Exhaust gas emission device for semiconductor equipment

Abstract

The utility model provides a kind of tail gas emission device based on semiconductor equipment, including tail gas emission pipeline, first pipeline system, second pipeline system and control module, first pipeline system includes first pipeline and the heat medium control pipeline being connected with first pipeline, and first pipeline is sleeved in tail gas emission pipeline outside;Second pipeline system includes second pipeline and the vacuum control pipeline and cooling medium control pipeline being connected with second pipeline respectively, and second pipeline is sleeved in first pipeline outside;Control module is connected with heat medium control pipeline, cooling medium control pipeline and vacuum control pipeline respectively, to be used for controlling second pipeline and vacuum control pipeline communication or with cooling medium control pipeline communication, to the vacuum extraction of second pipeline or to the cooling medium delivery of second pipeline.The application can effectively prevent the condensation of substances in the tail gas in the tail gas emission pipeline, reducing or avoiding pipe blockage.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to an exhaust gas emission device for semiconductor equipment. Background Technology

[0002] Semiconductor device growth equipment is used to grow semiconductor material layers. During the reaction process, process source gas is introduced into the reaction chamber, where the reaction takes place on the substrate to generate the required thin film material. At the same time, exhaust gas is also generated, which needs to be discharged through exhaust gas emission pipes to the post-processing device for harmless treatment such as combustion.

[0003] Exhaust gases typically contain unreacted raw materials and byproducts. These substances are discharged in gaseous form through the exhaust pipes. If the temperature inside the pipes is not well controlled, they will condense into solid products as the temperature drops, causing blockages. Frequent blockages and damage to exhaust pipes increase maintenance workload. More importantly, for some growth equipment, such as MOCVD equipment, undecomposed precursors or toxic substances (such as arsenic and phosphorus) in the exhaust gas are prone to explosive combustion in the air, increasing the difficulty of handling pipe blockages and compromising safety. Utility Model Content

[0004] The purpose of this invention is to provide a tail gas emission device for semiconductor equipment, which can effectively prevent substances in the tail gas from condensing in the tail gas emission pipeline, thereby reducing or avoiding pipeline blockage.

[0005] To achieve the above objectives, the exhaust gas emission device for semiconductor devices according to this utility model includes:

[0006] The exhaust pipe is connected to the semiconductor processing chamber;

[0007] The first pipeline system includes a first pipeline and a heat medium control pipeline connected to the first pipeline, wherein the first pipeline is sleeved outside the exhaust gas emission pipeline;

[0008] The second piping system includes a second pipe, and a vacuum control pipe and a cooling medium control pipe respectively connected to the second pipe, wherein the second pipe is sleeved outside the first pipe;

[0009] The control module is connected to the heat medium control pipeline, the cooling medium control pipeline, and the vacuum control pipeline, respectively. The control module is used to control the heat medium control pipeline to connect or disconnect from the first pipeline to deliver or stop delivering heat medium with a temperature higher than the exhaust gas temperature in the exhaust gas emission pipeline to the first pipeline, and to control the second pipeline to connect with the vacuum control pipeline or the cooling medium control pipeline to evacuate the second pipeline or deliver cooling medium to the second pipeline.

[0010] Preferably, the second pipeline includes several outer sleeves, each sleeve having a cylindrical structure and closed at both ends. The several outer sleeves are sequentially connected along the axial direction of the first pipeline and are fitted over the first pipeline. The cooling medium control pipeline has several sets and is connected to each of the several outer sleeves in a one-to-one correspondence.

[0011] Preferably, the second pipeline further includes a pipeline connector, and adjacent outer outer pipelines are connected through the pipeline connector. The adjacent outer outer pipelines include a first outer outer pipeline and a second outer outer pipeline. The pipeline connector includes a tubular main body, an elastic sleeve, and a locking sleeve. The tubular main body is sleeved on the end of the first outer outer pipeline. The elastic sleeve includes a plurality of elastic blades, which are circumferentially and spaced apart at the end of the tubular main body. The thickness of the elastic blades increases in the direction away from the tubular main body. The elastic sleeve is sleeved on the end of the second outer outer pipeline. The locking sleeve is movably disposed on the elastic sleeve, and the inner diameter of the locking sleeve is smaller than the outer diameter of the elastic sleeve when the end away from the tubular main body is in a contracted state.

[0012] Preferably, the tubular main body is provided with a separator that divides the tubular main body into two receiving cavities. The two receiving cavities are respectively used to receive the ends of adjacent outer sleeves. The two symmetrical ends of the tubular main body are respectively provided with elastic sleeves, and each elastic sleeve is movably fitted with a locking sleeve.

