A blanking mechanism of an IC carrier plate marking machine

Abstract

The utility model relates to IC carrier board processing equipment technical field, concretely relates to a kind of unloading mechanism of IC carrier plate marking machine, including rack, several unloading bins are installed on rack, unloading bin can stack multiple layers IC board workpieces, corresponding unloading bin fixed mounting is installed on rack with spacer device, spacer device includes mounting seat, mounting seat is fixedly installed on rack, paper carrier plate is installed on mounting seat, multiple layers spacer paper can be stacked on paper carrier plate, corresponding spacer paper's first direction fixed mounting is installed with several first stop lever on paper carrier plate, corresponding spacer paper's second direction fixed mounting is installed with several second stop lever on paper carrier plate, first positioning assembly that first stop lever is installed with the first positioning assembly that second stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop lever is installed with the second positioning assembly that first stop

Description

Technical Field

[0001] This utility model relates to the technical field of IC carrier processing equipment, specifically to a feeding mechanism for an IC carrier marking machine. Background Technology

[0002] In the manufacturing process of IC substrates, laser marking technology, with its non-contact and high-precision characteristics, has become the core method for marking defective IC substrates. Through the localized action of a high-energy-density laser beam, permanent markings can be formed on the surface of the IC substrate without generating mechanical stress, ensuring that the delicate circuits and components on the board are not damaged. After the marking process is completed, a feeding mechanism is needed to remove the IC substrate from the marking machine and store it in the feeding hopper for subsequent processes or warehousing management.

[0003] Laser processing technology places extremely stringent requirements on the surface integrity of IC substrates. Even the slightest scratch or indentation can affect the precision and quality of subsequent laser processing, and may even lead to signal transmission abnormalities. However, most IC substrate marking machines on the market have defects in their unloading mechanisms when transporting marked IC substrates to the unloading hopper. In existing unloading and storage methods, IC boards are typically stacked or closely arranged in the unloading hopper, resulting in contact and compression between them. Because the surface of the IC substrate is covered with micron-level circuitry and a fragile solder mask layer, scratches and abrasions are easily caused by this contact. This not only compromises the clarity of the laser-marked markings but may also damage critical structures on the substrate surface, severely impacting IC substrate quality and increasing product defect rates.

[0004] Therefore, how to design a feeding mechanism that can both avoid scratches and indentations caused by direct surface contact when stacking IC substrates and meet the stringent storage environment requirements of laser processing has become a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] To avoid scratches and indentations caused by direct surface contact during stacking, this application provides a feeding mechanism for an IC carrier marking machine.

[0006] The feeding mechanism of the IC carrier marking machine provided in this application adopts the following technical solution:

[0007] A feeding mechanism for an IC substrate marking machine includes a frame with a plurality of feeding bins mounted on the frame. Each feeding bin is capable of stacking multiple layers of IC substrate workpieces. A spacer device is fixedly mounted on the frame corresponding to each feeding bin. The spacer device includes a mounting base fixedly mounted on the frame. A substrate paper is mounted on the mounting base, and multiple layers of spacer paper can be stacked on the substrate paper. A plurality of first stops are fixedly mounted on the substrate paper in a first direction corresponding to the spacer paper, and a plurality of second stops are fixedly mounted on the substrate paper in a second direction corresponding to the spacer paper. A first positioning component penetrating the substrate paper is mounted on the mounting base corresponding to the first stops, and a second positioning component penetrating the substrate paper is mounted on the mounting base corresponding to the second stops.

[0008] Furthermore, the first positioning component includes a first guide rail, which is fixedly mounted on the mounting base. A first slider is slidably connected to the first guide rail. A plurality of first limiting rods are fixedly mounted on the first slider corresponding to the first stop rod. A first limiting groove is formed on the carrier paper corresponding to the first limiting rod, and the first limiting rod passes through the first limiting groove.

[0009] Furthermore, a first connecting bracket is fixedly installed on the first slider, and a first locking screw is threadedly connected to the first connecting bracket corresponding to the mounting base. The first locking screw has a locking part at one end near the mounting base and a driving part at the other end away from the mounting base.

[0010] Furthermore, the second positioning component includes a second guide rail, which is fixedly mounted on the mounting base. A second slider is slidably connected to the second guide rail. A plurality of second limiting rods are fixedly mounted on the second slider corresponding to the second stop rod. A second limiting groove is formed on the carrier paper corresponding to the second limiting rod, and the second limiting rod passes through the second limiting groove.

[0011] Furthermore, a second connecting bracket is fixedly installed on the second slider, and a second locking screw is threadedly connected to the second connecting bracket corresponding to the mounting base. The second locking screw has a locking part at one end near the mounting base and a driving part at the other end away from the mounting base.

