A plastic extruder cooling mechanism

Abstract

The utility model discloses a kind of plastic extruder cooling mechanisms, including the cooling box of being installed in the discharge pipe outside of plastic extruder feed hopper bottom;Natural cooling component, including the heat dissipation ring plate and outer ring of being sleeved in the discharge pipe outside and the heat dissipation fin of one end insertion outer ring inside;Water cooling circulation component, including the water storage barrel of being installed in cooling box inside, with the circulating water pump of water storage barrel inside intercommunication;In the utility model, the heat of high-heat discharge pipe is transferred to the heat dissipation ring plate and heat dissipation fin of low temperature, reaches the effect of natural heat dissipation cooling, circulating water pump sends the cold water in water storage barrel to cooling spiral duct, cold water finally flows into water storage barrel, when cold water circulation flows in water storage barrel, part of heat on heat dissipation ring plate and heat dissipation fin will be taken away, reach the purpose of cooling, under the synergistic effect of natural cooling component and water flow circulation component, reach the purpose of cooling the discharge pipe on plastic extruder feed hopper.

Description

Technical Field

[0001] This utility model belongs to the field of plastic extruder technology, specifically relating to a cooling mechanism for a plastic extruder. Background Technology

[0002] A plastic extruder is a mechanical device used to shape plastic materials into plastic products of the required shape and size. Specifically, the plastic material is poured into the feed hopper and then enters the barrel (screw) of the extruder. Through heating and pressurization, the plastic material is gradually melted and plasticized into a uniform melt under the push of the screw within the barrel. The melt is then extruded through the die head and mold to form the product. The patent document CN222727364U discloses a cooling device for a plastic extruder. The structure and principle of the plastic extruder are existing technologies and will not be described in detail in this application.

[0003] When a plastic extruder is working and manufacturing plastic products, the temperature of the barrel rises. This is typically achieved through air or water cooling. However, the feed hopper is located near the barrel's inlet. As the barrel temperature rises, the heat is transferred to the feed hopper, causing it to heat up as well. The plastic material fed into the feed hopper softens and clumps prematurely due to the high temperature, leading to material accumulation and preventing normal feeding. Stable feeding cannot be guaranteed. The feed hopper is generally cooled by natural heat dissipation, which is inefficient and cannot effectively dissipate heat. Residual heat on the inner wall of the feed hopper also heats the plastic material. The lack of a cooling design for the feed hopper in plastic extruders is a significant drawback.

[0004] The existing plastic extruders lack a design for cooling the feed hopper near the barrel. To address this issue, this application proposes a cooling mechanism for a plastic extruder. Utility Model Content

[0005] The purpose of this invention is to provide a cooling mechanism for a plastic extruder, so as to solve the problem mentioned in the background art that there is no design for cooling the feed hopper near the barrel in the plastic extruder.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a cooling mechanism for a plastic extruder, comprising...

[0007] A cooling box installed on the outside of the discharge pipe at the bottom of the feed hopper of a plastic extruder;

[0008] The natural cooling assembly includes a heat dissipation ring plate and an outer ring sleeved on the outside of the discharge pipe, and a heat dissipation fin with one end inserted into the inside of the outer ring;

[0009] The water-cooled circulation assembly includes a water storage tank installed inside a cooling box, a circulating water pump connected to the inside of the water storage tank, a cooling spiral pipe connected to the outlet pipe of the circulating water pump, and a first connecting water pipe whose two ends are respectively connected to one end of the cooling spiral pipe and the inside of the water storage tank. The top of the water storage tank is provided with a top plate, and a heat dissipation metal plate is fixed at the center of the bottom surface of the water storage tank. A temperature sensor is provided on the top plate, and a semiconductor cooling chip is fixedly connected to the surface of the heat dissipation metal plate.

[0010] Preferably, the discharge pipe passes through the bottom surface of the heat dissipation ring plate and the cooling box, and the inner diameter of the heat dissipation ring plate is the same as the outer diameter of the discharge pipe.

[0011] Preferably, an annular cavity A is formed between the heat dissipation ring plate and the outer ring, the heat sink is inserted into the annular cavity A, the heat sink is in contact with the heat dissipation ring plate, and the heat sink has a circular hole for the cooling spiral pipe to pass through.

