A heat pipe heat sink for a test apparatus

Abstract

The utility model belongs to the field of high -power test equipment especially relates to a heat pipe radiator for test equipment, including heat conduction matrix, heat pipe, heat dissipation matrix, heat conduction matrix is connected with heat dissipation matrix, it is equipped with a plurality of through -hole in the middle heat conduction matrix, the fixed connection of heat pipe has on heat dissipation matrix, the evaporation section of heat pipe is close to heat conduction matrix, the fixed connection of a plurality of radiating fins has on heat dissipation matrix, and the condensation section of radiating fin is close to heat pipe. Advantage is: has high -efficient heat dissipation, good dustproof, space utilization high -efficient, the advantage that heat is conducted downward, can effectively solve the heat dissipation problem of high -power test power supply equipment under special working condition, improves the operating stability and life of equipment.

Description

Technical Field

[0001] This utility model belongs to the field of high-power testing equipment, and in particular relates to a heat pipe radiator for testing equipment. Background Technology

[0002] In the field of high-power testing equipment operating under special conditions (such as high humidity and high dust environments), the equipment generates a large amount of heat during operation. If this heat cannot be dissipated in a timely and effective manner, the internal temperature of the equipment will rise, thereby affecting its performance, stability, and service life. Therefore, heat dissipation is one of the key issues that urgently needs to be addressed in the operation of such equipment.

[0003] However, equipment used in these special applications often has high dust protection requirements and cannot directly adopt traditional open cooling methods, such as direct convection cooling, otherwise a large amount of dust will be introduced, damaging the delicate components inside the equipment. At the same time, the internal structure of the equipment is usually quite compact with limited space, making it difficult to install large cooling devices, which further increases the difficulty of designing cooling equipment.

[0004] Currently, although various heat dissipation technologies are applied in different fields, existing heat dissipation solutions often fail to meet the needs of high-power test power supply equipment operating under special conditions due to their unique operating requirements and structural limitations. For example, while traditional air cooling is simple, its heat dissipation efficiency drops significantly when space is limited, making it difficult to guarantee heat dissipation efficiency and effectively reduce the internal temperature of the equipment. Open-type cooling, although highly efficient, easily introduces dust, affecting equipment performance. Traditional liquid cooling, while highly efficient, carries the risk of liquid leakage and is complex and costly. Summary of the Invention

[0005] To overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a heat pipe radiator for testing equipment. By adopting a heat pipe cooling method, it solves the heat dissipation problem of high-power test power supply equipment, while meeting the dustproof requirements and space constraints of the equipment.

[0006] To achieve the above objectives, this utility model employs the following technical solution:

[0007] A heat pipe radiator for testing equipment includes a heat-conducting substrate, a heat pipe, and a heat-dissipating substrate. The heat-conducting substrate and the heat-dissipating substrate are connected. The heat-conducting substrate has several through holes in the middle. The heat pipe is fixedly connected to the heat-dissipating substrate. The evaporation section of the heat pipe is close to the heat-conducting substrate. Several heat-dissipating fins are fixedly connected to the heat-dissipating substrate. The heat-dissipating fins are close to the condensation section of the heat pipe.

[0008] The heat-conducting substrate has several through holes on its side, its bottom surface is connected to the heat dissipation substrate, and its top surface is connected to the heat-generating device.

[0009] The through hole is oblong or rectangular.

[0010] The heat pipe has a straight structure.

[0011] The thermally conductive substrate has a cuboid structure.

[0012] The bottom of the heat dissipation base is provided with an installation groove, and several heat dissipation fins are fixedly connected to the end of the heat dissipation base.

[0013] It also includes a housing and a trolley. The housing is fixed on the trolley to form an internally enclosed cavity. The heating element is placed inside the cavity, the heat dissipation substrate is connected to the trolley, and the heat dissipation fins are placed outside the cavity.

[0014] The heat dissipation substrate is multiple.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention has the advantages of efficient heat dissipation, good dust prevention, efficient space utilization, and downward heat conduction. It can effectively solve the heat dissipation problem of high-power test power supply equipment under special working conditions, and improve the operational stability and service life of the equipment.