[0012] Furthermore, the unloading hopper includes a base plate, which is slidably connected to the frame. A first baffle and a second baffle, which are perpendicular to each other, are fixedly installed on the base plate. A carrier plate is slidably connected between the first baffle and the second baffle. Multiple IC board workpieces can be stacked on the carrier plate. A third positioning component penetrating the carrier plate is installed on the base plate in a first direction corresponding to the IC board workpiece. A fourth positioning component penetrating the carrier plate is installed on the base plate in a second direction corresponding to the IC board workpiece. A lifting component that is drively connected to the carrier plate is installed on the frame.

[0013] Furthermore, a sliding rod is slidably connected to the mounting base, one end of the sliding rod is fixedly connected to the carrier paper, and a sliding plate is fixedly installed at the end of the sliding rod away from the carrier paper. A synchronous movement component is provided between the sliding plate and the carrier paper.

[0014] Furthermore, the synchronous movement assembly includes a first piston cylinder and a second piston cylinder. The first piston cylinder is fixedly installed between the frame and the lifting assembly, and the second piston cylinder is fixedly installed between the frame and the sliding plate. The piston rod of the second piston cylinder is fixedly connected to the sliding plate. The rodless chambers of the first piston cylinder and the second piston cylinder are in sealed communication, and the interiors of the first piston cylinder and the second piston cylinder are filled with fluid.

[0015] Furthermore, a limiting plate is slidably connected to the top of the first limiting rod along the moving direction of the first limiting rod, and the limiting plate is provided with a limiting roller corresponding to the spacer paper, and the limiting roller is slidably connected to the spacer paper.

[0016] Furthermore, a pressure stabilizing tank is fixedly installed inside the frame, and the pressure stabilizing tank is in sealed communication with the first piston cylinder and the second piston cylinder.

[0017] Beneficial effects achieved:

[0018] This application uses spacer paper to form physical isolation between IC board components, avoiding scratches and indentations caused by direct surface contact during stacking, thus improving product quality; the spacer paper is fixed in two orthogonal directions by the spacer device to prevent misalignment during operation; the synchronous moving component enables the carrier plate and the carrier paper to move synchronously in opposite directions, ensuring that the gripping device can always quickly grip the paper as the carrier paper descends and gradually rises, reducing idle travel time and speeding up the unloading speed. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of one embodiment of this application.

[0020] Figure 2This is a structural exploded view of one embodiment of this application.

[0021] Figure 3 This is an exploded view of one embodiment of the diaphragm device in this application.

[0022] Figure 4 This is an exploded view of the structure of one embodiment of the third positioning component in this application.

[0023] Figure 5 This is a structural exploded view of one embodiment of the fourth positioning component in this application.

[0024] Figure 6 This is an exploded view of the structure of one embodiment of the lifting component in this application.

[0025] Figure 7 This is a partial internal structure diagram of one embodiment of this application.

[0026] Figure 8 This is a partial overall structural diagram of one embodiment of the synchronous movement component in this application.

[0027] Figure 9 This is a front view structural diagram of one embodiment of the synchronous moving component in this application.

[0028] Figure 10 yes Figure 8 Enlarged view of Part I of the structure.

[0029] Explanation of reference numerals in the attached drawings: 100, frame; 101, feeding bin; 1011, base plate; 1012, first baffle; 1013, second baffle; 1014, first mounting plate; 1015, second mounting plate; 102, material carrier plate; 103, ball bearing slide rail; 104, position sensor; 200, spacer device; 201, mounting base; 202, material carrier plate; 203, first stop bar; 204, second stop bar; 205, sliding rod; 206, sliding plate; 300 400. First positioning component; 301. First guide rail; 302. First slider; 303. First limiting rod; 304. First limiting groove; 305. First connecting frame; 306. First locking screw; 307. Limiting plate; 308. Limiting roller; 400. Second positioning component; 401. Second guide rail; 402. Second slider; 403. Second limiting rod; 404. Second limiting groove; 405. Second connecting frame; 406. Second locking screw; 500. Third positioning component; Positioning component; 501, mounting bracket; 502, first motor; 503, first rotating rod; 504, moving block; 505, third guide rail; 506, third moving slider; 507, third limiting rod; 508, third limiting groove; 509, first pulley; 510, second pulley; 511, synchronous toothed belt; 512, fixed rod; 600, fourth positioning component; 601, fourth guide rail; 602, second motor; 603, second rotating rod; 604, fourth sliding block; Block; 605, Fourth limiting rod; 606, Fourth limiting groove; 700, Lifting assembly; 701, Mounting platform; 702, Fifth guide rail; 703, Third motor; 704, Third rotating rod; 705, Fifth slider; 706, Moving plate; 707, First support rod; 708, Second support rod; 709, Sixth slider; 710, Sixth guide rail; 800, Synchronous moving assembly; 801, First piston cylinder; 802, Second piston cylinder; 803, Pressure stabilizing tank. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1-10 This application will be described in further detail.

