Photographic apparatus

Abstract

The present application provides a photographing device, which includes a housing, a heat dissipation bracket and a first circuit board assembly. The housing includes a housing accommodating space. The heat dissipation bracket is arranged in the housing accommodating space and includes a first part and a second part. The first part and the second part are detachably connected and jointly define a hollow part. The first circuit board assembly is arranged in the housing accommodating space, is connected to the heat dissipation bracket in a heat conduction manner, and is located in the hollow part of the heat dissipation bracket. The heat energy generated by the first circuit board assembly is conducted to the first part and the second part of the heat dissipation bracket.

Description

Technical Field

[0001] This case concerns photographic apparatus, particularly a photographic apparatus with high heat dissipation efficiency. Background Technology

[0002] With the rapid development of integrated circuits and sensing technology, modern photographic devices (such as industrial cameras) are trending towards higher resolution, higher frame rates, and miniaturization. To achieve better image quality and processing performance, photographic devices are generally equipped with high-performance image sensors, processors, and other high-speed computing components. These components generate heat during long-term or high-load operation.

[0003] Since photographic devices are typically handheld during shooting, and may even be in close contact with the human body (e.g., the hand) for extended periods, increased device temperature can cause discomfort to the user and degrade device performance. Furthermore, existing photographic devices are usually designed to be small, limiting the space available for internal heat dissipation structures and making it difficult to effectively improve heat dissipation efficiency.

[0004] To mitigate overheating, some traditional photographic equipment incorporates temperature sensors at high-heat-generating components to monitor temperature changes in real time. When the temperature of these components rises abnormally, a temperature regulation mechanism is triggered, such as activating an energy-saving mode or suspending certain functions to reduce system load. However, such mechanisms require additional temperature sensors and control systems, resulting in complex structures, increased costs, and no fundamental improvement in heat transfer efficiency.

[0005] In view of this, it is necessary to provide a photographic device with high heat dissipation efficiency to solve the problems faced by the existing technology. Utility Model Content

[0006] The purpose of this invention is to provide a photographic device that can improve heat dissipation, prevent localized high temperatures from forming on the part of the casing held by the user, reduce assembly difficulty, and reduce component damage during the manufacturing process.

[0007] To achieve the aforementioned objectives, this invention provides a photographic apparatus, comprising a housing, a heat sink bracket, and a first circuit board assembly. The housing includes a housing receiving space. The heat sink bracket is disposed within the housing receiving space and includes a first portion and a second portion. The first portion and the second portion are detachably connected and together define a hollow portion. The first circuit board assembly is disposed within the housing receiving space, thermally connected to the heat sink bracket, and located within the hollow portion of the heat sink bracket. Heat generated by the first circuit board assembly is conducted to the first portion and the second portion of the heat sink bracket.

[0008] In one embodiment of the present invention, the first part includes at least one first snap-fit ​​unit and a first thermally conductive connection part, wherein the second part includes at least one second snap-fit ​​unit and a second thermally conductive connection part, wherein the at least one second snap-fit ​​unit is detachably connected to the at least one first snap-fit ​​unit, such that the hollow part is formed between the first part and the second part, wherein the first thermally conductive connection part is thermally connected to the second thermally conductive connection part.

[0009] In one embodiment of the present invention, the at least one first snap-fit ​​unit of the first part includes a snap-fit ​​body, a snap-fit ​​opening, and a guide portion. The snap-fit ​​body includes a first surface and a second surface disposed opposite to each other, and the first surface is disposed inward. The snap-fit ​​opening penetrates the first surface and the second surface of the snap-fit ​​body and is configured to allow the at least one second snap-fit ​​unit to snap into it. The guide portion extends from one side of the snap-fit ​​body and includes a first guide surface. The first guide surface is connected to the first surface of the snap-fit ​​body, is not coplanar with the first surface of the snap-fit ​​body, and is inclined outward. When the first part is assembled with the second part, the first part moves toward the second part, and the at least one second snap-fit ​​unit of the second part abuts against the first guide surface of the guide portion and slides along the first guide surface to snap into the snap-fit ​​opening of the at least one first snap-fit ​​unit.

