Light emitting structure and light emitting device

Abstract

The application provides a light emitting structure and a light emitting device. The light emitting device comprises a circuit substrate and a plurality of light emitting structures. Each light emitting structure is attached to the circuit substrate. The light emitting structure comprises an LED light source and a lens. The lens and the LED light source are connected into one body by means of secondary injection molding. The LED light source is embedded in the lens. The LED light source has a solder pad. The solder pad is exposed to the lens so as to attach the light emitting structure to the circuit substrate. Before the light emitting structure is attached to the circuit substrate, the LED light source and the lens are connected into one body by means of secondary injection molding. Therefore, the manufacturing efficiency and the manufacturing precision of the light emitting device are improved.

Description

Technical Field

[0001] This application belongs to the field of backlight technology, and more specifically, relates to a light-emitting structure and a light-emitting device. Background Technology

[0002] In the field of TV backlight technology, various solutions can be adopted to achieve high color gamut and wide-angle light emission. To reduce costs, the industry typically mounts high color gamut LED light sources onto a circuit board and then uses dispensing to form specific shaped droplets to achieve wide-angle light emission. This method reduces reliance on quantum dot LED films to some extent, lowering costs, and also reduces the number of LED light sources by utilizing the wide-angle light emission characteristics. However, the above solutions still have significant drawbacks: Firstly, due to the large size of the circuit board, when the distance between LED light sources is large, the travel distance of the silicone dispensing increases significantly. The dispensing equipment is limited in speed and prone to accuracy deviations during long-distance dispensing, greatly reducing production efficiency and dispensing accuracy. Secondly, the silicone dispensing requires precise centering of the droplets directly above the LED light source, which places extremely high demands on the dispensing equipment's accuracy. This necessitates a large investment in expensive dispensing and testing equipment, and even then, a significant proportion of defective products still occur. Utility Model Content

[0003] The purpose of this application is to provide a light-emitting structure and a light-emitting device to solve the technical problems of low manufacturing efficiency and low yield of light-emitting devices in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: a light-emitting structure is provided, including an LED light source and a lens. The lens and the LED light source are connected as one unit by a secondary injection molding process. The LED light source is embedded in the lens and has pads. The pads are exposed outside the lens so that the light-emitting structure can be mounted on a circuit board.

[0005] In some embodiments, the lens is connected to a solder pad, and both the solder pad and the solder pad are used for mounting on the circuit board.

[0006] In some embodiments, the welding tab is at least partially embedded in the lens.

[0007] In some embodiments, the lens is formed by secondary injection molding using the welding sheet and the LED light source as a substrate.

[0008] In some embodiments, the lens has a first mounting surface for attaching to the circuit board, the solder pad has a second mounting surface for attaching to the circuit board, and the LED light source has a third mounting surface for attaching to the circuit board, wherein the first mounting surface, the second mounting surface, and the third mounting surface are flush.

[0009] In some embodiments, the number of welding tabs is multiple, and each welding tab surrounds the LED light source.

[0010] In some embodiments, the number of welding tabs is multiple, and the multiple welding tabs are distributed in a circle around the central axis of the lens. The cross-section of the first optical part of the lens, which is at least used to attach to the circuit board, is polygonal, and the multiple welding tabs are respectively disposed at multiple corners of the first optical part.

[0011] In some embodiments, the welding piece has a plurality of first side surfaces connected end to end, and the connecting line between two adjacent first side surfaces is a first ridge; the first optical part has a plurality of second side surfaces connected end to end, and the connecting line between two adjacent second side surfaces is a second ridge; a welding piece is provided for each second ridge, and the connecting surface between the second ridge and the corresponding first ridge passes through the central axis of the lens.

[0012] In some embodiments, the LED light source includes at least one LED chip;

[0013] When there are multiple LED chips, each LED chip is used to emit light of a different color.

[0014] On the other hand, this application also provides a light-emitting device, including a circuit board and a plurality of the above-mentioned light-emitting structures, each of the light-emitting structures being respectively mounted on the circuit board.