[0031] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] This application discloses a feeding mechanism for an IC substrate marking machine.

[0034] Please refer to Figures 1 to 10 In one embodiment of this application, a feeding mechanism for an IC substrate marking machine includes a frame 100. A plurality of feeding bins 101 are mounted on the frame 100. Each feeding bin 101 can hold multiple layers of IC substrate workpieces. A spacer device 200 is fixedly mounted on the frame 100 corresponding to the feeding bins 101. The spacer device 200 includes a mounting base 201, which is fixedly mounted on the frame 100. A carrier paper 202 is mounted on the mounting base 201, and multiple layers of spacer paper can be stacked on the carrier paper 202. A plurality of first stops 203 are fixedly mounted on the carrier paper 202 in a first direction corresponding to the spacer paper. A plurality of second stops 204 are fixedly mounted on the carrier paper 202 in a second direction corresponding to the spacer paper. A first positioning component 300 penetrating the carrier paper 202 is mounted on the mounting base 201 corresponding to the first stops 203, and a second positioning component 400 penetrating the carrier paper 202 is mounted on the mounting base 201 corresponding to the second stops 204.

[0035] During operation, several feeding bins 101 are installed on the frame 100 for stacking multi-layer IC board workpieces, achieving orderly storage of IC carrier boards. Carrier paper 202 is installed on the mounting base 201, also for stacking multi-layer spacer paper. The spacer paper is physically positioned by a first stop 203 and a second stop 204, ensuring its fixed position on the carrier paper 202 and preventing displacement during stacking. A first positioning component 300 and a second positioning component 400, corresponding to the first stop 203 and the second stop 204 respectively, penetrate the carrier paper 202, ensuring precise positioning of the spacer paper in two orthogonal directions.

[0036] When the IC substrate is marked and needs to be unloaded, the gripping device in the marking machine first moves the spacer paper from the spacer device 200 to the unloading bin 101, and then places the IC substrate onto the spacer paper in the unloading bin 101. This repeated operation can achieve the alternating stacking of the IC substrate and the spacer paper, thereby avoiding friction damage to the surface of the IC substrate.

[0037] By alternating the stacking of IC board workpieces and spacer paper, the paper is used to isolate adjacent IC boards, preventing surface scratches or indentations and improving product quality. At the same time, the first positioning component 300 and the second positioning component 400 enable the unloading mechanism to place spacer paper of different sizes to be compatible with IC board workpieces of different sizes and adapt to diverse product needs.

[0038] Please refer to Figures 1 to 10 In one embodiment of this application, the first positioning component 300 includes a first guide rail 301, which is fixedly mounted on the mounting base 201. A first slider 302 is slidably connected to the first guide rail 301. A plurality of first limiting rods 303 are fixedly mounted on the first slider 302 corresponding to the first stop rod 203. A first limiting groove 304 is opened on the carrier paper 202 corresponding to the first limiting rods 303, and the first limiting rods 303 pass through the first limiting groove 304.

[0039] During operation, the first guide rail 301 provides a sliding path for the first slider 302, limiting its direction of movement, so that the first limiting rod 303 can reciprocate in the first limiting groove 304. This allows the first limiting rod 303 to be used with different sizes of spacer paper, thus ensuring that the stacked spacer paper will not shift due to shaking, friction, etc. during the paper picking process.

[0040] Please refer to Figures 1 to 10 In one embodiment of this application, a first connecting frame 305 is fixedly installed on the first slider 302, and a first locking screw 306 is threadedly connected to the mounting base 201 on the first connecting frame 305. The first locking screw 306 has a locking part at one end near the mounting base 201 and a driving part at one end away from the mounting base 201.

[0041] During operation, when the first positioning component 300 needs to securely position the spacer paper, the first locking screw 306 is rotated in the opposite direction to release its locking part from the surface of the mounting base 201, thereby releasing the locking state and allowing the first slider 302 to slide along the first guide rail 301 to complete the positioning work of the first positioning component 300.

[0042] After the first positioning component 300 positions the spacer paper, the first locking screw 306 is rotated so that its driving part presses against the surface of the mounting base 201 again, thereby preventing the first slider 302 from continuing to slide and thus fixing the position of the first limit rod 303.

[0043] The first locking screw 306 prevents the first slider 302 from shifting due to vibration during equipment operation, ensuring that the spacer paper can be stably stored on the carrier paper 202. At the same time, the first locking screw 306 does not require tools and can be operated with one hand, which shortens the adjustment time and improves production efficiency.

[0044] Please refer to Figures 1 to 10 In one embodiment of this application, the second positioning component 400 includes a second guide rail 401, which is fixedly mounted on the mounting base 201. A second slider 402 is slidably connected to the second guide rail 401. A plurality of second limiting rods 403 are fixedly mounted on the second slider 402 corresponding to the second stop 204. A second limiting groove 404 is opened on the carrier paper 202 corresponding to the second limiting rods 403, and the second limiting rods 403 pass through the second limiting groove 404.

