A modular scalable data collector

Abstract

The utility model discloses a modularization expandable data collection ware belongs to environmental data collection technical field, solved the traditional data collection ware field maintenance efficiency low, the problem of poor expansion flexibility and poor environmental adaptability, including collection case, pluggable main control board subassembly, pluggable main control board subassembly includes double backboard zoning architecture, electromagnetic shield frame, battery, and main control board and battery are detachably installed in double backboard zoning architecture, and electromagnetic shield frame sets up between double backboard zoning architecture and the shell of collection case, double backboard zoning architecture includes upper backplate and lower backplate, in the utility model, pluggable main control board subassembly includes double backboard zoning architecture, and upper backplate can provide high density's I / O interface, and lower backplate constructs high -speed computing bus, and can easily expand to 128 way and above acquisition channel, and realizes the collaborative work of each component through the standardization bayonet, satisfies the deployment demand of large -scale ocean monitoring array.

Description

Technical Field

[0001] This utility model belongs to the field of environmental data acquisition technology, specifically relating to a modular and scalable data acquisition device. Background Technology

[0002] With the rapid development of industrial automation, environmental monitoring, and the Internet of Things (IoT), traditional data acquisition units, serving as hubs for sensors and digital systems, are increasingly revealing their bottlenecks. The fixed modular or integrated design of traditional data acquisition units makes channel expansion and functional upgrades exceptionally expensive: changes in demand often necessitate complete unit replacement or the purchase of new equipment, drastically increasing procurement costs and wasting significant resources. Furthermore, these devices typically offer only limited interfaces such as voltage, current, or thermocouples. When dealing with various heterogeneous sensors or wireless modules, additional adapters or dedicated acquisition cards are required, complicating the system architecture of traditional data acquisition units, increasing potential failure points, and significantly reducing compatibility and flexibility. Moreover, high-speed analog-to-digital converters and field-programmable gate arrays generate substantial heat under sustained high loads, and most older chassis rely on only a few heat sinks or natural convection, which is insufficient to handle internal heat buildup, easily leading to component aging. On-site installation and maintenance processes require professional engineers to disassemble and debug the unit; any hardware upgrade or troubleshooting necessitates system shutdown and reinstallation, severely extending maintenance cycles and increasing operational costs.

[0003] Currently, modular acquisition systems based on PC buses have inherent bottlenecks in real-time performance due to the trade-off between bus bandwidth and latency, especially in bus architectures where transmission delay and driver interrupt overhead are limiting factors. Portable recorders, while compact and with good cross-platform compatibility, are limited by insufficient USB bandwidth and real-time transmission performance, and their long grounding loops can easily cause electromagnetic interference, affecting measurement accuracy. Embedded DAQ devices, although able to reduce latency and improve stability through local preprocessing and hardware acceleration, still face bottlenecks in multi-channel synchronization, thermal management, and complex power rail design. Furthermore, high-density computing modules generate significant heat during continuous operation, which cannot be effectively dissipated through natural convection or limited heat sinks. The industry has stringent requirements for firmware and hardware lifecycle management of embedded controllers. Firmware upgrades and component replacements often require lengthy certification processes and service contracts for deployment, increasing the cost of technology iteration and maintenance. On-site installation and maintenance processes are cumbersome, requiring power-off disassembly, manual jumpering, DIP switch toggling, and reconfiguration of interrupt lines. Any hardware upgrade or troubleshooting will lead to system downtime and extend maintenance cycles. In high-energy physics, distributed monitoring, and other scenarios involving massive amounts of data, fixed architectures struggle to support local buffering and distributed processing, failing to meet the continuous reliability requirements of 24 / 7 operation. Furthermore, traditional integrated chassis lack effective secondary sealing and electromagnetic shielding designs, making them susceptible to external interference in high-humidity, high-dust, and high-vibration environments, severely impacting long-term system stability. To address the issues of low on-site maintenance efficiency, poor scalability, and limited environmental adaptability of traditional data acquisition units, we propose a modular and scalable data acquisition unit. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a modular and scalable data acquisition device that solves the problems of low on-site maintenance efficiency, poor expansion flexibility, and poor environmental adaptability of traditional data acquisition devices.