[0012] Preferably, the cooling spiral pipe is spiral in shape, and both ends of the cooling spiral pipe pass through the outer ring, and the cooling spiral pipe is in contact with the heat dissipation ring plate.

[0013] Preferably, the surface of the top plate is provided with a pipe opening a, and a sealing cap b is connected to the outside of the pipe opening a by threaded connection.

[0014] Preferably, the outer surface of the bottom end of the water storage cylinder is provided with a water outlet d, and the water inlet pipe of the circulating water pump is connected to the water outlet d.

[0015] Preferably, the top surfaces of the water storage cylinder and the heat dissipation ring plate are flush with the top surface of the outer ring, a support leg c is fixed on the bottom surface of the water storage cylinder, the heat dissipation metal plate is flush with the bottom surface of the water storage cylinder, and a button controller is fixed to the side of the cooling box by screws.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. In this utility model, the designed natural cooling component utilizes the principle of heat transfer through heat conduction to transfer the heat from the high-temperature discharge pipe to the low-temperature heat dissipation ring plate and heat sink, thereby achieving the effect of natural heat dissipation and cooling.

[0018] 2. In this utility model, through the designed water-cooling circulation component, the circulating water pump delivers the cold water in the water storage tank to the cooling spiral pipe. Then, the cold water in the cooling spiral pipe enters the water storage tank along the first connecting water pipe. The cold water in the water storage tank circulates. When the cold water circulates, it will carry away some of the heat on the heat dissipation ring plate and heat dissipation fins, thereby achieving the purpose of cooling.

[0019] 3. In this utility model, the temperature sensor and semiconductor cooling chip are designed to detect the water temperature inside the water storage tank. When the water temperature rises, the semiconductor cooling chip works and cools the water in the water storage tank. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a three-dimensional structural diagram of the cooling box of this utility model;

[0022] Figure 3 This is a top view of the cooling box of this utility model.

[0023] Figure 4 This is a cross-sectional view of the outer ring of this utility model.

[0024] Figure 5 This is a cross-sectional view of the water storage cylinder of this utility model.

[0025] In the diagram: 1. Feed hopper of plastic extruder; 2. Cooling box; 4. Water storage tank; 5. First connecting water pipe; 6. Circulating water pump; 7. Temperature sensor; 8. Semiconductor cooling chip; 11. Discharge pipe; 21. Button controller; 31. Heat dissipation ring plate; 32. Outer ring; 33. Heat sink; 34. Cooling spiral pipe; 41. Top plate; 42. Heat dissipation metal plate. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1 to 5 This utility model provides a technical solution: a cooling mechanism for a plastic extruder, including a cooling box 2 installed on the outside of the discharge pipe 11 at the bottom of the feed hopper 1 of the plastic extruder. Figure 1In this designation, B represents a plastic extruder. Cooling box 2 is fixed to plastic extruder B with screws and is positioned outside the discharge pipe 11. The natural cooling assembly includes a heat dissipation ring plate 31 and an outer ring 32 fitted around the outside of the discharge pipe 11, and a heat dissipation fin 33 with one end inserted into the outer ring 32. The heat dissipation ring plate 31 and heat dissipation fin 33 are made of aluminum alloy heat dissipation material. When the temperature of the discharge pipe 11 rises, during the heat transfer process via heat conduction, the heat from the higher-temperature discharge pipe 11 is transferred to the lower-temperature heat dissipation ring plate 31 and heat dissipation fin 33, achieving a heat dissipation effect. The top of the heat sink 33 protrudes from the outer ring 32. Under natural heat dissipation, the top of the heat sink 33 protruding from the outer ring 32 is at a low temperature. Some of the heat from the heat dissipation ring plate 31 and the heat sink 33 at the bottom position is conducted to the top of the heat sink 33 and dissipates under natural heat dissipation. The number of heat sinks 33 in this application is four, and the number can be increased according to actual needs. The water cooling circulation assembly includes a water storage tank 4 installed inside the cooling box 2, a circulating water pump 6 connected to the inside of the water storage tank 4, a cooling spiral pipe 34 connected to the outlet pipe of the circulating water pump 6, and two ends. A first connecting water pipe 5 connects to one end of the cooling spiral pipe 34 and the inside of the water storage tank 4. A circulating water pump 6 is fixed to the cooling box 2 with screws. When the circulating water pump 6 is working, it delivers cold water from the water storage tank 4 to the cooling spiral pipe 34. Then, the cold water in the cooling spiral pipe 34 enters the water storage tank 4 along the first connecting water pipe 5. The cold water circulates in the water storage tank 4. When the cold water flows in the cooling spiral pipe 34, it carries away some of the heat from the heat dissipation ring plate 31 and the heat dissipation fins 33, thus achieving the purpose of cooling. The top of the water storage tank 4 is provided with a top plate 4. 1. A heat dissipation metal plate 42 is fixed at the center of the bottom surface of the water storage cylinder 4. When the temperature of the liquid inside the water storage cylinder 4 rises, the temperature of the heat dissipation metal plate 42 rises and dissipates heat. A temperature sensor 7 is provided on the top plate 41. The temperature sensor 7 is used to sense the temperature of the liquid inside the water storage cylinder 4. A semiconductor cooling chip 8 is fixedly connected to the surface of the heat dissipation metal plate 42. The semiconductor cooling chip 8 is used to dissipate heat. The structure and principle of the circulating water pump 6, the temperature sensor 7 and the semiconductor cooling chip 8 in this application are all prior art and will not be described in detail here.