[0015] The beneficial effects of the light-emitting structure and device provided in this application are as follows: The light-emitting structure is assembled by connecting the LED light source and lens together through a secondary injection molding process. Since the LED light source has solder pads, during the fabrication of the light-emitting device, multiple light-emitting structures only need to be sequentially mounted onto the circuit board via the solder pads. This eliminates the need for long-distance dispensing operations on a large circuit board, thus avoiding speed limitations and accuracy deviations caused by long-distance dispensing operations, thereby improving the manufacturing efficiency and precision of the light-emitting device. Simultaneously, the lenses are pre-fabricated using standardized molds or processing tools, ensuring high uniformity in shape and size among the lenses. This prevents differences in lens shape from directly affecting the light emission angle and light distribution uniformity of the LED light source, improving the overall display effect of the television backlight. Furthermore, it eliminates the need for high-precision dispensing equipment, reducing manufacturing costs. Furthermore, the use of pads makes the assembly process of mounting the LED light source and lens assembly onto the circuit board simpler and more secure, further improving production efficiency and product stability. During product transportation and use, it can better resist vibration and impact, reduce problems such as optical performance degradation or electrical connection failures caused by structural loosening, improve product reliability and service life, and reduce after-sales maintenance costs. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a top view of the light-emitting device provided in the embodiments of this application;

[0018] Figure 2 This is a side view of the light-emitting device provided in an embodiment of this application;

[0019] Figure 3 This is a side view of the light-emitting structure provided in an embodiment of this application;

[0020] Figure 4 This is a top view of the light-emitting structure provided in an embodiment of this application;

[0021] Figure 5 This is a cross-sectional view of the LED light source in the light-emitting structure provided in the embodiments of this application;

[0022] Figure 6 This is a top view of the light-emitting structure provided in the embodiments of this application when the LED light source has multiple LED chips.

[0023] The following are the labeling elements in the figure:

[0024] 1. Light-emitting structure; 100. Lens; 110. First optical section; 120. Second optical section; 130. First mounting surface; 131. Second side surface; 132. Second ridge line; 200. LED light source; 210. Solder pad; 211. Third mounting surface; 220. Mounting bracket; 230. LED chip; 240. Encapsulating adhesive layer; 300. Solder sheet; 310. Second mounting surface; 320. First side surface; 330. First ridge line; 2. Circuit board. Detailed Implementation

[0025] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0027] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0029] Please refer to the following: Figures 1 to 4 The light-emitting structure 1 provided in the embodiments of this application will now be described.

[0030] The light-emitting structure 1 includes an LED light source 200 and a lens 100. The lens 100 and the LED light source 200 are connected as one unit by a secondary injection molding process. The LED light source 200 is embedded in the lens 100 and has a pad 210. The pad 210 is exposed outside the lens 100 so that the light-emitting structure 1 can be mounted on the circuit board 2.

[0031] The lens 100 can be made of light-transmitting material and manufactured by injection molding, compression molding or high-precision machining.

[0032] LED light source 200 may include LED chip 230 or LED light-emitting device after LED chip 230 is packaged.

[0033] The lens 100 and the LED light source 200 are connected as one unit through a secondary injection molding process. This can be achieved by inserting the LED light source 200 into the injection molding cavity during the injection molding of the lens 100, and then using the LED light source 200 as a substrate for secondary injection molding to form the lens 100, thereby connecting the lens 100 and the LED light source 200 as one unit. Alternatively, the lens 100 and the LED light source 200 can be manufactured separately, and then connected as one unit through a secondary injection molding process.

[0034] The pad 210 being exposed outside the lens 100 can mean that the pad 210 extends beyond the lens 100 so that it can be mounted on the circuit board 2; or it can mean that the outer surface of the pad 210 is flush with the outer surface of the lens 100 so that the pad 210 is exposed so that it can be mounted on the circuit board 2.