[0010] In one embodiment of the present invention, the first part of the heat dissipation bracket includes a first heat-conducting base plate, wherein the at least one first snap-fit ​​unit and the first heat-conducting connection part are respectively formed by extending vertically from the periphery of the first heat-conducting base plate.

[0011] In one embodiment of this utility model, the second part of the heat sink bracket includes:

[0012] A base; and

[0013] A second heat-conducting base plate is disposed on the base, wherein the second heat-conducting connection portion is formed by extending vertically from the periphery of the second heat-conducting base plate.

[0014] The at least one second snap-fit ​​unit extends from the base toward the second heat-conducting base plate and protrudes from the second heat-conducting base plate.

[0015] In one embodiment of the present invention, the second portion of the heat dissipation bracket includes an extension that extends from the periphery of the second heat-conducting base plate to the housing.

[0016] In one embodiment of the present invention, the housing includes a second cover, which is detachably disposed on the other side of the housing accommodating space. The second cover includes a connection port opening, wherein the connection port opening communicates with the housing accommodating space. The first circuit board assembly includes a connection port, which is correspondingly disposed at the connection port opening of the second cover.

[0017] In one embodiment of the present invention, the housing further includes an upper housing and a lower housing, and the photographic device includes:

[0018] A second circuit board assembly is disposed within the housing accommodating space, located between the heat sink bracket and the lower housing, and thermally connected to the heat sink bracket; and

[0019] A connection port carrier is disposed in the housing accommodating space and corresponds to the connection port of the first circuit board assembly, wherein the connection port carrier is thermally connected to the second cover.

[0020] At least a portion of the heat dissipation bracket extends between the connection port carrier and the connection port.

[0021] In one embodiment of the present invention, the housing includes a first cover, which is detachably disposed over one side of the housing accommodating space. The first cover includes:

[0022] A recess is recessed in the first cover and includes a bottom surface;

[0023] A receiving groove, recessed into the bottom surface of the recess; and

[0024] A cover opening extends through the receiving groove and connects the recess to the outside of the photographic device.

[0025] In one embodiment of this utility model, the photographic device includes:

[0026] A light-transmitting element is disposed in the receiving groove of the first cover and covers the opening of the cover;

[0027] A third circuit board assembly includes an optical sensor configured to capture optical images; and

[0028] A dustproof component is a hollow ring structure sandwiched between the light-transmitting element and the third circuit board assembly. The light-transmitting element, the third circuit board assembly, and the dustproof component together form a dustproof space, and the optical sensor is disposed corresponding to the dustproof space.

[0029] In one embodiment of the present invention, the third circuit board assembly includes a circuit board, and the optical sensor is disposed on the circuit board, wherein the dustproof component is sandwiched between the light-transmitting element and the circuit board of the third circuit board assembly to form the dustproof space, wherein the optical sensor is disposed in the dustproof space.

[0030] In one embodiment of the present invention, the optical sensor includes a top surface disposed relative to the circuit board, wherein the top surface includes a light-sensing area and a contact area, wherein the light-sensing area is configured to capture optical images, and the contact area is disposed around the light-sensing area, wherein the dustproof component is sandwiched between the light-transmitting element and the contact area of ​​the optical sensor to form the dustproof space, and the light-sensing area of ​​the optical sensor is disposed corresponding to the dustproof space. Attached Figure Description

[0031] Figure 1 This is a three-dimensional structural diagram of a photographic device according to an embodiment of this case;

[0032] Figure 2 for Figure 1 A three-dimensional structural diagram of the photographic device, in which the upper shell of the photographic device's housing is hidden;

[0033] Figure 3 for Figure 1 A schematic diagram of the exploded structure of the photographic device;

[0034] Figure 4A for Figure 1 An exploded view of the heat dissipation bracket of the photographic device;

[0035] Figure 4B for Figure 4A A three-dimensional structural diagram of the first part of the heat dissipation bracket of the photographic device;

[0036] Figure 5 for Figure 1 A three-dimensional structural diagram of the modular structure of the photographic device;

[0037] Figure 6 for Figure 5 A cross-sectional schematic diagram of the modular structure of the photographic device;

[0038] Figure 7 for Figure 5 A schematic diagram of the exploded structure of the modular design of the photographic device;

[0039] Figure 8 This is a cross-sectional schematic diagram of the modular structure of a photographic device in a variation of this case.

