A heat dissipation device and electronic equipment

Abstract

The utility model provides a kind of heat dissipation device and electronic equipment, the heat dissipation device includes accommodating part, and the closed accommodating cavity is formed on accommodating part;Heat conduction structure, heat conduction structure is placed in accommodating cavity, and at least one face of heat conduction structure is tightly attached to the inner surface of accommodating part, to allow heat conduction structure to transmit heat from the inside of accommodating cavity to accommodating part;Phase-changeable material, phase-changeable material is placed in the inside of accommodating cavity and contacts with heat conduction structure, the melting point of phase-changeable material is lower than the melting point of accommodating part and heat conduction structure material, and phase-changeable material is not filled up accommodating cavity.Electronic equipment includes aforementioned heat dissipation device and heat source.The heat dissipation device provided by the utility model can absorb the large amount of heat released by heat source in a short time through phase-changeable material and not to temperature rise too fast, especially suitable for the equipment that heat source can release large amount of heat or heat fluctuation in a short time.

Description

Technical Field

[0001] This utility model relates to electronic equipment, and more specifically, to a heat dissipation device and an electronic device. Background Technology

[0002] Typical electronic devices generally operate under typical power consumption conditions, and heat dissipation devices usually function stably. However, in certain special scenarios, the heat source may experience a sudden and significant increase in power, generating substantial heat in a short period, or the heat source may be subject to periodic fluctuations. Nevertheless, the chip's junction temperature must not exceed its normal operating temperature. Therefore, it is essential to study chip temperature protection issues caused by power consumption fluctuations. Utility Model Content

[0003] This invention provides a heat dissipation device and an electronic device, aiming to solve the above-mentioned problems in the prior art.

[0004] This utility model is implemented as follows:

[0005] A heat dissipation device includes a receiving element with a sealed cavity formed thereon; a heat-conducting structure placed within the cavity, with at least one side of the heat-conducting structure in close contact with the inner surface of the receiving element to allow the heat-conducting structure to transfer heat from the cavity to the receiving element; and a phase-change material placed within the cavity and in contact with the heat-conducting structure. The phase-change material has a melting point lower than that of the materials of the receiving element and the heat-conducting structure, and the phase-change material does not completely fill the cavity. The heat dissipation device provided by this invention includes a phase-change material and a heat-conducting structure. When a heat source emits a large amount of heat in a short time, the phase-change material can absorb a large amount of heat through a phase change. Furthermore, during the phase change process, the temperature of the phase-change material itself does not rise significantly, allowing the heat dissipation device as a whole to absorb a large amount of heat emitted by the heat source in a short time while maintaining its own temperature essentially constant. The heat dissipation device provided by this invention is particularly suitable for situations where the heat source releases a large amount of heat in a short time, or for situations where heat fluctuations are significant.

[0006] Optionally, the accommodating component includes a first inner surface and a second inner surface disposed opposite to each other, with one end of the heat-conducting structure tightly attached to the first inner surface of the accommodating component and the other end of the heat-conducting structure tightly attached to the second inner surface. With this structural arrangement, the heat-conducting structure can both transfer heat and strengthen the structure of the accommodating component.

[0007] Optionally, the outer surface of the accommodating member located on the same side as the first inner surface is the first outer surface; the heat dissipation device further includes an external heat dissipation module disposed on the first outer surface of the accommodating member. With this structure, the heat-conducting structure transfers heat to the side of the accommodating member located on the first inner surface, and then the heat is dissipated through the external heat dissipation module.

[0008] Optionally, the external heat dissipation module includes multiple heat dissipation fins. By incorporating heat dissipation fins, the external heat dissipation module can maintain high heat dissipation efficiency.

[0009] Optionally, the external heatsink module includes a fan. Including a fan helps maintain high heat dissipation efficiency in the external heatsink module.

[0010] Optionally, the thermally conductive structure includes multiple thermally conductive sheets, with the phase change material in contact with the thermally conductive sheets. By setting multiple thermally conductive sheets, the accommodating cavity can be divided into multiple spaces that can accommodate the phase change material, thereby achieving uniform heat absorption and dissipation. It can also increase the heat transfer area, improve heat dissipation efficiency, and help provide more support, thereby enhancing the structural strength of the accommodating component.