[0013] Preferably, the cooling medium control pipeline includes a cooling medium input pipeline, a cooling medium output pipeline, and a cooling medium flow control component, a cooling medium input switch valve, and a cooling medium output switch valve, which are respectively connected to the control module. The two ends of the cooling medium input pipeline are respectively connected to the cooling medium supply end and the second pipeline. The cooling medium flow control component and the cooling medium input switch valve are disposed in the cooling medium input pipeline. The cooling medium output pipeline is connected to the second pipeline, and the cooling medium output switch valve is disposed in the cooling medium output pipeline.

[0014] Preferably, the vacuum control pipeline includes a vacuum pump, a suction pipeline, and a switching valve. The two ends of the suction pipeline are respectively connected to the vacuum pump and the second pipeline. The switching valve is located in the suction pipeline. The vacuum pump and the switching valve are respectively connected to the control module.

[0015] Preferably, the second pipeline includes a plurality of outer sleeves, the outer sleeves having a cylindrical structure and being closed at both ends, the plurality of outer sleeves being sequentially connected along the axial direction of the first pipeline and sleeved outside the first pipeline; the plurality of outer sleeves are all connected to a vacuum pump through the suction pipeline, or the vacuum control pipeline has a plurality of sets and is connected to the plurality of outer sleeves one by one.

[0016] Preferably, the second pipeline system further includes an emission control pipeline, which includes an emission pipeline and an emission control valve disposed on the emission pipeline. The emission pipeline is connected to the second pipeline, and the emission control valve is connected to the control module.

[0017] Preferably, the outer wall of the second pipeline is provided with at least one through portion communicating with the discharge pipeline, the through portion protruding outward in a direction away from the inner wall of the second pipeline, and the through portion is provided on the outer wall of the second pipeline facing the ground.

[0018] Preferably, the heat medium control pipeline further includes a heat medium input pipeline, a heat medium output pipeline, and a heat medium flow control component, a heat medium input control switch valve, and a heat medium output control switch valve, which are respectively connected to the control module. The two ends of the heat medium input pipeline are respectively connected to the heat medium supply end and the first pipeline. The heat medium flow control component and the heat medium input control switch valve are disposed in the heat medium input pipeline. The two ends of the heat medium output pipeline are respectively connected to the heat medium supply end and the first pipeline. The heat medium output control switch valve is disposed in the heat medium output pipeline.

[0019] The beneficial effects of the exhaust gas emission device for semiconductor equipment described in this utility model are as follows:

[0020] (1) The heat medium transported in the first pipeline is used to transfer heat to the exhaust gas in the exhaust gas discharge pipeline, so that the temperature of the exhaust gas in the exhaust gas discharge pipeline is higher than the condensation point of the substances that are easy to condense and form deposits in the exhaust gas discharge pipeline. That is, the first pipeline system can effectively prevent the substances in the exhaust gas from condensing in the exhaust gas discharge pipeline, ensuring that they are discharged from the exhaust gas discharge pipeline in gaseous form, reducing or avoiding pipeline blockage.

[0021] (2) When the exhaust gas emission pipeline is working normally, the control module controls the vacuum control pipeline to evacuate the second pipeline to keep the heat medium in the first pipeline warm, thereby reducing the heat loss of the heat medium in the first pipeline and ensuring that the first pipeline system can prevent the substances in the exhaust gas from condensing in the exhaust gas emission pipeline, thereby reducing or avoiding pipeline blockage.

[0022] (3) When the first pipeline system and / or the exhaust gas emission pipeline need maintenance, the control module controls the supply of hot medium with a temperature higher than that of the exhaust gas in the exhaust gas emission pipeline to the first pipeline and supplies cooling medium in the second pipeline to cool the hot medium in the first pipeline. This allows the first pipeline and the exhaust gas emission pipeline to cool down quickly, thereby shortening the time required to wait for cooling down, enabling rapid repair, saving maintenance time, and ensuring the normal operation time of the semiconductor equipment.

[0023] (4) This application realizes multiple uses of one pipe, reduces the pipeline setup, overcomes the problem of limited installation space, and reduces cost investment. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the exhaust gas emission device, semiconductor processing chamber, and exhaust gas treatment device for semiconductor equipment according to an embodiment of the present invention.

[0025] Figure 2 This is a structural block diagram of a tail gas emission device for semiconductor equipment according to an embodiment of the present invention.

[0026] Figure 3 This is a schematic diagram of the structure of the exhaust gas emission pipe, the first pipe, and the second pipe in some embodiments of the exhaust gas emission device of this utility model. Figure 1 .

[0027] Figure 4 for Figure 3 The diagram shows the structure of the exhaust emission pipe, the first pipe, and the second pipe in the exhaust emission device. Figure 2 .

[0028] Figure 5 This is a schematic diagram of the exhaust gas emission pipeline, the first pipeline, and the second pipeline in some other embodiments of the exhaust gas emission device of this utility model.

[0029] Figure 6 This is a schematic diagram of the structural connection of the outer casing pipe and pipe connector in the exhaust gas emission device of some embodiments of this utility model.

