Buffering and heat dissipation integrated graphite copper foil gel composite tape for under-screen support

Abstract

The utility model discloses a buffer heat dissipation integrated graphite copper foil gel composite adhesive tape for screen support, including copper foil base material, copper foil base material one side is provided with the red processing layer, copper foil base material other side is provided with acrylic adhesive layer, acrylic adhesive layer is provided with graphite heat dissipation layer away from copper foil base material one side, graphite heat dissipation layer is provided with silicon gel buffer layer away from acrylic adhesive layer one side, silicon gel buffer layer is provided with fluorine plastic release layer away from graphite heat dissipation layer one side, and the structure has high strength, the characteristics of oxidation resistance, and has excellent buffering and heat dissipation performance simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of adhesive tapes, and in particular to an integrated graphite copper foil gel composite adhesive tape for under-screen support with buffer and heat dissipation. Background Technology

[0002] Currently, the high-strength support, buffer, and heat dissipation structure under mobile phone OLED screens, abbreviated as SCF structure, employs a multi-layer composite structure—copper foil layer + thermally conductive adhesive layer + buffer foam layer + backing adhesive / venting layer—to ensure thermal conductivity, support performance, and impact cushioning. This composite structure has complex manufacturing processes, high losses, and the uneven, porous surface of the foam increases the risk of delamination. Furthermore, the buffer foam relies on imported materials and lacks adhesive properties, requiring separate backing adhesive. The copper foil itself also lacks sufficient strength, leading to water ripples or molding marks on the screen under both on and off states due to compression. Additionally, the copper foil is prone to corrosion and oxidation in high-temperature and high-humidity environments, reducing heat dissipation and impacting the user experience. Therefore, it is necessary to provide a support, buffer, and heat dissipation tape for flexible OLED screens. Utility Model Content

[0003] The technical problem solved by this utility model is to provide a high-strength, oxidation-resistant integrated graphite copper foil gel composite tape for under-screen support and heat dissipation.

[0004] The technical solution adopted by this utility model to solve its technical problem is: an integrated graphite-copper foil gel composite tape for under-screen support, comprising a copper foil substrate, a reddening treatment layer on one side of the copper foil substrate, an acrylic adhesive layer on the other side of the copper foil substrate, a graphite heat dissipation layer on the side of the acrylic adhesive layer away from the copper foil substrate, a silicone gel buffer layer on the side of the graphite heat dissipation layer away from the acrylic adhesive layer, and a fluoroplastic release layer on the side of the silicone gel buffer layer away from the graphite heat dissipation layer.

[0005] Furthermore, the copper foil substrate is a high-strength alloy copper foil, and the thickness of the copper foil substrate is 0.01mm-0.035mm.

[0006] Furthermore, the high-strength alloy copper foil is a copper-zirconium-chromium alloy or a copper-nickel-silicon alloy.

[0007] Furthermore, the thickness of the reddening treatment layer is 0.6-2.0 μm.

[0008] Furthermore, the thickness of the acrylic adhesive layer is 0.008-0.01 mm.

[0009] Furthermore, the thickness of the silicone gel buffer layer is 0.08-0.13 mm.

[0010] Furthermore, the thickness of the fluoroplastic release layer is 0.025-0.075 mm.

[0011] Furthermore, the silica gel buffer layer has a black structure.

[0012] The beneficial effects of this utility model are:

[0013] 1. The copper alloy in this structure has high strength. The surface reddening treatment on the copper alloy can improve the oxidation resistance of the copper alloy in high temperature and high humidity environments. In addition, the copper foil itself can play the roles of support, heat dissipation and shielding.

[0014] 2. Better heat dissipation can be achieved by combining graphite layers with copper foil substrates.

[0015] 3. Using black silicone gel as a buffer layer material to replace traditional foam provides superior cushioning performance. While reducing thickness, its impact absorption rate is still higher than that of Japanese and Korean foam, effectively protecting the screen or display module from damage during drops or impacts. Furthermore, black silicone gel has excellent light-shielding properties, preventing external light from entering the display module from the back, avoiding light leakage or reflection, thereby improving display contrast and visual effects. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the integrated graphite copper foil gel composite tape for under-screen support, according to an embodiment of this application.