[0005] This utility model is implemented as follows: a modular and scalable data acquisition device, the modular and scalable data acquisition device comprising:

[0006] The data acquisition chassis has at least one set of push-button switches and a chassis rotary switch on the front side, at least one set of parallel interfaces for data acquisition devices on the rear side, and a visualization screen installed on the top of the data acquisition chassis.

[0007] A pluggable main control board assembly is located inside the data acquisition chassis, and the pluggable main control board assembly has a built-in pluggable main control board used to receive raw sensor data from the data acquisition board.

[0008] The pluggable main control board assembly includes a dual backplane partition architecture, an electromagnetic shielding frame, and a battery. The main control board and the battery are detachably installed in the dual backplane partition architecture. The electromagnetic shielding frame is located between the dual backplane partition architecture and the housing of the acquisition chassis. The electromagnetic shielding frame is used to provide electromagnetic shielding protection for the main control board. The dual backplane partition architecture includes an upper backplane and a lower backplane.

[0009] Preferably, the data acquisition chassis further includes:

[0010] At least one set of chassis grippers, wherein the chassis grippers are fixedly installed on the front side of the data acquisition chassis;

[0011] At least one set of anti-collision corners is provided at the end of the data acquisition chassis, and the anti-collision boundary is used to protect the data acquisition chassis and the safety of the operators;

[0012] At least one set of expandable cable ports, which are located on the front side of the acquisition chassis and are used to provide standardized interfaces for external modules or expansion boards.

[0013] The main power interface is installed on the side wall of the data acquisition chassis and is electrically connected to the battery.

[0014] The first heat dissipation vents are located on the left and right side walls of the data acquisition chassis;

[0015] The second heat dissipation vent is located on the rear side wall of the acquisition chassis, and the first and second heat dissipation vents are used to promote air convection and fan cooling inside the acquisition chassis.

[0016] Preferably, the visualization screen is detachably installed within the anti-corrosion alloy boundary, the anti-corrosion alloy boundary is fixedly connected to the top of the acquisition chassis, the visualization screen is electrically connected to the battery through the screen power interface, and the visualization screen is also bidirectionally connected to the main control board through the touch screen USB interface.

[0017] Preferably, the electromagnetic shielding frame is equipped with EMI conductive pads, which are used to form a grounding and shielding barrier for the main control board and data acquisition module, and to suppress electromagnetic interference. The electromagnetic shielding frame is provided with fixing slots and mounting grooves, which are used to accommodate the guide rails and clips for the internal wiring of the acquisition unit or the installation of modular boards.

[0018] Preferably, the upper back plate includes:

[0019] The first fixed interface board is fixedly installed inside the upper back plate;

[0020] The second fixed interface board is symmetrically arranged with the first fixed interface board and is fixedly installed inside the upper back plate. The second fixed interface board and the upper back plate are respectively provided with first screw fixing holes. At least one set of second screw fixing holes are respectively provided on the two side walls of the upper back plate. The first screw fixing holes and the second screw fixing holes are used to fix the upper back plate. The second fixed interface board is provided with at least one set of network interfaces, which are electrically connected to the main control board.

[0021] Preferably, the first fixed interface board is provided with a screen power interface, a touch screen USB interface, a control and communication interface, a data interface, a serial display bus, and a battery interface, and the screen power interface, touch screen USB interface, control and communication interface, data interface, serial display bus, and battery interface are electrically connected to the main control board.

[0022] Preferably, the lower back plate includes:

[0023] At least one set of fixed interface posts, which are fixedly installed inside the lower back plate and are used to connect to the upper back plate;

[0024] The battery placement area is located inside the lower back panel and is used to place the battery.

[0025] Preferably, the lower back plate further includes:

[0026] GPIO / Extension headers are used to bring out the GPIOs on the main control board to the headers;

[0027] An aluminum alloy shockproof shell is fixedly installed on the outer side wall of the lower back panel, and is used to protect the lower back panel.

[0028] Preferably, the network interface is a standard 8P8C connector, and the network interface supports a transmission rate of 10 / 100 / 1000Mbps.

