Novel chemical copper plating device for circuit board production

Abstract

The utility model discloses a novel chemical copper plating device for circuit board production relates to chemical copper plating technical field, including circuit board, device shell, outer frame and inner frame still include: circuit board fixing mechanism, activity setting on the device shell is used for the fixation of circuit board, and circuit board fixing mechanism includes the placement fixed frame of installation in the inner frame, and the fixed resistance pole is slidably installed in the placement fixed frame, circuit board elevating copper plating mechanism sets up on the device shell and outer frame is used for the elevating copper plating of circuit board, and the output of electric lifting rod installs on the outer frame, hot baking mechanism sets up on circuit board elevating copper plating mechanism is used for the quick air drying of circuit board, and hot baking mechanism includes the installation shell of installation on copper plating pool, and the installation shell is provided with electric heating wire and fan, the utility model discloses can fix circuit board in the placement fixed frame, and after the copper plating of circuit board, the hot baking air drying of circuit board can make circuit board quick drying, and do not affect the subsequent processing of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of chemical copper plating technology, and in particular to a novel chemical copper plating apparatus for circuit board production. Background Technology

[0002] Printed circuit boards (PCBs) play a crucial role in electronic products. First, they act as bridges between electronic components, enabling precise and reliable electronic and electrical connections and ensuring smooth signal and power transmission. Second, PCBs provide robust physical support for circuits, not only fixing component positions but also enhancing the circuit's mechanical strength and resisting external impacts.

[0003] Circuit board production requires copper plating, which involves placing the circuits into a copper plating bath using a copper plating device. Existing technology, patent CN219490160U, discloses a chemical copper plating device for circuit board production. However, this device struggles to quickly heat-dry the circuit boards after plating, affecting subsequent processing. Therefore, a novel chemical copper plating device for circuit board production is needed to meet these requirements. Utility Model Content

[0004] The purpose of this invention is to provide a novel chemical copper plating apparatus for circuit board production, in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a novel chemical copper plating apparatus for circuit board production, comprising a circuit board, an apparatus housing, an outer frame, and an inner frame, and further comprising:

[0006] A circuit board fixing mechanism is movably mounted on the housing of the device for fixing the circuit board. The circuit board fixing mechanism includes a placement frame installed in the inner frame, a fixing rod slidably installed in the placement frame, and an integrating rod installed on the placement frame.

[0007] A circuit board lifting and copper plating mechanism is provided on the device housing and the outer frame for lifting and copper plating of the circuit board. The circuit board lifting and copper plating mechanism includes a copper plating pool and an electric lifting rod installed on the device housing. The output end of the electric lifting rod is installed on the outer frame.

[0008] A hot drying mechanism is installed on the circuit board lifting and copper plating mechanism for rapid air drying of the circuit board. The hot drying mechanism includes a mounting housing installed on the copper plating tank, and an electric heating wire and a fan are installed inside the mounting housing.

[0009] Preferably, the circuit board fixing mechanism further includes a lifting plate disposed within the placement frame, a guide strip is installed on the top of the placement frame, a lever is slidably installed within the placement frame and the guide strip, and the lifting plate is mounted on the lever.

[0010] Preferably, one end of the lifting plate return spring is installed on the lever, the other end of the lifting plate return spring is installed on the guide bar, a stop rod return spring is installed on the integrated rod, and the other end of the stop rod return spring is installed on the placement frame.

[0011] Preferably, a limiting block is installed on the fixing rod, and a limiting groove is formed in the placement frame, with the limiting block abutting in the limiting groove.

[0012] Preferably, the circuit board lifting and copper plating mechanism further includes a support plate installed on the outer frame, a rotating motor installed on the support plate, a rotating shaft rotatably installed inside the outer frame, and the inner frame installed on the rotating shaft.

[0013] Preferably, the hot drying mechanism further includes a reciprocating lead screw rotatably installed inside the mounting housing, a lead screw sleeve is fitted onto the reciprocating lead screw, a fan is installed on the lead screw sleeve, a drive motor is installed on the top of the mounting housing, and the reciprocating lead screw is installed at the output end of the drive motor.

[0014] Preferably, a guide rod is installed inside the mounting housing, and a guide sleeve is slidably sleeved on the guide rod, the guide sleeve being mounted on the lead screw sleeve.

