedly connected to the base 10. The first guide rail 24 is fixedly connected to the first substrate 23 and is located on the side of the first substrate 23 opposite to the base 10.

[0043] The first substrate 23 is made of high-strength alloy material and is rigidly connected to the base 10 by bolts, effectively dispersing the reaction force generated during the stamping process. This design transfers the dynamic load to the entire frame, avoiding deformation caused by local stress concentration. The mounting surface of the first guide rail 24 is precision-ground to provide a stable mounting reference for the first guide rail 24. Placing the first guide rail 24 on the outside of the first substrate 23 prevents contaminants such as stamping oil and metal shavings from directly contacting its surface. If the first guide rail 24 or the first magnetic suction unit 21 malfunctions, the entire feeding module can be replaced simply by removing the connecting bolts of the first substrate 23. The first substrate 23 specifically adopts a thick silicon steel sheet laminate structure, which effectively blocks electromagnetic interference generated by the first magnetic suction unit 21 during operation.

[0044] More preferably, the first magnetic attraction part 21 is slidably connected to the first guide rail 24 and is located on the side of the first guide rail 24 away from the first substrate 23.

[0045] When the first magnetic suction part 21 is located outside the first guide rail 24, its sliding trajectory is completely separated from the fixed components such as the first substrate 23 and the base 10, avoiding interference between moving components such as the first mold 22 or the first pressure plate 43 and the fixed structure. If the first magnetic suction part 21 is placed between the first guide rail 24 and the first substrate 23, the height of the first guide rail 24 needs to be increased to accommodate the thickness of the first magnetic suction part 21. The outer layout of the first magnetic suction part 21 keeps its electromagnetic coil away from the metal material of the substrate, reducing eddy current losses. At the same time, the first substrate 23 can avoid distorting the magnetic field distribution. When the first magnetic suction part 21 is located on the outside, the replacement or maintenance of the magnetic suction unit can be completed by simply disassembling the connector between the first guide rail 24 and the first magnetic suction part 21, without disassembling the first substrate 23 or the first guide rail 24 itself. When the weight of the first magnetic suction part 21 is mainly located outside the first guide rail 24, the rotational inertia of the entire stamping machine 100 can be reduced, and the sliding response speed can be improved to meet the requirements of high-speed stamping. The outer layout ensures that the gravity of the first magnetic attraction part 21 is aligned with the bearing direction of the guide rail, reducing the impact of lateral force on the lifespan of the first guide rail 24.

[0046] More preferably, the first guide rail 24 extends along a first direction F1 parallel to the surface of the substrate. After the substrate 10 is energized to the first feeding mechanism 20, it drives the first magnetic suction part 21 to slide on the first guide rail 24 along the first direction F1.

[0047] The purpose of this design is to achieve rapid sliding and automatic alignment of the mold, improving the efficiency and accuracy of mold changes. Specifically, the first guide rail 24 is configured to extend along a first direction F1 parallel to the surface of the substrate, allowing the magnetic suction part to drive the mold to slide smoothly in the horizontal direction, facilitating precise positioning of the mold between the feeding mechanism and the stamping machine 100. By slidably connecting the first magnetic suction part 21 to the first guide rail 24 and driving the magnetic suction part to slide using an electrically controlled method, not only is the reliance on manual alignment and handling operations in traditional mold changes simplified, but the changeover time is also significantly reduced. Its sliding path is in a fixed direction, avoiding the complex positioning problems caused by multi-degree-of-freedom motion, thereby ensuring that the mold can be quickly and accurately positioned at the target stamping position. In addition, the sliding method of the guide rail also has good mechanical stability and repeatability, can adapt to frequent mold changing operations, and is suitable for high-speed operation requirements in mass production environments, fundamentally improving the stamping efficiency and intelligence level of the entire machine.

[0048] More preferably, the second feeding mechanism 30 further includes: a second substrate 33 and a second guide rail 34.

[0049] The second substrate 33 is fixedly connected to the base 10. Viewed along the first direction F1, the second substrate 33 and the first substrate 23 are arranged side by side. The second guide rail 34 is fixedly connected to the second substrate 33 and is located on the side of the second substrate 33 opposite to the base 10.