[0045] During operation, the second guide rail 401 provides a sliding path for the second slider 402, limiting its direction of movement, so that the second limiting rod 403 can reciprocate in the second limiting groove 404. This allows the second limiting rod 403 to be used with different sizes of spacer paper, thus ensuring that the stacked spacer paper will not shift due to shaking, friction, etc. during the paper picking process.

[0046] Please refer to Figures 1 to 10 In one embodiment of this application, a second connecting frame 405 is fixedly installed on the second slider 402, and a second locking screw 406 is threadedly connected to the mounting base 201 on the second connecting frame 405. The second locking screw 406 has a locking part at one end near the mounting base 201 and a driving part at the other end away from the mounting base 201.

[0047] During operation, when the second positioning component 400 needs to securely position the spacer paper, the second locking screw 406 is rotated in the opposite direction to release its locking part from the surface of the mounting base 201, thereby releasing the locking state and allowing the second slider 402 to slide along the second guide rail 401 to complete the positioning work of the second positioning component 400.

[0048] After the second positioning component 400 positions the spacer paper, the second locking screw 406 is rotated so that its locking part presses against the surface of the mounting base 201 again, thereby preventing the second slider 402 from continuing to slide and thus fixing the position of the second limit rod 403.

[0049] Please refer to Figures 1 to 10In one embodiment of this application, the unloading hopper 101 includes a base plate 1011, which is slidably connected to the frame 100. A first baffle 1012 and a second baffle 1013 perpendicular to each other are fixedly installed on the base plate 1011. A carrier plate 102 is slidably connected between the first baffle 1012 and the second baffle 1013. Multiple IC board workpieces can be stacked on the carrier plate 102. A third positioning component 500 penetrating the carrier plate 102 is installed on the base plate 1011 in a first direction corresponding to the IC board workpiece. A fourth positioning component 600 penetrating the carrier plate 102 is installed on the base plate 1011 in a second direction corresponding to the IC board workpiece. A lifting component 700 that is drively connected to the carrier plate 102 is installed on the frame 100.

[0050] During operation, the stacked IC board workpieces are placed on the carrier plate 102. The initial positioning of the IC board workpieces within the unloading bin 101 is achieved by utilizing the vertical relationship between the first baffle 1012 and the second baffle 1013. The third positioning component 500 and the fourth positioning component 600 penetrate the carrier plate 102 along the first and second directions of the IC board workpiece, respectively, and abut against the side of the IC board workpiece, ensuring that the IC board workpieces are accurately and stably placed on the carrier plate 102 on the horizontal plane. At the same time, the lifting component 700 is connected to the carrier plate 102 for transmission, which can control the vertical movement of the carrier plate, facilitating the unloading operation of the marking machine.

[0051] Through the cooperation of the third positioning component 500, the fourth positioning component 600 and the unloading bin 101, the unloading mechanism can accurately position and fix IC board workpieces of various specifications, and at the same time avoid the position displacement of IC board workpieces during the unloading process, thus improving the adaptability and practicality of the unloading mechanism.

[0052] Please refer to Figures 1 to 10 In one embodiment of this application, the third positioning component 500 includes a mounting frame 501, which is fixedly mounted on a base plate 1011. A first motor 502 is fixedly mounted on the base plate 1011. The first motor 502 is driven by a first rotating rod 503. A moving block 504 is threadedly connected to the first rotating rod 503. A third guide rail 505 is fixedly mounted on the mounting frame 501. A third moving slider 506 is fixedly mounted on the moving block 504. The third moving slider 506 is slidably connected to the third guide rail 505. A plurality of third limiting rods 507 are fixedly mounted on the moving block 504 corresponding to the first baffle 1012. A third limiting groove 508 is opened on the material plate 102 corresponding to the third limiting rods 507. The third limiting rods 507 pass through the third limiting groove 508.

[0053] During operation, the first motor 502 is started, driving the first rotating rod 503 to start rotating. At the same time, the first moving block 504 moves linearly along the first rotating rod 503 through the thread, driving the third moving slider 506 to move linearly along the third guide rail 505. This causes the third limiting rod 507 to move towards the first baffle 1012 within the third limiting groove 508, thereby accurately positioning and fixing the IC board workpiece on the carrier plate 102 in the first direction. When it is necessary to change the workpiece or adjust its position, the first motor 502 rotates in the opposite direction, and the first moving block 504 drives the third limiting rod 507 to exit the third limiting groove 508, releasing the positioning constraint on the workpiece.

[0054] The third positioning component 500 quickly and accurately controls the position of the third limit rod 507, thereby ensuring that the unloading mechanism can store IC board workpieces of different sizes in the first direction, reducing equipment changeover time, increasing the production capacity of the production line, and also ensuring that the IC board workpieces will not be displaced in the first direction due to vibration during the unloading process.

