MEMS heat dissipation device and mobile device

Abstract

The utility model provides a kind of MEMS heat dissipation device, including MEMS sound and heat dissipation chip, microchannel radiator of being attached to MEMS sound and heat dissipation chip, the size of gas passage of microchannel radiator is micrometer level, and the heat dissipation surface of microchannel radiator is used to attach in the surface of heat source.The utility model also provides corresponding mobile device.The utility model utilizes the high back pressure, low power consumption and miniaturization characteristics of MEMS heat dissipation chip, solves the problem that performance reduction and user experience difference caused by high-performance component heating under the extremely limited environment of space, power consumption and noise of mobile device;And the utility model integrates heat dissipation function and acoustic function in single MEMS device, to realize the multiplexing of device function and the further optimization of equipment space.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology for electronic devices, specifically relating to a heat dissipation device based on microelectromechanical systems (MEMS) technology and corresponding mobile devices (such as smartphones and tablets). Background Technology

[0002] Modern mobile devices, such as smartphones and tablets, are evolving towards thinner, lighter, and higher-performance designs. Their core components, such as system-on-a-chip (SoC) and 5G communication modules, generate significant heat when performing high-load tasks (e.g., high-definition video playback, demanding games, high-speed data transmission). However, the increasing pursuit of ultra-thin designs and the highly sealed structures used to meet IP protection standards (e.g., water and dust resistance) pose serious challenges to traditional heat dissipation solutions.

[0003] The main heat dissipation methods commonly used in mobile devices currently include:

[0004] 1. Passive heat dissipation: mainly relies on materials such as VC vapor chambers and graphite heat sinks to conduct heat from the heat source to the equipment casing, and then dissipate heat through natural convection and radiation with the external environment through the casing.

[0005] The drawback of this technology is:

[0006] 1. Limited heat dissipation efficiency: Due to the limited internal space and highly sealed design, direct heat exchange with the cold external air is restricted. Relying solely on passive heat dissipation from the casing, its heat dissipation efficiency is insufficient to cope with the continuous heat generation of high-power components. This bottleneck becomes even more pronounced when the ambient temperature is high or the equipment is running under high load for extended periods.

[0007] 2. Increased surface temperature: A large amount of internal heat accumulates and is conducted to the outer shell, which will cause the surface temperature of the device to be too high, affecting the user's grip experience (the surface is too hot to touch).

[0008] 3. Performance limitations (frequency reduction): To prevent core components from overheating and being damaged, devices usually adopt a frequency reduction strategy, sacrificing performance to reduce heat generation, which directly affects the user experience.

[0009] II. Traditional active cooling (micro fans): Although it has been tried in some mobile devices or gaming phones that pursue ultimate performance, the application of conventional micro fans in ordinary mobile phones / tablets is very rare.

[0010] The drawback of this technology is:

[0011] 1. Size and noise: Traditional miniature fans are relatively large and difficult to integrate into the compact space of ordinary mobile phones and tablets. At the same time, their operating noise is also difficult to meet the requirements of mobile devices for quiet operation.

[0012] 2. Insufficient back pressure: Even micro fans generate relatively low air pressure (back pressure). To achieve effective forced air cooling inside mobile devices, it is necessary to overcome the resistance of narrow air ducts and possible dustproof structures. Low back pressure fans cannot drive sufficient airflow.

[0013] 3. Power consumption and reliability: The power consumption of the fan is a burden for mobile devices with limited battery capacity, and the reliability and lifespan of the mechanical rotating parts are also issues that need to be considered.

[0014] 4. Sealing conflict: Introducing a fan requires opening air inlets and outlets, which contradicts the increasingly high IP protection rating (waterproof and dustproof) that mobile devices are pursuing.

[0015] Furthermore, existing technologies still fall short in balancing the requirements of thinness, high performance, low power consumption, low noise, and good heat dissipation in mobile devices. Given the limited internal space of mobile devices, various functional modules compete for limited volume. Integrating components with different functions would greatly optimize the internal layout of the device.

[0016] Therefore, there is an urgent need for a new technology solution that can achieve efficient, low-power, and low-noise active heat dissipation in the extremely constrained internal environment of mobile devices, and can be integrated with existing functional devices to further save valuable internal space. Utility Model Content

[0017] The purpose of this invention is to provide a MEMS heat dissipation device and a mobile device to solve the problem of insufficient heat dissipation of high-performance components inside mobile devices due to insufficient space.