[0029] Compared with the prior art, the embodiments of this application have the following main advantages:

[0030] In this embodiment of the invention, the modular and scalable data acquisition unit supports the second-level disassembly and replacement of the data acquisition board and edge computing board on the shipboard or buoy platform while powered on, significantly shortening offshore maintenance time and reducing downtime risks, and greatly improving the continuous availability and operational efficiency of the monitoring system. The built-in GPU acceleration unit and local high-speed storage can perform real-time preprocessing and deep learning inference on multi-source sensor data such as ocean temperature, salinity, and dissolved oxygen at the edge, quickly detecting and issuing early warnings of anomalies, minimizing data uplink latency, and thus enabling rapid response to changes in the marine environment.

[0031] In this invention, the pluggable main control board assembly includes a dual-backplane partitioned architecture. The upper backplane provides high-density I / O interfaces, while the lower backplane constructs a high-speed computing bus, easily expandable to 128 or more acquisition channels. Standardized bayonet mounts enable collaborative operation of all components, meeting the deployment requirements of large-scale marine monitoring arrays. IP67-rated secondary sealing and full-coverage electromagnetic shielding ensure stable and reliable operation even in high humidity, high salinity, and strong electromagnetic interference environments. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the modular and scalable data acquisition device provided by this utility model.

[0033] Figure 2 This is an isometric view of the modular and scalable data acquisition device provided by this utility model.

[0034] Figure 3 This is a schematic diagram of the structure of the visualization screen provided by this utility model.

[0035] Figure 4 This is a schematic diagram of the electromagnetic shielding frame provided by this utility model.

[0036] Figure 5 This is a schematic diagram of the structure of the upper back plate provided by this utility model.

[0037] Figure 6 This is an isometric view of the upper back plate provided by this utility model.

[0038] Figure 7 This is a schematic diagram of the structure of the lower back plate provided by this utility model.

[0039] In the diagram: 1-Chassis gripper, 2-Button switch, 3-Chassis rotary switch, 4-Visual screen, 5-Expandable cable port, 6-Anti-collision corner, 7-First heat dissipation vent, 8-Second heat dissipation vent, 9-Data acquisition parallel interface, 10-Main power interface, 11-Corrosion-resistant alloy boundary, 12-Fixing slot, 13-Mounting groove, 14-EMI conductive pad, 15-First screw fixing port, 16-Screw power interface, 17-Touchscreen USB interface, 18-Control and communication interface, 19-Data interface, 20-Serial display bus, 21-Battery interface, 22-First fixed interface board, 23-Network interface, 24-Second fixed interface board, 25-Second screw fixing port, 26-Fixing interface post, 27-Battery placement area, 28-GPIO / expansion header, 29-Aluminum alloy shockproof housing. Detailed Implementation

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0041] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0042] This utility model embodiment provides a modular and scalable data acquisition device, such as... Figures 1-2 As shown, the modular and scalable data acquisition device includes:

[0043] The data acquisition chassis has at least one set of push-button switches 2 and a chassis rotary switch 3 on the front side, at least one set of data acquisition parallel interfaces 9 on the rear side, and a visualization screen 4 installed on the top of the data acquisition chassis. The data acquisition parallel interfaces 9 are used to connect multiple sensors or data acquisition and edge analysis units in parallel to the same bus to achieve cascading expansion; each node can be distinguished by address or terminating resistor.

[0044] A pluggable main control board assembly is located inside the data acquisition chassis, and the pluggable main control board assembly has a built-in pluggable main control board used to receive raw sensor data from the data acquisition board.

[0045] It should be noted that the main control board integrates a GPU acceleration unit, a data acquisition and edge analysis unit, a module online hot-swap unit, an intelligent thermal management unit, and a power redundancy and automatic switching unit. The data acquisition and edge analysis unit is used to perform time-series alignment, noise reduction, and compression processing on raw sensor data, and can call locally deployed machine learning models to output real-time decision or alarm information, reducing core network bandwidth usage and accelerating response latency. The module online hot-swap unit is electrically connected to button switch 2. When maintenance personnel press button switch 2 on the front panel corresponding to the module, the module online hot-swap unit automatically isolates the power and data channels of the board and triggers a self-test program. After physical plugging and unplugging, the new board immediately completes self-test, driver loading, and communication initialization without requiring a complete shutdown or restart. The intelligent thermal management unit is used to continuously collect the temperature and load of each area, and adjust the dual-channel fan speed and guide vane angle based on a preset multi-variable control strategy to achieve dynamic temperature balance between the hot zone and the computing power zone, ensuring long-term stable operation. The power redundancy and automatic switching unit block monitors the voltage and current status of the two inputs. When the main power supply is abnormal (such as voltage fluctuation or power failure), the intelligent switching logic switches to the backup input within milliseconds and records the switching log and alarms to ensure zero interruption of online services.