[0050] The main purpose of this design is to achieve parallel feeding at multiple workstations, thereby improving the overall processing efficiency and flexibility of the circuit board stamping machine 100. Firstly, by arranging the first substrate 23 and the second substrate 33 side-by-side on the base 10, multiple feeding mechanisms can be arranged within a limited space, allowing multiple molds or stamping stations to operate synchronously or alternately. This parallel structure facilitates continuous processing of circuit boards of different specifications, avoiding equipment downtime due to mold switching, and is particularly suitable for multi-model, small-batch production scenarios. Secondly, the second guide rail 34 is fixedly connected to the second substrate 33 and arranged on the side away from the base 10, ensuring that the sliding path of the second magnetic suction part 31 avoids the core structure of the base 10, thus effectively utilizing space and avoiding motion interference. Simultaneously, the fixed structure between the guide rail and the substrate provides good support and guidance, ensuring the stability and accuracy of the feeding process. Furthermore, this structural layout also facilitates modular design and maintenance. If a feeding module needs to be replaced or upgraded, only the corresponding substrate and guide rail parts need to be operated, without affecting the normal operation of other mechanisms, thereby improving the maintainability and expandability of the equipment. Overall, this design helps achieve the goal of high-speed, high-precision, and multi-station collaborative stamping operations.

[0051] More preferably, the second magnetic attraction part 31 is slidably connected to the second guide rail 34 and is located on the side of the second guide rail 34 opposite to the second substrate 33.

[0052] The second magnetic suction unit 31 is slidably connected to the second guide rail 34, allowing it to move linearly along the guide rail, thus quickly and accurately moving the mold from the pre-assembly area to the stamping station. This sliding connection method has good guiding and repeatability accuracy, helping to reduce deviations during mold movement, ensuring the mold can be accurately aligned with the stamping position, and improving processing quality. Positioning the second magnetic suction unit 31 on the side of the second guide rail 34 away from the second base plate 33 is a space optimization design. This arrangement keeps the magnetic suction unit and the mold it carries away from the base plate body, avoiding interference with other components on the base plate during mold movement, thereby improving structural compatibility and operational safety. This arrangement also facilitates modular assembly and maintenance. When the second guide rail 34 or the second magnetic suction unit 31 needs to be replaced, only the components on one side of the second guide rail 34 need to be operated, avoiding significant impact on the entire machine and improving maintenance efficiency and equipment availability. Therefore, this design has significant advantages in improving the working efficiency of stamping equipment, the flexibility of mold replacement, and the convenience of maintenance.

[0053] More preferably, the second guide rail 34 also extends along the first direction F1. After the base 10 is energized to the second feeding mechanism 30, it drives the second magnetic suction part 31 to slide on the second guide rail 34 along the first direction F1.

[0054] The second guide rail 34 is designed to extend along the first direction F1, aligning its movement direction with that of the first feeding mechanism 20. This design promotes structural symmetry and layout optimization of the entire equipment. The unified sliding direction simplifies the design and manufacturing of components such as the guide rail and magnetic suction unit, and also facilitates later installation, debugging, and system maintenance, reducing manufacturing and operating costs. By energizing the second feeding mechanism 30 through the base 10, the second magnetic suction unit 31 slides along the second guide rail 34 in the first direction F1, enabling automatic adsorption, movement, and positioning of the second mold 32. This sliding method allows for rapid mold replacement and feeding without manual intervention, effectively shortening production cycle time and improving capacity utilization. Sliding in the same direction also facilitates coordination of the working rhythms of the first and second feeding mechanisms 30, allowing the two molds to operate simultaneously or alternately, thus adapting to the complex multi-process processing requirements of circuit boards. This parallel structure, combined with the unified sliding direction and magnetic drive method, provides a solid foundation for the equipment to achieve multi-mold linkage stamping and continuous operation.

[0055] More preferably, the stamping machine 100 further includes: a first stamping mechanism 40 and a second stamping mechanism 50.

[0056] The first stamping mechanism 40 is fixedly connected to the first substrate 23. The first stamping mechanism 40 includes a first pneumatic part 41, a first guide shaft 42 fixedly connected to the first substrate 23 and located between the first substrate 23 and the first pneumatic part 41, and a first pressure plate 43 slidably connected to the first guide shaft 42 and fixedly connected to the first pneumatic part 41. The second stamping mechanism 50 is fixedly connected to the second substrate 33. The second stamping mechanism 50 includes a second pneumatic part 51, a second guide shaft 52 fixedly connected to the second substrate 33 and located between the second substrate 33 and the second pneumatic part 51, and a second pressure plate 53 slidably connected to the second guide shaft 52 and fixedly connected to the second pneumatic part 51.

