Wafer measurement device
By vertically mounting the wafer and combining it with error elimination components, the measurement error problems caused by gravity and vibration were solved, achieving higher measurement accuracy and precision.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU RUIFEI PHOTOELECTRIC TECH CO LTD
- Filing Date
- 2025-09-15
- Publication Date
- 2026-06-26
AI Technical Summary
Existing wafer measurement equipment suffers from deformation and errors caused by gravity and vibration, which affect the accuracy and precision of measurements.
A wafer measurement device was designed, which uses vertical mounting of the sample to be measured and measures vibration error in real time through an error elimination component, including synchronous movement of a standard sample and a standard probe to eliminate measurement error.
This reduces the impact of gravity on the measurement structure, improves measurement accuracy and precision, and ensures the accuracy and reliability of the measurement data.
Smart Images
Figure CN224416063U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer fabrication technology, and in particular to a wafer measurement device. Background Technology
[0002] In the packaging process, after the wafer thinning process, it is necessary to detect the wafer thickness distribution (THK) and total thickness deviation (TTV) to avoid subsequent bonding failures due to uneven wafer thickness. During the wafer manufacturing process, the thickness error accumulation of the multi-layer stacked structure of Dynamic Random Access Memory (DRAM) requires measurement to obtain its thickness uniformity indicators, among which the key indicators include the thickness distribution (THK) and total thickness deviation (TTV).
[0003] Existing measuring equipment includes a support for placing the sample and a measuring component. During measurement, the sample is placed horizontally on the support (the support provides three-point or planar support for the sample), and the measuring component moves to measure the sample. However, due to the deformation caused by gravity, the measurement results cannot accurately reflect the geometric parameters of the sample's morphology, thus affecting measurement accuracy. Furthermore, vibrations generated during the movement of the measuring component introduce errors into the measurement results, reducing measurement precision. Utility Model Content
[0004] Therefore, the technical problem to be solved by this utility model is to overcome the above-mentioned problems existing in the prior art.
[0005] To solve the above-mentioned technical problems, this utility model provides a wafer measurement device, comprising:
[0006] The measurement platform includes a measurement base and a measurement chamber located on top of the measurement base;
[0007] A measuring fixture is disposed in a measuring chamber. The measuring fixture includes a mounting component and a first mounting position and a second mounting position disposed on the mounting component. The sample to be measured is mounted on the first mounting position and is set vertically.
[0008] The measuring component is located in the measuring chamber; the measuring component includes two measuring probes; the two measuring probes are symmetrically arranged on both sides of the sample to be tested, and are used to measure the thickness of the sample to be tested;
[0009] An error elimination assembly is located in the measurement chamber. The error elimination assembly includes a standard sample and two standard probes. The standard sample is vertically positioned and installed in the second mounting position. The two standard probes are symmetrically positioned on both sides of the standard sample and are used to measure the thickness of the standard sample.
[0010] The moving component is located in the measurement chamber; the moving component is connected to the measurement probe and the standard probe, and is used to drive the measurement probe and the standard probe to move synchronously on the X-axis and Z-axis.
[0011] In one embodiment of the present invention, the moving assembly includes a first moving part and two second moving parts; the first moving part is connected to the top of the measuring chamber and is used to drive the measuring probe and the standard probe to reciprocate on the X-axis; the two second moving parts are symmetrically arranged on both sides of the measuring fixture; the second moving parts are used to drive the measuring probe and the standard probe to reciprocate on the Z-axis.
[0012] In one embodiment of the present invention, the moving assembly further includes a gantry and a connector; the gantry spans the top of the measuring fixture; the gantry is connected to the output end of the first moving part, and the two ends of the gantry are respectively connected to two second moving parts; the second moving parts are slidably connected to the measuring chamber; the output end of the second moving part is connected to the connector, the two ends of the connector are respectively located on both sides of the measuring fixture, and the end of the connector is connected to the measuring probe and the standard probe.
[0013] In one embodiment of this utility model, the connector is located on the back of the measuring fixture.
[0014] In one embodiment of the present invention, the moving component further includes two sets of guide portions; the two sets of guide portions are respectively connected to the top of the measuring chamber, and the guide portions are arranged in a one-to-one correspondence with the second moving portion; the guide portion includes a guide rail and a slider that cooperates with the guide rail; the guide rail extends along the X-axis and is connected to the measuring chamber; the slider is connected to the top of the second moving portion.