[0018] To achieve the above objectives, this utility model provides a MEMS heat dissipation device, including a MEMS sound and heat dissipation chip and a microchannel heat sink attached to the MEMS sound and heat dissipation chip. The gas channel of the microchannel heat sink has a size of micrometers, and the heat dissipation surface of the microchannel heat sink is used to be attached to the surface of the heat source.

[0019] The MEMS sound and heat dissipation chip is a single MEMS device, including a heat dissipation functional area and an acoustic functional area. The specific structures of the heat dissipation functional area and the acoustic functional area are consistent with those of the MEMS heat dissipation chip and the MEMS sound chip, respectively.

[0020] The MEMS sound and heat dissipation chip has two independent electric drive interfaces corresponding to the heat dissipation functional area and the acoustic functional area, which are connected to the drive chip through the electric drive interfaces.

[0021] The MEMS sound and heat dissipation chip can be switched between heat dissipation mode, acoustic mode, acoustic-thermal hybrid mode and off state; in heat dissipation mode, the driving chip only provides driving signals to the heat dissipation functional area; in acoustic mode, the driving chip only provides driving signals to the acoustic functional area; in acoustic-thermal hybrid mode, the driving chip simultaneously provides independent driving signals to the heat dissipation functional area and the acoustic functional area.

[0022] Each MEMS sound and heat dissipation chip has a ventilation port for the heat dissipation functional area and a sound emission port for the acoustic functional area arranged adjacent to each other on its side.

[0023] The heat source is a chip on the circuit board; the MEMS sound and heat dissipation chip and the microchannel heat sink are in one group and located on the same side of the circuit board, or in two groups and located on both sides of the circuit board; for one group of MEMS sound and heat dissipation chip and microchannel heat sink, the number of microchannel heat sink is one, and the number of MEMS sound and heat dissipation chip is one or two.

[0024] For a set of MEMS sound and heat dissipation chips and microchannel heat sinks, there is one microchannel heat sink and two MEMS sound and heat dissipation chips, which are respectively attached to the two sides of the MEMS sound and heat dissipation chips; and the microchannel heat sink includes a gas channel, the channel wall of which is parallel to the connecting axis of the two ends where the MEMS sound and heat dissipation chips are located.

[0025] The microchannel heat sink has a highly thermally conductive material on its heat dissipation surface in contact with the heat source.

[0026] On the other hand, this utility model provides a mobile device, including a MEMS heat dissipation device, a SoC chip and a driver chip as described above, wherein the heat dissipation surface of the microchannel heat sink of the MEMS heat dissipation device is attached to the surface of the SoC chip and the MEMS sound and heat dissipation chip of the MEMS heat dissipation device are connected to the driver chip.

[0027] Each MEMS sound and heat dissipation chip has a ventilation port for the heat dissipation functional area and a sound-emitting hole for the acoustic functional area arranged adjacently on its side; the mobile device also includes a housing, and the housing of the mobile device has ventilation and sound-emitting holes corresponding to the ventilation ports and sound-emitting holes of the MEMS sound and heat dissipation chips.

[0028] This invention utilizes the high back pressure, low power consumption, and miniaturization characteristics of MEMS heat dissipation chips to solve the problems of performance throttling and poor user experience (hot surface) caused by heat generation from high-performance components (such as SoCs and 5G modules) in mobile devices operating under extremely limited space, power consumption, and noise conditions. Furthermore, it overcomes the challenge of traditional micro-fans being difficult to apply to active cooling in mainstream mobile devices due to their size, noise, power consumption, low back pressure, and incompatibility with device sealing. It also addresses how to effectively utilize the high heat transfer potential of microchannel heat sinks while overcoming their high flow resistance to achieve efficient forced convection cooling in mobile devices. In addition, this invention integrates MEMS heat dissipation and acoustic functions (such as speakers) into a single MEMS device, achieving functional reuse and further optimizing device space. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a MEMS heat dissipation device for a mobile device according to an embodiment of the present invention.

[0030] Figure 2 This is a connection block diagram of a mobile device according to an embodiment of the present invention. Detailed Implementation

[0031] The present invention will be further described below with reference to specific embodiments. It should be understood that the following embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0032] like Figure 1 The image shows a MEMS heat dissipation device according to a first embodiment of the present invention, which is used to provide efficient active heat dissipation for the SoC chip (system-on-a-chip) of electronic devices (such as mobile devices) and to exchange heat using external air.