[0015] The beneficial effects of this utility model are:

[0016] In this invention, pulling the integrated rod outwards can move the fixing rod outwards from the placement frame. The limiting block enters the limiting groove to prevent the fixing rod from being pulled out. Furthermore, the fixing rod leaving the placement frame does not affect the placement of the circuit board. When the circuit board is placed in the placement frame, the fixing rod will move forward and press against the circuit board under the action of the rod return spring, thereby fixing the circuit board in the placement frame.

[0017] In this invention, the extension of the electric lifting rod causes the outer frame to descend, which in turn pulls the circuit board into the copper plating bath for copper plating. The contraction of the copper plating bath then pulls the copper-plated circuit board upwards. The rotation of the motor drives the circuit board to rotate, allowing it to be heated and rotated simultaneously.

[0018] In this invention, the heating wire heats the air, and the fan blows the hot air onto the circuit board after copper plating. The drive motor rotates, which in turn drives the fan to move up and down. This, in turn, causes the lead screw to rotate, which in turn drives the lead screw sleeve to move up and down, thus driving the fan to move up and down to supply heat to the circuit board. The heat treatment range of the circuit board is wide. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the novel chemical copper plating apparatus for circuit board production proposed in this utility model.

[0020] Figure 2 This is a schematic diagram of the inner frame, push rod, return spring, and other structures of the novel chemical copper plating device for circuit board production proposed in this utility model.

[0021] Figure 3 This is a schematic diagram of the lifting plate, lifting plate reset spring, and other structures of the novel chemical copper plating device for circuit board production proposed in this utility model.

[0022] Figure 4 This is a schematic diagram of the integrated rod, retaining rod, and other structures of the novel chemical copper plating device for circuit board production proposed in this utility model.

[0023] Figure 5 This is a schematic diagram of the placement frame, guide strips, and other structures of the novel chemical copper plating device for circuit board production proposed in this utility model.

[0024] Figure 6 This is a schematic diagram of part A of the novel chemical copper plating apparatus for circuit board production proposed in this utility model.

[0025] Figure 7 This is a schematic diagram of the structure of the novel chemical copper plating device for circuit board production proposed in this utility model, including the fan, heating wire, and reciprocating lead screw.

[0026] In the diagram: 1. Circuit board; 2. Device housing; 3. Outer frame; 4. Inner frame; 5. Circuit board fixing mechanism; 51. Placement frame; 52. Fixing rod; 53. Integrating rod; 54. Lifting plate; 55. Guide bar; 56. Pulley; 57. Lifting plate return spring; 58. Rod return spring; 59. Limiting block; 510. Limiting groove; 6. Circuit board lifting and copper plating mechanism; 61. Copper plating pool; 62. Electric lifting rod; 63. Support plate; 64. Rotating motor; 65. Rotating shaft; 7. Heating mechanism; 71. Mounting housing; 72. Heating wire; 73. Fan; 74. Reciprocating lead screw; 75. Lead screw sleeve; 76. Drive motor; 77. Guide sleeve; 78. Guide rod. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0028] Example:

[0029] like Figure 1-7 As shown, this embodiment provides a novel chemical copper plating apparatus for circuit board production, including a circuit board 1, an apparatus housing 2, an outer frame 3, and an inner frame 4. It also includes a circuit board fixing mechanism 5, which is movably mounted on the apparatus housing 2 for fixing the circuit board 1. The circuit board fixing mechanism 5 includes a placement frame 51 installed in the inner frame 4. A fixing rod 52 is slidably installed in the placement frame 51, and an integrating rod 53 is installed on the placement frame 51. Pulling the integrating rod 53 outward can pull the fixing rod 52 outward from the placement frame 51. Then, the circuit board is placed in the placement frame 51, and the fixing rod 52 moves forward and abuts against the circuit board, thereby fixing the circuit board in the placement frame 51. A circuit board lifting and copper plating mechanism 6 is installed on the device housing 2 and the outer frame 3. It is used for lifting and copper plating of the circuit board 1. The circuit board lifting and copper plating mechanism 6 includes a copper plating pool 61 and an electric lifting rod 62 installed on the device housing 2. The output end of the electric lifting rod 62 is installed on the outer frame 3. When the electric lifting rod 62 extends, it causes the outer frame 3 to descend. When the outer frame 3 descends, it causes the circuit board to enter the copper plating pool 61 for copper plating. When the copper plating pool 61 contracts, it pulls the copper-plated circuit board upward. A heat drying mechanism 7 is installed on the circuit board lifting and copper plating mechanism 6. It is used for rapid air drying of the circuit board 1. The heat drying mechanism 7 includes a mounting housing 71 installed on the copper plating pool 61. The mounting housing 71 contains an electric heating wire 72 and a fan 73. The electric heating wire 72 heats the air, and the fan 73 blows hot air onto the copper-plated circuit board. The fan 73 moves up and down to provide heat to the circuit board. The circuit board also rotates during heat drying, resulting in a better heat drying effect and rapid drying of the circuit board.

