Pressure test fixture for a bipv assembly
The BIPV component pressure test fixture, with its 'well'-shaped frame structure and spring clips, solves the problems of compatibility and reusability between different versions, achieving efficient and accurate pressure testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHANGZHOU ALMADEN
- Filing Date
- 2025-05-23
- Publication Date
- 2026-06-26
AI Technical Summary
Existing technologies cannot adapt to the pressure resistance tests of different BIPV component types and cannot be reused, resulting in unstable and inconvenient testing.
Design a withstand voltage test fixture for BIPV modules. The fixture uses four sets of insulating fixing plates spliced into a 'well' shaped frame structure, combined with spring clips and conductive layers to ensure adaptability to different module sizes, provide stable clamping and uniform current distribution, and form a continuous conductive circuit.
It achieves stable adaptation and efficient testing of different BIPV components, improves the accuracy and reliability of testing, and reduces operation time and cost.
Smart Images

Figure CN224416980U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of BIPV component technology, specifically to a testing fixture, and more particularly to a pressure resistance testing fixture for BIPV components. Background Technology
[0002] Building-integrated photovoltaics (BIPV), a technology that combines solar energy with buildings, is gradually becoming a trend in green building and sustainable urban development. Withstand voltage performance is a crucial indicator of a BIPV system. It verifies the system's stability and reliability under high-voltage conditions. By applying voltages several times higher than the normal operating voltage, it checks whether the system can maintain stability and avoid phenomena such as voltage leakage, battery casing rupture, or overheating. Insufficient withstand voltage performance may lead to short circuits or other unexpected failures under high-voltage conditions, affecting the system's lifespan and safety. Insulation performance is equally critical, determining the effective isolation between the system's internal and external circuits and preventing the danger of current leakage. Insulation resistance testing typically uses a specialized insulation resistance tester to measure the resistance between the system casing and internal electrodes. Poor insulation performance may lead to current leakage, which can damage the internal battery structure, cause overheating, and even trigger external circuit failures, creating greater safety hazards.
[0003] BIPV modules are designed in diverse ways, requiring different module sizes to be used depending on the building structure. Furthermore, BIPV modules generally do not use frames, and copper foil is used as the negative electrode for withstand voltage and insulation testing. This necessitates that the testing fixtures be adaptable to different module sizes. Therefore, there is an urgent need to design a withstand voltage testing fixture for BIPV modules that can accommodate different module sizes and be reusable. Utility Model Content
[0004] The technical problem to be solved by this utility model is: in order to solve the problem that the existing technology in the background art does not have a pressure resistance test that is adaptable to different BIPV module models and can be reused, a pressure resistance test fixture for BIPV modules is provided. This structure is designed specifically for BIPV modules, taking into account the adaptability to various sizes, test stability and ease of operation, and is suitable for batch testing of building photovoltaic integrated products.
[0005] The technical solution adopted by this utility model to solve its technical problem is: a pressure withstand test fixture for BIPV components, including four sets of insulating fixing plates spliced to form a "well" shaped frame structure. Each set of insulating fixing plates includes an upper fixing plate, a lower fixing plate, and a spring clip. The fixed end of the spring clip is connected to the lower fixing plate, and its movable end is connected to the upper fixing plate to control opening and closing. The inner surfaces of the upper and lower fixing plates are fully covered with a conductive layer. One side of the conductive layer has an extension protruding towards the adjacent insulating fixing plate, and the extension makes conductive contact with the conductive layer of the adjacent insulating fixing plate. At least one set of insulating fixing plates has a lead wire connected to its conductive layer.
[0006] Four sets of insulating fixing plates are spliced into a "well"-shaped frame to ensure that the fixture can adapt to the diverse sizes of BIPV modules. The "well"-shaped frame structure provides stable test support, ensuring the overall rigidity of the fixture and uniform clamping of the BIPV modules, avoiding test errors caused by uneven force. The fixed end of the spring clip connects to the lower fixing plate, and the movable end connects to the upper fixing plate, enabling rapid clamping and release of the module under test, improving test efficiency. A fully enclosed conductive layer ensures uniform distribution of test current, avoiding partial discharge or missed measurements, and improving the accuracy of withstand voltage tests. The extended section of the conductive layer forms conductive contact between the conductive layers of adjacent insulating fixing plates, ensuring the continuity of the entire test circuit and avoiding test failures due to poor contact. Lead wires are used to connect to a high-voltage tester, forming a complete withstand voltage test circuit.