[0046] It should be noted that the intelligent thermal management unit employs a partitioned redundant dual-airflow cooling system combined with adjustable air deflectors and intelligent fan speed control based on a multivariable PID algorithm to maintain thermal balance in high-load or high-temperature environments, ensuring the continuous and stable operation of ships or buoy platforms. Meanwhile, the modular and scalable data acquisition unit, through dual independent power inputs and an intelligent seamless switching module plus a UPS interface, can complete switching within seconds and record alarms in the event of battery mains power failure or power outage, further improving power supply reliability and safety.

[0047] The pluggable main control board assembly includes a dual-backplane partitioned architecture, an electromagnetic shielding frame, and a battery. The main control board and the battery are detachably installed within the dual-backplane partitioned architecture. The electromagnetic shielding frame is located between the dual-backplane partitioned architecture and the housing of the acquisition chassis. The electromagnetic shielding frame is used to provide electromagnetic shielding protection for the main control board. The dual-backplane partitioned architecture includes an upper backplane and a lower backplane. The dual-backplane partitioned architecture adopts an IP67-level secondary sealing and full-coverage electromagnetic shielding design.

[0048] In this embodiment of the invention, the modular and scalable data acquisition unit supports the second-level disassembly and replacement of the data acquisition board and edge computing board on the shipboard or buoy platform while powered on, significantly shortening offshore maintenance time and reducing downtime risks, and greatly improving the continuous availability and operational efficiency of the monitoring system. The built-in GPU acceleration unit and local high-speed storage can perform real-time preprocessing and deep learning inference on multi-source sensor data such as ocean temperature, salinity, and dissolved oxygen at the edge, quickly detecting and issuing early warnings of anomalies, minimizing data uplink latency, and thus enabling rapid response to changes in the marine environment.

[0049] Meanwhile, in this utility model, the pluggable main control board assembly includes a dual-backplane partitioned architecture. The upper backplane provides high-density I / O interfaces, while the lower backplane constructs a high-speed computing bus, which can be easily expanded to 128 or more acquisition channels. Standardized bayonet mounts enable collaborative operation of all components, meeting the deployment requirements of large-scale marine monitoring arrays. IP67-level secondary sealing and full-coverage electromagnetic shielding design ensure stable and reliable operation even in high humidity, high salt, and strong electromagnetic interference environments. Furthermore, the modular and scalable data acquisition unit provided in this utility model embodiment offers advantages such as high availability, ease of maintenance, scalability, and thermal optimization. High availability is achieved through modular redundancy design combined with intelligent monitoring, ensuring that single-point failures do not affect the overall system. Ease of maintenance is significantly reduced through hot-swapping and quick-release panels, greatly shortening on-site maintenance time. Scalability is achieved through the linear expansion of the lower backplane bus and pluggable board count as needed. Thermal optimization is achieved through dual-channel cooling and dynamic strategies, ensuring long-term thermal stability under high-density deployment.

[0050] In a further preferred embodiment of this utility model, such as Figure 1 As shown, the data acquisition chassis also includes:

[0051] At least one set of chassis grippers 1, wherein the chassis grippers 1 are fixedly installed on the front side of the data acquisition chassis;

[0052] At least one set of anti-collision corners 6, the anti-collision corners 6 are set at the end of the acquisition box, the anti-collision boundary is used to protect the acquisition box and the safety of the operator, and the anti-collision corners 6 can be equipped with anti-collision buffer devices to absorb impact energy, thereby protecting the box and the operator.

[0053] At least one set of expandable cable ports 5, the expandable cable ports 5 are located on the front side of the acquisition chassis, and the expandable cable ports 5 are used to provide standardized interfaces for external modules or expansion boards, thereby facilitating subsequent functional upgrades and modular design;

[0054] The main power interface 10 is installed on the side wall of the data acquisition chassis and is electrically connected to the battery. The main power interface 10 is used to provide stable and safe power to various electronic devices to ensure normal operation of the equipment.