[0040] [Symbol Explanation]

[0041] 100: Photographic installation

[0042] 1: Shell

[0043] 10: Housing space

[0044] 11: Upper shell

[0045] 12: Lower shell

[0046] 13: First cover

[0047] 131: concave part

[0048] 131a: Bottom surface

[0049] 132: Receiving slot

[0050] 133: Opening of the lid

[0051] 134: Lens Cap

[0052] 14: Second cover

[0053] 141: Connection port opening

[0054] 101: Heat insulation sheet

[0055] 2: Heat dissipation bracket

[0056] 20: Hollow section

[0057] 21: Part One

[0058] 211: First snap-fit ​​unit

[0059] 211a: Snap-on body

[0060] 211b: Snap-on opening

[0061] 211c: Guidance Unit

[0062] 211d: First surface

[0063] 211e: Second surface

[0064] 211f: First guiding surface

[0065] 212: First thermally conductive connection part

[0066] 213: First heat-conducting base plate

[0067] 22: Part Two

[0068] 221: Second snap-fit ​​unit

[0069] 222: Second thermally conductive connection part

[0070] 223: Base

[0071] 224: Second heat-conducting base plate

[0072] 225: Extension

[0073] 3: First Circuit Board Assembly

[0074] 31: Connection Port

[0075] 41: First thermally conductive middle layer

[0076] 42: Second thermally conductive middle layer

[0077] 5: Second circuit board assembly

[0078] 6: Connecting port carrier

[0079] 7: Light-transmitting element

[0080] 8: Third Circuit Board Assembly

[0081] 81: Optical Sensor

[0082] 81a: Top surface

[0083] 81b: Light sensing area

[0084] 81c: Contact area

[0085] 82: Circuit board

[0086] 9: Dustproof parts

[0087] 90: Dustproof space Detailed Implementation

[0088] Some typical embodiments embodying the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and illustrations herein are for illustrative purposes only and not intended to limit this invention. For example, if the following description of this invention places a first feature on or above a second feature, it indicates that it includes embodiments where the first and second features are in direct contact, and also includes embodiments where additional features can be placed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, different embodiments in this invention may use repeated reference numerals and / or markings. These repeated reference numerals and / or markings are for simplification and clarity purposes and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Furthermore, to facilitate the description of the relationship between one component or feature in the accompanying drawings and another component(s) or feature(s), spatially related terms such as “below,” “under,” “lower,” “above,” “upper,” and similar terms may be used. In addition to the orientations shown in the accompanying drawings, spatially related terms are used to cover different orientations of the device in use or operation. The device may be positioned in other orientations (e.g., rotated 90 degrees or located in other orientations), and the spatially related terms used may be interpreted accordingly. When a component is referred to as being “connected” or “coupled” to another component, it may be directly connected to or coupled to the other component, or there may be an intervening component. Although the numerical ranges and parameters of the general scope of this application are approximate, the values ​​are stated as precisely as possible in specific examples. Furthermore, it is understood that while terms such as "first," "second," and "third" may be used in the claims to describe different components, these components should not be limited by these terms. The components described in the embodiments are represented by different component symbols. These terms are used to distinguish different components; for example, a first component may be referred to as a second component. Similarly, a second component may also be referred to as a first component without departing from the scope of the embodiments. The term "and / or" in the specification includes any or all combinations of one or more of the related listed items. The term "about" refers to an average value within a standard error range generally accepted by those skilled in the art.

