A trimming die for trimming a semiconductor package

Abstract

The utility model relates to the technical field of automobile foot pad processing, disclose a half conducting body package cut -off rib forming is with cut -off rib female die, including mould body, both sides of mould body are fixedly connected with two mounting plates, the inside slide connection of mounting plate has the fixed link, the inside slide connection of fixed link has the sliding rod, the top fixed connection of sliding rod has the link rod, the top fixed connection of link rod has the pressing block, the bottom fixed connection of sliding rod has the limit disc, the inside of fixed link's bottom is provided with limit hole, the inside of limit hole is provided with strong spring, the outside of fixed link is provided with two movable hole, the inside movable connection of movable hole has the ball, the inside of mould body is provided with a plurality of accommodating hole. In the utility model, when installing the mould, can reduce the cumbersome of installation, and kept the integrity of mould mounting structure, increased the stability of installation.

Description

Technical Field

[0001] This utility model relates to the field of automotive floor mat processing technology, and in particular to a cutting die for semiconductor packaging cutting molding. Background Technology

[0002] A semiconductor packaging lead-cutting and forming apparatus is a specialized piece of equipment used for the post-packaging processing of semiconductors, playing a crucial role in the entire semiconductor manufacturing process. This apparatus mainly consists of a power system, a transmission system, a mold system, and a control system. These systems work together to complete the critical processing of the packaged semiconductor devices. Among them, the mold system is the core, and the lead-cutting die is an important component of the mold system.

[0003] Most lead-cutting dies serve as molds within semiconductor packaging lead-cutting forming devices to aid in semiconductor molding. This necessitates the use of appropriate tools to tighten bolts. Bolts are inserted into the mounting holes of the lead-cutting die, aligned with the corresponding screw holes on the semiconductor packaging lead-cutting forming device. Then, tools such as wrenches are used to gradually tighten the bolts, ensuring the lead-cutting die is securely installed.

[0004] In the prior art, the installation of some lead cutting dies by tightening bolts with tools is not only cumbersome and time-consuming, increasing the installation time, but also prone to wear between the bolts and the mounting holes during repeated bolt tightening for mold maintenance or replacement. This reduces the stability of the lead cutting die installation, affects the service life of the lead cutting die, and the reliability of lead cutting forming. Therefore, in order to address the above shortcomings, a lead cutting die for semiconductor packaging lead cutting forming is proposed. Utility Model Content

[0005] The purpose of this utility model is to address the shortcomings of existing technologies by proposing a cutting die for semiconductor packaging cutting. This invention aims to improve the existing technology where the cutting die is not only cumbersome to install, but also increases bolt wear and reduces the stability of the cutting die installation due to repeated bolt tightening during maintenance.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A semiconductor packaging lead cutting die includes a die body. Two mounting plates are fixedly connected to the left and right sides of the die body. A fixed rod is slidably connected inside the mounting plate. A sliding rod is slidably connected inside the fixed rod. A connecting rod is fixedly connected to the top of the sliding rod. A pressing block is fixedly connected to the top of the connecting rod. A limiting plate is fixedly connected to the bottom of the sliding rod. A limiting hole is formed inside the bottom of the fixed rod. A strong spring is installed inside the limiting hole. Two movable holes are formed outside the fixed rod. A locking ball is movably connected inside the movable hole. Multiple receiving holes are formed inside the die body. A telescopic spring is installed inside the receiving hole. A limiting component is slidably connected inside the receiving hole. A guide plate is rotatably connected to the adjacent side of every two limiting components. Multiple rotating components are rotatably connected to the adjacent side of every two guide plates.

[0008] Furthermore, a baffle is fixedly connected to the top of the fixing rod, and the bottom end of the baffle contacts the top end of the mounting plate.

[0009] Furthermore, the limiting component includes a limiting plate, the outside of which is slidably connected to the inside of the receiving hole, and a connecting block is fixedly connected to the adjacent side of each pair of limiting plates, and the adjacent side of each pair of connecting blocks is fixedly connected to the distant side of the two guide plates respectively.