[0015] In one embodiment of this utility model, a first through hole is provided on the mounting member at the first mounting position; the measuring fixture further includes a first clamp, which is disposed on the first mounting position; the first clamp includes a first annular clamp and a plurality of first limiting members; the first annular clamp is installed on one side of the first through hole; along the circumference of the first annular clamp, the plurality of first limiting members are spaced apart on one side of the first annular clamp, and the first limiting members are connected to the end of the first annular clamp away from the mounting member; the first limiting member includes a small diameter section and a large diameter section with a diameter greater than the small diameter section, the small diameter section is connected to the first annular clamp, and the large diameter section is connected to the end of the small diameter section away from the first annular clamp.
[0016] In one embodiment of this utility model, a second through hole is provided on the mounting component at the second mounting position; the measuring fixture also includes a second clamp, which is disposed at the second mounting position; the second clamp includes a second annular clamp and a plurality of tightening screws; the second annular clamp is installed on one side of the second through hole; the plurality of tightening screws are circumferentially spaced on the outer wall of the second annular clamp; the standard sample is disposed in the second annular clamp, and the tightening screws pass through the second annular clamp and abut against the outer wall of the standard sample.
[0017] In one embodiment of this invention, the measuring probe and the standard probe have the same structure.
[0018] In one embodiment of this invention, the standard sample is made of flat glass.
[0019] In one embodiment of this utility model, the mounting component is detachably connected to the measuring platform by bolts.
[0020] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:
[0021] The wafer measurement device described in this application reduces the influence of gravity on the measurement structure and improves measurement accuracy. This application also includes an error elimination component, which measures errors caused by interference factors such as vibration. By integrating these errors into the data measured by the measurement component, more accurate measurement data can be obtained, thus improving the accuracy and precision of the measurement data. Attached Figure Description
[0022] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein:
[0023] Figure 1 This is a schematic diagram of the structure of a wafer measuring device in a preferred embodiment of the present invention (with the switchable windows removed from the front and back sides).
[0024] Figure 2 yes Figure 1 Front view of the wafer measuring device shown;
[0025] Figure 3 yes Figure 2 AA section view;
[0026] Figure 4 yes Figure 1 The diagram shows the internal structure of the wafer measurement device.
[0027] Figure 5 yes Figure 6 Enlarged view of point B;
[0028] Figure 6 yes Figure 1 A schematic diagram of the wafer measurement device without the top and side structures;
[0029] Explanation of reference numerals in the accompanying drawings: 100, measuring platform; 110, measuring base; 120, measuring chamber;
[0030] 200. Measuring fixture; 210. Mounting component; 220. First mounting position; 230. Second mounting position; 240. First fixture; 241. First ring fixture; 242. First limiting component; 2421. Small diameter section; 2422. Large diameter section; 250. Second fixture; 251. Second ring fixture;
[0031] 300. Measuring components; 310. Measuring probe;
[0032] 400. Error cancellation component; 410. Standard sample; 420. Standard probe;
[0033] 500. Moving component; 510. First moving part; 520. Second moving part; 530. Gantry frame; 540. Connector; 550. Guide part;
[0034] 600. Sample to be tested. Detailed Implementation
[0035] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.
[0036] It should be noted that the X-axis and Z-axis intersect (e.g., are perpendicular); the plane formed by the X-axis and Z-axis is parallel to the surface of the sample 600 to be tested.
[0037] Reference Figures 1-6 As shown, this embodiment of the present invention provides a wafer measurement device, including:
[0038] The measurement platform 100 includes a measurement base 110 and a measurement chamber 120 located on top of the measurement base 110. In some embodiments, the measurement chamber 120 is provided with windows that can be opened and closed around its perimeter, so that opening the windows facilitates the installation and removal of the sample 600 to be tested, and allows the measurement personnel to open the windows to observe the measurement situation during the measurement process.
[0039] The measuring fixture 200 is disposed in the measuring chamber 120. The measuring fixture 200 includes a mounting member 210 and a first mounting position 220 and a second mounting position 230 disposed on the mounting member 210. The sample 600 to be tested is vertically disposed and is mounted on the first mounting position 220.