[0089] Figure 1 This is a schematic diagram of the photographic apparatus according to one embodiment of this case. Figure 2 for Figure 1 A three-dimensional structural diagram of the photographic device, in which the upper shell of the photographic device is hidden. Figure 3 for Figure 1 A schematic diagram of the exploded structure of the photographic device, and Figure 4A for Figure 1An exploded view of the heat dissipation bracket of the photographic device. Figure 4B for Figure 4A A three-dimensional structural diagram of the first part of the heat dissipation bracket of the photographic device. (See diagram below.) Figures 1 to 4B As shown, in this embodiment, the photographic device 100 includes a housing 1, a heat dissipation bracket 2, and a first circuit board assembly 3. The housing 1 includes a housing receiving space 10. The heat dissipation bracket 2 is disposed in the housing receiving space 10 of the housing 1 and includes a first portion 21 and a second portion 22. The first portion 21 and the second portion 22 are detachably connected and together define a hollow portion 20. The first circuit board assembly 3 is disposed in the housing receiving space 10, thermally connected to the heat dissipation bracket 2, and located in the hollow portion 20 of the heat dissipation bracket 2. The first circuit board assembly 3 may include, for example, electronic components with high power or that easily generate high heat, and the heat generated is conducted to the first portion 21 and the second portion 22 of the heat dissipation bracket 2, and then to a specific location on the housing 1. By conducting the heat generated by the first circuit board assembly 3 to a specific location on the housing 1 through the heat dissipation bracket 2, heat dissipation efficiency is improved, and localized high temperatures are avoided at the location where the user holds the housing 1. Furthermore, since the first portion 21 and the second portion 22 of the heat dissipation bracket 2 are detachably snap-fitted together, assembly difficulty is reduced. In addition, since the first circuit board assembly 3 is disposed between the first part 21 and the second part 22 of the heat sink bracket 2 (i.e., the hollow part 20), the electronic components on the first circuit board assembly 3 are prevented from being exposed, thereby reducing component damage during the manufacturing process.

[0090] like Figure 3 and Figure 4A As shown, in this embodiment, the first part 21 of the heat dissipation bracket 2 includes at least one first snap-fit ​​unit 211 and a first thermally conductive connection part 212. The second part 22 of the heat dissipation bracket 2 includes at least one second snap-fit ​​unit 221 and a second thermally conductive connection part 222. The number of at least one first snap-fit ​​unit 211 and at least one second snap-fit ​​unit 221 in this embodiment corresponds, wherein four first snap-fit ​​units 211 and four second snap-fit ​​units 221 are preferred (e.g., four first snap-fit ​​units 211 and four second snap-fit ​​units 221). Figure 2 (As shown), but the number is not limited thereto. Each second snap-fit ​​unit 221 is detachably connected to the corresponding first snap-fit ​​unit 211, so that the hollow portion 20 is formed between the first portion 21 and the second portion 22. The first thermally conductive connection portion 212 of the first portion 21 is thermally connected to the second thermally conductive connection portion 222 of the second portion 22 to realize heat conduction between the first portion 21 and the second portion 22.

[0091] like Figures 2 to 4AAs shown, in this embodiment, at least one first latching unit 211 of the first portion 21 of the heat dissipation bracket 2 includes a latching body 211a, a latching opening 211b, and a guide portion 211c. The latching body 211a includes a first surface 211d and a second surface 211e disposed opposite to each other. The first surface 211d is disposed inward (towards the hollow portion 20), and the second surface 211e is disposed outward (away from the hollow portion 20). The latching opening 211b penetrates through the first surface 211d and the second surface 211e of the latching body 211a, and is configured to allow at least one second latching unit 221 to be latched therein. The guide portion 211c extends from one side of the latching body 211a and includes a first guide surface 211f. The first guide surface 211f is connected to the first surface 211d of the latching body 211a and is not coplanar with the first surface 211d of the latching body 211a. The first guide surface 211f is inclined outward (away from the hollow portion 20). When the first part 21 is assembled with the second part 22, the first part 21 moves toward the second part 22, causing at least one second snap-fit ​​unit 221 of the second part 22 to abut against the first guide surface 211f of the guide portion 211c. Thereafter, the first part 21 continues to move toward the second part 22, causing the second snap-fit ​​unit 221 to slide along the first guide surface 211f until it snaps into place with the snap-fit ​​opening 211b of the at least one first snap-fit ​​unit 211. The guide portion 211c reduces assembly difficulty and improves convenience.

[0092] like Figure 4A and Figure 4B As shown, in this embodiment, the first part 21 of the heat dissipation bracket 2 includes a first thermally conductive base plate 213. At least one first snap-fit ​​unit 211 and a first thermally conductive connection portion 212 are respectively formed by extending vertically from the periphery of the first thermally conductive base plate 213. By providing the first thermally conductive base plate 213, the thermally conductive area is increased, thereby improving the heat dissipation efficiency.