[0030] In this embodiment of the utility model, furthermore, to facilitate the removal of the circuit board and to reset the fixing rod 52 and the lifting plate 54, the circuit board fixing mechanism 5 also includes a lifting plate 54 disposed within the placement frame 51. A guide bar 55 is installed on the top of the placement frame 51, and a lever 56 is slidably installed within the placement frame 51 and the guide bar 55. Pushing the lever 56 upward allows the guide bar 55 to guide the movement of the lever 56, enabling the lever 56 to move only up and down. The upward movement of the lever 56 will cause the lifting plate 54 to move upward and lift the circuit board after copper plating, making it easier to remove the circuit board from the placement frame 51. The lifting plate 54 is mounted on the lever 56; one end of the lifting plate reset spring 57 is mounted on the lever 56, and the other end of the lifting plate reset spring 57 is mounted on the guide bar 55. After the lifting plate 54 has risen, it can automatically reset under the action of the lifting plate reset spring 57. An abutment return spring 58 is installed on the integrated rod 53, and the other end of the abutment return spring 58 is installed on the placement bracket 51; when the fixed abutment 52 is operated, the fixed abutment 52 can be automatically reset under the action of the abutment return spring 58.

[0031] In this embodiment of the utility model, furthermore, in order to limit the positioning of the retaining rod 52, a limiting block 59 is installed on the retaining rod 52, and a limiting groove 510 is formed in the placement frame 51, with the limiting block 59 abutting in the limiting groove 510; the limiting block 59 entering the limiting groove 510 can prevent the retaining rod 52 from being pulled out, and the retaining rod 52 leaving the placement frame 51 does not affect the placement of the circuit board.

[0032] In this embodiment of the utility model, further, in order to make the circuit board rotate, the circuit board lifting and copper plating mechanism 6 also includes a support plate 63 installed on the outer frame 3, a rotating motor 64 installed on the support plate 63, a rotating shaft 65 rotatably installed inside the outer frame 3, and an inner frame 4 installed on the rotating shaft 65; the rotation of the rotating motor 64 will drive the rotating shaft 65 to rotate, the rotation of the rotating shaft 65 will drive the inner frame 4 to rotate, and thus drive the circuit board to rotate.

[0033] In this embodiment of the invention, further, in order to drive the fan 73 to move up and down, the heating mechanism 7 also includes a reciprocating lead screw 74 rotatably installed inside the mounting housing 71. A lead screw sleeve 75 is sleeved on the reciprocating lead screw 74, and the fan 73 is installed on the lead screw sleeve 75. A drive motor 76 is installed on the top of the mounting housing 71, and the reciprocating lead screw 74 is installed at the output end of the drive motor 76. The rotation of the drive motor 76 will drive the reciprocating lead screw 74 to rotate, and the rotation of the reciprocating lead screw 74 will drive the lead screw sleeve 75 to move up and down, thereby driving the fan 73 to move up and down.

[0034] In this embodiment of the invention, furthermore, in order to guide the movement of the lead screw sleeve 75, a guide rod 78 is installed inside the mounting housing 71, and a guide sleeve 77 is slidably sleeved on the guide rod 78. The guide sleeve 77 is installed on the lead screw sleeve 75. The sliding of the guide sleeve 77 on the guide rod 78 can guide the movement of the lead screw sleeve 75, so that the fan 73 can only move up and down, and the rotation of the reciprocating lead screw 74 will drive the lead screw sleeve 75 to move up and down.