[0057] The purpose of this configuration is to achieve multi-station parallel stamping processing, improving the working efficiency of the circuit board stamping machine 100 and its ability to adapt to complex processes. The first stamping mechanism 40 is fixedly connected to the first substrate 23, and equipped with a first pneumatic unit 41, a first guide shaft 42, and a first pressure plate 43, ensuring good guidance and stability for the first stamping mechanism 40. The guide shaft guides the pressure plate to precisely press down along a predetermined path, cooperating with the die below to complete high-precision punching, cutting, or forming operations. Simultaneously, the pneumatic unit, as a drive source, provides stable and controllable stamping force, adapting to the processing needs of circuit boards of different materials and thicknesses. A second stamping mechanism 50 is set up and fixed to the second substrate 33, structurally consistent with the first stamping mechanism 40. This parallel dual-stamping machine 100 design facilitates the parallel processing of two processes, such as preliminary cutting on one side and precision forming on the other. By rationally arranging the die type and the pressure plate movement rhythm, one-stop processing of complex circuit boards can be achieved, avoiding frequent material transfers between different devices. Both stamping presses employ guide shafts and pneumatic pressure plates, which not only improves the accuracy and repeatability of the stamping action but also simplifies the mechanism control and maintenance process. This structural design, while meeting the demands of high-frequency, high-precision processing, also provides a solid foundation for modular expansion or integration with intelligent control systems, further enhancing the equipment's flexible manufacturing capabilities and industrial automation level.

[0058] More preferably, when viewed along the first direction F1, the first stamping mechanism 40 and the second stamping mechanism 50 are arranged side by side on the base 10. The first guide shaft 42 extends along a second direction F2 perpendicular to the first direction F1, and the second guide shaft 52 also extends along the second direction F2.

[0059] This configuration aims to optimize the structural layout and movement direction of the stamping machine 100, improving processing efficiency, structural compactness, and ease of maintenance. Viewed along the first direction F1, the first stamping mechanism 40 and the second stamping mechanism 50 are arranged side-by-side on the base 10, allowing the two stamping stations to work collaboratively on the same platform, achieving parallel operation. Compared to traditional series-arranged stamping structures, the side-by-side layout significantly shortens the material transfer path between the two stations, increasing the overall production cycle time. Simultaneously, this configuration helps maintain a consistent transmission direction and positioning reference for the circuit board during stamping, contributing to improved product processing accuracy and consistency. Both the first guide shaft 42 and the second guide shaft 52 extend along the second direction F2, perpendicular to the first direction F1, meaning they both employ an up-and-down guide structure perpendicular to the feeding direction. This unified guide direction simplifies the design and control system. The pneumatic pressure plate moves up and down in the same direction, facilitating centralized control of the air source and synchronized pressing actions, and making intelligent adjustment and feedback control easier to achieve. This structural layout enhances the modularity and future expandability of the stamping machine 100. Both stamping presses are independent control units, which makes it easy to adjust the mold type or stamping program according to different process requirements. They also facilitate subsequent maintenance or partial upgrades without disassembling the entire stamping platform, thereby improving the service life and maintenance efficiency of the equipment.

[0060] Even better,

[0061] The base 10 drives the first mold 22 to be located below the first pressure plate 43, and the first pneumatic part 41 drives the first pressure plate 43 to press down along the second direction F2 to abut against the first mold 22.

[0062] The base 10 drives the second mold 32 to be located below the second pressure plate 53, and the second pneumatic part 51 drives the second pressure plate 53 to press down along the second direction F2 to abut against the second mold 32.

[0063] The purpose of this design is to achieve an efficient stamping operation process while ensuring precise alignment between the die and the pressure plate, thereby improving the stability and accuracy of circuit board processing. The base 10 can drive the first die 22 and the second die 32 to be positioned below their respective first pressure plate 43 and second pressure plate 53, ensuring precise alignment between the die and the pressure plate before stamping. This independent drive and positioning mechanism facilitates rapid die switching and adjustment, improves the automation level of the entire machine, and avoids positional deviations caused by manual intervention, thus increasing processing yield. The first pneumatic unit 41 and the second pneumatic unit 51 control their respective pressure plates to move downwards along the second direction F2 (vertical direction), ensuring that the die receives stable and uniform stamping pressure. This pneumatic drive method has a fast response and is suitable for stamping operations on various circuit board materials. Furthermore, it allows for control of the pressing speed and force by adjusting the air pressure, helping to adapt to the processing needs of circuit boards of different thicknesses and densities.