[0093] like Figure 4AAs shown, in this embodiment, the second part 22 of the heat dissipation bracket 2 includes a base 223 and a second heat-conducting base plate 224. The second heat-conducting base plate 224 is disposed on the base 223. The second heat-conducting connection portion 222 extends vertically from the periphery of the second heat-conducting base plate 224. At least one second snap-fit ​​unit 221 extends from the base 223 toward the second heat-conducting base plate 224 and protrudes from the second heat-conducting base plate 224. In other words, the plane of the free end of the at least one second snap-fit ​​unit 221 is higher than the surface of the second heat-conducting base plate 224. The provision of the second heat-conducting base plate 224 increases the heat-conducting area and improves the heat dissipation efficiency. In one embodiment, the base 223 and the second heat-conducting base plate 224 are made of different materials, such as aluminum or aluminum alloy for the base 223, and copper or copper alloy for the second heat-conducting base plate 224, but are not limited thereto. Since the base 223 of the second part 22 is made of a lower-cost material such as aluminum or aluminum alloy, the second part 22 does not need to be made entirely of a more expensive material (such as copper), thereby reducing costs and weight.

[0094] like Figure 2 , Figure 3 and Figure 4A As shown, in this embodiment, the imaging device 100 includes a first thermally conductive intermediate layer 41. The first thermally conductive intermediate layer 41 is disposed in the hollow portion 20 and is thermally connected between the first circuit board assembly 3 and the first thermally conductive base plate 213 of the heat dissipation bracket 2. The outline of the first thermally conductive intermediate layer 41 matches the outline of the first thermally conductive base plate 213, thereby increasing the thermally conductive area and improving heat dissipation efficiency. In one embodiment, the surface of the first thermally conductive intermediate layer 41 facing the first circuit board assembly 3 is a non-flush surface, and this surface matches the height of each electronic component on the upper surface of the first circuit board assembly 3, thereby making the first thermally conductive intermediate layer 41 tightly bonded to the first circuit board assembly 3, increasing the thermally conductive area and heat dissipation efficiency.

[0095] In this embodiment, the imaging device 100 includes a second thermally conductive intermediate layer 42. The second thermally conductive intermediate layer 42 is disposed in the hollow portion 20 and thermally connected between the first circuit board assembly 3 and the second thermally conductive base plate 224 of the heat dissipation bracket 2. The contour of the second thermally conductive intermediate layer 42 matches the contour of the second thermally conductive base plate 224, thereby increasing the thermally conductive area and improving heat dissipation efficiency. In one embodiment, the surface of the second thermally conductive intermediate layer 42 facing the first circuit board assembly 3 is a non-flush surface, and this surface matches the height of each electronic component on the lower surface of the first circuit board assembly 3, thereby ensuring a tight bond between the second thermally conductive intermediate layer 42 and the first circuit board assembly 3, increasing the thermally conductive area and heat dissipation efficiency.

[0096] like Figures 2 to 4BAs shown, in this embodiment, the second part 22 of the heat dissipation bracket 2 includes an extension 225. The extension 225 extends from the periphery of the second heat-conducting base plate 224 to the second cover 14 of the housing 1 (i.e., the aforementioned specific position of the housing 1), wherein the second cover 14 is a position that is not easily touched by the user when holding the photography device 100. By providing the extension 225, the heat generated by the first circuit board assembly 3 is conducted through the extension 225 to the position that is not easily touched by the user, thereby preventing the housing 1 from forming local high temperatures at the position held by the user, and improving the heat dissipation efficiency.

[0097] like Figures 1 to 3 As shown, in this embodiment, the housing 1 of the photographic device 100 includes an upper housing 11, a lower housing 12, a first cover 13, and a second cover 14. The lower housing 12 is detachably connected to the upper housing 11 and together with the upper housing 11 defines the housing accommodating space 10, a first opening (not shown), and a second opening (not shown). The first opening and the second opening are respectively connected to the housing accommodating space 10 and are arranged opposite to each other. The first cover 13 is detachably fitted onto one side of the housing accommodating space 10 and covers the first opening, and the second cover 14 is detachably fitted onto the other side of the housing accommodating space 10 and covers the second opening.