[0035] In this embodiment, the light-emitting structure 1 is assembled by connecting the LED light source 200 and the lens 100 together through secondary injection molding. The LED light source 200 has pads 210, allowing multiple light-emitting structures 1 to be sequentially mounted onto the circuit board 2 via the pads 210 during manufacturing. This eliminates the need for long-distance dispensing operations on the large circuit board 2, avoiding speed limitations and accuracy deviations caused by long-distance dispensing, thus improving the manufacturing efficiency and precision of the light-emitting device. Furthermore, since the lenses 100 are pre-fabricated using standardized molds or processing tools, the shape and size of each lens 100 are highly uniform. Differences in the shape of each lens 100 do not directly affect the light emission angle and light distribution uniformity of the LED light source 200, improving the overall display effect of the television backlight. Moreover, it eliminates the need for high-precision dispensing equipment, reducing manufacturing costs. Furthermore, the use of pads 210 simplifies the assembly process and ensures a more secure mounting when attaching the LED light source 200 and lens 100 assembly to the circuit board 2, thereby improving production efficiency and product stability. During transportation and use, the product is better able to withstand vibration and impact, reducing issues such as decreased optical performance or electrical connection failures caused by structural loosening, thus improving product reliability and lifespan and lowering after-sales maintenance costs. In addition, by embedding the LED light source 200 within the lens 100, the light emitted by the LED light source 200 can be directed to different positions within the lens 100. The lens 100 then optically processes the light, achieving a combination of excellent optical performance between the LED light source 200 and the lens 100.

[0036] In some embodiments, please refer to Figure 3 and Figure 4 The lens 100 is connected to a solder pad 300, and both the solder pad 300 and the solder pad 210 are used to mount on the circuit board 2.

[0037] Specifically, the solder pads 300 are typically made of metal, such as copper or nickel. These metals have good electrical and thermal conductivity and can form a good solder joint with the solder paste during reflow soldering. When mounting the light-emitting structure 1 onto the circuit board 2, solder paste is first applied to the exposed copper positions of the solder pads 300 and pads 210 on the circuit board 2. Then, the light-emitting structure 1 is transported to the top of the circuit board 2 using a mounting device, and the solder pads 300 and pads 210 are respectively placed on the corresponding solder paste. Next, the circuit board 2 and the light-emitting structure 1 are transported together to a reflow soldering device for heating to melt the solder paste and allow it to flow, so that the positions of the solder pads 300 and pads 210 are aligned accordingly. Finally, the device is cooled to ensure that the light-emitting structure 1 is firmly mounted on the circuit board 2.

[0038] In this embodiment, the solder pads 300 and 210 allow the lens 100 and LED light source 200 to be mounted on the circuit board 2 via reflow soldering. During the solder paste melting process, the relative positions of the solder pads 300 and the exposed copper on the circuit board 2 are automatically corrected, ensuring the light-emitting structure 1 is in the correct position and greatly improving the optical performance and quality stability of the light-emitting device. Furthermore, by providing solder pads 210 and solder pads 300 on the LED light source 200 and lens 100 respectively, reliable soldering connection points are provided between the lens 100 and the circuit board 2, thus ensuring the mounting stability of the entire light-emitting structure 1 on the circuit board 2. It is understood that in other embodiments of this application, the solder pads 300 may be omitted, and the lens 100 may be fixed to the circuit board 2 by bonding, snap-fitting, or other methods; this is not a limitation.

[0039] In some embodiments, the lens 100 is formed by secondary injection molding based on the welding sheet 300 and the LED light source 200.

[0040] Specifically, the secondary injection molding of the lens 100 includes the following steps:

[0041] First, the LED light source 200 and the welding piece 300 are fixed: specifically, a high-precision die bonding device is used to fix the LED light source 200 and the welding piece 300 onto a film material with a certain degree of adhesion according to a pre-designed distance and position. For example, a visual recognition system is used for precise positioning to ensure that the spacing error between the LED light source 200 and the welding piece 300 is controlled within ±0.05 mm, so as to ensure the consistency of the optical and electrical performance of the subsequent light-emitting structure 1.

[0042] Next, the lens 100 is formed: specifically, the film material that fixes the LED light source 200 and the welding piece 300 is placed in a mold. The mold is precision-machined according to the required shape and size of the lens 100. Liquid silicone is injected; the liquid silicone must have good fluidity and optical transparency, and its refractive index must match that of the LED light source 200 and air to reduce light refraction loss. Curing is performed under specific temperature and pressure conditions, such as a temperature controlled within the range of 80℃-180℃ and a pressure controlled within the range of 0.5MPa-5.0MPa, maintained for 1-60 minutes, allowing the silicone to fully cure and tightly encapsulate the LED light source 200 and the welding piece 300, forming the light-emitting structure 1. After curing, the light-emitting structure 1 is carefully removed, and its appearance and dimensions are preliminarily inspected, rejecting products that clearly do not meet the requirements.

