Semiconductor wafer detection carrying device

Abstract

The utility model relates to a kind of semiconductor wafer detection bearing device, including rotary telescopic platform mechanism, chucking claw mechanism and wafer bearing mechanism installed on rotary telescopic platform mechanism;The wafer bearing mechanism includes wafer turntable, the turntable turntable of being rotatably arranged on wafer turntable and multiple wafer bearing mechanisms installed on turntable turntable;Turntable turntable rotation drives multiple the wafer bearing mechanism synchronous rotation, the chucking claw mechanism is used to chuck the wafer of setting, chucking claw mechanism can be driven telescopic to set wafer transfer to corresponding wafer bearing mechanism;The semiconductor wafer detection bearing device of the technical solution, by setting multiple bearing devices on turntable turntable, simultaneously by corresponding chucking claw component cooperation corresponding bearing device, the wafer of different sizes, different specifications is selected corresponding bearing device, stable installation is implemented, subsequent semiconductor wafer is detected conveniently.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, specifically to a semiconductor wafer inspection carrier device. Background Technology

[0002] Semiconductor wafers are the core material for manufacturing silicon semiconductor devices. A wafer is a circular silicon wafer formed by slicing, grinding, and polishing high-purity silicon single crystal rods. Primarily used in integrated circuit manufacturing, its core parameters, including doping concentration and carrier lifetime, directly affect chip performance. Its manufacturing and application involve multiple technical stages and industrial dimensions; therefore, it is necessary to perform corresponding fixed tests on the manufactured semiconductor wafers to ensure product quality.

[0003] Traditional semiconductor wafer fixing and inspection methods are divided into two types. One type uses different semiconductor equipment according to wafer size, meaning that one semiconductor equipment is only used for a single wafer size. Different semiconductor equipment is selected for subsequent semiconductor positioning and inspection based on the wafer size. The other type involves replacing different fixing mechanisms (i.e., by changing the tooling of the fixing mechanism) and installing fixing mechanisms for different wafer sizes on the semiconductor equipment, thereby enabling wafers of different sizes to complete semiconductor-related fixing and inspection on the same semi-fixed inspection equipment.

[0004] Both of the above-mentioned semiconductor wafer fixing methods have obvious drawbacks. First, they increase the equipment investment cost by increasing the number of semiconductor devices. Second, changing the fixing structure not only requires changeover time, but also requires equipment verification after the mechanism is changed, which increases the corresponding time cost.

[0005] Therefore, in order to solve the above problems, a semiconductor wafer inspection carrier device is needed to solve the aforementioned technical issues. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a semiconductor wafer inspection carrier device. By setting multiple carrier devices on the turntable and using corresponding gripper assemblies to cooperate with the corresponding carrier devices, wafers of different sizes and specifications can be selected for the corresponding carrier devices for stable installation, which facilitates subsequent semiconductor wafer inspection.

[0007] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0008] A semiconductor wafer inspection carrier device includes a rotary telescopic stage mechanism, a clamping claw mechanism mounted on the rotary telescopic stage mechanism, and a wafer carrier mechanism. The wafer carrier mechanism includes a wafer turntable, a turntable disk rotatably disposed on the wafer turntable, and multiple wafer carrier mechanisms mounted on the turntable disk. The rotation of the turntable disk drives the multiple wafer carrier mechanisms to rotate synchronously. The clamping claw mechanism is used to clamp a set wafer, and the clamping claw mechanism can be driven to extend and retract to transfer the set wafer to the corresponding wafer carrier mechanism.

[0009] Furthermore, the gripper mechanism includes a gripper seat mounted on the rotary telescopic table mechanism, a first gripper assembly and a second gripper assembly mounted in conjunction with the gripper seat; the rotary telescopic table mechanism drives the first gripper assembly and the second gripper assembly to move synchronously.

[0010] Furthermore, the first gripper assembly includes a gripper plate that is mounted in conjunction with a gripper seat, a left fork arm disposed at the end of the gripper plate, a right fork arm disposed on the upper surface of the gripper plate, and an anti-slip pad; the left fork arm and the right fork arm have the same structure and are arranged parallel to each other.

[0011] Furthermore, the second gripper assembly includes an upper arc-shaped clamping plate, a lower arc-shaped support plate, and a limiting guide block protruding from the upper surface of the lower arc-shaped support plate, which are installed in conjunction with the gripper seat; the upper arc-shaped clamping plate and the lower arc-shaped support plate are arranged in parallel to each other, and the limiting guide blocks are two blocks with the same structure and the two limiting guide blocks are symmetrically distributed relative to the gripper seat.