[0098] like Figure 2 and Figure 3 As shown, in this embodiment, the photographic device 100 includes a heat insulation sheet 101. The heat insulation sheet 101 is disposed in the housing accommodating space 10 and between the housing 1 and the heat dissipation bracket 2, serving to insulate against heat. The heat insulation sheet 101 is disposed between the first cover 13 of the housing 1 and the first portion 21 of the heat dissipation bracket 2, thereby isolating heat conduction between the first portion 21 of the heat dissipation bracket 2 and the first cover 13 of the housing 1, preventing localized high temperatures from forming on the housing 1 at the user's hand position (e.g., the first cover 13). In one embodiment, the heat insulation sheet 101 is made of, for example but not limited to, a plastic material.

[0099] like Figure 1 and Figure 2 As shown, in this embodiment, the second cover 14 includes a connection port opening 141. The connection port opening 141 communicates with the housing accommodating space 10. The first circuit board assembly 3 includes a connection port 31. The connection port 31 is correspondingly disposed in the connection port opening 141 of the second cover 14, configured to electrically connect to a connector to realize information and / or power transmission, and is thermally connected to the second cover 14. In one embodiment, the connection port 31 is, for example, but not limited to, an RJ45 connection port.

[0100] like Figure 2 and Figure 3As shown, in this embodiment, the imaging device 100 further includes a second circuit board assembly 5. The second circuit board assembly 5 is disposed in the housing accommodating space 10, located between the heat dissipation bracket 2 and the lower housing 12, and is thermally connected to the second portion 22 of the heat dissipation bracket 2. The heat generated by the second circuit board assembly 5 is conducted to the second cover 14 (i.e., a specific location) of the housing 1 through the second portion 22 of the heat dissipation bracket 2, thereby improving heat dissipation efficiency and preventing localized high temperatures from forming on the housing 1 at the user's hand position. In one embodiment, the second circuit board assembly 5 may include, for example but not limited to, relatively low-power electronic components.

[0101] like Figure 2 As shown, in this embodiment, the imaging device 100 further includes a connection port carrier 6. The connection port carrier 6 is disposed in the housing accommodating space 10 and corresponds to the connection port 31 of the first circuit board assembly 3. In this embodiment, at least a portion of the connection port carrier 6 is disposed in the second circuit board assembly 5, and at least a portion of the connection port carrier 6 is disposed in the lower housing 12, but this is not a limitation. The connection port carrier 6 is thermally connected to the second cover 14. At least a portion of the heat dissipation bracket 2 (e.g., extension 225) extends between the connection port carrier 6 and the connection port 31. Therefore, the heat generated by the first circuit board assembly 3 and the second circuit board assembly 5 is conducted to the heat dissipation bracket 2, and then conducted through the extension 225 to the connection port carrier 6 and the connection port 31. Finally, the heat is conducted from the connection port carrier 6 and the connection port 31 to the second cover 14. Through the above-mentioned heat conduction path, the heat generated by the first circuit board assembly 3 and the second circuit board assembly 5 is conducted to a specific location of the housing 1 (i.e., the second cover 14) to improve heat dissipation efficiency and prevent local high temperatures from forming in the position where the housing 1 is held by the user.

[0102] Figure 5 for Figure 1 A three-dimensional structural diagram of the modular structure of the photographic device. Figure 6 for Figure 5 A cross-sectional schematic diagram of the modular structure of the photographic device. Figure 7 for Figure 5 An exploded view of the modular structure of the photographic device. (See diagram below.) Figures 5 to 7 As shown, in this embodiment, the housing 1 (such as...) Figure 2 The first cover 13 (as shown) includes a recess 131, a receiving groove 132, and a cover opening 133. The recess 131 is recessed in the first cover 13 and includes a bottom surface 131a. The receiving groove 132 is recessed in the bottom surface 131a of the recess 131. The cover opening 133 extends through the receiving groove 132 and communicates with the photographic device 100 (as shown) through the recess 131. Figure 3 (As shown) External. In this embodiment, the photographic device 100 (such as...) Figure 3The first cover 13 (shown) includes a light-transmitting element 7, a third circuit board assembly 8, and a dustproof component 9. The light-transmitting element 7 is disposed in the receiving groove 132 of the first cover 13 and covers the cover opening 133. The third circuit board assembly 8 includes an optical sensor 81. The optical sensor 81 is configured to capture optical images. The dustproof component 9 is a hollow annular structure and is sandwiched between the light-transmitting element 7 and the third circuit board assembly 8. The light-transmitting element 7, the third circuit board assembly 8, and the dustproof component 9 together form a dustproof space 90, and the optical sensor 81 is disposed corresponding to the dustproof space 90. By setting the dustproof space 90, the influence of dust or moisture on the optical image capturing operation of the optical sensor 81 is reduced, thereby improving the image capturing quality. In this embodiment, the first cover 13 includes a lens cover 134, which covers the opposite side of the recess 131 to prevent foreign objects from entering the first cover 13.