[0030] Figures 1 to 6 The reference numerals in the attached figures are as follows:

[0031] 100. Semiconductor processing chamber; 200. Exhaust gas treatment device;

[0032] 1. Exhaust gas emission pipeline;

[0033] 2. Heat medium control pipeline; 21. Heat medium supply end; 22. First pipeline; 23. Heat medium input pipeline; 24. Heat medium output pipeline; 25. Heat medium flow control component; 26. Heat medium input control valve; 27. Heat medium output control valve;

[0034] 3. Second conduit; 31. Penetration section; 32. Outer conduit; 321. First outer conduit; 322. Second outer conduit; 33. Conduit connector; 331. Tubular main body; 332. Elastic sleeve; 333. Locking sleeve;

[0035] 4. Vacuum control piping; 41. Vacuum pump; 42. Suction piping; 43. Switch valve;

[0036] 5. Cooling medium control pipeline; 51. Cooling medium supply end; 52. Cooling medium input pipeline; 53. Cooling medium output pipeline; 54. Cooling medium flow control device; 55. Cooling medium input switch valve; 56. Cooling medium output switch valve; 57. Cooling medium recovery end;

[0037] 6. Control module;

[0038] 7. Discharge pipeline; 71. Discharge control valve. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0040] To overcome the problems existing in the prior art, this utility model provides a tail gas emission device for semiconductor equipment, which can not only effectively prevent substances in the tail gas from condensing in the tail gas emission pipeline, but also shorten the time required for the tail gas emission device to cool down, thus ensuring the normal operation time of the semiconductor equipment; at the same time, this application realizes multiple uses of one pipe, reduces the pipeline setup, overcomes the problem of limited installation space, and reduces cost investment.

[0041] In some embodiments of this utility model, reference is made to Figure 1 The semiconductor equipment includes a semiconductor processing chamber 100, an exhaust gas emission device, and an exhaust gas treatment device 200.

[0042] In some embodiments of this utility model, reference is made to Figures 1 to 5 The exhaust gas emission device for semiconductor equipment includes an exhaust gas emission pipeline 1, a first pipeline system (not shown in the figure), a second pipeline system (not shown in the figure), and a control module 6. The two ends of the exhaust gas emission pipe 1 are respectively connected to the semiconductor processing chamber 100 and the exhaust gas treatment device 200; the first pipeline system includes a first pipe 22 and a heat medium control pipe 2 connected to the first pipe 22, the first pipe 22 being sleeved outside the exhaust gas emission pipe 1; the second pipeline system (not shown in the figure) includes a second pipe 3, and a vacuum control pipe 4 and a cooling medium control pipe 5 respectively connected to the second pipe 3, the second pipe 3 being sleeved outside the first pipe 22; the control module 6 is respectively connected to the heat medium control pipe 2, the cooling medium control pipe 5 and the vacuum control pipe 4, the control module 6 is used to control the heat medium control pipe 2 to connect or disconnect from the first pipe 22 to deliver or stop delivering heat medium with a temperature higher than the exhaust gas temperature in the exhaust gas emission pipe 1 to the first pipe 22, and to control the second pipe 3 to connect with the vacuum control pipe 4 or the cooling medium control pipe 5 to evacuate the second pipe 3 or deliver cooling medium to the second pipe 3.

[0043] In this application, the first pipeline system includes a first pipeline 22 and a heat medium control pipeline 2 connected to the first pipeline 22. The first pipeline 22 is sleeved outside the exhaust gas emission pipeline 1. The control module 6 is connected to the heat medium control pipeline 2. The control module 6 is used to control the connection or disconnection between the heat medium control pipeline 2 and the first pipeline 22 to deliver or stop the delivery of heat medium with a temperature higher than the exhaust gas temperature in the exhaust gas emission pipeline 1 to the first pipeline 22. This allows the heat medium delivered through the first pipeline 22 to transfer heat to the exhaust gas in the exhaust gas emission pipeline 1, thereby making the exhaust gas temperature in the exhaust gas emission pipeline 1 higher than the condensation point of substances that are easy to condense and form deposits in the exhaust gas emission pipeline 1. In other words, the first pipeline system can effectively prevent substances in the exhaust gas from condensing in the exhaust gas emission pipeline 1, ensuring that they are discharged in gaseous form from the exhaust gas emission pipeline 1 and enter the exhaust gas treatment device 200 at the rear end.