[0055] Please refer to Figures 1 to 10 In one embodiment of this application, a first pulley 509 is fixedly connected to a first motor 502, and a second pulley 510 is fixedly connected to a first rotating rod 503. A synchronous toothed belt 511 is sleeved on the outside of the first pulley 509 and the second pulley 510, and the synchronous toothed belt 511 meshes with the first pulley 509 and the second pulley 510 at the same time.

[0056] During operation, the first motor 502 is started to make the first pulley 509 rotate synchronously, thereby transmitting power to the second pulley 510 through the meshing synchronous toothed belt 511, which drives the first rotating rod 503 to rotate synchronously, thereby realizing the positioning of the IC board workpiece by the third limit rod 507.

[0057] Please refer to Figures 1 to 10 In one embodiment of this application, the fourth positioning component 600 includes a fourth guide rail 601, which is fixedly mounted on a base plate 1011. A second motor 602 is fixedly mounted on the base plate 1011 corresponding to the fourth guide rail 601. The second motor 602 is drivenly connected to a second rotating rod 603. A fourth slider 604 is threadedly connected to the second rotating rod 603. The fourth slider 604 is slidably connected to the fourth guide rail 601. A fourth limiting rod 605 is fixedly connected to the fourth slider 604 corresponding to a second baffle 1013. A fourth limiting groove 606 is provided on the material plate 102 corresponding to the fourth limiting rod 605, and the fourth limiting rod 605 passes through the fourth limiting groove 606.

[0058] During operation, the second motor 602 is started, driving the second rotating rod 603 to rotate, which in turn drives the fourth slider 604 to slide on the fourth guide rail 601. The fourth limiting rod 605, along with the fourth slider 604, pushes the IC board workpiece towards the second baffle 1013, achieving precise positioning of the IC board workpiece in the second direction. When it is necessary to replace the IC board workpiece with another specification or to release the positioning, the second motor 602 can be reversed to achieve the positioning constraint.

[0059] The fourth positioning component 600 automatically drives the fourth limit rod 605 to accurately position the IC board workpiece in the second direction, and enables the unloading mechanism to adapt to the positioning requirements of IC board workpieces of different sizes in the second direction, while also ensuring that the IC board workpiece will not be displaced due to vibration in the second direction.

[0060] Please refer to Figures 1 to 10 In one embodiment of this application, the lifting assembly 700 includes a mounting platform 701, which is fixedly installed inside the frame 100. A fifth guide rail 702 is fixedly connected to the mounting platform 701. A third motor 703 is fixedly installed on the mounting platform 701. The third motor 703 is driven by a third rotating rod 704. A fifth slider 705 is rotatably connected to the third rotating rod 704. The fifth slider 705 is slidably connected to the fifth guide rail 702. A movable plate 706 is fixedly connected to the fifth slider 705 corresponding to the material carrier plate 102. A plurality of first support rods 707 are fixedly connected to the movable plate 706. The first support rods 707 penetrate the frame 100. A second support rod 708 is fixedly connected to the end of the material carrier plate 102 near the frame 100 corresponding to the first support rod 707. The second support rod 708 penetrates the unloading bin 101.

[0061] During operation, the third motor 703 is started to drive the third rotating rod 704 to rotate synchronously, and at the same time, the fifth slider 705 is driven to move linearly along the fifth guide rail 702. At this time, the fifth slider 705 drives the first support rod 707 to move linearly through the moving plate 706, thereby pushing the second support rod 708 and the material carrier plate 102 to move linearly, thus realizing the smooth lifting and lowering of the IC board workpiece in the vertical direction.

[0062] The cooperation of multiple first support rods 707 and second support rods 708 provides support for the material carrier plate 102. During the operation of the marking machine, it ensures that the IC board workpieces are stacked layer by layer in the material carrier plate 102 and gradually descend to the bottom of the unloading bin 101, reducing the processing time between processes, realizing uninterrupted processing, and improving the working efficiency of the marking machine.

[0063] Please refer to Figures 1 to 10In one embodiment of this application, a sixth slider 709 is fixedly connected to the material carrier plate 102, and a sixth guide rail 710 is fixedly installed on the first baffle 1012 corresponding to the sixth slider 709. The sixth slider 709 and the sixth guide rail 710 are slidably connected.

[0064] When the lifting assembly 700 drives the carrier plate 102 to move vertically upward and downward, the sixth guide rail 710 provides guidance for the sixth slider 709, ensuring that the carrier plate 102 can only move vertically during the lifting process, limiting the displacement and swaying of the carrier plate 102 in the horizontal direction, and ensuring that the carrier plate 102 can reach the predetermined position smoothly and accurately.

[0065] The cooperation between the sixth slider 709 and the sixth guide rail 710 prevents the IC board workpiece from being misaligned or tipped over due to shaking, ensuring safety and stability during the material feeding process.