[0103] In one embodiment, the first cover 13, the light-transmitting element 7, the third circuit board assembly 8, and the dustproof component 9 are constructed as a modular structure to improve the convenience of component assembly and replacement. Furthermore, the photographic device 100 (such as...) Figure 3 (As shown) Only the components of the above modular structure must be assembled in a cleanroom, thereby reducing cleanroom installation costs and improving production efficiency.

[0104] like Figure 6 As shown, in this embodiment, the third circuit board assembly 8 includes a circuit board 82. An optical sensor 81 is disposed on the circuit board 82. A dustproof component 9 is sandwiched between the light-transmitting element 7 and the circuit board 82 of the third circuit board assembly 8 to form a dustproof space 90. The optical sensor 81 is housed in the dustproof space 90, thereby reducing the impact of dust or moisture on the optical image capturing operation of the optical sensor 81 and improving the quality of image capturing. In this embodiment, the dustproof component 9 is, for example, but not limited to, a rubber ring.

[0105] Figure 8 This is a cross-sectional structural diagram of the modular structure of a photographic device in a variation of this case. For example... Figure 8As shown, in this variation, the optical sensor 81 of the third circuit board assembly 8 includes a top surface 81a. The top surface 81a is disposed relative to the circuit board 82. The top surface 81a includes a light-sensing area 81b and a contact area 81c. The light-sensing area 81b is configured to capture optical images. The contact area 81c is disposed around the light-sensing area 81b. A dustproof member 9 is sandwiched between the inner surface of the light-transmitting element 7 and the contact area 81c of the optical sensor 81 to form a dustproof space 90, and the light-sensing area 81b of the optical sensor 81 is disposed corresponding to the dustproof space 90. By having the light-sensing area 81b of the optical sensor 81 disposed corresponding to the dustproof space 90, the influence of dust or moisture on the optical image capturing operation of the light-sensing area 81b of the optical sensor 81 is reduced, thereby improving the quality of image capture. In this embodiment, the dustproof member 9 is, for example, but not limited to, a compressible ring-shaped sponge structure.

[0106] In summary, this invention provides a photographic device that uses a heat dissipation bracket to conduct heat generated by the first circuit board assembly to a specific location on the housing, thereby improving heat dissipation efficiency and preventing localized high temperatures from forming on the housing where the user holds it. Furthermore, the detachable assembly of the first and second parts of the heat dissipation bracket reduces assembly difficulty. Additionally, the placement of the first circuit board assembly between the first and second parts of the heat dissipation bracket prevents exposure of electronic components on the first circuit board assembly, reducing component damage during manufacturing. Moreover, the dustproof space reduces the impact of dust or moisture on the optical sensor's optical image capture operation, thus improving image capture quality.

[0107] This case may be modified in various ways by those skilled in the art, but all modifications shall not fall outside the scope of protection sought by the appended claims.

Claims

1. A photographic device, characterized in that, Include: A housing, comprising a housing accommodating space; A heat dissipation bracket is disposed in the housing accommodating space and includes a first part and a second part, wherein the first part and the second part are detachably assembled and together define a hollow portion; as well as A first circuit board assembly is disposed in the housing accommodating space, is thermally connected to the heat dissipation bracket, and is located in the hollow part of the heat dissipation bracket, wherein the heat generated by the first circuit board assembly is conducted to the first part and the second part of the heat dissipation bracket.

2. The photographic apparatus as claimed in claim 1, characterized in that, The first part includes at least one first snap-fit ​​unit and a first thermally conductive connection portion, wherein the second part includes at least one second snap-fit ​​unit and a second thermally conductive connection portion, wherein the at least one second snap-fit ​​unit is detachably connected to the at least one first snap-fit ​​unit, such that the hollow portion is formed between the first part and the second part, wherein the first thermally conductive connection portion is thermally connected to the second thermally conductive connection portion.