[0055] The first heat dissipation vent 7 is located on the left and right side walls of the acquisition chassis;

[0056] The second heat dissipation vent 8 is located on the rear side wall of the acquisition chassis. The first heat dissipation vent 7 and the second heat dissipation vent 8 are used to promote air convection and fan cooling inside the acquisition chassis. The first heat dissipation vent 7 and the second heat dissipation vent 8 can be arranged in a matrix or in a ring. The shape of the first heat dissipation vent 7 and the second heat dissipation vent 8 can be a grille or a fan opening. The arrangement of the first heat dissipation vent 7 and the second heat dissipation vent 8 can prevent the components from overheating due to long-term stable operation.

[0057] In this embodiment, the chassis gripper 1 provides a convenient holding point for carrying and installing / removing the device. The design is sufficiently strong and ergonomic, ensuring balanced force and comfortable grip when carried with one or two hands. The push-button switch 2 is the most basic user input element, used to turn the circuit on / off or trigger specific commands. The push-button switch 2 can be normally open, normally closed, self-locking, or non-self-locking. The chassis rotary switch 3 consists of a rotating shaft and multiple contacts, allowing the acquisition chassis to be opened by rotation.

[0058] In a further preferred embodiment of this utility model, such as Figure 3 As shown, the visualization screen 4 is detachably installed inside the anti-corrosion alloy boundary 11, which is fixedly connected to the top of the acquisition chassis. The visualization screen 4 is electrically connected to the battery through the screen power interface 16, and it is also bidirectionally connected to the main control board through the touch screen USB interface 17. The visualization screen 4 can provide real-time data monitoring, status indication and interactive operation, and supports touch or button navigation, thus facilitating on-site or remote operation and maintenance.

[0059] In a further preferred embodiment of this utility model, such as Figure 4 As shown, an EMI conductive pad 14 is installed on the electromagnetic shielding frame. The EMI conductive pad 14 is used to form a grounding and shielding barrier for the main control board and data acquisition module, and to suppress electromagnetic interference. The electromagnetic shielding frame has a fixing groove 12 and a mounting groove 13. The fixing groove 12 and the mounting groove 13 are used to accommodate the guide rails and clips when the internal wiring of the acquisition unit or the modular board is installed.

[0060] In this embodiment, the EMI conductive pad 14 can be conductive foam or FoF pad. The fixing groove 12 and the mounting groove 13 can accommodate the guide rails and buckles when installing internal wiring or modular boards, thereby ensuring accurate positioning and convenient disassembly and assembly of each component.

[0061] In a further preferred embodiment of this utility model, such as Figures 5-6 As shown, the upper back plate includes:

[0062] The first fixed interface plate 22 is fixedly installed inside the upper back plate;

[0063] The second fixed interface board 24 is symmetrically arranged with the first fixed interface board 22 and is fixedly installed inside the upper back panel. The second fixed interface board 24 and the upper back panel are respectively provided with first screw fixing holes 15. At least one set of second screw fixing holes 25 are respectively provided on the two side walls of the upper back panel. The first screw fixing holes 15 and the second screw fixing holes 25 are used to fix the upper back panel. The second fixed interface board 24 is provided with at least one set of network interfaces 23. The network interfaces 23 are electrically connected to the main control board and are standard 8P8C connectors. The network interfaces 23 support a transmission rate of 10 / 100 / 1000Mbps.

[0064] It should be noted that the first fixed interface plate 22 and the second fixed interface plate 24 can be rectangular or "L" shaped structures. The first fixed interface plate 22 and the second fixed interface plate 24 can be fixedly installed on the upper and lower sides of the upper back plate by means of clips or screws. The first screw fixing port 15 and the second screw fixing port 25 can provide structural connection and support to ensure that the outer shell, guide rail, upper back plate, lower back plate, etc. are firmly assembled by standard screws.