[0040] The measuring component 300 is disposed in the measuring chamber 120; the measuring component 300 includes two measuring probes 310; the two measuring probes 310 are symmetrically disposed on both sides of the sample 600 to be tested, and are used to measure the thickness of the sample 600 to be tested;
[0041] Error elimination component 400 is disposed in measuring chamber 120 and located beside measuring component 300; error elimination component 400 includes standard sample 410 and two standard probes 420; standard sample 410 is vertically arranged and installed in second mounting position 230; two standard probes 420 are symmetrically arranged on both sides of standard sample 410 and are used to measure the thickness of standard sample 410.
[0042] The moving component 500 is located in the measuring chamber 120; the moving component 500 is connected to the measuring probe 310 and the standard probe 420; the moving component 500 is used to drive the measuring probe 310 and the standard probe 420 to move synchronously on the X-axis and Z-axis, and the X-axis and Z-axis intersect.
[0043] Specifically, in this application, the sample 600 to be tested is vertically mounted on the mounting component 210. This ensures that the sample 600 is in a vertical position during measurement, preventing deformation due to gravity and reducing the impact of gravity on the sample 600's deformation, thus guaranteeing measurement accuracy. Furthermore, the vertical orientation of the sample 600 ensures that both sides of the sample 600 are unobstructed, allowing the measuring probe 310 to perform complete and rapid measurements of the entire side of the sample 600.
[0044] Secondly, since the standard probe 420 and the measuring probe 310 move synchronously, the vibrations generated by their movement during the measurement process are identical. If the data measured by the standard probe 420 on the standard sample 410 deviates from the standard data of the standard sample 410, this deviation is caused by the vibrations generated by the movement of the standard probe 420 and the measuring probe 310 during the measurement process. Therefore, the standard probe 420 in this application can measure the error caused by vibration during the measurement process in real time. This error is also the error of the measuring probe 310 when measuring the sample 600. In other words, during measurement, the error elimination component 400 can measure the measurement error of the sample 600. After the measuring probe 310 measures the data of the sample 600, it eliminates this measurement error, resulting in more accurate measurement data for the sample 600, thereby improving the accuracy of the measurement data and increasing the measurement precision.
[0045] Therefore, this application reduces the influence of gravity on the measurement structure and improves measurement accuracy. This application also provides an error elimination component 400, which can measure errors caused by interference factors such as vibration. By integrating the above errors into the data measured by the measurement component 300, more accurate measurement data can be obtained, thereby improving the accuracy of the measurement data and improving the measurement precision.
[0046] Furthermore, the moving assembly 500 includes a first moving part 510 and two second moving parts 520; the first moving part 510 is connected to the top of the measuring chamber 120 and is used to drive the measuring probe 310 and the standard probe 420 to reciprocate on the X-axis; the two second moving parts 520 are symmetrically arranged on both sides of the measuring fixture 200; the second moving parts 520 are used to drive the measuring probe 310 and the standard probe 420 to reciprocate on the Z-axis.
[0047] Furthermore, the moving assembly 500 also includes a gantry 530 and a connector 540; the gantry 530 spans the top of the measuring fixture 200; the gantry 530 is connected to the output end of the first moving part 510, and its two ends are respectively connected to two second moving parts 520; the second moving parts 520 are slidably connected to the measuring chamber 120; the output end of the second moving part 520 is connected to the connector 540, the two ends of the connector 540 are respectively located on both sides of the measuring fixture 200, and the end of the connector 540 is connected to the measuring probe 310 and the standard probe 420. In some embodiments, the first moving part 510 and the second moving part 520 are linear modules.
[0048] Specifically, in this embodiment, the synchronous movement of the measuring probe 310 and the standard probe 420 is achieved through the first moving part 510, the second moving part 520, the gantry 530 and the connecting part 540, which has a simple structure and low manufacturing cost.
[0049] Furthermore, the connector 540 is located on the back of the measuring fixture 200.
[0050] Specifically, in this embodiment, the connector 540 is located on the back of the measuring fixture 200, so as not to affect the clamping of the sample 600 to be tested on the front side of the measuring fixture 200.
[0051] Furthermore, the moving assembly 500 also includes two sets of guide sections 550; the two sets of guide sections 550 are respectively connected to the top of the measuring chamber 120, and the guide sections 550 are arranged in a one-to-one correspondence with the second moving section 520; the guide section 550 includes a guide rail and a slider that cooperates with the guide rail; the guide rail extends along the X-axis and is connected to the measuring chamber 120; the slider is connected to the top of the second moving section 520.