[0017] The layers are labeled as follows: 1. Copper foil substrate; 2. Reddening treatment layer; 3. Acrylic adhesive layer; 4. Graphite heat dissipation layer; 5. Silicone gel buffer layer; 6. Fluoroplastic release layer. Detailed Implementation

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0019] like Figure 1 As shown, the integrated graphite-copper foil gel composite tape for under-screen support includes a copper foil substrate 1, a reddening treatment layer 2 on one side of the copper foil substrate 1, an acrylic adhesive layer 3 on the other side of the copper foil substrate 1, a graphite heat dissipation layer 4 on the side of the acrylic adhesive layer 3 away from the copper foil substrate 1, a silicone gel buffer layer 5 on the side of the graphite heat dissipation layer 4 away from the acrylic adhesive layer 3, and a fluoroplastic release layer 6 on the side of the silicone gel buffer layer 5 away from the graphite heat dissipation layer 4.

[0020] Specifically, through the careful design and combination of each layer of materials, this composite tape not only simplifies the complexity of traditional multi-layer composite structures but also significantly improves overall performance. The efficient heat dissipation characteristics of the graphite heat dissipation layer 4, combined with the excellent conductivity and high strength of the copper foil substrate 1, allow heat to be quickly conducted and dissipated, effectively reducing the temperature of the screen area and extending the lifespan of mobile phones and other electronic products. Meanwhile, the addition of the red-treated layer 2 further enhances the oxidation resistance of the copper foil substrate 1, ensuring stable operation of the tape in high-temperature and high-humidity environments.

[0021] In the above structure, the copper foil substrate 1 is a high-strength alloy copper foil, and the thickness of the copper foil substrate 1 is 0.01mm-0.035mm, such as 0.01mm, 0.02mm, 0.035mm, etc. The high-strength alloy copper foil can specifically be a copper-zirconium-chromium alloy or a copper-nickel-silicon alloy.

[0022] The above-mentioned alloy copper foil can achieve both good heat dissipation performance and extremely high strength. Experimental verification shows that the alloy copper foil with a thickness range of 0.01mm-0.035mm has a thermal conductivity >330W / mK, tensile strength >600MPa, Vickers hardness (HV) >140, elastic modulus >100GPa, and shielding effectiveness (30MHZ~1.5GHZ) of 93.393~109.152dB. Therefore, the copper foil substrate 1 can play the roles of longitudinal heat conduction, shielding and support.

[0023] In this embodiment, the thickness of the reddening treatment layer 2 is 0.6-2.0 μm, for example: 0.6 μm, 1 μm, 2 μm, etc.

[0024] Specifically, the reddening layer 2 is formed on the surface of the copper alloy by electrodeposition to create a dense oxide film or complex film, giving the copper foil a red appearance. It should be noted that the above method is an existing process, so it will not be described in detail here. In this structure, the setting of the reddening layer 2 can significantly improve the heat resistance and oxidation resistance of the copper foil substrate 1. According to the test, the reddening surface of the copper foil substrate 1 and the surface reddening layer has a dyne value >60. After 240 hours at a temperature of 85 degrees Celsius, a relative humidity of 85%RH, and a time of 240 hours, the appearance of the reddening surface of the reddening copper foil shows no obvious oxidation. Using two 500g gold-plated copper blocks as test resistors, the surface resistance of the reddening surface of the reddening copper foil is <0.01Ω.

[0025] In this embodiment, the thickness of the acrylic adhesive layer 3 is 0.008-0.01 mm, specifically 0.008 mm, 0.009 mm, 0.01 mm, etc.

[0026] Specifically, the acrylic adhesive layer 3 is a substrate-free, high-adhesion acrylic double-sided adhesive, whose main function is to tightly bond the graphite heat dissipation layer 4 and the copper foil substrate layer 1 together, thereby optimizing the interfacial thermal resistance.

[0027] Specifically, the graphite heat dissipation layer 4 is the main functional layer for heat dissipation, with an in-plane thermal conductivity of up to 1200–1600 W / (m·K). The graphite heat dissipation layer 4 and the copper foil substrate 1 work together to achieve good heat conduction and heat dissipation effects, which can quickly expand point heat sources such as driver ICs and power chips into surface heat sources, thereby eliminating local hot spots. When this tape product is used in screen modules, the overall efficiency of the product is improved through the horizontal heat equalization + vertical heat conduction mechanism.

[0028] In this embodiment, the thickness of the silicone gel buffer layer 5 is 0.08-0.13 mm, specifically 0.08 mm, 0.1 mm, 0.13 mm, etc.

[0029] Specifically, the silicone gel buffer layer 5 plays a role in buffering protection and heat dissipation in the tape structure. The thermally conductive silicone gel layer not only conducts heat and dissipates heat, but also utilizes the helical arrangement of silicone molecules to form good shock resistance, buffering and absorption performance. According to the test, when a 11.2G ball is dropped from a height of 90 meters, the impact force absorption rate of the silicone gel buffer layer 5 is 65%, and the buffering and absorption performance is comparable to that of imported foam. The peel force is greater than 2500gf / 25mm, the film storage modulus is 550±66KPa, and the thermal conductivity is 0.4W / mk. It not only achieves good thermal conductivity, but also has good adhesion and shock absorption performance.