[0011] Optionally, the heat-conducting structure can be porous. By setting the heat-conducting structure to porous, the accommodating cavity can be divided into multiple spaces that can accommodate phase change materials, so as to achieve uniform heat absorption and dissipation, and increase the heat transfer area and improve heat dissipation efficiency.

[0012] Optionally, the receiving component includes a substrate and a sealing cover, which are fixedly connected. By configuring the receiving component to include a substrate and a sealing cover, during the manufacturing process of the heat dissipation device, a heat-conducting structure is installed in the substrate, and a phase change material is placed therein. Then, the sealing cover is fixedly installed, forming a sealed receiving cavity between the sealing cover and the substrate, preventing the phase change material from overflowing after absorbing heat and turning into a liquid.

[0013] Optionally, the cavity can be a cuboid or annular cavity.

[0014] This invention also provides an electronic device, which includes a heat source and the aforementioned heat dissipation device; the accommodating member includes a first outer surface and a second outer surface disposed opposite to the first outer surface, an external heat dissipation module is disposed on the first outer surface, and the heat source is attached to the second outer surface; one end of the heat-conducting structure is attached to the inner wall of one side of the first outer surface of the accommodating member, and the other end is attached to the inner wall of one side of the second outer surface of the accommodating member. Because this electronic device includes the aforementioned heat dissipation device with a phase change material, the phase change material enables the heat dissipation device to absorb a large amount of heat released by the heat source in a short period of time.

[0015] The beneficial effects of this invention are as follows: The heat dissipation device provided by this invention incorporates a heat-conducting structure and a phase-change material. Normally, heat is dissipated through the heat-conducting structure. However, when a heat source releases a large amount of heat in a short time, and the heat-conducting structure cannot dissipate the heat in time, the phase change of the phase-change material absorbs the large amount of heat released by the heat source in a short period. Furthermore, during the phase change process, the temperature of the phase-change material itself does not rise significantly, allowing the heat dissipation device as a whole to absorb a large amount of heat emitted by the heat source in a short time while maintaining its own temperature relatively constant. The heat dissipation device provided by this invention is particularly suitable for situations where the heat source releases a large amount of heat in a short time, or for situations where heat fluctuations are significant.

[0016] This invention also provides an electronic device, which includes a heat source and the aforementioned heat dissipation device. Under normal circumstances, the heat generated by the heat source of the electronic device can be transferred through a thermally conductive structure. When the heat source generates a large amount of heat in a short period of time, the heat of the electronic device can be absorbed by a phase change material, and the temperature change of the heat dissipation device is not significant, thereby preventing a sharp rise in the temperature of the key components of the electronic device. The thermally conductive structure is placed between the first outer surface and the second outer surface, and can also serve as a structural reinforcement for the accommodating component. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is an exploded structural diagram of a heat dissipation device provided in an embodiment of this utility model.

[0019] Figure 2 This is a schematic diagram of a heat dissipation device provided in an embodiment of the present invention.

[0020] Figure 3 This is an exploded structural diagram of a heat dissipation device provided in an embodiment of this utility model.

[0021] Figure 4 This is an exploded structural diagram of another heat dissipation device provided in an embodiment of this utility model.

[0022] Icons: 100-Heat dissipation device; 110-Accommodation component; 111-Base; 112-Sealing cover; 113-First inner surface; 114-Second inner surface; 115-Accommodation cavity; 120-Heat-conducting structure; 130-Phase change material; 140-External heat dissipation module. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0024] In the description of this utility model, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Example

[0026] Please see Figures 1-4 This utility model provides a heat dissipation device 100, including a housing 110, a thermally conductive structure 120, and a phase change material 130.

[0027] The accommodating member 110 forms a closed accommodating cavity 115. Specifically, the accommodating member 110 can be made of metal or non-metal materials, preferably metal materials, and the material of the accommodating member 110 preferably has good thermal conductivity.