[0043] In this embodiment, the lens 100 is formed by secondary injection molding using the welding sheet 300 and LED light source 200 as a substrate. This has several advantages: First, production efficiency is improved. Before secondary molding, only the LED light source 200 and welding sheet 300 need to be mounted on a small-sized film. More light-emitting structures 1 can be produced per unit time, significantly increasing production efficiency—potentially several times or more compared to traditional processes. This not only accelerates the production speed of the light-emitting structures 1 to meet market demand for quantity but also effectively reduces the production time cost per unit. Second, regarding product quality and optical performance, injection molding, with its carefully designed molds, ensures a highly uniform and precisely controllable shape and size for the lens 100. This fundamentally solves the problem of inconsistent shape and size of the lens 100 caused by precision issues in traditional dispensing processes, greatly improving the consistency and stability of the product's optical performance. In practical applications, this results in more uniform and stable backlighting, reducing issues such as uneven brightness and color deviation caused by differences in optical performance, significantly improving display quality, and providing users with a superior visual experience. Third, from a cost control perspective, on the one hand, since high-precision dispensing is not required on the large-size circuit board 2, reliance on expensive dispensing and testing equipment is reduced, thus lowering not only equipment purchase costs but also equipment maintenance and operating costs. On the other hand, it reduces the number of defective products caused by dispensing accuracy issues, reducing raw material waste and the cost of handling defective products. Furthermore, during the mounting of the light-emitting structure 1 onto the circuit board 2, the solder pad 300 achieves automatic calibration of the light-emitting structure 1's position and ensures a firm connection, eliminating the need for large fixtures to press the circuit board 2, reducing fixture investment and management costs. These factors combined comprehensively reduce production costs and enhance the product's market competitiveness. Fourth, regarding ease of operation and stability, using SMT (Surface Mount Technology) to mount the light-emitting structure 1 onto the circuit board 2 is relatively simple, and the solder pad 300 enhances the connection's firmness, ensuring accurate and stable mounting. The entire production process is simplified, reducing complex operational steps, lowering the risk of human error during production, and improving the stability and reliability of the production process, which is conducive to large-scale, high-quality production. It is understood that in other embodiments of this application, the welding piece 300 may also be embedded in the lens 100 by bonding or interference fit, and this is not the only limitation.

[0044] In some embodiments, please refer to Figure 3The lens 100 has a first mounting surface 130 for mounting on the circuit board 2, the solder pad 300 has a second mounting surface 310 for mounting on the circuit board 2, and the LED light source 200 has a third mounting surface 211 for mounting on the circuit board 2. The first mounting surface 130, the second mounting surface 310, and the third mounting surface 211 are flush. In this embodiment, by aligning the first mounting surface 130, the second mounting surface 310, and the third mounting surface 211, the stability of the light-emitting structure 1 on the circuit board 2 can be ensured. It is understood that in other embodiments of this application, the second mounting surface 310 and the third mounting surface 211 may also be flush, and the second mounting surface 310 and the third mounting surface 211 may convex outward relative to the first mounting surface 130; this is not a unique limitation.

[0045] In some embodiments, please refer to Figure 3 The LED light source 200 is embedded in the lens 100 through the first mounting surface 130 of the lens 100. The light-emitting end of the LED light source 200 is embedded inside the lens 100. The pad 210 of the LED light source 200 is exposed outside the lens 100, so it can be mounted on the circuit board 2 through the pad 210.