[0064] Therefore, after the base 10 is energized to the first feeding mechanism 20 and the second feeding mechanism 30 respectively, the first magnetic suction part 21 attracts and fixes the first mold 22, and the second magnetic suction part 31 attracts and fixes the second mold 32. This allows the molds on the stamping machine 100 to be quickly assembled and disassembled on the magnetic suction part of the electromagnet by switching the power on and off, effectively improving the mold replacement efficiency. Furthermore, the design of the stamping machine 100 with a first feeding structure and a second feeding mechanism 30 allows the stamping machine 100 to be designed with first molds 22 and second molds 32 according to different stamping requirements of the circuit board, avoiding frequent transfer of the circuit board between multiple stamping machines 100 and improving stamping efficiency.

[0065] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A circuit board stamping machine, characterized in that, The stamping machine includes: Matrix A first feeding mechanism is fixedly connected to the base. The first feeding mechanism includes a first magnetic suction part and a first mold located on the side of the first magnetic suction part away from the base. The second feeding mechanism is fixedly connected to the base. The second feeding mechanism includes a second magnetic suction part and a second mold located on the side of the second magnetic suction part away from the base. The first feeding mechanism and the second feeding mechanism are arranged side by side on the base and are electrically connected to the base respectively. After the base is energized to the first feeding mechanism, the first magnetic part attracts the first mold and the first mold is fixedly connected to the first magnetic part. After the base is energized to the second feeding mechanism, the second magnetic part attracts the second mold and the second mold is fixedly connected to the second magnetic part.

2. The circuit board stamping machine according to claim 1, characterized in that, The first feeding mechanism also includes: The first substrate is fixedly connected to the base; The first guide rail is fixedly connected to the first substrate and is located on the side of the first substrate away from the base.

3. A circuit board stamping machine according to claim 2, characterized in that, The first magnetic attraction part is slidably connected to the first guide rail and is located on the side of the first guide rail away from the first substrate.

4. A circuit board stamping machine according to claim 3, characterized in that, The first guide rail extends along a first direction parallel to the surface of the substrate. After the substrate is energized to the first feeding mechanism, it drives the first magnetic suction part to slide along the first direction on the first guide rail.

5. A circuit board stamping machine according to claim 4, characterized in that, The second feeding mechanism also includes: The second substrate is fixedly connected to the base body. When viewed along the first direction, the second substrate and the first substrate are arranged side by side. The second guide rail is fixedly connected to the second substrate and is located on the side of the second substrate away from the base.

6. A circuit board stamping machine according to claim 5, characterized in that, The second magnetic attraction part is slidably connected to the second guide rail and is located on the side of the second guide rail away from the second substrate.

7. A circuit board stamping machine according to claim 6, characterized in that, The second guide rail also extends along the first direction. After the substrate is energized to the second feeding mechanism, it drives the second magnetic suction part to slide along the first direction on the second guide rail.

8. A circuit board stamping machine according to claim 7, characterized in that, The stamping press also includes: A first stamping mechanism is fixedly connected to the first substrate. The first stamping mechanism is provided with a first pneumatic part, a first guide shaft fixedly connected to the first substrate and located between the first substrate and the first pneumatic part, and a first pressure plate slidably connected to the first guide shaft and fixedly connected to the first pneumatic part. The second stamping mechanism is fixedly connected to the second substrate. The second stamping mechanism is provided with a second pneumatic part, a second guide shaft fixedly connected to the second substrate and located between the second substrate and the second pneumatic part, and a second pressure plate slidably connected to the second guide shaft and fixedly connected to the second pneumatic part.

9. A circuit board stamping machine according to claim 8, characterized in that, Viewed along the first direction, the first stamping mechanism and the second stamping mechanism are arranged side by side on the base. The first guide shaft extends along a second direction perpendicular to the first direction, and the second guide shaft also extends along the second direction.

10. A circuit board stamping machine according to claim 9, characterized in that, The base drives the first mold to be located below the first pressure plate, and the first pneumatic part drives the first pressure plate to press down along the second direction to abut against the first mold; The base drives the second mold to be located below the second pressure plate, and the second pneumatic unit drives the second pressure plate to press down along the second direction to abut against the second mold.

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