[0028] The heat-conducting structure 120 is placed in the receiving cavity 115, and at least one side of the heat-conducting structure 120 is in close contact with the inner surface of the receiving member 110, so as to allow the heat-conducting structure 120 to transfer heat from the inside of the receiving cavity 115 to the receiving member 110. The heat-conducting structure 120 can be made of metallic or non-metallic materials, and the material of the heat-conducting structure 120 preferably has good thermal conductivity.

[0029] The phase change material 130 is placed inside the accommodating cavity 115 and in contact with the heat-conducting structure 120. The melting point of the phase change material 130 is lower than that of the materials in the accommodating element 110 and the heat-conducting structure 120, and the phase change material 130 does not completely fill the accommodating cavity 115. The phase change material 130 refers to a material that can change from a solid to a liquid or from a liquid to a gas upon absorbing a certain amount of heat. Since a phase change usually involves a volume change, the phase change material 130 does not completely fill the accommodating cavity 115. Thus, during the phase change, the remaining air in the accommodating cavity 115 can be compressed, preventing the phase change from compressing the accommodating element 110 and causing it to bear excessive pressure. The sealed accommodating cavity 115 prevents the material from overflowing after the phase change.

[0030] In this embodiment of the invention, the phase change material 130 is a material that can change from solid to liquid. The phase change material 130 in this embodiment of the invention can be paraffin wax. Preferably, the melting point of the phase change material 130 is significantly different from the melting points of the materials of the housing 110 and the thermally conductive structure 120, so that when the phase change material 130 undergoes a solid-to-liquid phase change, the mechanical properties of the housing 110 and the thermally conductive structure 120 are not significantly affected.

[0031] In the heat dissipation device 100 provided in this embodiment of the present invention, when the heat released by the heat source is uniform and slow, the heat is promptly dissipated by the heat-conducting structure 120, the temperature rise of the heat dissipation device 100 is not significant, and the phase change material 130 does not undergo a phase change. When the heat source releases a large amount of heat in a short period of time, and the heat-conducting structure 120 cannot dissipate the heat in time, the phase change material 130 can absorb a large amount of heat through a phase change. Furthermore, during the phase change process, the temperature of the phase change material 130 itself does not rise significantly, allowing the heat dissipation device 100 as a whole to absorb a large amount of heat emitted by the heat source in a short period of time while maintaining its own temperature essentially constant. The heat dissipation device 100 provided in this embodiment of the present invention is particularly suitable for situations where the heat source releases a large amount of heat in a short period of time, or for situations where heat fluctuations are significant.

[0032] Furthermore, the heat-conducting structure 120 can be made of materials such as copper, aluminum, copper alloy, aluminum alloy, graphite, and ceramic.

[0033] Preferably, the accommodating member 110 includes a first inner surface 113 and a second inner surface 114 disposed opposite to each other. One end of the heat-conducting structure 120 is in close contact with the first inner surface 113 of the accommodating member 110, and the other end of the heat-conducting structure 120 is in close contact with the second inner surface 114. Further, the space formed between the heat-conducting structures 120 is used to place the phase change material 130. Heat released by the heat source is transferred through one end of the accommodating member 110 to the accommodating cavity 115, and is then transferred from one end to the other by the heat-conducting structure 120. If the heat released by the heat source in a short time is large, the phase change material 130 placed in the accommodating cavity 115 absorbs the heat and undergoes a phase change as the heat accumulates, thereby absorbing a large amount of heat and maintaining a relatively small temperature change. With this structural arrangement, the heat-conducting structure 120 can both transfer heat and strengthen the structure of the accommodating member 110.