[0012] Furthermore, the plurality of wafer carrier mechanisms include a first carrier device, a second carrier device, and a third carrier device mounted on a turntable; the first carrier device and the second carrier device have the same overall structure and are used for mounting and testing wafers of different sizes, and the third carrier device is used for mounting and testing wafers of different models.

[0013] Furthermore, the first carrier device includes a chassis mounted on a turntable, a positioning guide post mounted on the chassis, a carrier plate mounted in conjunction with the positioning guide post, and a lifting and positioning component mounted on the chassis in conjunction with the carrier plate; the lifting and positioning component is mounted below the carrier plate and can be lifted and lowered in the vertical direction to cooperate with the carrier plate for wafer positioning.

[0014] Furthermore, the lifting and positioning assembly includes a lifting crossbeam, a drive cylinder that works in conjunction with the lifting crossbeam and drives the lifting crossbeam to reciprocate in the vertical direction, and a lifting and positioning column installed on the upper surface of the lifting crossbeam; the movement of the lifting crossbeam drives the lifting and positioning column to move synchronously and work in conjunction with the wafer positioning and installation.

[0015] Furthermore, the carrier plate is provided with a carrier plate positioning hole for use in conjunction with the telescopic positioning of the lifting positioning column, and the carrier plate is provided with an adsorption hole for use in conjunction with wafer adsorption and mounting.

[0016] Furthermore, the middle part of the lifting crossbeam has a ring-shaped structure, and there are multiple lifting positioning columns that are evenly distributed on the ring-shaped structure.

[0017] Furthermore, the third supporting device includes a third base mounted on the turntable and a positioning detection platform disposed on the third base.

[0018] The beneficial effects of this technical solution are:

[0019] The semiconductor wafer inspection carrier device of this technical solution sets up multiple carrier devices on the turntable, and at the same time, the corresponding gripper assembly cooperates with the corresponding carrier device to realize the selection of the corresponding carrier device for wafers of different sizes and specifications, and to achieve stable installation, which facilitates the subsequent inspection of semiconductor wafers. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the gripper mechanism in this utility model;

[0022] Figure 3 This is a schematic diagram of the wafer carrier mechanism in this utility model;

[0023] Figure 4 This is a schematic diagram of the installation of the lifting and positioning component of this utility model;

[0024] Figure 5 This is a schematic diagram of the wafer in this utility model (i.e., a schematic diagram of the first product).

[0025] Figure 6 This is a schematic diagram of the second wafer of this utility model (i.e., a schematic diagram of the second product).

[0026] The attached diagram lists the components represented by each number as follows:

[0027] 1. Rotary worktable; 2. Telescopic mechanism; 3. Clamping claw mechanism; 4. Wafer carrying mechanism; 31. Clamping claw base; 32. Induction detection block; 33. Clamping claw plate; 34. Left fork arm; 35. Anti-slip pad; 36. Right fork arm; 37. Upper arc-shaped clamping plate; 38. Limiting guide block; 39. Lower arc-shaped support plate; 41. Turntable turntable; 42. Third carrying device; 43. First carrying device; 44. Second carrying device; 45. Carrying plate; 46. Air inlet; 47. Adsorption hole; 48. Carrying plate positioning hole; 49. Positioning guide post hole; 50. Chassis; 51. Positioning guide post; 52. Lifting crossbeam; 53. Lifting positioning post; 54. Drive cylinder; 6. Wafer; 7. Second wafer; 71. Wafer ring; 72. Wafer surface. Detailed Implementation