3. The photographic apparatus as claimed in claim 2, characterized in that, The first part of the at least one first latching unit includes a latching body, a latching opening, and a guide portion. The latching body includes a first surface and a second surface disposed opposite to each other, with the first surface facing inward. The latching opening penetrates the first surface and the second surface of the latching body and is configured to allow the at least one second latching unit to latch therein. The guide portion extends from one side of the latching body and includes a first guide surface. The first guide surface is connected to the first surface of the latching body, is not coplanar with the first surface of the latching body, and is inclined outward. When the first part is assembled with the second part, the first part moves toward the second part, and the at least one second latching unit of the second part abuts against the first guide surface of the guide portion and slides along the first guide surface to latch into the latching opening of the at least one first latching unit.

4. The photographic apparatus as claimed in claim 2, characterized in that, The first part of the heat dissipation bracket includes a first thermally conductive base plate, wherein the at least one first snap-fit ​​unit and the first thermally conductive connection part are respectively formed by extending vertically from the periphery of the first thermally conductive base plate.

5. The photographic apparatus as claimed in claim 4, characterized in that, The second part of the heat sink bracket includes: A base; and A second heat-conducting base plate is disposed on the base, wherein the second heat-conducting connection portion is formed by extending vertically from the periphery of the second heat-conducting base plate. The at least one second snap-fit ​​unit extends from the base toward the second heat-conducting base plate and protrudes from the second heat-conducting base plate.

6. The photographic apparatus as claimed in claim 5, characterized in that, The second portion of the heat sink includes an extension that extends from the periphery of the second heat-conducting base plate to the housing.

7. The photographic apparatus as claimed in claim 1, characterized in that, The housing includes a second cover that is detachably mounted on the other side of the housing accommodating space. The second cover includes a connection port opening that communicates with the housing accommodating space. The first circuit board assembly includes a connection port that is correspondingly located at the connection port opening of the second cover.

8. The photographic apparatus as claimed in claim 7, characterized in that, The housing also includes an upper housing and a lower housing, and the photographic device includes: A second circuit board assembly is disposed within the housing accommodating space, located between the heat sink bracket and the lower housing, and thermally connected to the heat sink bracket; and A connection port carrier is disposed in the housing accommodating space and corresponds to the connection port of the first circuit board assembly, wherein the connection port carrier is thermally connected to the second cover. At least a portion of the heat dissipation bracket extends between the connection port carrier and the connection port.

9. The photographic apparatus as claimed in claim 1, characterized in that, The housing includes a first cover that is detachably fitted over one side of the housing's accommodating space, the first cover comprising: A recess is recessed in the first cover and includes a bottom surface; A receiving groove, recessed into the bottom surface of the recess; and A cover opening extends through the receiving groove and connects the recess to the outside of the photographic device.

10. The photographic apparatus as claimed in claim 9, characterized in that, The photographic device includes: A light-transmitting element is disposed in the receiving groove of the first cover and covers the opening of the cover; A third circuit board assembly includes an optical sensor configured to capture optical images; and A dustproof component is a hollow ring structure sandwiched between the light-transmitting element and the third circuit board assembly. The light-transmitting element, the third circuit board assembly, and the dustproof component together form a dustproof space, and the optical sensor is disposed corresponding to the dustproof space.

11. The photographic apparatus as claimed in claim 10, characterized in that, The third circuit board assembly includes a circuit board, and the optical sensor is disposed on the circuit board. The dustproof component is sandwiched between the light-transmitting element and the circuit board of the third circuit board assembly to form the dustproof space, wherein the optical sensor is disposed in the dustproof space.

12. The photographic apparatus as claimed in claim 11, characterized in that, The optical sensor includes a top surface disposed relative to the circuit board, wherein the top surface includes a light-sensing area and a contact area, wherein the light-sensing area is configured to capture optical images, and the contact area is disposed around the light-sensing area, wherein a dustproof component is sandwiched between the light-transmitting element and the contact area of ​​the optical sensor to form the dustproof space, and the light-sensing area of ​​the optical sensor is disposed corresponding to the dustproof space.

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