[0034] Optionally, the outer surface of the accommodating member 110 located on the same side as the first inner surface 113 is the first outer surface; the heat dissipation device 100 also includes an external heat dissipation module 140, which is disposed on the first outer surface of the accommodating member 110. For example, if the accommodating member 110 has a basically cuboid structure, the external heat dissipation module 140 can be disposed on the upper surface of the accommodating member 110, while the heat source is located on the lower surface of the accommodating member 110, and the heat is transferred in the direction from bottom to top; if the accommodating member 110 has a basically annular structure, the external heat dissipation module 140 can be disposed on the outer surface of the accommodating member 110, while the heat source is located inside the inner surface of the accommodating member 110, and the heat is transferred in the direction from inside to outside. With this structure, the heat-conducting structure 120 transfers heat to one side of the first inner surface 113 of the accommodating member 110, and then dissipates the heat through the external heat dissipation module 140. This allows the heat absorbed by the heat-conducting structure 120 from the heat source to be dissipated in a timely manner through the external heat dissipation module 140, thus preventing the temperature of the heat-conducting structure 120 itself from rising too quickly and affecting the heat dissipation effect.

[0035] Preferably, the external heat dissipation module 140 includes multiple heat dissipation fins. Specifically, one end of each heat dissipation fin is fixedly connected to the surface of the housing 110, and the other end extends to the outside. The heat dissipation fins absorb heat transferred from the heat-conducting structure 120 from the housing 110 and dissipate the heat to the outside. The heat dissipation fins have a relatively large heat dissipation area and a large number, thus achieving high heat dissipation efficiency and enabling heat to be dissipated in a timely manner.

[0036] Preferably, the external heat dissipation module 140 includes a fan. By providing a fan, the external heat dissipation module 140 helps maintain high heat dissipation efficiency.

[0037] Furthermore, the external heat dissipation module 140 may also include heat dissipation fins and a fan, or other heat dissipation structures may be provided.

[0038] Preferably, the thermally conductive structure 120 includes multiple thermally conductive sheets, and the phase-change material 130 is in contact with the thermally conductive sheets. For details, please refer to [link to relevant documentation]. Figure 2 The heat-conducting plates can be arranged in a parallel manner; please refer to [link / reference]. Figure 4 Alternatively, they can be arranged radially along the circumference. Preferably, the spacing between the multiple heat-conducting structures 120 is uniform. By setting multiple heat-conducting sheets, the accommodating cavity 115 can be divided into multiple spaces that can accommodate the phase change material 130, so as to achieve uniform heat absorption and dissipation. It can also increase the heat transfer area, improve heat dissipation efficiency, and help provide more support, thereby enhancing the structural strength of the accommodating component 110.

[0039] Preferably, the heat-conducting structure 120 is a porous structure. For example, the heat-conducting structure 120 can be configured as a honeycomb structure. By configuring the heat-conducting structure 120 as a porous structure, the accommodating cavity 115 can be divided into multiple spaces that can accommodate the phase change material 130, so as to achieve uniform heat absorption and dissipation, and increase the heat transfer area and improve heat dissipation efficiency.

[0040] Preferably, the accommodating member 110 includes a base 111 and a sealing cover 112, which are fixedly connected. By configuring the accommodating member 110 to include a base 111 and a sealing cover 112, during the manufacturing process of the heat dissipation device 100, a heat-conducting structure 120 is installed in the base 111, and a phase change material 130 is placed therein. Then, the sealing cover 112 is fixedly installed, forming a sealed accommodating cavity 115 between the sealing cover 112 and the base 111, preventing the phase change material 130 from overflowing after absorbing heat and turning into a liquid.

[0041] Preferably, the accommodating cavity 115 is a cuboid or annular cavity. For details, please refer to [link / reference needed]. Figures 1-3 The rectangular cavity 115 is suitable for placing a heat source on one side of the accommodating member 110 and placing the external heat dissipation module 140 on the other side of the accommodating member 110. For example, the heat source can be placed on the lower side of the accommodating member 110 and the external heat dissipation module 140 can be placed on the upper side of the accommodating member 110.