[0046] In some embodiments, please refer to Figure 3 and Figure 4 The central axis of the LED light source 200 coincides with the central axis of the lens 100. Here, the central axis of the lens 100 refers to the central axis of the lens 100 perpendicular to the first mounting surface 130. When the cross-section of the lens 100 is circular, the central axis of the lens 100 is a line passing through the center of each cross-section; when the cross-section of the lens 100 is square, the central axis of the lens 100 is a line passing through the intersection of the diagonals of each cross-section. Similarly, the central axis of the LED light source 200 is also perpendicular to the central axis of the third mounting surface 211. In this embodiment, by setting the central axis of the LED light source 200 and the central axis of the lens 100 to coincide, the optical processing effect of the lens 100 on the LED light source 200 is uniformly distributed circumferentially, thereby making the light emission effect of the light-emitting structure 1 uniform circumferentially. It is understood that in other embodiments of this application, the central axis of the LED light source 200 may be set to deviate from the central axis of the lens 100; this is not a unique limitation.

[0047] In some embodiments, please refer to Figure 4Multiple solder pads 300 are arranged around the LED light source 200. When mounting the light-emitting structure 1 onto the circuit board 2, the pads 210 of the LED light source 200 and each solder pad 300 can be mounted onto the circuit board 2 by reflow soldering, thereby realizing the mounting of the light-emitting structure 1. In this embodiment, the arrangement of multiple solder pads 300 ensures the reliable and stable mounting of the lens 100 on the circuit board 2. At the same time, the arrangement of multiple solder pads 300 around the LED light source 200 ensures the circumferential stability of the LED light source 200 on the circuit board 2, ensuring the reliable mounting of the LED light source 200 on the circuit board 2 and preventing the LED light source 200 from falling off and causing poor conductivity.

[0048] In some embodiments, there are multiple solder pads 300, which are arranged in a circle around the central axis of the lens 100. The first optical portion 110 of the lens 100, which is at least used to adhere to the circuit board 2, has a polygonal cross-section, and the multiple solder pads 300 are correspondingly disposed at multiple corners of the first optical portion 110. This arrangement ensures that, when the lens 100 is polygonal, the positions of the solder pads 300 are evenly distributed, and that the corners of the lens 100 are evenly attached to the circuit board 2. It is understood that in other embodiments of this application, the solder pads 300 may also be triangular, rectangular, or unevenly distributed around the LED light source 200, and this is not a unique limitation.

[0049] For some specific embodiments, please refer to Figure 4 The first optical section 110 has a square cross-section, and four welding tabs 300 are arranged in a circle around the central axis of the lens 100, with each of the four welding tabs 300 corresponding to one of the four corners of the first optical section 110. This arrangement ensures that, when the lens 100 is square, the positions of the welding tabs 300 are evenly distributed, and that the four corners of the lens 100 are evenly mounted on the circuit board 2. It is understood that, in other embodiments of this application, the cross-section of the first optical section 110 of the lens 100 can also be designed as a pentagon, hexagon, or a polygon with more than one hexagonal shape, or it can be designed as a circle. In this case, the number of welding tabs 300 can be two, three, four, or more, and each welding tab 300 can be arranged in a circle.

[0050] In some embodiments, please refer to Figure 4 The welding piece 300 is square, corresponding to the first mounting surface 130 of the square. The square welding piece 300 has better welding stability.

[0051] In some embodiments, the welding piece 300 has a plurality of first side surfaces 320 connected end to end, and the connecting line between two adjacent first side surfaces 320 is a first ridge 330; the first optical part 110 has a plurality of second side surfaces 131 connected end to end, and the connecting line between two adjacent second side surfaces 131 is a second ridge 132; a welding piece 300 is provided for each second ridge 132, and the connecting surface between the second ridge 132 and the corresponding first ridge 330 passes through the central axis of the lens 100. The above arrangement can ensure that each welding piece 300 can firmly and stably mount the lens 100 onto the circuit board 2.

[0052] Preferably, the welding piece 300 has four first side surfaces 320 connected end to end; the first optical part 110 of the lens 100 has four second side surfaces 131 connected end to end.

[0053] In some embodiments, please refer to Figure 3 and Figure 4 The lens 100 includes a first optical section 110 and a second optical section 120, which are stacked along the central axis of the lens 100. The first optical section 110 has a square cross-section, and the second optical section 120 has a circular cross-section. The LED light source 200 and each welding piece 300 are embedded in the first optical section 110. The first mounting surface 130 is the surface of the first optical section 110 facing away from the second optical section 120. In this embodiment, by designing the second optical section 120 of the lens 100 as circular, the circular shape, with its isotropic characteristics, allows light to diffuse at a relatively uniform angle, thereby expanding the illumination range and reducing blind spots. The square design of the first optical section 110 allows for better focusing of light, concentrating it on a specific area and increasing the illuminance of that area. Furthermore, the close fit of the square first optical section 110 guides more light into the second optical section 120 for scattering, improving the overall luminous efficiency of the light-emitting structure 1.

