Wafer pressing plate quick change mechanism

By designing positioning pin and magnet components, combined with rotating snap-fit ​​components, the wafer platen assembly achieves rapid and consistent installation, solving the problems of scattered parts and inconvenient installation in existing technologies, and improving replacement efficiency.

CN224402089UActive Publication Date: 2026-06-23DALIAN JAFENG AUTOMATION CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DALIAN JAFENG AUTOMATION CO LTD
Filing Date
2026-05-14
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

The existing wafer mounter platen assembly and film support ring are installed by screws, which results in scattered parts, difficulty in ensuring installation consistency, screws that are easy to loosen or strip, inconvenient operation, and long replacement time.

Method used

The positioning pin assembly and magnet assembly are used to achieve rapid positioning of the membrane support ring, and the rotating buckle assembly and positioning pin assembly are used to achieve rapid installation of the pressure plate. The threaded connection method is abandoned and an integral design is adopted to ensure installation consistency and quick replacement.

Benefits of technology

It enables rapid installation and positioning of the membrane support ring and pressure plate, ensuring installation consistency, saving on parts classification work, and improving replacement efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224402089U_ABST
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Abstract

The utility model discloses a wafer pressing plate quick change mechanism, including first film supporting ring and first pressing plate subassembly, first film supporting ring is positioned on the drive gear ring of base by at least two groups's first positioning pin subassembly, and first film supporting ring is adsorbed on the drive gear ring through first magnet subassembly, first pressing plate subassembly includes first pressing plate, first support subassembly, first connecting ring and at least two groups's second positioning pin subassembly, and first pressing plate is fixed on first connecting ring through first support subassembly interval, and first connecting ring is connected with the pressing plate mounting ring of wafer platform through first rotary buckle subassembly and is limited first connecting ring relative to the movement of pressing plate mounting ring along the axial direction, and first connecting ring is connected with the pressing plate mounting ring through second positioning pin subassembly and is limited first connecting ring relative to the movement of pressing plate mounting ring along the circumference direction, the utility model discloses first film supporting ring quick installation positioning on the drive gear ring and first pressing plate quick installation positioning on the pressing plate mounting ring.
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