[0044] Furthermore, this application utilizes a second pipeline system (not shown in the figure) including a second pipeline 3, and a vacuum control pipeline 4 and a cooling medium control pipeline 5 respectively connected to the second pipeline 3. The second pipeline 3 is sleeved outside the first pipeline 22. The control module 6 is connected to the heat medium control pipeline 2, the cooling medium control pipeline 5, and the vacuum control pipeline 4 respectively. The control module 6 is used to control the connection or disconnection of the heat medium control pipeline 2 with the first pipeline 22 to supply or stop supplying heat medium with a temperature higher than the exhaust gas temperature in the exhaust gas emission pipeline 1 to the first pipeline 22, and to control the connection of the second pipeline 3 with the vacuum control pipeline 4 or with the cooling medium control pipeline 5 to evacuate the second pipeline 3 or supply cooling medium to the second pipeline 3. This allows the control module 6 to control the vacuum control pipeline 4 to supply cooling medium to the second pipeline 3 when the exhaust gas emission pipeline 1 is operating normally. The pipeline 3 is evacuated to insulate the heat medium in the first pipeline 22, thereby reducing heat loss and ensuring that the first pipeline system can prevent substances in the exhaust gas from condensing in the exhaust gas emission pipeline 1. When the first pipeline system and / or the exhaust gas emission pipeline 1 require maintenance, the control module 6 controls the cessation of the supply of heat medium with a temperature higher than the exhaust gas temperature in the exhaust gas emission pipeline 1 to the first pipeline 22, and supplies cooling medium to the second pipeline 3 to cool the heat medium in the first pipeline 22. This allows the first pipeline 22 and the exhaust gas emission pipeline 1 to cool down quickly, shortening the waiting time for cooling, enabling rapid maintenance, saving maintenance time, and ensuring the normal operation time of the semiconductor equipment. At the same time, this application achieves multiple uses for one pipe, reduces pipeline setup, overcomes the problem of limited installation space, and reduces cost investment.

[0045] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2 The heat medium control pipeline 2 further includes a heat medium input pipeline 23, a heat medium output pipeline 24, and a heat medium flow control component 25, a heat medium input control valve 26, and a heat medium output control valve 27, which are respectively connected to the control module 6. The two ends of the heat medium input pipeline 23 are respectively connected to the heat medium supply end 21 and the first pipeline 22. The heat medium flow control component 25 and the heat medium input control valve 26 are disposed in the heat medium input pipeline 23. The two ends of the heat medium output pipeline 24 are respectively connected to the heat medium supply end 21 and the first pipeline 22. The heat medium output control valve 27 is disposed in the heat medium output pipeline 24. When the exhaust gas emission pipeline 1 is operating normally, the control module 6 controls the opening of the heat medium input control switch valve 26 and the heat medium output control switch valve 27 to circulate the heat medium into the first pipeline 22. Furthermore, the control module 6 can control the flow rate of the heat medium in the first pipeline 22 by controlling the heat medium flow control component 25. This allows the exhaust gas temperature in the exhaust gas emission pipeline 1 to be adjusted by regulating the flow rate of the heat medium in the first pipeline 22. In practical use, when the exhaust gas temperature in the exhaust gas emission pipeline 1 exceeds a predetermined value... When the temperature is within the preset range, the flow rate of the heat medium in the first pipeline 22 is reduced by controlling the heat medium flow control component 25, so that the temperature of the exhaust gas in the exhaust gas discharge pipeline 1 can quickly return to the preset temperature range. When the temperature of the exhaust gas in the exhaust gas discharge pipeline 1 is lower than the preset range, the flow rate of the heat medium in the first pipeline 22 is increased by controlling the heat medium flow control component 25, so that the temperature of the exhaust gas in the exhaust gas discharge pipeline 1 can quickly rise to the preset range. The preset range of exhaust gas temperature can be adjusted and set according to the actual process and the type of substances in the exhaust gas. When the first pipeline system and / or the exhaust gas discharge pipeline 1 needs maintenance, the heat medium input control switch valve 26 and the heat medium output control switch valve 27 can be closed by controlling the control module 6 to stop the supply of heat medium to the first pipeline 22, so that the first pipeline 22 and the exhaust gas discharge pipeline 1 can be quickly cooled down.

[0046] In some embodiments of this invention, the heat medium is high-temperature water or high-temperature steam, etc.

[0047] In this application, the heat medium supply end 21 includes a heat medium, a heating device that can maintain the heat medium at a preset temperature, and a temperature detection device, etc. The specific structure of the heat medium supply end 21 and the necessary adaptation structure are conventional settings in the art and will not be described in detail here. The preset temperature of the heat medium can be set according to the exhaust gas temperature at the exhaust gas emission end and the temperature range that the exhaust gas needs to be maintained in the exhaust gas emission pipeline.