[0033] The MEMS heat dissipation device includes a MEMS sound and heat dissipation chip 10 (i.e., the airflow generating part) and a microchannel heat sink 20. The bottom surface of the microchannel heat sink 20 is attached to the top surface of the MEMS sound and heat dissipation chip 10, and the bottom surface of the microchannel heat sink 20 serves as a heat dissipation surface attached above the surface of the heat source. In this embodiment, the heat source is a chip on the circuit board 50 of the electronic device, particularly a SoC chip 60.

[0034] In this embodiment, there is one microchannel heat sink 20 and two MEMS sound and heat dissipation chips 10, which are respectively attached to the two sides of the MEMS sound and heat dissipation chip 10, thus forming a set of MEMS sound and heat dissipation chips 10 and microchannel heat sink 20 located on the same side of the circuit board. Therefore, the MEMS heat dissipation chips at both ends are activated simultaneously, forming a push-pull or end-to-end driven airflow system, generating forced airflow. When one of the microchannel heat sinks 20 acts as the air inlet, the other must act as the air outlet.

[0035] In other embodiments, the MEMS sound and heat dissipation chip 10 and the microchannel heat sink 20 can be in two sets, with the two sets of MEMS sound and heat dissipation chips 10 and microchannel heat sink 20 located on opposite sides of the circuit board. For one set of MEMS sound and heat dissipation chips 10 and microchannel heat sink 20, the number of microchannel heat sink 20 is one, and the number of MEMS sound and heat dissipation chips 10 is one or two.

[0036] The MEMS sound and heat dissipation chip 10 is a single MEMS device capable of performing both sound and heat dissipation functions. Specifically, this invention improves the structure of existing MEMS heat dissipation chips to obtain the MEMS sound and heat dissipation chip 10, which includes a heat dissipation functional area and an acoustic functional area. Both the heat dissipation and acoustic functional areas are arrays of microdiaphragms / MEMS microstructures, and both employ the same fabrication process. Both the heat dissipation and acoustic functional areas utilize driving signals to drive the MEMS microstructures to vibrate at high speeds (typically in the ultrasonic frequency range) to achieve their functions. However, the heat dissipation functional area is used to generate heat dissipation airflow, while the acoustic functional area is used to generate sound waves. The specific structures of the heat dissipation and acoustic functional areas are consistent with those of currently available MEMS heat dissipation chips and MEMS sound chips. The heat dissipation chip has a very high back pressure (reaching over 1000 Pa) and very low power (typically in the tens of milliwatts). Furthermore, the heat dissipation chip itself is dustproof and waterproof, and can switch between blowing and suction modes via control signals.

[0037] In other words, although the heat dissipation and acoustic functional areas are integrated on the same chip, their internal microstructures are independently optimized for their respective functions, and the MEMS sound and heat dissipation chip 10 has two independent electrical drive interfaces corresponding to the heat dissipation functional area and the acoustic functional area, respectively. Therefore, the heat dissipation and acoustic functional areas of the MEMS sound and heat dissipation chip 10 are connected to the drive chip through the electrical drive interface. By selectively applying corresponding drive signals to the heat dissipation and acoustic functional areas through the drive chip, the MEMS device can achieve efficient heat dissipation or high-fidelity acoustic output, or achieve collaborative operation under a specific control strategy.

[0038] Therefore, the MEMS sound and heat dissipation chip 10 can be switched between heat dissipation mode, acoustic mode, acoustic-thermal hybrid mode and off state.

[0039] In heat dissipation mode, the driver chip only provides a drive signal to the heat dissipation functional area of ​​the MEMS sound and heat dissipation chip 10 to drive the heat dissipation functional area to generate a directional heat dissipation airflow for heat dissipation. The drive signal provided to the heat dissipation functional area is usually a high-frequency, high-power single-frequency sine wave or square wave.

[0040] In acoustic mode, the driving chip only provides driving signals to the acoustic functional area of ​​the MEMS sound and heat dissipation chip 10 to drive the acoustic functional area to generate sound waves for transmitting sound information. The driving signals provided to the acoustic functional area are usually complex waveforms modulated by audio data (such as modulated ultrasonic carrier waves).