[0028] In this embodiment, the discharge pipe 11 passes through the bottom surface of the heat dissipation ring plate 31 and the cooling box 2. The inner diameter of the heat dissipation ring plate 31 is the same as the outer diameter of the discharge pipe 11, and the heat dissipation ring plate 31 and the discharge pipe 11 are stably attached.

[0029] In this embodiment, an annular cavity A is formed between the heat dissipation ring plate 31 and the outer ring 32. The heat dissipation fin 33 is inserted into the annular cavity A and is attached to the heat dissipation ring plate 31. A circular hole is provided on the heat dissipation fin 33 for the cooling spiral pipe 34 to pass through. The cooling spiral pipe 34, the heat dissipation fin 33 and the heat dissipation ring plate 31 are all made of aluminum alloy material with high heat dissipation performance and have the function of heat dissipation.

[0030] In this embodiment, the cooling spiral pipe 34 is spiral in shape. The cooling spiral pipe 34 is relatively long and has a large contact area with cold water, which can remove heat. Both ends of the cooling spiral pipe 34 pass through the outer ring 32, and the cooling spiral pipe 34 is in contact with the heat dissipation ring plate 31.

[0031] In this embodiment, a pipe opening a is provided on the surface of the top plate 41. A sealing cap b is connected to the outside of the pipe opening a by a threaded connection. The sealing cap b is connected to the pipe opening a by a threaded connection. When the cold water inside the water storage tank 4 decreases, the sealing cap b can be unscrewed and water can be manually added to the water storage tank 4 from the pipe opening a.

[0032] In this embodiment, the outer surface of the bottom end of the water storage cylinder 4 is provided with a water outlet d. The water inlet pipe of the circulating water pump 6 is connected to the water outlet d. The circulating water pump 6 is in a connected state with the water storage cylinder 4. The circulating water pump 6 circulates and transports the cold water stored inside the water storage cylinder 4.

[0033] In this embodiment, the top surfaces of the water storage cylinder 4, the heat dissipation ring plate 31, and the outer ring 32 are flush. A support leg c is fixed on the bottom surface of the water storage cylinder 4, supporting the water storage cylinder 4. There is a gap between the water storage cylinder 4 and the cooling box 2, which facilitates heat dissipation from the semiconductor cooling chip 8. The heat dissipation metal plate 42 is flush with the bottom surface of the water storage cylinder 4. A button controller 21 is fixed to the side of the cooling box 2 by screws. The button controller 21 is electrically connected to the circulating water pump 6, the temperature sensor 7, and the semiconductor cooling chip 8, and can control their opening and closing.

[0034] Working principle and usage process of this utility model:

[0035] When plastic material is fed from the feed hopper 1 of the plastic extruder into the barrel of the plastic extruder B, the temperature of the discharge pipe 11 rises. During the heat transfer process of heat conduction, the heat from the high-temperature discharge pipe 11 is transferred to the low-temperature heat dissipation ring plate 31 and heat dissipation fins 33, achieving a natural heat dissipation and cooling effect.