[0010] Furthermore, the rotating assembly includes a first rolling wheel, and multiple first rolling wheels are externally rotatably connected to the inside of one side of the guide plate, while multiple second rolling wheels are rotatably connected to the bottom of the mold body.

[0011] Furthermore, a plurality of fixed posts are fixedly connected to the top of the mold body, and the outer bottom end of the pressing block is slidably connected to the inside of the top of the fixed rod.

[0012] Furthermore, the outer side of the sliding rod contacts the outer side of the engaging ball, and the outer side of the limiting disc is slidably connected to the inside of the limiting hole.

[0013] Furthermore, one end of the strong spring is fixedly connected to the bottom of the inner end of the limiting hole, and the other end of the strong spring is fixedly connected to the bottom end of the limiting plate.

[0014] Furthermore, the outer side of the connecting rod is in contact with the outer side of the engaging ball, and the thickness of the connecting rod is less than the thickness of the sliding rod.

[0015] This utility model has the following beneficial effects:

[0016] 1. In this utility model, during installation, pressing the pressing block drives the sliding rod, causing the locking ball to be squeezed and disappear. During the pressing process, the locking ball moves onto the connecting rod, and the strong spring is also squeezed. At this time, the fixing rod is inserted into the installation hole, the pressing block is released, and everything is reset, completing the installation of the mold. This reduces the complexity of installation, maintains the integrity of the mold installation structure, and increases the stability of installation.

[0017] 2. In this utility model, when the package is placed on the mold, the rolling wheel can automatically adjust its position according to the actual size and shape of the package under the action of the telescopic spring, thereby ensuring that the contact between the mold and the package is closer and more uniform during the cutting process, improving the mold's adaptability to packages of different sizes, and thus improving the accuracy of cutting. Attached Figure Description

[0018] Figure 1 This is a perspective view of a semiconductor packaging lead cutting die proposed in this utility model;

[0019] Figure 2 This is a schematic diagram of the mounting plate structure of a semiconductor packaging lead cutting die proposed in this utility model;

[0020] Figure 3 for Figure 2 Enlarged view of point A in the image;

[0021] Figure 4 for Figure 2 Enlarged view of point B in the image.

[0022] Legend:

[0023] 1. Mold body; 2. Fixed column; 3. Mounting plate; 4. Fixed rod; 5. Baffle; 6. Sliding rod; 7. Connecting rod; 8. Pressing block; 9. Limiting plate; 10. Limiting hole; 11. Strong spring; 12. Movable hole; 13. Engaging ball; 14. Receiving hole; 15. Telescopic spring; 16. Limiting plate; 17. Connecting block; 18. Guide plate; 19. Rolling wheel one; 20. Rolling wheel two. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Reference Figures 1 to 3This utility model provides an embodiment of a semiconductor packaging lead cutting die, comprising a die body 1, which serves as the basic structure of the entire die. Multiple fixing posts 2 are fixedly connected to the top of the die body 1. Two mounting plates 3 are fixedly connected to both the left and right sides of the die body 1, extending outwards from both sides to provide suitable space and position for the installation process. A fixing rod 4 is slidably connected inside the mounting plate 3, allowing the fixing rod 4 to move flexibly up and down within the mounting plate 3. A baffle 5 is fixedly connected to the outside of the top of the fixing rod 4, designed to limit the downward movement of the fixing rod 4. The bottom of the baffle 5 contacts the top of the mounting plate 3, preventing the fixing rod 4 from detaching from the mounting plate 3 when the fixing rod 4 moves downwards. A sliding rod 6 is slidably connected inside the fixing rod 4, allowing it to slide smoothly up and down within the fixing rod 4. A connecting rod 7 is fixedly connected to the top of the sliding rod 6, and the thickness of the connecting rod 7 is less than the thickness of the sliding rod 6.