[0065] In this embodiment, the first fixed interface board 22 is provided with a screen power interface 16, a touch screen USB interface 17, a control and communication interface 18, a data interface 19, a serial display bus 20, and a battery interface 21. These interfaces are electrically connected to the main control board. The screen power interface 16 provides power to the visual screen 4. The touch screen USB interface 17 is dedicated to bidirectional communication between the touch screen control signals and the main control board, enabling data transmission of touch points, gestures, etc. The control and communication interface 18 provides low-speed serial control with the PLC and MCU, suitable for configuration, debugging, and remote command scenarios. The data interface 19 is used for file storage, log export, or firmware upgrades, thereby simplifying the maintenance process. The serial display bus 20 is used for high-speed differential signals within the panel and to drive the LCD / TFT panel. The serial display bus 20 has high bandwidth and strong anti-interference capabilities. The battery interface 21 connects to an external lithium battery or lead-acid battery module for power outage recovery or field power supply, and usually requires a dedicated plug and BMS communication.

[0066] In a further preferred embodiment of this utility model, such as Figure 7 As shown, the lower back plate includes:

[0067] At least one set of fixed interface posts 26 are fixedly installed in the lower back plate and are used to connect to the upper back plate.

[0068] The battery placement area 27 is located inside the lower back panel. The battery placement area 27 is used to place the battery and provides a bracket or slot for external batteries to facilitate battery fixation, heat dissipation and safety protection.

[0069] GPIO / Extension header 28 is used to bring out the GPIO on the main control board to the header. The flexible software can be configured as input / output, and it can also be used for LED indication, key scanning, digital acquisition, etc.

[0070] An aluminum alloy shockproof shell 29 is fixedly installed on the outer side wall of the lower back panel and is used to protect the lower back panel.

[0071] In this embodiment, to comprehensively improve the on-site maintenance efficiency, expansion flexibility, and environmental adaptability of the data acquisition equipment, this utility model divides the system functional unit into several independently replaceable plug-in modules. Any faulty module can be replaced as needed without shutting down the system. After the module is inserted, the built-in automatic identification circuit reads the ID in real time and completes the address mapping, eliminating the need for manual DIP switch configuration, thus truly achieving "plug and play". Moreover, the modular and expandable data acquisition unit adopts an open unified architecture for its internal bus, allowing for flexible addition or removal of daughter cards and automatic loading of corresponding drivers on-site without the need for factory modification. The modular and expandable data acquisition unit's chassis combines a dedicated rubber sealing ring and a secondary sealing cavity design, and is equipped with a replaceable dust filter and a one-way exhaust valve at the air inlet, achieving IP67 or higher dustproof and waterproof capabilities. At the same time, the inner copper-aluminum composite electromagnetic shielding layer is continuously welded or tin-plated to meet electromagnetic compatibility requirements, significantly improving the system's reliability and stability in high humidity, high dust, and strong electromagnetic interference environments. This provides an efficient, maintainable, expandable, and environmentally adaptable data acquisition solution for industrial sites.

[0072] In summary, this utility model provides a modular and scalable data acquisition device. In its embodiments, the modular and scalable data acquisition device supports second-level disassembly and replacement of the data acquisition board and edge computing board on shipboard or buoy platforms while powered on, significantly shortening offshore maintenance time and reducing downtime risks, thereby greatly improving the continuous availability and operational efficiency of the monitoring system. The built-in GPU acceleration unit and local high-speed storage can perform real-time preprocessing and deep learning inference on multi-source sensor data such as ocean temperature, salinity, and dissolved oxygen at the edge, quickly detecting and issuing early warnings of anomalies, minimizing data uplink latency, and thus achieving rapid response to changes in the marine environment. It can also meet the continuous acquisition and analysis of massive amounts of data 24 / 7. When deployed in harsh environments, the lightweight, high-strength, and vibration-resistant modular design also brings superior reliability and maintenance convenience to the modular and scalable data acquisition device.

[0073] In this invention, the pluggable main control board assembly includes a dual-backplane partitioned architecture. The upper backplane provides high-density I / O interfaces, while the lower backplane constructs a high-speed computing bus, easily expandable to 128 or more acquisition channels. Standardized bayonet mounts enable collaborative operation of all components, meeting the deployment requirements of large-scale marine monitoring arrays. IP67-rated secondary sealing and full-coverage electromagnetic shielding ensure stable and reliable operation even in high humidity, high salinity, and strong electromagnetic interference environments.

[0074] It should be noted that, for the sake of simplicity, the foregoing embodiments are all described as a series of actions. However, those skilled in the art should understand that the present invention is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to the present invention. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0075] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.