[0066] Please refer to Figures 1 to 10 In one embodiment of this application, a first mounting plate 1014 is fixedly installed on the base plate 1011 corresponding to the frame 100, and a second mounting plate 1015 is fixedly installed on the frame 100 corresponding to the first mounting plate 1014. A ball bearing slide rail 103 is installed between the first mounting plate 1014 and the second mounting plate 1015.

[0067] During operation, when maintenance or material unloading is required in the unloading bin 101, the bottom plate 1011 is pulled out of the mechanism via the ball bearing slide rail 103, thus facilitating subsequent work by the operator.

[0068] Please refer to Figures 1 to 10 In one embodiment of this application, a position sensor 104 is fixedly connected to the top of the first baffle 1012 and the second baffle 1013. The position sensor 104 is electrically connected to a controller, and the controller is electrically connected to the third motor 703.

[0069] During operation, the position of the IC board workpiece on the carrier plate 102 is monitored in real time by the position sensor 104, and the signal is converted into an electrical signal. Then, the position sensor 104 transmits the electrical signal to the controller that is electrically connected to it. After processing and analyzing the signal, the controller sends a command to the third motor 703 according to the preset program.

[0070] As the IC board workpiece is gradually placed on the carrier plate 102, the edge of the workpiece triggers the position sensor 104. Simultaneously, the position sensor 104 converts the detected signal into an electrical signal and transmits it to the controller. The controller then transmits the electrical signal to the third motor 703, causing the third motor 703 to operate and gradually move the carrier plate 102 downwards, thus moving the IC board workpiece away from the area monitored by the position sensor 104. This control mechanism ensures that the IC board workpiece and carrier plate 102 continuously move downwards during the unloading process, guaranteeing the optimal unloading position for the workpiece, accelerating the unloading pace, and enabling the marking machine to operate continuously and efficiently, thereby improving overall production efficiency.

[0071] Please refer to Figures 1 to 10 In one embodiment of this application, a fixing rod 512 is fixedly installed on the moving block 504. The fixing rod 512 passes through the third limiting groove 508. A counting sensor is fixedly installed on the fixing rod 512. The counting sensor is electrically connected to a controller.

[0072] During operation, when an IC board workpiece is placed on the carrier plate 102, the edge of the workpiece triggers a counting sensor on the fixing rod 512. Simultaneously, the counting sensor converts the detected signal into an electrical signal and transmits it to the controller. Each time a new IC board workpiece is placed downwards, the counting sensor is triggered, and the controller records an increase in the count.

[0073] The counting sensor calculates the number of IC board components in real time, avoiding errors caused by manual counting, ensuring the accuracy of production data, and providing data support for production statistics and quality traceability; the controller judges the feeding status by the change in quantity, which helps to detect abnormalities such as material jams and leakage in a timely manner.

[0074] Please refer to Figures 1 to 10 In one embodiment of this application, a sliding rod 205 is slidably connected to the mounting base 201. One end of the sliding rod 205 is fixedly connected to the carrier paper 202. A sliding plate 206 is fixedly installed at the end of the sliding rod 205 away from the carrier paper 202. A synchronous movement component 800 is provided between the sliding plate 206 and the carrier paper 202.

[0075] During the gradual feeding process, as the number of IC board workpieces increases, the carrier plate 102 will gradually move downwards. At this time, the synchronous moving component 800 will gradually raise the carrier plate 202, thereby ensuring that the spacer paper can always be in the best position to be gripped. This allows the spacer paper to be quickly and alternately stacked between the IC board workpieces, thus speeding up the production pace.

[0076] Please refer to Figures 1 to 10In one embodiment of this application, the synchronous moving assembly 800 includes a first piston cylinder 801 and a second piston cylinder 802. The first piston cylinder 801 is fixedly installed between the frame 100 and the lifting assembly 700, and the second piston cylinder 802 is fixedly installed between the frame 100 and the sliding plate 206. The piston rod of the second piston cylinder 802 is fixedly connected to the sliding plate 206. The rodless chambers of the first piston cylinder 801 and the second piston cylinder 802 are in sealed communication, and the interiors of the first piston cylinder 801 and the second piston cylinder 802 are filled with fluid.

[0077] During operation, the first piston cylinder 801 and the second piston cylinder 802 are sealed and connected, forming a closed pressure system. The first piston cylinder 801 is fixedly installed between the frame 100 and the lifting assembly 700. The extension and retraction of the lifting assembly 700 drives the piston rod of the first piston cylinder 801 to move up and down. When the lifting assembly 700 moves the material carrier plate 102 downward, the piston rod of the first piston cylinder 801 also retracts, increasing the fluid pressure inside the first piston cylinder 801. This pressure is then transmitted to the second piston cylinder 802 through the sealed and connected pipe. Under the pressure, the piston rod of the second piston cylinder 802 extends outward, thereby pushing the sliding plate 206 upward, ultimately achieving synchronous movement of the material carrier plate 202 and the material carrier plate 102.