[0028] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0029] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the gripper mechanism in this utility model; Figure 3 This is a schematic diagram of the wafer carrier mechanism in this utility model; Figure 4 This is a schematic diagram of the installation of the lifting and positioning component of this utility model; Figure 5 This is a schematic diagram of the wafer in this utility model (i.e., a schematic diagram of the first product). Figure 6This is a schematic diagram of the second wafer of this utility model (i.e., a schematic diagram of the second product); as shown in the figure, a semiconductor wafer inspection carrier device includes a rotary telescopic stage mechanism (including a rotary worktable 1 and a telescopic mechanism 2, the rotary worktable 1 is mounted on a rotatable workbench, and the rotary worktable 1 can be rotated; the telescopic mechanism 2 can be a telescopic robotic arm or other telescopic mechanism; the rotary telescopic stage mechanism as a whole adopts an existing rotatable and telescopic mechanism, similar to a rotary telescopic robotic arm, etc., to achieve the above functions, which will not be elaborated here), a clamping claw mechanism 3 mounted on the rotary telescopic stage mechanism, and The wafer carrier mechanism 4 includes a wafer turntable, a turntable disk 41 rotatably mounted on the wafer turntable, and multiple wafer carrier mechanisms mounted on the turntable disk 41 (the wafer turntable serves as a bottom rotating support structure, and can drive the turntable disk 41 to rotate; the specific rotational engagement method can be achieved using existing technology, and will not be elaborated here); the rotation of the turntable disk 41 drives the multiple wafer carrier mechanisms to rotate synchronously, and the clamping claw mechanism 3 is used to clamp the set wafers. The clamping claw mechanism can be driven to extend and retract to transfer the set wafers to the corresponding wafer carrier mechanisms.

[0033] The semiconductor wafer inspection carrier device of this technical solution sets up multiple carrier devices on the turntable, and at the same time, the corresponding gripper assembly cooperates with the corresponding carrier device. That is, the rotation of the rotating worktable 1 drives the telescopic mechanism 2 to rotate, and the telescopic mechanism 2 then telescopically clamps wafers of different sizes or models onto the corresponding carrier devices. This realizes that wafers of different sizes and specifications can be selected with the corresponding carrier devices for stable installation, which facilitates the subsequent inspection of semiconductor wafers.

[0034] In this embodiment, the gripper mechanism 3 includes a gripper seat 31 mounted on the rotary telescopic table mechanism (mounted at the front end of the telescopic mechanism 2), a first gripper assembly and a second gripper assembly mounted in conjunction with the gripper seat 31; the rotary telescopic table mechanism drives the first gripper assembly and the second gripper assembly to move synchronously.

[0035] The front end of the telescopic mechanism 2 is fixedly installed with the gripper seat 31. Both gripper assemblies are integrated and installed on the gripper seat 31, and the two gripper assemblies are in the vertical direction (i.e., Figure 1 A certain installation spacing is formed in the vertical height direction of the rotary table. This design facilitates the positioning and clamping of different types of wafers, thereby enabling the telescopic transfer of wafers.

[0036] In this embodiment, the first gripper assembly includes a gripper plate 33 that is installed in conjunction with the gripper seat 31, a left fork arm 34 disposed at the end of the gripper plate 33, a right fork arm 36 disposed on the upper surface of the gripper plate 33, and an anti-slip washer 35 disposed on the upper surface of the gripper plate 33; the left fork arm 34 and the right fork arm 36 have the same structure and are arranged parallel to each other.

[0037] The gripper plate 33 is fixedly installed in conjunction with the gripper seat 31 using a detachable fixed connection. As the basic support component of the gripper assembly, the front end of the gripper plate 33 is provided with a left fork arm 34 and a right fork arm 36 with the same structure. The gripper plate 33 has an arc-shaped groove protruding. The double fork arm and the arc-shaped groove ensure that the wafer can be installed in place during transfer. At the same time, two anti-slip pads 35 are provided on the upper surface of the gripper plate 33 to further improve the stability of the wafer during transfer and ensure that it will not fall off during the transfer process. The first gripper assembly is mainly used for the transfer of the first product wafer 6.

[0038] In this embodiment, the second gripper assembly includes an upper arc-shaped clamping plate 37, a lower arc-shaped support plate 39, and a limiting guide block 38 protruding from the upper surface of the lower arc-shaped support plate 39, which are installed in conjunction with the gripper seat. The upper arc-shaped clamping plate 37 and the lower arc-shaped support plate 39 are arranged in parallel to each other, and the limiting guide block 38 consists of two identical blocks that are symmetrically distributed relative to the gripper seat.

[0039] The upper arc-shaped clamping plate 37 and the lower arc-shaped support plate 39, which are arranged in parallel with each other, are fixedly installed with the gripper seat 31. A limit guide block 38 structure is formed by protrusion on the upper surface of the lower arc-shaped support plate 39. The two limit guide blocks 38 with the same structure are equivalent to the gripper plates 33 symmetrically arranged. When the second type of product wafer, namely the second wafer 7, is used, the wafer ring 71 is clamped between the upper arc-shaped clamping plate 37 and the lower arc-shaped support plate 39 and is located between the two limit guide blocks 38 to ensure stable and reliable clamping. Of course, a notch structure is formed on the lower arc-shaped support plate 39, and a corresponding sensing detection block 32 is set at the notch structure to facilitate the detection of whether the second wafer 7 is clamped in place. Of course, an identification device is also installed at the front end of the gripper seat 31 (the identification device in the prior art can be installed and arranged accordingly) to facilitate the identification of different types and models of wafers and select different grippers for corresponding clamping.