[0036] In addition, the top of the heat sink 33 protrudes from the outer ring 32. Under natural heat dissipation, the top of the heat sink 33 protruding from the outer ring 32 is at a low temperature. Some of the heat from the heat dissipation ring plate 31 and the heat sink 33 at the bottom position is conducted to the top of the heat sink 33 and dissipates under natural heat dissipation.

[0037] When the circulating water pump 6 is working, it delivers the cold water in the water storage tank 4 to the cooling spiral pipe 34. Then, the cold water in the cooling spiral pipe 34 enters the water storage tank 4 along the first connecting water pipe 5. The cold water in the water storage tank 4 circulates. When the cold water in the cooling spiral pipe 34 flows, it will carry away some of the heat on the heat dissipation ring plate 31 and the heat dissipation fins 33, thus achieving the purpose of cooling.

[0038] When the temperature of the cold water in the water storage tank 4 rises, the temperature sensor 7 detects that the cold water temperature has risen to a certain value, and the thermoelectric cooler 8 starts to work. The thermoelectric cooler 8 is based on the Peltier effect and uses direct current to drive two different semiconductor materials (N-type and P-type) to form a hot and cold end, thereby achieving heat transfer. The thermoelectric cooler 8 plays the role of heat dissipation.

[0039] In summary, the plastic extruder of this application has a design for cooling the feed hopper near the barrel. With the combined action of the natural cooling component and the water circulation component, the discharge pipe 11 on the feed hopper 1 of the plastic extruder is cooled.

[0040] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cooling mechanism for a plastic extruder, characterized in that: include A cooling box (2) is installed on the outside of the discharge pipe (11) at the bottom of the feed hopper (1) of a plastic extruder; The natural cooling assembly includes a heat dissipation ring plate (31) and an outer ring (32) sleeved on the outside of the discharge pipe (11), and a heat dissipation fin (33) with one end inserted into the outer ring (32); The water-cooled circulation assembly includes a water storage cylinder (4) installed inside the cooling box (2), a circulating water pump (6) connected to the inside of the water storage cylinder (4), a cooling spiral pipe (34) connected to the outlet pipe of the circulating water pump (6), and a first connecting water pipe (5) whose two ends are respectively connected to one end of the cooling spiral pipe (34) and the inside of the water storage cylinder (4). The top of the water storage cylinder (4) is provided with a top plate (41), and a heat dissipation metal plate (42) is fixed at the center of the bottom surface of the water storage cylinder (4). A temperature sensor (7) is provided on the top plate (41), and a semiconductor cooling chip (8) is fixedly connected to the surface of the heat dissipation metal plate (42).

2. The cooling mechanism for a plastic extruder according to claim 1, characterized in that: The discharge pipe (11) passes through the bottom surface of the heat dissipation ring plate (31) and the cooling box (2), and the inner diameter of the heat dissipation ring plate (31) is the same as the outer diameter of the discharge pipe (11).

3. The cooling mechanism for a plastic extruder according to claim 1, characterized in that: An annular cavity A is formed between the heat dissipation ring plate (31) and the outer ring (32). The heat dissipation fin (33) is inserted into the annular cavity A. The heat dissipation fin (33) is in contact with the heat dissipation ring plate (31). A circular hole is provided on the heat dissipation fin (33) for the cooling spiral pipe (34) to pass through.

4. The cooling mechanism for a plastic extruder according to claim 1, characterized in that: The cooling spiral pipe (34) is spiral in shape, and the two ends of the cooling spiral pipe (34) pass through the outer ring (32). The cooling spiral pipe (34) is in contact with the heat dissipation ring plate (31).

5. A cooling mechanism for a plastic extruder according to claim 1, characterized in that: The top plate (41) has a pipe opening a on its surface, and a sealing cap b is connected to the outside of the pipe opening a by threaded connection.

6. A cooling mechanism for a plastic extruder according to claim 1, characterized in that: The outer surface of the bottom end of the water storage cylinder (4) is provided with a water outlet d, and the water inlet pipe of the circulating water pump (6) is connected to the water outlet d.

7. A cooling mechanism for a plastic extruder according to claim 1, characterized in that: The top surfaces of the water storage cylinder (4), the heat dissipation ring plate (31), and the outer ring (32) are flush. A support leg c is fixed on the bottom surface of the water storage cylinder (4). The heat dissipation metal plate (42) is flush with the bottom surface of the water storage cylinder (4). A button controller (21) is fixed to the side of the cooling box (2) by screws.

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