[0017] Specific technical effects:

[0018] 1. High-efficiency heat dissipation capability

[0019] By directly conducting heat generated by the internal heat source (heat-generating device) to the heat-conducting substrate and utilizing the high thermal conductivity of the heat pipe to rapidly transfer heat to the heat dissipation substrate, efficient heat transfer is achieved. As a highly efficient heat transfer element, the heat pipe has a thermal conductivity far exceeding that of traditional metal materials, significantly improving heat dissipation efficiency. Multiple heat dissipation units are installed inside the casing to meet the heat dissipation requirements of high-power equipment, maintaining the internal temperature within a reasonable range even under high heat loads. The use of multiple heat dissipation units enables efficient heat dissipation within a limited space, avoiding the structural problems caused by excessively large heat sinks and improving the overall performance and reliability of the equipment.

[0020] 2. Good dustproof performance

[0021] This invention features a fully sealed structure, completely preventing external dust from entering the equipment. This is particularly important for equipment with high dust protection requirements under special operating conditions, effectively protecting internal precision components from dust contamination, extending the equipment's service life, and preventing reduced heat dissipation efficiency due to dust accumulation.

[0022] 3. Simple structure and high reliability

[0023] This novel heat pipe radiator has a simple structure, is easy to manufacture and maintain, and achieves efficient heat dissipation while ensuring system reliability. This structural design not only reduces manufacturing costs but also improves the operational stability of the equipment.

[0024] 4. Heat is conducted downwards.

[0025] This invention solves the problem that traditional heat pipe radiators cannot conduct heat from top to bottom. Through the heat-conducting substrate, heat pipe, and heat dissipation substrate, heat can be smoothly conducted from inside the device to the heat dissipation substrate at the bottom of the device, achieving effective heat dissipation.

[0026] 5. Strong environmental adaptability

[0027] This invention is not only suitable for ordinary environments, but can also operate normally under special working conditions (such as high humidity and high dust environments). Through its sealed design and efficient heat dissipation performance, it can effectively cope with various complex environmental conditions, ensuring that the equipment maintains good heat dissipation under different working conditions. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of this utility model.

[0029] Figure 2 This is a schematic diagram of the heat dissipation unit.

[0030] Figure 3 This is a schematic diagram of the connection between the heat-conducting substrate and the heat-dissipating substrate.

[0031] Figure 4 This is a schematic diagram of the heat dissipation substrate.

[0032] In the diagram: 1. Housing; 2. Heating element; 3. Heat dissipation unit; 4. Cart; 5. Heat dissipation substrate; 6. Heat pipe; 7. Thermally conductive substrate; 8. Through hole; 9. Heat dissipation fins; 10. Mounting slot. Detailed Implementation

[0033] The present invention will now be described in detail with reference to the accompanying drawings. However, it should be noted that the implementation of the present invention is not limited to the following embodiments.

[0034] See Figures 2-4 A heat pipe 6 radiator for testing equipment includes multiple heat dissipation units 3. Each heat dissipation unit 3 includes a heat-conducting substrate 7, a heat pipe 6, and a heat dissipation substrate 5. The heat-conducting substrate 7 is connected to the heat dissipation substrate 5. The heat-conducting substrate 7 has several through holes 8 in the middle. The heat pipe 6 is fixedly connected to the heat dissipation substrate 5. The evaporation section of the heat pipe 6 is close to the heat-conducting substrate 7. Several heat dissipation fins 9 are fixedly connected to the heat dissipation substrate 5. The heat dissipation fins 9 are close to the condensation section of the heat pipe 6.

[0035] The heat-conducting substrate 7 has a cuboid structure. Several through holes 8 are formed on the side of the heat-conducting substrate 7. Its bottom surface is connected to the heat dissipation substrate 5, and its top surface is connected to the heat-generating device 2. The through holes 8 of the heat-conducting substrate 7 are oblong or rectangular.

[0036] The heat pipe 6 has a straight structure. The bottom of the heat dissipation base 5 is provided with a mounting groove 10 for mounting the heat pipe 6. The mounting groove 10 fits tightly with the heat pipe 6 to reduce thermal resistance and efficiently transfer heat to the heat dissipation base 5 through the heat pipe 6. The upper surface of the end of the heat dissipation base 5 is connected to the heat pipe 6, and several heat dissipation fins 9 are fixedly connected to the lower part of the end of the heat dissipation base 5.