[0048] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2 The cooling medium control pipeline 5 includes a cooling medium input pipeline 52, a cooling medium output pipeline 53, and a cooling medium flow control component 54, a cooling medium input switch valve 55, and a cooling medium output switch valve 56, which are respectively connected to the control module 6. The two ends of the cooling medium input pipeline 52 are respectively connected to the cooling medium supply end 51 and the second pipeline 3. The cooling medium flow control component 54 and the cooling medium input switch valve 55 are disposed in the cooling medium input pipeline 52. The cooling medium output pipeline 53 is connected to the second pipeline 3, and the cooling medium output switch valve 56 is disposed in the cooling medium output pipeline 53. When the first pipeline system and / or the exhaust gas emission pipeline 1 require maintenance, the control module 6 can control the opening of the cooling medium input switch valve 55 and the cooling medium output switch valve 56 to deliver cooling medium to the second pipeline 3, enabling the first pipeline 22 and the exhaust gas emission pipeline 1 to cool down quickly. When the exhaust gas emission pipeline 1 is operating normally, the control module 6 can control the closing of the cooling medium input switch valve 55 and the cooling medium output switch valve 56 to stop the delivery of cooling medium to the second pipeline 3. Furthermore, the control module 6 can control the flow rate of the cooling medium in the second pipeline 3 by controlling the cooling medium flow control element 54, so that the heat of the hot medium in the first pipeline 22 can be quickly removed by adjusting the flow rate of the cooling medium in the second pipeline 3. That is, the cooling rate of the hot medium in the first pipeline 22 can be regulated and controlled, thereby shortening the waiting time for cooling down and ensuring the normal operation time of the semiconductor equipment.

[0049] In this application, the cooling medium supply end 51 includes a cooling medium, a refrigeration device that can maintain the cooling medium at a preset temperature, and a temperature detection device, etc. The specific structure of the cooling medium supply end 51 and the necessary adaptation structure are conventional settings in the art and will not be described in detail here. The preset temperature of the cooling medium can be set according to the exhaust gas temperature, the temperature of the heat medium, and the preset cooling time, etc.

[0050] In some embodiments of this invention, the cooling medium is a water-based medium, an air-based medium, or a liquid refrigerant. In some embodiments, the cooling medium is a water-based medium. Water is the most common cooling medium, inexpensive, and readily available. Furthermore, water has a high specific heat capacity and heat transfer coefficient, enabling it to effectively absorb and dissipate heat.

[0051] In some embodiments, the other end of the cooling medium output pipe 53 is connected to the cooling medium supply end 51 to circulate the cooling medium.

[0052] In other embodiments, the other end of the cooling medium output pipe 53 is connected to the cooling medium recovery end 57 to prevent the cooling medium after passing through the second pipe 3 from being heated by the heat transfer of the heat medium in the first pipe 22 and flowing back to the cooling medium supply end 51, thus affecting the temperature of the cooling medium in the cooling medium supply end 51.

[0053] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2 The vacuum control pipeline 4 includes a vacuum pump 41 and a suction pipeline 42. The two ends of the suction pipeline 42 are connected to the vacuum pump 41 and the second pipeline 3, respectively. The vacuum pump 41 is connected to the control module 6. This allows the control module 6 to control the vacuum pump 41 to create a vacuum in the second pipeline 3 during normal operation of the exhaust gas emission pipeline 1, thereby insulating the heat medium in the first pipeline 22 and reducing heat loss. This ensures that the first pipeline system can prevent substances in the exhaust gas from condensing in the exhaust gas emission pipeline 1.

[0054] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2 The vacuum control line 4 also includes a switching valve 43, which is located in the suction line 42 and connected to the control module 6. After the air in the second line 3 is extracted by the vacuum pump 41, the switching valve 43 is closed by the control module 6 to maintain a vacuum in the second line 3 and prevent the vacuum pump 41 from operating for an extended period of time.

[0055] In some embodiments of this utility model, the switching valve 43 may also be a one-way valve.

[0056] In some embodiments of this utility model, the second pipeline system further includes an emission control pipeline, see reference. Figure 1 and Figure 2 The emission control pipeline includes an emission pipeline 7 and an emission control valve 71 disposed on the emission pipeline 7. The emission pipeline 7 is connected to the second pipeline 3, and the emission control valve 71 is connected to the control module 6. When the second pipeline 3 contains cooling medium, the control module 6 controls the opening of the emission control valve 71 to discharge the cooling medium from the second pipeline 3. When the second pipeline 3 is in a vacuum state, the control module 6 controls the opening of the emission control valve 71 to connect the second pipeline 3 to the atmosphere, thus de-vacuuming the second pipeline 3.

[0057] In some embodiments of this utility model, reference is made to Figure 1The outer wall of the second pipe 3 is provided with at least one through portion 31 that connects to the discharge pipe 7. The through portion 31 protrudes outward in a direction away from the inner wall of the second pipe 3, and the through portion 31 is provided on the outer wall of the second pipe 3 facing the ground. This facilitates the rapid discharge of the cooling medium in the second pipe 3 and helps to completely drain the cooling medium in the second pipe 3.

[0058] In some specific embodiments of this utility model, there are several through-holes 31 and several groups of discharge control pipelines, that is, each of the drainage pipelines is equipped with a drainage control valve, and several groups of discharge pipelines 7 are arranged in a one-to-one correspondence with several through-holes 31, so that the cooling medium in the second pipeline 3 can be quickly drained. In other specific embodiments of this utility model, there are several through-holes 31, and the through-holes 31 are connected to the discharge pipelines 7 through branch pipelines, that is, the through-holes 31 converge into one discharge pipeline 7 through branch pipelines, which can reduce the pipeline setup.