[0007] According to one embodiment of the present invention, the protruding length of the extension section is 5-20mm, and the extension section forms overlapping contact with the conductive layer of the adjacent insulating fixing plate.
[0008] A protrusion length of 5-20mm ensures sufficient contact area between adjacent conductive layers, reducing contact resistance and improving the conductivity stability of the test circuit. The extension overlaps with the conductive layer of the adjacent insulating fixing plate, preventing breaks in the conductive layer due to splicing errors of the insulating fixing plate, ensuring continuous transmission of test current, and improving test reliability.
[0009] According to one embodiment of the present invention, the length of the lead wire is 0.5-1m.
[0010] A lead wire length of 0.5-1m ensures operational flexibility and facilitates connection to test equipment, while avoiding the introduction of additional resistance or electromagnetic interference from excessively long wires, thus ensuring accurate test signals.
[0011] According to one embodiment of the present invention, the conductive layer has a volume resistivity of 1 to 3 × 10^ -8 A conductive material with an Ω·m conductivity and a thickness of 0.1-1 mm.
[0012] The volume resistivity of the conductive material is limited to 1 to 3 × 10⁻ 8 The resistance is measured in Ω·m to ensure the conductive layer has extremely low resistance, reducing energy loss during testing and improving testing accuracy. The conductive layer thickness is limited; if it is less than 0.1 mm, it is easily damaged; if it is greater than 1 mm, it may affect clamping flexibility. This range balances conductivity and mechanical strength.
[0013] According to one embodiment of this utility model, the conductive layer is a metal conductive film or conductive rubber. A metal conductive film has excellent conductivity and is suitable for high-precision testing. Conductive rubber has a certain degree of elasticity, which can adapt to minor unevenness on the surface of the BIPV component, ensuring good contact.
[0014] According to one embodiment of the present invention, the upper fixing plate and the lower fixing plate are longer than 2m and their width is 5-20mm.
[0015] The upper and lower fixing plates are longer than 2m to accommodate common BIPV module sizes; their width is in the range of 5-20mm. If it is greater than 20mm, it may obstruct the edge of the module and affect the test; if it is less than 5mm, it may lead to insufficient structural strength.
[0016] According to one embodiment of the present invention, the upper fixing plate and the lower fixing plate adopt a volume resistivity of 10. 7 ~10 16 A rigid insulating material with a strength of Ω·m. This setup ensures insulation performance and prevents leakage or breakdown during testing.
[0017] According to one embodiment of the present invention, the rigid insulating material is wood, tempered glass, or engineering plastic.
[0018] Wood is inexpensive and easy to process, but requires moisture protection. Tempered glass has high mechanical strength and good weather resistance, making it suitable for outdoor testing. Engineering plastics are lightweight and corrosion-resistant, making them suitable for high-frequency testing scenarios.
[0019] According to one embodiment of the present invention, four sets of insulating fixing plates form a continuous conductive circuit through conductive contact of their respective extension sections.
[0020] By overlapping the extension sections, the conductive layers of the four sets of fixing plates form a closed loop, ensuring that the test current is evenly distributed and avoiding undetected areas.
[0021] According to one embodiment of the present invention, the spring clip is made of insulating material, and its clamping force causes the conductive layers on the inner sides of the upper and lower fixing plates to be tightly pressed against the component under test.
[0022] Insulating materials prevent current leakage through the spring clips during testing, ensuring safety; the clamping force is controllable, ensuring close contact between the conductive layer and the component under test, while avoiding excessive clamping force that could damage the surface of the BIPV component.
[0023] The beneficial effects of this utility model are:
[0024] (1) The building photovoltaic modules can be stably clamped by the "well" shaped frame and the fixing plate with a length greater than 2m;
[0025] (2) By using a low-resistance conductive layer and a continuous conductive loop, the test current is ensured to be evenly distributed, thus avoiding missed measurements;
[0026] (3) With its quick opening and closing via spring clips and modular assembly, it is suitable for batch testing on production lines;
[0027] (4) High-insulation materials and insulating spring clips meet insulation requirements;
[0028] (5) It can be adapted to different BIPV components and is compatible with vertical and horizontal testing scenarios. Attached Figure Description
[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0030] Figure 1 This is a structural schematic diagram of Embodiment 1 of the present invention.
[0031] Figure 2 This is a schematic diagram of the structure of a set of insulating fixing plates in Embodiment 1 of this utility model.