[0078] Utilizing the characteristics of fluid transmission, the first piston cylinder 801 and the second piston cylinder 802 can achieve near-zero-delay synchronous action, ensuring the accuracy of alternating stacking of IC boards and spacer paper. Furthermore, compared to mechanical transmission, fluid transmission is less prone to wear and jamming, reducing the risk of equipment failure and improving the stability and reliability of the feeding mechanism.

[0079] Please refer to Figures 1 to 10 In one embodiment of this application, the top end of the first limiting rod 303 is slidably connected to a limiting plate 307 along the moving direction of the first limiting rod 303, and the limiting plate 307 is provided with a limiting roller 308 corresponding to the spacer paper, and the limiting roller 308 is slidably connected to the spacer paper.

[0080] Before the material feeding operation, the limiting plate 307 is pulled out from the first limiting rod 303, so that the spacer paper is placed on the carrier paper 202. Then the limiting plate 307 is slid to correspond with the spacer paper, so that the limiting roller 308 just abuts against the spacer paper.

[0081] During the process of the spacer paper being sucked away, the limiting roller 308 contacts and rolls with the surface of the spacer paper, so that the spacer paper can be steadily positioned and the extraction operation can be performed more smoothly, and it also avoids scratches and damage to the surface of the spacer paper; and the limiting roller 308 always applies a certain pressure to the spacer paper to ensure that the spacer paper is further firmly placed on the carrier paper 202.

[0082] Please refer to Figures 1 to 10 In one embodiment of this application, a pressure stabilizing tank 803 is fixedly installed inside the frame 100. The pressure stabilizing tank 803 is in sealed communication with the first piston cylinder 801 and the second piston cylinder 802.

[0083] During operation, the pressure stabilizing tank 803 is connected to both the first piston cylinder 801 and the second piston cylinder 802 via a sealed pipe, forming a closed fluid circuit. When the fluid pressure in the first piston cylinder 801 and the second piston cylinder 802 fluctuates rapidly, the pressure stabilizing tank 803 absorbs or replenishes the pressure to prevent drastic pressure fluctuations in the circuit, ensuring that the first piston cylinder 801 and the second piston cylinder 802 are always under the same fluid pressure reference.

[0084] The pressure stabilizing tank 803 balances the pressure of the first piston cylinder 801 and the second piston cylinder 802 to ensure that the material carrier plate 102 and the material carrier plate 202 move in strict synchronization, avoid positional deviation caused by uneven pressure, and improve the reliability of the automated process of the feeding mechanism.

[0085] Please refer to Figures 1 to 10 In one specific embodiment of this application, multiple unloading bins 101 can be evenly arranged and distributed on the frame 100. The multiple unloading bins 101 can respectively place IC board workpieces of different specifications. For example, they can be classified according to the number of marking points on the IC board workpieces. An orderly material management system is formed by multiple unloading bins 101, which facilitates classification and storage.

[0086] The implementation principle of the unloading mechanism of an IC carrier marking machine according to an embodiment of this application is as follows:

[0087] Before the material feeding process, the spacer paper is stacked on the carrier paper 202 and initially positioned by the first stop 203 and the second stop 204. Then, the spacer paper is pressed against the first stop 203 by the first limit rod 303 and against the second stop 204 by the second limit rod 403. Finally, the first locking screw 306 and the second locking screw 406 are tightened to lock the first connecting frame 305 and the second connecting frame 405 onto the mounting base 201, ensuring that the spacer paper can be stably placed on the carrier paper 202.

[0088] During the unloading process, the IC board workpiece is placed on the carrier plate 102. At the same time, the third limiting rod 507 abuts the IC board workpiece against the first baffle 1012, and the fourth limiting rod 605 abuts the IC board workpiece against the second baffle 1013. Simultaneously, the spacer paper in the spacer device 200 is alternately stacked between adjacent IC board workpieces by the gripping device. As the carrier plate 102 gradually descends, the piston rod of the first piston cylinder 801 retracts, causing the pressure inside the first piston cylinder 801 to increase. This pushes the piston rod in the second piston cylinder 802, which is sealed and connected to the first piston cylinder 801, to move upward, thereby pushing the carrier plate 202 to rise gradually, so that the spacer paper is always at the optimal height that the gripping device can grip.