[0040] In this embodiment, the plurality of wafer carrier mechanisms include a first carrier device 43, a second carrier device 44, and a third carrier device 42 mounted on a turntable 41; the first carrier device 43 and the second carrier device 44 have the same overall structure and are used for mounting and testing wafers of different sizes, and the third carrier device 42 is used for mounting and testing wafers of different models.

[0041] Three carrier devices are integrated on the turntable 41, including a first carrier device 43 and a second carrier device 44 with the same overall structure but used for different sizes, and a third carrier device 42 used for testing different types of wafers. Wafers 6 of the same type but different sizes are tested using the corresponding first carrier device 43 and second carrier device 44, and the second wafer 7 is tested using the corresponding third carrier device 42.

[0042] In this embodiment, the first support device 43 includes a chassis 50 mounted on a turntable 41, a positioning guide post 51 mounted on the chassis 50, a support plate 45 mounted in conjunction with the positioning guide post 51, and a lifting and positioning component mounted on the chassis 50 in conjunction with the support plate 45. The lifting and positioning component is mounted below the support plate 45 and can be lifted and lowered in the vertical direction to cooperate with the support plate 45 for wafer 6 positioning.

[0043] The chassis 50 is fixedly installed on the upper surface of the turntable 41. As the turntable 41 rotates synchronously, multiple positioning guide posts 51 are fixedly installed on the upper surface of the chassis 50. The bearing plate 45 is correspondingly provided with positioning guide post holes 49 to cooperate with the multiple positioning guide posts 51 to form a stable working position. The lifting and positioning component is correspondingly installed on the chassis 50 and located on the lower surface of the bearing plate 45. It can be adjusted and controlled in the vertical direction to achieve positioning and installation with the wafer 6.

[0044] In this embodiment, the lifting and positioning assembly includes a lifting crossbeam 52, a drive cylinder 54 that works with the lifting crossbeam 52 and drives the lifting crossbeam 52 to reciprocate in the vertical direction, and a lifting and positioning column 53 installed on the upper surface of the lifting crossbeam 52; the movement of the lifting crossbeam 52 drives the lifting and positioning column 53 to move synchronously and work with the wafer 6 for positioning and installation.

[0045] The drive cylinder 54 is fixedly installed on the upper surface of the chassis 50. The corresponding output ends of the two drive cylinders 54 are matched with the two ends of the lifting crossbeam 52 (the two drive cylinders are selected to lift synchronously, that is, to ensure that the lifting crossbeam 52 maintains balance during the lifting process). The upper end face of the lifting crossbeam 52 is fixedly installed with a lifting positioning column 53. The corresponding bearing plate 45 is provided with a bearing plate positioning hole 48, which allows the lifting crossbeam 52 to move in the vertical direction, driving the lifting positioning column 53 to pass through the bearing plate positioning hole 48 and move in the vertical direction.

[0046] In this embodiment, the carrier plate 45 is provided with a carrier plate positioning hole 48 for use in conjunction with the telescopic positioning of the lifting positioning column 53, and the carrier plate 45 is provided with an adsorption hole 47 for use in conjunction with wafer adsorption and mounting.

[0047] The carrier plate 45 has multiple adsorption holes 47, and the lower surface of the carrier plate 45 is equipped with multiple air inlets 46. In use, the wafer 6 is transferred to the top of the carrier plate 45 through the first gripper assembly and descends. At this time, the lifting positioning column 53 extends out of the upper surface of the carrier plate 45, and the wafer 6 falls onto the lifting positioning column 53. The lifting positioning column 53 begins to descend until the wafer 6 falls onto the upper surface of the carrier plate 45, and the air inlets 46 begin to adsorb, so that the wafer 6 adheres to the upper surface of the carrier plate 45, completing the entire process.

[0048] In this embodiment, the middle part of the lifting crossbeam 52 is a ring structure, and there are multiple lifting positioning columns 53, which are evenly distributed on the ring structure.

[0049] The lifting crossbeam 52 has a circular structure in the middle, and multiple lifting positioning columns 53 are evenly distributed in the middle to ensure the positioning and installation effect of the wafer 6.