[0035] Working principle: In use, pull the integrated rod 53 outward. The integrated rod 53 can pull the retaining rod 52 outward from the placement frame 51. The limiting block 59 enters the limiting groove 510, which can prevent the retaining rod 52 from being pulled out. The retaining rod 52 leaving the placement frame 51 does not affect the placement of the circuit board. Then, place the circuit board in the placement frame 51. Under the action of the rod return spring 58, it will drive the retaining rod 52 to move forward and abut against the circuit board, thereby fixing the circuit board in the placement frame 51. After the copper plating is completed, push the lever 56 upward. The guide bar 55 can guide the movement of the lever 56, so that the lever 56 can only move up and down. The upward movement of the lever 56 will drive the lifting plate 54 to move upward and lift the copper-plated circuit board upward, making it easy to remove the circuit board from the placement frame 51. The extension of the electric lifting rod 62 causes the outer frame 3 to descend, which in turn causes the circuit board to enter the copper plating tank 61 for copper plating. The contraction of the copper plating tank 61 pulls the copper-plated circuit board upwards. The rotation of the rotating motor 64 causes the rotating shaft 65 to rotate, which in turn causes the inner frame 4 to rotate, and consequently the circuit board to rotate. The heating wire 72 heats the air, and the fan 73 blows the hot air onto the copper-plated circuit board. The rotation of the drive motor 76 causes the reciprocating screw 74 to rotate. The guide sleeve 77 slides on the guide rod 78, which guides the movement of the screw sleeve 75, allowing the fan 73 to move only up and down. The rotation of the reciprocating screw 74 then causes the screw sleeve 75 to move up and down, thus driving the fan 73 to move up and down to heat the circuit board. The circuit board also rotates during the heating process, resulting in a better heating effect and faster drying of the circuit board.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A novel chemical copper plating apparatus for circuit board production, comprising a circuit board (1), an apparatus housing (2), an outer frame (3), and an inner frame (4), characterized in that, Also includes: The circuit board fixing mechanism (5) is movably mounted on the outer shell (2) of the device for fixing the circuit board (1). The circuit board fixing mechanism (5) includes a placement frame (51) installed in the inner frame (4). A fixing rod (52) is slidably installed in the placement frame (51). An integrating rod (53) is installed on the placement frame (51). A circuit board lifting and copper plating mechanism (6) is provided on the device housing (2) and the outer frame (3) for lifting and copper plating of the circuit board (1). The circuit board lifting and copper plating mechanism (6) includes a copper plating pool (61) and an electric lifting rod (62) installed on the device housing (2). The output end of the electric lifting rod (62) is installed on the outer frame (3). The hot drying mechanism (7) is installed on the circuit board lifting copper plating mechanism (6) and is used for the rapid drying of the circuit board (1). The hot drying mechanism (7) includes a mounting housing (71) installed on the copper plating tank (61). The mounting housing (71) is provided with a heating wire (72) and a fan (73).

2. The novel chemical copper plating apparatus for circuit board production according to claim 1, characterized in that: The circuit board fixing mechanism (5) further includes a lifting plate (54) disposed in the placement frame (51). A guide strip (55) is installed on the top of the placement frame (51). A lever (56) is slidably installed in the placement frame (51) and the guide strip (55). The lifting plate (54) is installed on the lever (56).

3. The novel chemical copper plating apparatus for circuit board production according to claim 2, characterized in that: One end of the lifting plate return spring (57) is installed on the lever (56), and the other end of the lifting plate return spring (57) is installed on the guide bar (55). A stop rod return spring (58) is installed on the integrated rod (53), and the other end of the stop rod return spring (58) is installed on the placement frame (51).

4. The novel chemical copper plating apparatus for circuit board production according to claim 3, characterized in that: A limiting block (59) is installed on the fixed abutment (52), and a limiting groove (510) is opened in the placement frame (51), with the limiting block (59) abutting in the limiting groove (510).

5. The novel chemical copper plating apparatus for circuit board production according to claim 1, characterized in that: The circuit board lifting and copper sinking mechanism (6) also includes a support plate (63) installed on the outer frame (3), a rotating motor (64) is installed on the support plate (63), a rotating shaft (65) is rotatably installed inside the outer frame (3), and the inner frame (4) is installed on the rotating shaft (65).

6. The novel chemical copper plating apparatus for circuit board production according to claim 1, characterized in that: The heating mechanism (7) further includes a reciprocating lead screw (74) rotatably installed in the mounting housing (71), a lead screw sleeve (75) is sleeved on the reciprocating lead screw (74), the fan (73) is installed on the lead screw sleeve (75), a drive motor (76) is installed on the top of the mounting housing (71), and the reciprocating lead screw (74) is installed at the output end of the drive motor (76).

7. The novel chemical copper plating apparatus for circuit board production according to claim 6, characterized in that: A guide rod (78) is installed inside the mounting housing (71), and a guide sleeve (77) is slidably sleeved on the guide rod (78). The guide sleeve (77) is installed on the lead screw sleeve (75).

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