[0032] Figure 3 yes Figure 2 A magnified structural diagram of point A in the middle.
[0033] Figure 4 This is an installation diagram of Embodiment 1 of this utility model.
[0034] In the diagram: 1. Insulating fixing plate; 11. Upper fixing plate; 12. Lower fixing plate; 13. Spring clip; 14. Conductive layer; 141. Extension section; 2. Lead wire; 3. BIPV component under test. Detailed Implementation
[0035] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.
[0036] Example 1
[0037] like Figures 1-3As shown, a withstand voltage testing fixture for a BIPV module includes four sets of insulating fixing plates 1, spliced together to form a "well"-shaped frame structure. Each set of insulating fixing plates 1 includes an upper fixing plate 11, a lower fixing plate 12, and a spring clip 13. The fixed end of the spring clip 13 is connected to the lower fixing plate 12, and its movable end is connected to the upper fixing plate 11 to control opening and closing. The inner surfaces of the upper fixing plate 11 and the lower fixing plate 12 are fully covered with a conductive layer 14. One side of the conductive layer 14 has an extension section 141 protruding towards the adjacent insulating fixing plate 1, and the extension section 141 forms a conductive contact with the conductive layer 14 of the adjacent insulating fixing plate 1. At least one set of insulating fixing plates 1 has a conductive layer 14 connected to a lead wire 2. Specifically, the length of the lead wire 2 is 0.5-1m, which ensures operational flexibility and facilitates connection to testing equipment, while avoiding the introduction of additional resistance or electromagnetic interference by excessively long wires, ensuring accurate test signals.
[0038] Specifically, the four sets of insulating fixing plates 1 form a continuous conductive loop through the conductive contact of their respective extensions 141, ensuring uniform distribution of the test current and avoiding undetected areas. The spring clips 13 are made of insulating material, which prevents current leakage during testing, ensuring safety. Their clamping force ensures that the conductive layers 14 on the inner sides of the upper fixing plate 11 and lower fixing plate 12 are tightly pressed against the component under test. The clamping force is controllable, ensuring close contact between the conductive layer 14 and the component under test, while avoiding excessive clamping force that could damage the BIPV component surface. Furthermore, the upper fixing plate 11 and lower fixing plate 12 are longer than 2m, adapting to common BIPV component sizes; their width is 5-20m, ensuring that they do not obstruct the component edges and affect testing, while also guaranteeing structural strength. The upper fixing plate 11 and lower fixing plate 12 are made of materials with a volume resistivity of 10... 7 ~10 16 A rigid insulating material with an Ω·m rating, preferably wood, tempered glass, or engineering plastic, is used to ensure insulation performance and prevent leakage or breakdown during testing.
[0039] The conductive layer 14 has a volume resistivity of 1 to 3 × 10^ -8 The conductive material has a resistance of Ω·m, ensuring that the conductive layer 14 has extremely low resistance, reducing energy loss during testing and improving testing accuracy; its thickness is 0.1-1mm, making it less prone to breakage and not affecting clamping flexibility, while balancing conductivity and mechanical strength. The conductive layer 14 is preferably a metal conductive film or conductive rubber.
[0040] The protruding length of the extension section 141 is 5-20mm, which ensures that the adjacent conductive layers 14 have sufficient contact area, reduces contact resistance, and improves the conductivity stability of the test circuit. In addition, the extension section 141 forms an overlapping contact with the conductive layer 14 of the adjacent insulating fixing plate 1, which avoids the conductive layer 14 from being broken due to splicing error of the insulating fixing plate 1, ensures the continuous transmission of test current, and improves test reliability.
[0041] Specific operating procedures: as follows Figure 4 As shown, four sets of insulating fixing plates 1 are spliced into a "well" shaped frame, ensuring that the extension section 141 of the conductive layer 14 tightly overlaps with the conductive layer 14 of the adjacent insulating fixing plate 1, forming a continuous conductive circuit; check whether the lead wire 2 is intact, and connect it to the high-voltage output terminal of the withstand voltage tester and the insulation resistance tester; clean the surface of the BIPV component 3 under test, ensuring that there is no dust, oil or water stains, to avoid affecting the contact of the conductive layer 14; place the BIPV component 3 under test flat or vertically (depending on the tooling installation method), adjust the tooling position so that the "well" shaped frame completely covers the edge of the BIPV component 3 under test, press the spring clip 13, so that the conductive layer 14 of the upper fixing plate 11 and the lower fixing plate 12 is tightly pressed against the surface of the BIPV component 3 under test, ensuring no gaps; connect the lead wire 2 to the high-voltage terminal of the withstand voltage tester and the insulation resistance tester. The metal frame or electrode of the BIPV module 3 under test is connected to the grounding terminals of the withstand voltage tester and the insulation resistance tester. If the BIPV module 3 under test has no frame, conductive foil needs to be attached to the back as a grounding electrode. Apply pressure and perform withstand voltage and insulation tests. After the test, reduce the voltage to zero, disconnect the two testers, loosen the spring clip 13 to remove the fixture, and check whether there are any signs of breakdown on the surface of the module.