[0030] Specifically, the silicone gel buffer layer 5 has a black structure.

[0031] Specifically, carbon black and graphene materials can be filled into the silicone gel. On the one hand, this can improve the thermal conductivity, buffering, and antistatic properties of the adhesive layer. On the other hand, when the tape is used on a screen module, it can have good light-shielding properties.

[0032] In this embodiment, the thickness of the fluoroplastic release layer 6 is 0.025-0.075mm, specifically 0.025mm, 0.05mm, 0.075mm, etc.

[0033] Specifically, the fluoroplastic release layer 6 is used as a protective layer to protect the silicone gel buffer layer 5 from contamination during transportation. When the fluoroplastic release layer 6 is removed, the release force is 2-5g, and the residual adhesion rate of the release layer is ≥90%.

[0034] In summary, the copper alloy in this structure possesses high strength. The surface red-oxidation treatment on the copper alloy enhances its oxidation resistance in high-temperature and high-humidity environments. Furthermore, the copper foil itself provides support, heat dissipation, and shielding. The composite of the graphite layer and the copper foil substrate achieves even better heat dissipation. In addition, using black silicone gel as a buffer layer material, replacing traditional foam, provides superior cushioning performance. While reducing thickness, its impact absorption rate is still higher than that of Japanese and Korean foam, effectively protecting the screen or display module from damage during drops or impacts. Moreover, the black silicone gel has excellent light-shielding properties, preventing external light from entering the display module from the back, avoiding light leakage or reflection, thereby improving display contrast and visual effects.

[0035] In the specific production process, the copper foil substrate 1 is first reddened to improve its heat resistance and oxidation resistance. Then, the graphite sheet is tightly bonded to the non-reddened side of the copper foil substrate 1 through the acrylic adhesive layer 3 to form an integrated graphite copper structure. Next, a black buffer heat dissipation silicone gel layer is coated on this side of the composite graphite sheet. The graphite copper foil composite material is baked in an oven with a length of 30m, a coating speed of 1-2m / min, and a maximum oven temperature of 150℃. After baking, it is laminated with a fluoroplastic release film and rolled up to become an integrated graphite copper foil gel composite tape.

[0036] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An integrated graphite-copper foil gel composite tape for under-screen support, characterized in that: The material includes a copper foil substrate (1), a reddening treatment layer (2) is provided on one side of the copper foil substrate (1), an acrylic adhesive layer (3) is provided on the other side of the copper foil substrate (1), a graphite heat dissipation layer (4) is provided on the side of the acrylic adhesive layer (3) away from the copper foil substrate (1), a silicone gel buffer layer (5) is provided on the side of the graphite heat dissipation layer (4) away from the acrylic adhesive layer (3), and a fluoroplastic release layer (6) is provided on the side of the silicone gel buffer layer (5) away from the graphite heat dissipation layer (4).

2. The integrated graphite-copper foil gel composite tape for under-screen support with buffer and heat dissipation as described in claim 1, characterized in that: The copper foil substrate (1) is a high-strength alloy copper foil, and the thickness of the copper foil substrate (1) is 0.01mm-0.035mm.

3. The integrated graphite-copper foil gel composite tape for under-screen support with buffer and heat dissipation as described in claim 2, characterized in that: The high-strength alloy copper foil is a copper-zirconium-chromium alloy or a copper-nickel-silicon alloy.

4. The integrated graphite-copper foil gel composite tape for under-screen support with buffer and heat dissipation as described in claim 1, characterized in that: The thickness of the reddening treatment layer (2) is 0.6-2.0 μm.

5. The integrated graphite-copper foil gel composite tape for under-screen support as described in claim 1, characterized in that: The thickness of the acrylic adhesive layer (3) is 0.008-0.01 mm.

6. The integrated graphite-copper foil gel composite tape for under-screen support with buffer and heat dissipation as described in claim 1, characterized in that: The thickness of the silicone gel buffer layer (5) is 0.08-0.13 mm.

7. The integrated graphite-copper foil gel composite tape for under-screen support with buffer and heat dissipation as described in claim 1, characterized in that: The thickness of the fluoroplastic release layer (6) is 0.025-0.075 mm.

8. The integrated graphite-copper foil gel composite tape for under-screen support with buffer and heat dissipation as described in claim 6, characterized in that: The silica gel buffer layer (5) has a black structure.

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