[0059] In some embodiments of this invention, the vacuum pump 41 is a vacuum water pump. This allows the cooling medium, such as water or gas, in the second pipeline 3 to be extracted and a vacuum to be created in the second pipeline 3, achieving two goals at once without the need for an additional pipeline to discharge the cooling medium.

[0060] In some embodiments of this utility model, the exhaust gas emission pipe 1, the second pipe 3, and the first pipe 22 are integrally formed. In some specific embodiments, refer to... Figure 3 and Figure 4 The inner wall of the first pipe 22 is the outer wall of the exhaust pipe 1, and the inner wall of the second pipe 3 is the outer wall of the first pipe 22. That is, the first pipe 22 and the exhaust pipe 1 share a common annular wall, and the second pipe 3 and the first pipe 22 share a common annular wall, resulting in faster heat transfer. In other specific embodiments, refer to... Figure 5 The inner wall of the first pipe 22 is fitted to the outer wall of the exhaust pipe 1, and the inner wall of the second pipe 3 is fitted to the outer wall of the first pipe 22. That is, the exhaust pipe 1, the second pipe 3 and the first pipe 22 each have their own inner wall and outer wall, making the structure more stable and robust.

[0061] In some embodiments of this utility model, the second pipeline 3 is an integral structure.

[0062] In other embodiments of this utility model, reference is made to Figure 6The second conduit 3 includes several outer conduits 32, each of which has a cylindrical structure and is closed at both ends. These outer conduits 32 are sequentially connected along the axial direction of the first conduit 22 and are fitted over the first conduit 22. This facilitates the installation of the outer conduits 32 outside the first conduit 22.

[0063] In this application, the axial direction of the first pipe 22 is the direction in which the first pipe 22 extends, that is, the direction perpendicular to the diameter direction of the first pipe 22.

[0064] In some embodiments of this utility model, when the second pipeline 3 includes several outer outer pipelines 32, the cooling medium control pipeline 5 is provided with several groups and is connected one-to-one with several of the outer outer pipelines 32 to respectively deliver cooling medium into the several outer outer pipelines 32, so that the hot medium in the first pipeline 22 can be cooled in a timely and rapid manner, thereby improving the cooling efficiency of the hot medium in the first pipeline 22. This can effectively avoid the problem of reduced cooling efficiency caused by the temperature of the cooling medium in the later section of the second pipeline 3 rising due to heat transfer of the hot medium in the first pipeline 22 when the second pipeline 3 is an integral piece.

[0065] In some embodiments of this invention, when the second pipeline 3 includes several outer outer pipelines 32, each of the several outer outer pipelines 32 is connected to a vacuum pump 41 via a suction pipeline 42. In other embodiments of this invention, when the second pipeline 3 includes several outer outer pipelines 32, the vacuum control pipeline 4 is provided with several groups and is connected one-to-one with each of the several outer outer pipelines 32. This allows for the separate evacuation of several outer outer pipelines 32, enabling timely and rapid evacuation of the first pipeline 22. Furthermore, if some of the outer outer pipelines 32 are damaged, the remaining intact outer outer pipelines 32 can still insulate the heat medium inside the first pipeline 22, thereby reducing heat loss of the heat medium inside the first pipeline 22.

[0066] In some embodiments of this invention, when the second pipeline 3 includes a plurality of outer pipelines 32, each of the outer pipelines 32 is provided with the discharge control pipeline. This is to allow the cooling medium in each outer pipeline 32 to be discharged, or to allow each outer pipeline 32 to be released from a vacuum state through the discharge control pipeline.

[0067] In some embodiments of this utility model, reference is made to Figure 6The second conduit 3 further includes a conduit connector 33, through which adjacent outer conduits 32 are connected. Adjacent outer conduits 32 include a first outer conduit 321 and a second outer conduit 322. The conduit connector 33 includes a tubular main body 331, an elastic sleeve 332, and a locking sleeve 333. The tubular main body 331 is fitted onto the end of the second outer conduit 322. The elastic sleeve 332 includes a plurality of elastic blades, which are circumferentially spaced and arranged at intervals within the tubular main body. At the end of the main body 331, the thickness of the elastic blade increases in the direction away from the tubular main body 331. The elastic sleeve 332 is sleeved on the end of the first outer sleeve 321. The locking sleeve 333 is movably disposed on the elastic sleeve 332, and the inner diameter of the locking sleeve 333 is smaller than the outer diameter of the elastic sleeve 332 when the end away from the tubular main body 331 is in a contracted state. That is, when the locking sleeve 333 moves in the direction away from the tubular main body 331, it will cause the elastic sleeve 332 to... As the elastic blades of section 2 gradually contract, the distance between adjacent elastic blades decreases until the locking sleeve 333 moves to a position where the outer diameter of the elastic sleeve portion 332 is larger than the inner diameter of the locking sleeve 333. At this point, the locking sleeve 333 will be unable to move, thus locking the elastic sleeve portion 332 to the first outer sleeve 321. Meanwhile, the locking sleeve 333 moves along the direction closer to the tubular main body portion 331, and the elastic blades of the elastic sleeve portion 332 gradually open, increasing the distance between adjacent elastic blades. The locking of the first outer sleeve 332 can be loosened by the sleeve part 332. The connection and disassembly between adjacent outer sleeves 32 can be simple and convenient through the pipe connector 33. Moreover, the adjacent outer sleeves 32 are connected and fixed by the pipe connector 33, avoiding the spacing between adjacent outer sleeves 32. This ensures that the outer wall of the first pipe 22 can be covered by the outer sleeve 32, avoiding partial exposure of the first pipe 22. This is beneficial for heat preservation or cooling of the heat medium in the first pipe 22.