[0042] Comparative example: A conventional component was subjected to a withstand voltage insulation test with copper foil attached around its perimeter.
[0043] The withstand voltage insulation performance of the 2378*1128*5mm BIPV module was tested according to the methods of Example 1 and the comparative example, and the results are shown in the table below:
[0044] Preparation time before test / min Copper foil usage / m Insulation resistance / Ω Insulation resistance / Ω Example 1 3 Reuse 30200 Comparative Example 30 7m 29990
[0045] Therefore, it can be seen that Embodiment 1, through its modular "well"-shaped frame structure and spring clip 13 for rapid fixation, reduces preparation time from 30 minutes to 3 minutes, making it suitable for batch testing on production lines; it eliminates the tedious step of manually pasting copper foil, and the conductive layer 14 automatically forms a closed loop; the amount of copper foil used is reduced from 7 meters per batch to near zero, significantly reducing costs; the insulation resistance results are basically consistent, meaning the contact resistance between the conductive layer 14 and the copper foil is equivalent, and the overlapping of the extension section 141 introduces additional resistance. Based on the above-described ideal embodiment of this utility model, and through the above description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A pressure test fixture for a BIPV assembly, characterized by: The structure comprises four sets of insulating fixing plates (1) spliced together to form a "well" shaped frame structure. Each set of insulating fixing plates (1) includes an upper fixing plate (11), a lower fixing plate (12), and a spring clip (13). The fixed end of the spring clip (13) is connected to the lower fixing plate (12), and its movable end is connected to the upper fixing plate (11) to control opening and closing. The inner surfaces of the upper fixing plate (11) and the lower fixing plate (12) are fully covered with a conductive layer (14). One side of the conductive layer (14) has an extension section (141) protruding towards the adjacent insulating fixing plate (1). The extension section (141) forms a conductive contact with the conductive layer (14) of the adjacent insulating fixing plate (1). At least one set of insulating fixing plates (1) has a conductive layer (14) connected to an outgoing wire (2).
2. The pressure test fixture for BIPV assembly according to claim 1, wherein: The protruding length of the extension section (141) is 5-20 mm, and the extension section (141) forms an overlapping contact with the conductive layer (14) of the adjacent insulating fixing plate (1).
3. The BIPV assembly's voltage withstand test fixture of claim 1, wherein: The length of the lead wire (2) is 0.5-1m.
4. The BIPV assembly's voltage withstand test fixture of claim 1, wherein: The conductive layer (14) is made of a conductive material with a volume resistivity of 1-3 x 10^ -8 Ω·m, and has a thickness of 0.1-1 mm.
5. The pressure withstand testing fixture for BIPV components according to claim 4, characterized in that: The conductive layer (14) is a metal conductive film or conductive rubber.
6. The BIPV assembly's voltage withstand test fixture of claim 1, wherein: The upper fixing plate (11) and the lower fixing plate (12) are longer than 2m and have a width of 5-20mm.
7. The pressure withstand testing fixture for BIPV components according to claim 1, characterized in that: The upper fixing plate (11) and the lower fixing plate (12) are made of a hard insulating material with a volume resistivity of 10 7 ~ 10 16 Ω.m.
8. The pressure withstand testing fixture for BIPV components according to claim 7, characterized in that: The rigid insulating material is wood, tempered glass, or engineering plastic.
9. The pressure withstand testing fixture for BIPV components according to claim 1, characterized in that: The four sets of insulating fixing plates (1) form a continuous conductive circuit through the conductive contact of their respective extensions (141).
10. The pressure withstand testing fixture for BIPV components according to claim 1, characterized in that: The spring clip (13) is made of insulating material, and its clamping force makes the conductive layer (14) on the inner side of the upper fixing plate (11) and the lower fixing plate (12) tightly press against the component under test.