[0042] This utility model embodiment also provides an electronic device, which includes a heat source and the aforementioned heat dissipation device 100. Specifically, the heat source can be a chip in an electronic device, especially a chip in an electronic device used for AI training. The accommodating member 110 includes a first outer surface and a second outer surface disposed opposite to the first outer surface. An external heat dissipation module 140 is disposed on the first outer surface, and the heat source is attached to the second outer surface. One end of the thermally conductive structure 120 is attached to the inner wall of one side of the first outer surface of the accommodating member 110, and the other end is attached to the inner wall of one side of the second outer surface of the accommodating member 110. Further:

[0043] If the heat source is planar, then the housing 110 can be basically rectangular in shape. Please refer to [link / reference]. Figures 1-3 The second outer surface of the accommodating member 110 can be the lower surface of the accommodating member 110, and the first outer surface can be the upper surface of the accommodating member 110. The heat source is placed on the lower surface of the accommodating member 110, the external heat dissipation module 140 is located on the upper surface of the accommodating member 110, and the heat conduction structure 120 extends in the direction from the lower surface to the upper surface, thereby transferring the heat dissipated by the heat source to the upper surface and dissipating it through the external heat dissipation module 140.

[0044] If the heat source is cylindrical, then the housing 110 can be basically annular in structure. Please refer to [link / reference]. Figure 4 Furthermore, the second outer surface of the accommodating member 110 can be an inner cylindrical surface, and the first outer surface can be an outer cylindrical surface. The heat source is placed inside the inner cylindrical surface of the accommodating member 110, and the external heat dissipation module 140 is located on the outer cylindrical surface of the accommodating member 110. The heat conduction structure 120 extends in the direction from the inner cylindrical surface to the outer cylindrical surface, thereby transferring the heat emitted by the heat source to the outer cylindrical surface and conducting it out through the outer cylindrical surface.

[0045] Because the electronic device includes the aforementioned heat dissipation device 100 with phase change material 130, the phase change material 130 enables the heat dissipation device 100 to absorb a large amount of heat released by the heat source in a short period of time and maintain its own temperature. It is especially suitable for scenarios where the heat source may release a large amount of heat in a short period of time or where the heat fluctuation is obvious.

[0046] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat dissipation device, characterized in that, include: A receiving member having a closed receiving cavity formed thereon; A thermally conductive structure is disposed in the receiving cavity, and at least one side of the thermally conductive structure is in close contact with the inner surface of the receiving member to allow the thermally conductive structure to transfer heat from the interior of the receiving cavity to the receiving member; A phase change material is placed inside the accommodating cavity and in contact with the heat-conducting structure. The melting point of the phase change material is lower than that of the accommodating material and the heat-conducting structure material, and the phase change material does not completely fill the accommodating cavity.

2. The heat dissipation device according to claim 1, characterized in that, The accommodating member includes a first inner surface and a second inner surface disposed opposite to each other, one end of the heat-conducting structure is in close contact with the first inner surface of the accommodating member, and the other end of the heat-conducting structure is in close contact with the second inner surface.

3. The heat dissipation device according to claim 2, characterized in that, The outer surface of the accommodating member located on the same side as the first inner surface is the first outer surface; The heat dissipation device further includes an external heat dissipation module, which is disposed on the first outer surface of the accommodating member.

4. The heat dissipation device according to claim 3, characterized in that, The external heat dissipation module includes multiple heat dissipation fins.

5. The heat dissipation device according to claim 3, characterized in that, The external heat dissipation module includes a fan.

6. The heat dissipation device according to claim 1, characterized in that, The thermally conductive structure includes multiple thermally conductive sheets, and the phase change material is in contact with the thermally conductive sheets.

7. The heat dissipation device according to claim 1, characterized in that, The thermally conductive structure is a porous structure.

8. The heat dissipation device according to any one of claims 1-7, characterized in that, The accommodating element includes a base and a sealing cover, which are fixedly connected.

9. The heat dissipation device according to any one of claims 1-7, characterized in that, The accommodating cavity is a cuboid or annular cavity.

10. An electronic device, characterized in that, Includes a heat source and a heat dissipation device as described in any one of claims 1-9; The accommodating member includes a first outer surface and a second outer surface disposed opposite to the first outer surface. The first outer surface can be used to assemble an external heat dissipation module, and the heat source is attached to the second outer surface. One end of the heat-conducting structure is attached to the inner wall of one side of the first outer surface of the accommodating member, and the other end is attached to the inner wall of one side of the second outer surface of the accommodating member.

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