[0089] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A feeding mechanism for an IC carrier marking machine, characterized in that: The system includes a frame (100) on which a plurality of feeding bins (101) are mounted. Each feeding bin (101) is capable of stacking multiple layers of IC board workpieces. A spacer device (200) is fixedly mounted on the frame (100) corresponding to each feeding bin (101). The spacer device (200) includes a mounting base (201) fixedly mounted on the frame (100). A carrier paper (202) is mounted on the mounting base (201), and multiple layers of spacer paper can be stacked on the carrier paper (202). A plurality of first stops (203) are fixedly installed on the carrier paper (202) in a first direction corresponding to the spacer paper, and a plurality of second stops (204) are fixedly installed on the carrier paper (202) in a second direction corresponding to the spacer paper. A first positioning component (300) penetrating the carrier paper (202) is installed on the mounting base (201) in correspondence with the first stops (203), and a second positioning component (400) penetrating the carrier paper (202) is installed on the mounting base (201) in correspondence with the second stops (204).

2. The unloading mechanism of an IC carrier marking machine according to claim 1, characterized in that: The first positioning component (300) includes a first guide rail (301), which is fixedly mounted on the mounting base (201). A first slider (302) is slidably connected to the first guide rail (301). A plurality of first limiting rods (303) are fixedly mounted on the first slider (302) corresponding to the first stop rod (203). A first limiting groove (304) is opened on the carrier paper (202) corresponding to the first limiting rod (303), and the first limiting rod (303) passes through the first limiting groove (304).

3. The unloading mechanism of an IC carrier marking machine according to claim 2, characterized in that: A first connecting bracket (305) is fixedly installed on the first slider (302). A first locking screw (306) is threadedly connected to the first connecting bracket (305) corresponding to the mounting base (201). The first locking screw (306) has a locking part at one end near the mounting base (201) and a driving part at one end away from the mounting base (201).

4. The unloading mechanism of an IC carrier marking machine according to claim 1, characterized in that: The second positioning component (400) includes a second guide rail (401), which is fixedly mounted on the mounting base (201). A second slider (402) is slidably connected to the second guide rail (401). A plurality of second limiting rods (403) are fixedly mounted on the second slider (402) corresponding to the second stop (204). A second limiting groove (404) is opened on the carrier paper (202) corresponding to the second limiting rod (403), and the second limiting rod (403) passes through the second limiting groove (404).

5. The unloading mechanism of an IC carrier marking machine according to claim 4, characterized in that: A second connecting bracket (405) is fixedly installed on the second slider (402). A second locking screw (406) is threadedly connected to the second connecting bracket (405) corresponding to the mounting base (201). The second locking screw (406) has a locking part at one end near the mounting base (201) and a driving part at one end away from the mounting base (201).

6. The unloading mechanism of an IC carrier marking machine according to claim 1, characterized in that: The unloading hopper (101) includes a base plate (1011), which is slidably connected to the frame (100). A first baffle (1012) and a second baffle (1013) perpendicular to each other are fixedly installed on the base plate (1011). A carrier plate (102) is slidably connected between the first baffle (1012) and the second baffle (1013). Multiple IC board workpieces can be stacked on the carrier plate (102). A third positioning component (500) penetrating the carrier plate (102) is installed on the base plate (1011) in a first direction corresponding to the IC board workpiece. A fourth positioning component (600) penetrating the carrier plate (102) is installed on the base plate (1011) in a second direction corresponding to the IC board workpiece. A lifting component (700) that is drively connected to the carrier plate (102) is installed on the frame (100).

7. The unloading mechanism of an IC carrier marking machine according to claim 6, characterized in that: A sliding rod (205) is slidably connected to the mounting base (201). One end of the sliding rod (205) is fixedly connected to the carrier paperboard (202). A sliding plate (206) is fixedly installed at the end of the sliding rod (205) away from the carrier paperboard (202). A synchronous moving component (800) is provided between the sliding plate (206) and the carrier paperboard (202).

8. The unloading mechanism of an IC carrier marking machine according to claim 7, characterized in that: The synchronous moving assembly (800) includes a first piston cylinder (801) and a second piston cylinder (802). The first piston cylinder (801) is fixedly installed between the frame (100) and the lifting assembly (700). The second piston cylinder (802) is fixedly installed between the frame (100) and the sliding plate (206). The piston rod of the second piston cylinder (802) is fixedly connected to the sliding plate (206). The rodless chambers of the first piston cylinder (801) and the second piston cylinder (802) are in sealed communication. The interiors of the first piston cylinder (801) and the second piston cylinder (802) are filled with fluid.

9. The unloading mechanism of an IC carrier marking machine according to claim 2, characterized in that: The top end of the first limiting rod (303) is slidably connected to a limiting plate (307) along the moving direction of the first limiting rod (303). The limiting plate (307) is provided with a limiting roller (308) corresponding to the spacer paper. The limiting roller (308) is slidably connected to the spacer paper.

10. The unloading mechanism of an IC carrier marking machine according to claim 8, characterized in that: A pressure stabilizing tank (803) is fixedly installed inside the frame (100). The pressure stabilizing tank (803) is in sealed communication with the first piston cylinder (801) and the second piston cylinder (802).

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