An LED device based on a 3D printing process
By using 3D printing technology to print the lead layer, circuit connection layer and electrode control layer of LED devices layer by layer, the misalignment connection of the transition conductors is achieved, which solves the problems of poor high consistency between devices and large errors caused by the superposition of multiple processes, and improves the light emission quality and overall precision of LED devices.
CN224402028UActive Publication Date: 2026-06-23HUBEI XINYING OPTOELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUBEI XINYING OPTOELECTRONICS CO LTD
- Filing Date
- 2025-06-27
- Publication Date
- 2026-06-23
Smart Images

Figure CN224402028U_ABST
Abstract
The application relates to an LED device formed based on a 3D printing process, which comprises a pin layer, a circuit connection layer and an electrode control layer which are formed by printing layer by layer from bottom to top by a 3D printer; the pin layer comprises a first epoxy resin layer and a plurality of pin electrodes which are connected to each other, and the pin electrodes are distributed at four corner positions of the first epoxy resin layer; the circuit connection layer comprises a second epoxy resin layer and a plurality of switching conductors which are connected to each other, one end of each of the switching conductors is connected to each of the pin electrodes; the electrode control layer comprises a third epoxy resin layer and a metal pad which are connected to each other, the metal pad comprises a common electrode pad and a plurality of non-common electrode pads; the other end of each of the switching conductors is extended and connected to the corresponding common electrode pad and non-common electrode pad or is bent and extended and connected. The pin layer, the circuit connection layer and the electrode control layer of the application are formed by one-time printing, the deviation between single LED devices is reduced, and the light emitting quality is improved.
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