[0052] Specifically, during the movement of the measuring probe 310 and the standard probe 420, the guide part 550 plays a guiding role, making their movement more stable and reliable, reducing movement vibration and noise, thereby improving measurement accuracy.
[0053] Furthermore, the mounting component 210 is provided with a first through hole at the position of the first mounting position 220; the measuring fixture 200 also includes a first fixture 240 for clamping the sample 600 to be tested, the first fixture 240 being disposed on the first mounting position 220. The first fixture 240 includes a first annular fixture 241 and a plurality of first limiting members 242; the first annular fixture 241 is mounted on one side of the first through hole; along the circumference of the first annular fixture 241, the plurality of first limiting members 242 are spaced apart on one side of the first annular fixture 241, and the first limiting members 242 are connected to the side of the first annular fixture 241 away from the mounting component 210; the first limiting member 242 includes a small diameter section 2421 and a large diameter section 2422 with a diameter greater than that of the small diameter section 2421, the small diameter section 2421 being connected to the first annular fixture 241, and the large diameter section 2422 being connected to the end of the small diameter section 2421 away from the first annular fixture 241. The outer wall of the sample 600 rests on the small diameter section 2421, while the side of the sample 600 is blocked by the large diameter section 2422.
[0054] Specifically, in this embodiment, the sample 600 to be tested is installed onto the first ring clamp 241 by the first limiting member 242. This installation method avoids the sample 600 to be tested being deformed by large forces, which would affect the accuracy of the measurement data, and will not cause damage to the surface of the sample 600 to be tested; and it is convenient to quickly install and remove the sample 600 to be tested.
[0055] Furthermore, the mounting component 210 has a second through hole at the second mounting position 230; the measuring fixture 200 also includes a second fixture 250 for clamping the standard sample 410, the second fixture 250 being disposed on the second mounting position 230. The second fixture 250 includes a second annular fixture 251 and a plurality of tightening screws (not shown in the figure); the second annular fixture 251 is mounted on one side of the second through hole; the plurality of tightening screws are circumferentially spaced on the outer wall of the second annular fixture 251; the standard sample 410 is disposed in the second annular fixture 251, the tightening screws passing through the second annular fixture 251 and abutting against the outer wall of the standard sample 410.
[0056] Specifically, since the standard sample 410 does not need to be replaced frequently and is relatively thick, this embodiment uses a tightening screw to press against the outer wall of the standard sample 410, thereby fixing the standard sample 410 to the second ring clamp 251. This results in a simpler structure, lower cost, and more stable fixation.
[0057] Furthermore, the measuring probe 310 and the standard probe 420 have the same structure. In some embodiments, the measuring probe 310 is a spectral confocal displacement meter, which includes a light source, a dispersive component, and a spectrometer.
[0058] During measurement, the spectral confocal displacement meter emits a white light source, which is then decomposed into a continuous spectrum (i.e., light of different wavelengths) by a dispersive component (such as a grating or prism). The light of different wavelengths is focused onto the surface of the sample 600 to be measured, and then the sample 600 reflects the light back. The spectrometer analyzes the peak wavelength and accurately calculates the distances L1 and L2 between the spectral confocal displacement meter and the surface of the sample 600 (L1 and L2 are the distances from the two surfaces of the sample 600 to their corresponding measuring probes 310, respectively). Since the distance L between the two measuring probes 310 is known and constant, the thickness H of the sample 600 is H = L - L1 - L2.
[0059] In other embodiments, the measuring probe 310 employs a laser interferometer.
[0060] Furthermore, the standard sample 410 is made of flat glass. In some embodiments, the standard sample 410 may be made of other flat materials.
[0061] Specifically, this embodiment has low manufacturing costs.
[0062] Furthermore, the mounting component 210 is detachably connected to the measuring platform 100 by bolts.
[0063] Specifically, it facilitates quick installation and disassembly of the measuring fixture 200.
[0064] Since this application places the sample 600 to be tested vertically, the influence of gravity on the deformation of the sample 600 to be tested is reduced, and the accuracy of its warp measurement will also be improved.
[0065] During the measurement process using this application, the sample 600 to be measured does not need to be moved, which can increase the measurement accuracy of the thickness distribution (THK), total thickness deviation (TTV), and warp of the sample 600 to be measured.