[0026] A pressing block 8 is fixedly connected to the top of the connecting rod 7. The pressing block 8 is the part that the operator directly contacts during installation. The outer bottom end of the pressing block 8 is slidably connected to the inside of the top of the fixed rod 4. The bottom end of the sliding rod 6 is fixedly connected to a limiting plate 9. The outer side of the limiting plate 9 is slidably connected to the inside of the limiting hole 10. The limiting hole 10 provides a limited sliding space for the limiting plate 9, ensuring the directionality and range of the sliding. A strong spring 11 is installed inside the limiting hole 10. One end of the strong spring 11 is fixedly connected to the bottom end of the inside of the limiting hole 10, and the other end is fixedly connected to the bottom end of the limiting plate 9. This connection method allows the strong spring 11 to be compressed or extended when the limiting plate 9 slides within the limiting hole 10, thereby storing or releasing elastic force. The fixed rod 4 has two movable holes 12 on its outside. The movable holes 12 provide space for the locking ball 13 to move flexibly within them. The locking ball 13 is movably connected inside the movable holes 12 and is in contact with the outside of the sliding rod 6 and the connecting rod 7.

[0027] Reference Figure 1 , Figure 2 and Figure 4The mold body 1 has multiple receiving holes 14 inside, which serve as internal accommodating spaces, providing additional accommodating space. A telescopic spring 15 is installed inside each receiving hole 14, and a limiting assembly is slidably connected inside the receiving hole 14. The limiting assembly includes a limiting plate 16, which is slidably connected to the outside of the receiving hole 14 and can slide in a specific direction within the receiving hole 14. A connecting block 17 is fixedly connected to the adjacent side of every two limiting plates 16, serving as a connecting component. The adjacent side of every two connecting blocks 17 is fixedly connected to the distant side of two guide plates 18. The guide plates 18 play a guiding and motion-transmitting role in the entire structure. A guide plate 18 is rotatably connected to the adjacent side of every two limiting assemblies; this rotatable connection allows the guide plates 18 to rotate flexibly.

[0028] Multiple rotating components are rotatably connected to adjacent sides of every two guide plates 18. These rotating components are key to achieving contact with the package and adaptive adjustment. Each rotating component includes a rolling wheel 19, which is externally rotatably connected to the inside of one side of the guide plate 18. The rolling wheel 19 can rotate freely within the guide plate 18 and, upon contact with the package, can rotate and adjust its position according to changes in the shape and pressure of the package. Multiple rolling wheels 20 are rotatably connected to the bottom interior of the mold body 1. The rotatable connection of the rolling wheels 20 to the bottom interior of the mold body 1 allows them to rotate according to the condition of the bottom of the package, achieving adaptive contact with the package together with the rolling wheels 19.

[0029] Working Principle: During installation, first press the pressing block 8. The pressing block 8 moves the connecting rod 7 downward, which in turn moves the sliding rod 6 downward. The sliding rod 6 compresses the engaging ball 13, causing it to retract into the movable hole 12 and disappear into the original engaging position of the fixed rod 4. During this process, the sliding rod 6 moves the limiting plate 9 downward within the limiting hole 10, compressing the strong spring 11. Then, the fixed rod 4 is inserted into the mounting hole. Once the fixed rod 4 reaches the appropriate position, the pressing block 8 is released. At this point, under the elastic force of the strong spring 11, the limiting plate 9 moves the sliding rod 6 upward, causing the connecting rod 7 and the pressing block 8 to reset. The engaging ball 13, under the elastic force of the strong spring 11, returns to its original position, completing the installation of the cutting die. This installation method reduces the complexity of installation, maintains the integrity of the die installation structure, and increases the stability of the installation.