[0068] In this application, when connecting adjacent outer sleeves 32, the tubular main body 331 is first fitted onto the end of the second outer sleeve 322, then the first outer sleeve 321 is fitted into the elastic sleeve 332, and finally the locking sleeve 333 is rotated away from the tubular main body 331 until the locking sleeve 333 can no longer rotate, thus locking the first outer sleeve 321, thereby completing the connection between the first outer sleeve 321 and the second outer sleeve 322. In some specific embodiments of this utility model, the tubular main body 331 is fitted onto the end of the second outer sleeve 322 by means of threads or snap-fit.

[0069] In this application, when the elastic sleeve portion 332 is in a contracted state, the inner diameter of the structure formed by the ends of all the elastic blades of the elastic sleeve portion 332 away from the tubular main body portion 331 is equal to the outer diameter of the first pipeline 22. When the elastic sleeve portion 332 is in a contracted state, the ends of all the elastic blades of the elastic sleeve portion 332 away from the tubular main body portion 331 are in close contact with the first pipeline 22. At this time, the outer diameter of the structure formed by the ends of the elastic sleeve portion 332 away from the tubular main body portion 331 is the smallest. When 332 is in the open state, the ends of all the elastic blades of the elastic sleeve portion 332 away from the tubular main body portion 331 are spaced apart from the first pipeline 22. At this time, the outer diameter of the structure formed by the ends of the elastic sleeve portion 332 away from the tubular main body portion 331 is relatively large. The outer diameter of the elastic sleeve portion 332 when the ends of the elastic sleeve portion 332 away from the tubular main body portion 331 are in the contracted state refers to the outer diameter of the structure formed when the ends of all the elastic blades of the elastic sleeve portion 332 away from the tubular main body portion 331 are in close contact with the first pipeline 22.

[0070] In this application, the inner diameter of the tubular main body 331 is adapted to the outer diameter of the outer sleeve 32, that is, the inner diameter of the tubular main body 331 can be slightly larger than the outer diameter of the outer sleeve 32 so as to be able to be fitted onto the outer sleeve 32.

[0071] In some embodiments of this utility model, the tubular main body 331 is provided with a separator dividing the tubular main body 331 into two receiving cavities. The two receiving cavities are respectively used to receive the ends of adjacent outer sleeves 32. The two symmetrical ends of the tubular main body 331 are respectively provided with elastic sleeves 332, and each elastic sleeve 332 is movably fitted with a locking sleeve 333. This makes the connection between adjacent outer sleeves 32 simpler and more convenient, and helps to make the connection between adjacent outer sleeves 32 more secure, preventing one of the outer sleeves 32 from sliding out from the end without the elastic sleeve 332, and also helps to firmly fix the outer sleeve 32 to the first pipe 22.

[0072] Specifically, when connecting adjacent outer sleeves 32, firstly, the end of the second outer sleeve 322 is sequentially inserted into the elastic sleeve 332 and the receiving cavity near the first end of the tubular main body 331. Then, the locking sleeve 333 on the elastic sleeve 332 is rotated in a direction away from the tubular main body 331 until the locking sleeve 333 can no longer be rotated, thus locking the second outer sleeve 322. Next, the end of the first outer sleeve 321 is sequentially inserted into the elastic sleeve 332 and the receiving cavity near the second end of the tubular main body 331. Then, the locking sleeve 333 on the elastic sleeve 332 is rotated in a direction away from the tubular main body 331 until the locking sleeve 333 can no longer be rotated, thus locking the first outer sleeve 321. This completes the connection between the first outer sleeve 321 and the second outer sleeve 322.