[0037] The internal heating element 2 conducts a portion of the heat to the heat-conducting substrate 7 through direct contact, and then conducts it to the outside of the housing 1 through the heat pipe 6 and the heat dissipation substrate 5; the other portion of the heat is dissipated into the air, collected and conducted to the heat-conducting substrate 7 through the through hole 8 of the heat-conducting substrate 7, and then conducted to the outside of the housing 1 through the heat pipe 6 and the heat dissipation substrate 5.

[0038] See Figures 1-4 The heat pipe 6 radiator for the testing equipment also includes a housing 1 and a carriage 4. The housing 1 is fixed on the carriage 4 to form an internally enclosed cavity. The heating element 2 is disposed inside the cavity. The heat dissipation base 5 is connected to the carriage 4, and the heat dissipation fins 9 are disposed outside the cavity. A fan can be installed inside the housing 1 to exchange heat between the housing 1 and the through holes 8 of the heat-conducting base 7, and then transfer the collected heat to the heat-conducting base 7. The heat-conducting base 7 then transfers the collected heat through the heat pipe 6 to the heat dissipation base 5 located at the bottom of the equipment (heating element 2), thus completing the heat dissipation at the bottom of the equipment.

[0039] Multiple heat dissipation units 3 can be installed side by side on the trolley 4, and high-power heat dissipation can be achieved through multiple heat dissipation units.

[0040] This invention features efficient heat dissipation, excellent dust prevention, efficient space utilization, and downward heat conduction, effectively solving the heat dissipation problem of high-power test power supply equipment under special operating conditions, and improving the operational stability and service life of the equipment. The entire invention is a sealed structure, completely preventing external dust from entering the equipment. This is particularly important for equipment with high dust prevention requirements under special operating conditions, effectively protecting internal precision components from dust contamination, extending the equipment's service life, and preventing the decrease in heat dissipation efficiency caused by dust accumulation.

[0041] Through the above specific embodiments, those skilled in the art can easily implement this utility model. However, it should be understood that this utility model is not limited to the specific embodiments described above. Based on the disclosed embodiments, those skilled in the art can arbitrarily combine different technical features to achieve different technical solutions. Due to space limitations and for the sake of brevity, not all of these combined solutions have been described. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat pipe radiator for testing equipment, characterized in that, It includes a heat-conducting substrate, a heat pipe, and a heat-dissipating substrate. The heat-conducting substrate and the heat-dissipating substrate are connected. The heat-conducting substrate has several through holes in the middle. The heat pipe is fixedly connected to the heat-dissipating substrate. The evaporation section of the heat pipe is close to the heat-conducting substrate. Several heat-dissipating fins are fixedly connected to the heat-dissipating substrate. The heat-dissipating fins are close to the condensation section of the heat pipe.

2. A heat pipe radiator for testing equipment according to claim 1, characterized in that, The heat-conducting substrate has several through holes on its side, its bottom surface is connected to the heat dissipation substrate, and its top surface is connected to the heat-generating device.

3. A heat pipe radiator for testing equipment according to claim 1, characterized in that, The through hole is oblong or rectangular.

4. A heat pipe radiator for testing equipment according to claim 1, characterized in that, The heat pipe has a straight structure.

5. A heat pipe radiator for testing equipment according to claim 1, characterized in that, The thermally conductive substrate has a cuboid structure.

6. A heat pipe radiator for testing equipment according to claim 1, characterized in that, The bottom of the heat dissipation base is provided with an installation groove, and several heat dissipation fins are fixedly connected to the end of the heat dissipation base.

7. A heat pipe radiator for testing equipment according to claim 1, characterized in that, It also includes a housing and a trolley. The housing is fixed on the trolley to form an internally enclosed cavity. The heating element is placed inside the cavity, the heat dissipation substrate is connected to the trolley, and the heat dissipation fins are placed outside the cavity.

8. A heat pipe radiator for testing equipment according to claim 7, characterized in that, The heat dissipation substrate is multiple.

Images