[0050] In this embodiment, the third supporting device 42 includes a third base mounted on the turntable and a positioning detection platform disposed on the third base. The third base is fixedly mounted on the upper surface of the turntable 41. The positioning detection platform includes an inner positioning post 421 and an outer ring 422 sleeved on the inner positioning post. In use, the wafer ring 71 is sleeved on the outer side of the positioning post 421, and the wafer surface 72 is attached to the top surface of the positioning post 421 to achieve positioning installation.

[0051] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0052] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0053] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor wafer inspection carrier device, characterized in that: The device includes a rotary telescopic stage mechanism, a clamping claw mechanism mounted on the rotary telescopic stage mechanism, and a wafer carrier mechanism. The wafer carrier mechanism includes a wafer turntable, a turntable disk rotatably mounted on the wafer turntable, and multiple wafer carrier mechanisms mounted on the turntable disk. The rotation of the turntable disk drives the multiple wafer carrier mechanisms to rotate synchronously. The clamping claw mechanism is used to clamp a set wafer, and the clamping claw mechanism can be driven to extend and retract to transfer the set wafer to the corresponding wafer carrier mechanism.

2. The semiconductor wafer inspection carrier apparatus of claim 1, wherein: The gripper mechanism includes a gripper base mounted on a rotary telescopic table mechanism, a first gripper assembly and a second gripper assembly mounted in conjunction with the gripper base; the rotary telescopic table mechanism drives the first gripper assembly and the second gripper assembly to move synchronously.

3. The semiconductor wafer inspection carrier apparatus of claim 2, wherein: The first gripper assembly includes a gripper plate that is fixedly installed in conjunction with a gripper seat, a left fork arm and a right fork arm that are fixedly disposed at the end of the gripper plate, and an anti-slip washer that is fixedly installed on the upper surface of the gripper plate; the left fork arm and the right fork arm have the same structure and are arranged parallel to each other.

4. The semiconductor wafer inspection carrier apparatus of claim 2, wherein: The second gripper assembly includes an upper arc-shaped clamping plate, a lower arc-shaped support plate, and a limiting guide block protruding from the upper surface of the lower arc-shaped support plate, which are fixedly installed in conjunction with the gripper seat; the upper arc-shaped clamping plate and the lower arc-shaped support plate are arranged in parallel to each other, and the limiting guide blocks are two identical blocks and the two limiting guide blocks are symmetrically distributed relative to the gripper seat.

5. The semiconductor wafer inspection carrier apparatus of claim 1, wherein: The plurality of wafer carrier mechanisms include a first carrier device, a second carrier device, and a third carrier device mounted on a turntable; the first carrier device and the second carrier device have the same overall structure and are used for mounting and testing wafers of different sizes, and the third carrier device is used for mounting and testing wafers of different models.

6. The semiconductor wafer inspection carrier apparatus of claim 5, wherein: The first support device includes a chassis fixedly installed on a turntable, a positioning guide post fixedly installed on the chassis, a support plate detachably and fixedly connected to the positioning guide post, and a lifting and positioning component installed on the chassis to cooperate with the support plate; the lifting and positioning component is installed below the support plate and can be raised and lowered in the vertical direction to cooperate with the support plate for wafer positioning.

7. The semiconductor wafer inspection carrier apparatus of claim 6, wherein: The lifting and positioning assembly includes a lifting crossbeam, a drive cylinder that works with the lifting crossbeam and drives the lifting crossbeam to reciprocate in the vertical direction, and a lifting and positioning column installed on the upper end face of the lifting crossbeam; the movement of the lifting crossbeam drives the lifting and positioning column to move synchronously, and causes the lifting and positioning column to extend upward or retract downward from the support plate to cooperate with wafer positioning and installation.

8. The semiconductor wafer inspection carrier apparatus of claim 7, wherein: The carrier plate has a carrier plate positioning hole for use with the telescopic positioning of the lifting positioning column, and an adsorption hole for use with the adsorption and mounting of the wafer.

9. The semiconductor wafer inspection carrier apparatus of claim 8, wherein: The lifting crossbeam has a ring-shaped structure in the middle, and there are multiple lifting positioning columns that are evenly distributed around the ring-shaped structure.

10. The semiconductor wafer inspection carrier apparatus of claim 5, wherein: The third supporting device includes a third base mounted on the turntable and a positioning detection platform disposed on the third base.

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