[0041] In the acoustic-thermal hybrid mode, the driving chip simultaneously provides independent driving signals to the heat dissipation functional area and the acoustic functional area of ​​the MEMS sound and heat dissipation chip 10, so as to drive the heat dissipation functional area to generate heat dissipation airflow and the acoustic functional area to generate sound waves for transmitting sound information.

[0042] The microchannel heat sink 20 includes gas channels and heat dissipation fins.

[0043] The gas channel wall needs to be parallel to the connecting axis between the two ends of the MEMS sound and heat dissipation chip 10, forming a straight through-type gas channel from one end of the MEMS sound and heat dissipation chip 10 to the other end. Heat dissipation fins are set on the inner wall surface of the gas channel, extending upwards perpendicular to the surface of the heat source, but the length extension direction of the heat dissipation fins is consistent with the extension direction of the gas channel. The internal structure of the microchannel heat sink needs to meet the following requirements: ① All parallel microchannels should be as consistent in geometric dimensions as possible (width, depth, length). Significant dimensional deviations will cause the flow resistance of this channel to differ from other channels, thus affecting flow distribution; ② Control the cross-sectional dimensions (width × depth) and total length of the microchannels to avoid excessive pressure drop leading to insufficient airflow at the far end. The heat dissipation fins are made of materials similar to those used in traditional laptops and other mobile devices, using thermally conductive materials such as copper.

[0044] In this embodiment, the microchannel heat sink 20 has a highly thermally conductive material (such as a VC vapor chamber) on its heat dissipation surface in contact with the heat source, directly contacting the heat source to improve heat conduction efficiency. The length of the microchannel heat sink 20 is equal to the length of the VC vapor chamber 80 plus the length of the microchannel heat sinks 20 on both sides, and the size of the heat source is smaller than the size of the VC vapor chamber 80. Therefore, the heat generated by the SoC chip 60 is first quickly absorbed and evenly distributed by the adjacent VC vapor chamber, achieving heat transfer. Subsequently, the heat is efficiently conducted from the VC vapor chamber to the fins and channel walls of the upper microchannel layer.

[0045] In this embodiment, each MEMS sound and heat dissipation chip 10 has a ventilation opening for an adjacent heat dissipation functional area and a sound-emitting hole for an acoustic functional area on its side. A dustproof mesh 30 is provided at the ventilation opening of the MEMS sound and heat dissipation chip 10, and the housing of the mobile device has ventilation and sound-emitting holes corresponding to the ventilation opening and sound-emitting hole of the MEMS sound and heat dissipation chip 10. The dustproof mesh 30 is preferably a waterproof and breathable membrane. The ventilation and sound-emitting holes have the functions of sound generation and ventilation, thereby saving space.

[0046] In this embodiment, the MEMS sound and heat dissipation chip 10 is fixed to the circuit board 50 by a padding material 40. The MEMS sound and heat dissipation chip 10 is also connected to the power supply and drive circuit of the circuit board 50 by means of ribbon cables or flying wires.

[0047] The working principle of the MEMS heat dissipation device for mobile devices of this invention is as follows: The MEMS sound and heat dissipation chip 10 at the air intake end draws in cool air from the external environment through the air intake of the electronic device's casing. The air is forced to flow through a microchannel heat sink 20 filled with hot fins. Forced convection heat exchange occurs between the air and the high-temperature fins, efficiently removing heat. The heated air reaches the other end of the microchannel heat sink 20. The MEMS sound and heat dissipation chip 10 at the exhaust end extracts this hot air and discharges it to the outside of the device through the exhaust port of the device casing, thus achieving external air circulation and heat dissipation. Through continuous external air circulation, the heat generated by the SoC is continuously removed, effectively reducing the chip temperature and maintaining device performance. Furthermore, waterproof and breathable membranes are used as dust filters at both the airflow inlet and outlet, and because the airflow direction can be changed through a push-pull working mode, dust from the air intake is discharged in the opposite direction.

[0048] like Figure 2 As shown, based on the MEMS heat dissipation device described above, the realized mobile device includes: SoC chip 60, MEMS heat dissipation device, and driver chip 70. The heat dissipation surface of the microchannel heat sink of the MEMS heat dissipation device is attached to the surface of the SoC chip 60, and the MEMS sound and heat dissipation chip 10 of the MEMS heat dissipation device are connected to the driver chip 70.