[0054] In some embodiments, please refer to Figure 5 and Figure 6 The LED light source 200 includes at least one LED chip 230; specifically, the number of LED chips 230 can be one or more. When the number of LED chips 230 is multiple, each LED chip 230 is used to emit light of a different color. This allows for a wider range of application scenarios through the mixing and control of multi-color light.

[0055] In some embodiments, please refer to Figure 5 and Figure 6The LED light source 200 includes a mounting bracket 220, at least one LED chip 230 mounted in the mounting bracket 220, and an encapsulating adhesive layer 240 filled between the at least one LED chip 230 and the mounting bracket 220. A pad 210 is provided on the side of the mounting bracket 220 away from the encapsulating adhesive layer 240 and is electrically connected to the at least one LED chip 230.

[0056] Specifically, the mounting bracket 220 has a mounting cavity, in which at least one LED chip 230 is mounted, and an encapsulating adhesive layer 240 fills the mounting cavity.

[0057] On the other hand, please see Figure 1 and Figure 2 This application also provides a light-emitting device, including a circuit board 2 and a plurality of light-emitting structures 1, each of which is mounted on the circuit board 2. Specifically, the light-emitting structures 1 are regularly distributed on the circuit board 2, and each light-emitting structure 1 is mounted on the circuit board 2 by reflow soldering. The light-emitting device of this application improves the manufacturing efficiency and precision of the device through the arrangement of the aforementioned light-emitting structures 1.

[0058] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A light-emitting structure, characterized in that, The device includes an LED light source and a lens. The lens and the LED light source are connected as one unit by a secondary injection molding process. The LED light source is embedded in the lens and has pads that are exposed on the lens so that the light-emitting structure can be mounted on a circuit board.

2. The light-emitting structure as described in claim 1, characterized in that, The lens is connected to a solder pad, and both the solder pad and the solder pad are used to mount the circuit board.

3. The light-emitting structure as described in claim 2, characterized in that, The welding piece is at least partially embedded in the lens.

4. The light-emitting structure as described in claim 2, characterized in that, The lens is formed by secondary injection molding using the welding sheet and the LED light source as a substrate.

5. The light-emitting structure according to any one of claims 2 to 4, characterized in that, The lens has a first mounting surface for attaching to the circuit board, the solder pad has a second mounting surface for attaching to the circuit board, and the LED light source has a third mounting surface for attaching to the circuit board. The first mounting surface, the second mounting surface, and the third mounting surface are flush.

6. The light-emitting structure according to any one of claims 2 to 4, characterized in that, The number of welding pieces is multiple, and each welding piece surrounds the LED light source.

7. The light-emitting structure according to any one of claims 2 to 4, characterized in that, The number of welding pieces is multiple, and the multiple welding pieces are distributed in a circle with the central axis of the lens as the center. The cross-section of the first optical part of the lens, which is at least used to attach to the circuit board, is polygonal, and the multiple welding pieces are respectively disposed at multiple corners of the first optical part.

8. The light-emitting structure as described in claim 7, characterized in that, The welding piece has multiple first side surfaces connected end to end, and the connecting line between two adjacent first side surfaces is a first ridge line; the first optical part has multiple second side surfaces connected end to end, and the connecting line between two adjacent second side surfaces is a second ridge line; a welding piece is provided for each second ridge line, and the connecting surface between the second ridge line and the corresponding first ridge line passes through the central axis of the lens.

9. The light-emitting structure according to any one of claims 1 to 4, characterized in that, The LED light source includes at least one LED chip; When there are multiple LED chips, each LED chip is used to emit light of a different color.

10. A light-emitting device, characterized in that, It includes a circuit board and a plurality of light-emitting structures as described in any one of claims 1 to 9, wherein each of the light-emitting structures is respectively mounted on the circuit board.

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