[0073] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A tail gas emission device for semiconductor equipment, characterized in that, include: The exhaust pipe is connected to the semiconductor processing chamber; The first pipeline system includes a first pipeline and a heat medium control pipeline connected to the first pipeline, wherein the first pipeline is sleeved outside the exhaust gas emission pipeline; The second piping system includes a second pipe, and a vacuum control pipe and a cooling medium control pipe respectively connected to the second pipe, wherein the second pipe is sleeved outside the first pipe; The control module is connected to the heat medium control pipeline, the cooling medium control pipeline, and the vacuum control pipeline, respectively. The control module is used to control the heat medium control pipeline to connect or disconnect from the first pipeline to deliver or stop delivering heat medium with a temperature higher than the exhaust gas temperature in the exhaust gas emission pipeline to the first pipeline, and to control the second pipeline to connect with the vacuum control pipeline or the cooling medium control pipeline to evacuate the second pipeline or deliver cooling medium to the second pipeline.

2. The exhaust gas emission device for semiconductor devices according to claim 1, characterized in that, The second pipeline includes several outer sleeves, each sleeve having a cylindrical structure and closed at both ends. Several outer sleeves are sequentially connected along the axial direction of the first pipeline and are fitted over the first pipeline. The cooling medium control pipeline has several sets and is connected to each of the several outer sleeves in a one-to-one correspondence.

3. The exhaust gas emission device for semiconductor devices according to claim 2, characterized in that, The second pipeline also includes a pipeline connector, and adjacent outer pipelines are connected through the pipeline connector. The adjacent outer pipelines include a first outer pipeline and a second outer pipeline. The pipeline connector includes: The tubular main body is fitted onto the end of the first outer sleeve pipe; The elastic sleeve includes a plurality of elastic blades, which are circumferentially and spaced apart at the end of the tubular main body. The thickness of the elastic blades increases in the direction away from the tubular main body. The elastic sleeve is fitted onto the end of the second outer sleeve. A locking sleeve is movably disposed on the elastic sleeve portion, and the inner diameter of the locking sleeve is smaller than the outer diameter of the elastic sleeve portion when the end away from the tubular main body portion is in a contracted state.

4. The exhaust gas emission device for semiconductor devices according to claim 3, characterized in that, The tubular main body is provided with a partition that divides the tubular main body into two receiving cavities. The two receiving cavities are respectively used to receive the ends of adjacent outer sleeves. The two symmetrical ends of the tubular main body are respectively provided with elastic sleeves, and each elastic sleeve is movably fitted with a locking sleeve.

5. The exhaust gas emission device for semiconductor devices according to claim 1, characterized in that, The cooling medium control pipeline includes a cooling medium input pipeline, a cooling medium output pipeline, and a cooling medium flow control component, a cooling medium input switch valve, and a cooling medium output switch valve, which are respectively connected to the control module. The two ends of the cooling medium input pipeline are respectively connected to the cooling medium supply end and the second pipeline. The cooling medium flow control component and the cooling medium input switch valve are located in the cooling medium input pipeline. The cooling medium output pipeline is connected to the second pipeline, and the cooling medium output switch valve is located in the cooling medium output pipeline.

6. The exhaust gas emission device for semiconductor devices according to claim 1, characterized in that, The vacuum control pipeline includes a vacuum pump, a suction pipeline, and a switching valve. The two ends of the suction pipeline are respectively connected to the vacuum pump and the second pipeline. The switching valve is located in the suction pipeline. The vacuum pump and the switching valve are respectively connected to the control module.

7. The exhaust gas emission device for semiconductor devices according to claim 6, characterized in that, The second pipeline includes several outer tubes, each outer tube having a cylindrical structure and closed at both ends. Several outer tubes are connected sequentially along the axial direction of the first pipeline and are fitted over the first pipeline. Each of the several outer tubes is connected to a vacuum pump through the suction pipeline, or the vacuum control pipeline has several sets and is connected to each of the several outer tubes in a one-to-one correspondence.

8. The exhaust gas emission device for semiconductor devices according to claim 1, characterized in that, The second piping system also includes an emission control piping, which includes an emission pipe and an emission control valve disposed on the emission pipe. The emission pipe is connected to the second piping, and the emission control valve is connected to the control module.

9. The exhaust gas emission device for semiconductor devices according to claim 8, characterized in that, The outer wall of the second pipeline is provided with at least one through-hole that connects to the discharge pipeline. The through-hole protrudes outward in a direction away from the inner wall of the second pipeline, and the through-hole is provided on the outer wall of the second pipeline facing the ground.

10. The exhaust gas emission device for semiconductor devices according to claim 1, characterized in that, The heat medium control pipeline further includes a heat medium input pipeline, a heat medium output pipeline, and a heat medium flow control component, a heat medium input control switch valve, and a heat medium output control switch valve, which are respectively connected to the control module. The two ends of the heat medium input pipeline are respectively connected to the heat medium supply end and the first pipeline. The heat medium flow control component and the heat medium input control switch valve are disposed in the heat medium input pipeline. The two ends of the heat medium output pipeline are respectively connected to the heat medium supply end and the first pipeline. The heat medium output control switch valve is disposed in the heat medium output pipeline.

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