[0049] The specific structure of the MEMS heat dissipation device is as described above.

[0050] In addition, the mobile device also includes a housing, which has ventilation and sound holes at the vents and sound holes corresponding to the MEMS sound and heat dissipation chip 10.

[0051] The workflow of a mobile device is as follows:

[0052] Step S1: Utilize the SoC chip 60 to receive inputs from the temperature sensor, audio subsystem, and main system.

[0053] Specifically, the SoC chip 60 receives information such as temperature sensors, playback requests from the audio subsystem (or software level), and the performance status of the main system.

[0054] The hardware logic unit inside the SoC chip 60 (which may be a dedicated thermal management unit or firmware executed by the CPU / microcontroller) receives input from the temperature sensor, audio subsystem, and main system.

[0055] Step S2: The SoC chip 60 obtains a decision result based on preset decision rules (temperature threshold, whether there is an audio request, priority setting, etc.). The decision result includes whether the MEMS sound and heat dissipation chip 10 enters the heat dissipation mode, acoustic mode, sound and heat hybrid mode, or off state. Based on the decision result, the SoC chip 60 generates a logic level control signal.

[0056] Examples of decision rules are as follows:

[0057] Off state:

[0058] Conditions: The temperature is very low and there is no audio playback.

[0059] Action: MEMS off.

[0060] Cooling mode:

[0061] Condition 1: High temperature and no audio playback.

[0062] Condition 2: Extremely high temperature and priority given to ensuring equipment performance.

[0063] Action: Only the heat dissipation function area is active.

[0064] Acoustic modes:

[0065] Conditions: The temperature is not high and audio is playing.

[0066] Action: Only the acoustic function area is active.

[0067] Acoustic-thermal mixing mode:

[0068] Conditions: High temperature and audio playback (except for extremely high temperatures where device performance is prioritized).

[0069] Action: The acoustic function zone operates, while the thermal function zone assists in heat dissipation with reduced power. If the temperature continues to deteriorate, audio quality / volume may be further reduced to enhance heat dissipation, or audio may be temporarily sacrificed for full-power heat dissipation.

[0070] The control signals for logic levels include:

[0071] Switch signal: Turns MEMS sound and heat dissipation chip 10 on or off.

[0072] Operating mode signals: heat dissipation mode / acoustic mode / acoustic-thermal hybrid mode.

[0073] Control parameters: Signals of operating parameters (such as heat dissipation intensity or acoustic parameters).

[0074] In addition, in acoustic mode / acoustic-thermal hybrid mode, SoC chip 60 also needs to send audio data streams to driver chip 70.

[0075] Step S3: The driver chip 70 receives the logic control signal from the SoC chip 60, decodes the logic control signal to turn off the MEMS sound and heat dissipation chip 10, or generates a corresponding drive signal according to the working mode and working parameters.

[0076] The drive signal provided to the heat dissipation functional area is usually a high-frequency, high-power single-frequency sine wave or square wave. The drive signal provided to the acoustic functional area is usually a complex waveform modulated by audio data (such as a modulated ultrasonic carrier).

[0077] If a signal is received to turn off MEMS audio and heat dissipation chip 10, the output stage is disabled.

[0078] Step S4: The MEMS sound and heat dissipation chip 10 receives the final drive signal from the driver chip 70.

[0079] Therefore, the MEMS sound and heat dissipation chip 10 performs physical actions based on the received signals to generate directional airflow (heat dissipation mode) or sound waves (acoustic mode).

[0080] In summary, this invention utilizes the high back pressure, low power consumption, and miniaturization characteristics of MEMS heat dissipation chips. A MEMS heat dissipation chip with extremely high back pressure (e.g., 1000 Pa level), low power consumption (tens of milliwatts level), and miniaturization is used as an active airflow driving source. This MEMS heat dissipation chip is combined with a specially designed microchannel heat sink and applied to mobile devices (such as smartphones and tablets) where space, power consumption, and noise are extremely limited and often highly sealed. The high back pressure characteristic of the MEMS chip overcomes the high flow resistance of the microchannel heat sink, achieving in a very small volume what traditional micro fans struggle to accomplish. This invention achieves highly efficient forced convection cooling, significantly improving heat dissipation performance while maintaining low power consumption and low noise operation. This addresses the issues of performance throttling and poor user experience (hot surfaces) caused by overheating of high-performance components (such as SoCs and 5G modules) in mobile devices operating in environments with extremely limited space, power consumption, and noise. Furthermore, it overcomes the challenges of traditional micro-fans, which are difficult to apply to active cooling in mainstream mobile devices due to their size, noise, power consumption, low back pressure, and incompatibility with device sealing. It also solves the problem of effectively utilizing the high heat transfer potential of microchannel heat sinks while overcoming their high flow resistance to achieve efficient forced convection cooling in mobile devices. In addition, this invention integrates MEMS heat dissipation and acoustic functions (such as speakers) into a single MEMS device, enabling functional reuse and further optimization of device space.