[0066] This application can effectively reduce the influence of gravity on the deformation of the sample 600 under test, and can measure the error caused by vibration during the movement process. This application can perform high-precision measurement on the sample 600 under test, and for 3D IC packaging technology, it can improve its process quality and yield.
[0067] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.
Claims
1. A wafer measurement device, characterized in that: include: The measurement platform includes a measurement base and a measurement chamber located on top of the measurement base; A measuring fixture is disposed in the measuring chamber. The measuring fixture includes a mounting component and a first mounting position and a second mounting position disposed on the mounting component. The sample to be tested is vertically disposed, and the sample to be tested is vertically mounted on the first mounting position. A measuring component is disposed in the measuring chamber; the measuring component includes two measuring probes; the two measuring probes are symmetrically disposed on both sides of the sample to be tested, and are used to measure the thickness of the sample to be tested; An error elimination component is disposed in the measurement chamber; the error elimination component includes a standard sample and two standard probes; the standard sample is vertically arranged and installed in the second mounting position; the two standard probes are symmetrically arranged on both sides of the standard sample for measuring the thickness of the standard sample; A movable component is disposed in the measurement chamber; the movable component is connected to the measurement probe and the standard probe; the movable component is used to drive the measurement probe and the standard probe to move synchronously on the X-axis and Z-axis.
2. The wafer measuring device according to claim 1, characterized in that: The moving assembly includes a first moving part and two second moving parts; the first moving part is connected to the top of the measuring chamber and is used to drive the measuring probe and the standard probe to reciprocate along the X-axis; the two second moving parts are symmetrically arranged on both sides of the measuring fixture; the second moving parts are used to drive the measuring probe and the standard probe to reciprocate along the Z-axis.
3. The wafer measuring device according to claim 2, characterized in that: The moving assembly also includes a gantry and a connector; the gantry spans the top of the measuring fixture; the gantry is connected to the output end of the first moving part, and both ends of the gantry are respectively connected to two second moving parts; the second moving parts are slidably connected to the measuring chamber; the output end of the second moving part is connected to the connector, both ends of the connector are located on both sides of the measuring fixture, and the end of the connector is connected to the measuring probe and the standard probe.
4. The wafer measuring device according to claim 3, characterized in that: The connector is located on the back of the measuring fixture.
5. The wafer measuring apparatus according to claim 4, characterized in that: The moving component further includes two sets of guides; the two sets of guides are respectively connected to the top of the measuring chamber, and the guides are arranged one-to-one with the second moving part; the guide includes a guide rail and a slider that cooperates with the guide rail; the guide rail extends along the X-axis and is connected to the measuring chamber; the slider is connected to the top of the second moving part.
6. The wafer measuring apparatus according to claim 1, characterized in that: The mounting component has a first through hole at the first mounting position; the measuring fixture further includes a first clamp, which is disposed at the first mounting position; the first clamp includes a first annular clamp and a plurality of first limiting members; the first annular clamp is mounted on one side of the first through hole; along the circumference of the first annular clamp, the plurality of first limiting members are spaced apart on one side of the first annular clamp, and the first limiting members are connected to the end of the first annular clamp away from the mounting component; the first limiting member includes a small diameter section and a large diameter section with a diameter greater than the small diameter section, the small diameter section is connected to the first annular clamp, and the large diameter section is connected to the end of the small diameter section away from the first annular clamp.
7. The wafer measuring apparatus according to claim 1, characterized in that: The mounting component has a second through hole at the second mounting position; the measuring fixture also includes a second clamp, which is located at the second mounting position; the second clamp includes a second annular clamp and a plurality of tightening screws; the second annular clamp is mounted on one side of the second through hole; the plurality of tightening screws are spaced circumferentially on the outer wall of the second annular clamp; the standard sample is located in the second annular clamp, and the tightening screws pass through the second annular clamp and abut against the outer wall of the standard sample.
8. The wafer measuring apparatus according to claim 1, characterized in that: The measuring probe and the standard probe have the same structure.
9. The wafer measuring apparatus according to claim 1, characterized in that: The standard sample is made of flat glass.
10. The wafer measuring apparatus according to claim 1, characterized in that: The mounting component is detachably connected to the measuring platform by bolts.