Claims

1. A modular and scalable data acquisition device, the modular and scalable data acquisition device comprising: The data acquisition chassis has at least one set of push-button switches and a chassis rotary switch on the front side, characterized in that at least one set of parallel interfaces for data acquisition devices is provided on the rear side of the data acquisition chassis, and a visualization screen is installed on the top of the data acquisition chassis. A pluggable main control board assembly is located inside the data acquisition chassis, and the pluggable main control board assembly has a built-in pluggable main control board used to receive raw sensor data from the data acquisition board. The pluggable main control board assembly includes a dual backplane partition architecture, an electromagnetic shielding frame, and a battery. The main control board and the battery are detachably installed in the dual backplane partition architecture. The electromagnetic shielding frame is located between the dual backplane partition architecture and the housing of the acquisition chassis. The electromagnetic shielding frame is used to provide electromagnetic shielding protection for the main control board. The dual backplane partition architecture includes an upper backplane and a lower backplane.

2. The modular and scalable data acquisition device as described in claim 1, characterized in that: The data acquisition chassis also includes: At least one set of chassis grippers, wherein the chassis grippers are fixedly installed on the front side of the data acquisition chassis; At least one set of anti-collision corners is provided at the end of the data acquisition chassis, and the anti-collision boundary is used to protect the data acquisition chassis and the safety of the operators; At least one set of expandable cable ports, which are located on the front side of the acquisition chassis and are used to provide standardized interfaces for external modules or expansion boards. The main power interface is installed on the side wall of the data acquisition chassis and is electrically connected to the battery. The first heat dissipation vents are located on the left and right side walls of the data acquisition chassis; The second heat dissipation vent is located on the rear side wall of the acquisition chassis, and the first and second heat dissipation vents are used to promote air convection and fan cooling inside the acquisition chassis.

3. The modular and scalable data acquisition device as described in claim 1, characterized in that: The visualization screen is detachably installed within the anti-corrosion alloy boundary, which is fixedly connected to the top of the acquisition chassis. The visualization screen is electrically connected to the battery through the screen power interface, and it is also bidirectionally connected to the main control board through the touch screen USB interface.

4. The modular and scalable data acquisition device as described in claim 2, characterized in that: The electromagnetic shielding frame is equipped with EMI conductive pads, which are used to form a grounding and shielding barrier for the main control board and data acquisition module, and to suppress electromagnetic interference. The electromagnetic shielding frame has a fixing slot and a mounting groove, which are used to accommodate the guide rails and clips for the internal wiring of the acquisition unit or the installation of modular boards.

5. The modular and scalable data acquisition device as described in any one of claims 2-4, characterized in that: The upper back plate includes: The first fixed interface board is fixedly installed inside the upper back plate; The second fixed interface board is symmetrically arranged with the first fixed interface board and is fixedly installed inside the upper back plate. The second fixed interface board and the upper back plate are respectively provided with first screw fixing holes. At least one set of second screw fixing holes are respectively provided on the two side walls of the upper back plate. The first screw fixing holes and the second screw fixing holes are used to fix the upper back plate. The second fixed interface board is provided with at least one set of network interfaces, which are electrically connected to the main control board.

6. The modular and scalable data acquisition device as described in claim 5, characterized in that: The first fixed interface board is provided with a screen power interface, a touch screen USB interface, a control and communication interface, a data interface, a serial display bus, and a battery interface. The screen power interface, touch screen USB interface, control and communication interface, data interface, serial display bus, and battery interface are electrically connected to the main control board.

7. The modular and scalable data acquisition device as described in claim 6, characterized in that: The lower back plate includes: At least one set of fixed interface posts, which are fixedly installed inside the lower back plate and are used to connect to the upper back plate; The battery placement area is located inside the lower back panel and is used to place the battery.

8. The modular and scalable data acquisition device as described in claim 7, characterized in that: The lower back plate also includes: GPIO / Extension headers are used to bring out the GPIOs on the main control board to the headers; An aluminum alloy shockproof shell is fixedly installed on the outer side wall of the lower back panel, and is used to protect the lower back panel.

9. The modular and scalable data acquisition device as described in claim 6, characterized in that: The network interface is a standard 8P8C connector, and the network interface supports a transmission rate of 10 / 100 / 1000Mbps.

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