[0081] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various variations can be made to the above embodiments of this utility model. All simple and equivalent changes and modifications made based on the claims and description of this utility model application fall within the protection scope of the claims of this utility model patent. Any aspects not described in detail in this utility model are conventional technical content.

Claims

1. A MEMS heat dissipating device, characterized by, It includes a MEMS sound and heat dissipation chip, a microchannel heat sink attached to the MEMS sound and heat dissipation chip, the gas channels of the microchannel heat sink being micrometer-sized, and the heat dissipation surface of the microchannel heat sink being attached to the surface of a heat source.

2. The MEMS heat dissipation device according to claim 1, characterized in that, The MEMS sound and heat dissipation chip is a single MEMS device, including a heat dissipation functional area and an acoustic functional area. The specific structures of the heat dissipation functional area and the acoustic functional area are consistent with those of the MEMS heat dissipation chip and the MEMS sound chip, respectively.

3. The MEMS heat dissipation device according to claim 2, characterized in that, The MEMS sound and heat dissipation chip has two independent electric drive interfaces corresponding to the heat dissipation functional area and the acoustic functional area, which are connected to the drive chip through the electric drive interfaces.

4. The MEMS heat dissipation device according to claim 3, characterized in that, The MEMS sound and heat dissipation chip can be switched between heat dissipation mode, acoustic mode, acoustic-thermal hybrid mode and off state; In heat dissipation mode, the driver chip only provides drive signals to the heat dissipation functional area; In acoustic mode, the driver chip only provides drive signals to the acoustic functional area; In the acoustic-thermal hybrid mode, the driver chip simultaneously provides independent drive signals to the heat dissipation functional area and the acoustic functional area.

5. The MEMS heat dissipation device according to claim 2, characterized in that, Each MEMS sound and heat dissipation chip has a ventilation port for the heat dissipation functional area and a sound emission port for the acoustic functional area arranged adjacent to each other on its side.

6. The MEMS heat dissipation device according to claim 1, characterized in that, The heat source is a chip on the circuit board; the MEMS sound and heat dissipation chip and the microchannel heat sink are in one group and located on the same side of the circuit board, or in two groups and located on both sides of the circuit board. For a set of MEMS sound and heat dissipation chips and microchannel heat sinks, the number of microchannel heat sinks is 1, and the number of MEMS sound and heat dissipation chips is 1 or 2.

7. The MEMS heat dissipation device according to claim 6, characterized in that, For a set of MEMS sound and heat dissipation chips and microchannel heat sinks, there is one microchannel heat sink and two MEMS sound and heat dissipation chips, which are respectively attached to the two sides of the MEMS sound and heat dissipation chips; and the microchannel heat sink includes a gas channel, the channel wall of which is parallel to the connecting axis of the two ends where the MEMS sound and heat dissipation chips are located.

8. The MEMS heat dissipation device according to claim 1, characterized in that, The microchannel heat sink has a highly thermally conductive material on its heat dissipation surface in contact with the heat source.

9. A mobile device, characterized in that, The device includes a MEMS heat dissipation device, a SoC chip, and a driver chip according to any one of claims 1-8, wherein the heat dissipation surface of the microchannel heat sink of the MEMS heat dissipation device is attached to the surface of the SoC chip, and the MEMS sound and heat dissipation chip of the MEMS heat dissipation device are connected to the driver chip.

10. The mobile device according to claim 9, characterized in that, Each MEMS sound and heat dissipation chip has a ventilation port for the heat dissipation functional area and a sound-emitting hole for the acoustic functional area arranged adjacently on its side; the mobile device also includes a housing, and the housing of the mobile device has ventilation and sound-emitting holes corresponding to the ventilation ports and sound-emitting holes of the MEMS sound and heat dissipation chips.

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