[0030] When the package is placed on the mold body 1, the package comes into contact with roller 19 and roller 20. Due to the differences in size and shape of different packages, when the package exerts different pressures and positional changes on roller 19 and roller 20, roller 19 will be displaced by the pressure. The displacement of roller 19 will drive guide plate 18 to rotate. The rotation of guide plate 18 will drive another guide plate 18 connected to it to rotate. The rotation of the two guide plates 18 will cause the limiting plate 16 in the two limiting components to slide in the receiving hole 14. The limiting plate 16 will drive the connecting block 17 to move, and then drive the entire limiting component to slide in the receiving hole 14. At the same time, roller 20 will also rotate and displace according to the situation of the bottom of the package. During this process, the telescopic spring 15 extends and retracts according to the displacement of the first roller 19 and the second roller 20, so that the first roller 19 and the second roller 20 can automatically adjust their positions according to the actual size and shape of the package, thereby ensuring that the contact between the mold and the package is closer and more uniform during the cutting process, improving the mold's adaptability to packages of different sizes, and thus improving the accuracy of cutting.

[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A die for forming semiconductor package lead cutting, comprising a die body (1), characterized in that: Two mounting plates (3) are fixedly connected to both the left and right sides of the mold body (1). A fixing rod (4) is slidably connected inside the mounting plate (3). A sliding rod (6) is slidably connected inside the fixing rod (4). A connecting rod (7) is fixedly connected to the top of the sliding rod (6). A pressing block (8) is fixedly connected to the top of the connecting rod (7). A limiting plate (9) is fixedly connected to the bottom of the sliding rod (6). A limiting hole (10) is opened inside the bottom of the fixing rod (4). A strong force is provided inside the limiting hole (10). The spring (11) has two movable holes (12) on the outside of the fixed rod (4). The movable holes (12) are movably connected to the inside of the movable holes (13). The mold body (1) has multiple receiving holes (14) inside. The receiving holes (14) are provided with telescopic springs (15). The receiving holes (14) are slidably connected to limit components. Each pair of limit components is rotatably connected to a guide plate (18) on one side. Each pair of guide plates (18) is rotatably connected to a multiple rotating components on one side.

2. The semiconductor packaging lead cutting die according to claim 1, characterized in that: A baffle (5) is fixedly connected to the top of the fixed rod (4), and the bottom end of the baffle (5) is in contact with the top end of the mounting plate (3).

3. The semiconductor packaging lead cutting die according to claim 1, characterized in that: The limiting component includes a limiting plate (16), the outside of which is slidably connected to the inside of the receiving hole (14). A connecting block (17) is fixedly connected to the adjacent side of each pair of limiting plates (16), and the adjacent side of each pair of connecting blocks (17) is fixedly connected to the distant side of each pair of guide plates (18).

4. A semiconductor packaging lead cutting die according to claim 1, characterized in that: The rotating assembly includes a first rolling wheel (19), and the outer sides of multiple first rolling wheels (19) are rotatably connected to the inside of one side of the guide plate (18). Multiple second rolling wheels (20) are rotatably connected to the bottom of the mold body (1).

5. A semiconductor packaging lead cutting die according to claim 1, characterized in that: The top of the mold body (1) is fixedly connected to a plurality of fixed columns (2), and the outer bottom end of the pressing block (8) is slidably connected to the inside of the top of the fixed rod (4).

6. A semiconductor packaging lead cutting die according to claim 1, characterized in that: The outside of the sliding rod (6) is in contact with the outside of the locking ball (13), and the outside of the limiting plate (9) is slidably connected to the inside of the limiting hole (10).

7. A semiconductor packaging lead cutting die according to claim 1, characterized in that: One end of the strong spring (11) is fixedly connected to the bottom of the inner end of the limiting hole (10), and the other end of the strong spring (11) is fixedly connected to the bottom end of the limiting plate (9).

8. A semiconductor packaging lead cutting die according to claim 1, characterized in that: The outside of the connecting rod (7) is in contact with the outside of the locking ball (13), and the thickness of the connecting rod (7) is less than the thickness of the sliding rod (6).

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