Thermal compression bonding head and bonding apparatus
By using a heat exchange system that alternates between gas and liquid circulation in the liquid cooling plate, the problem of thermal bending deformation caused by temperature difference during the heating process of the liquid cooling plate is solved, and high-precision and high-efficiency chip bonding production is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 智慧星空(上海)工程技术有限公司
- Filing Date
- 2025-08-04
- Publication Date
- 2026-06-26
AI Technical Summary
The existing liquid cooling plate has a significant temperature difference between the upper and lower surfaces during the heating process, which leads to thermal bending deformation and affects the accuracy and quality of chip bonding.
The heat exchange system employs alternating gas and liquid circulation. By supplying gas during the heating phase to reduce heat transfer efficiency, it ensures the synchronization of temperature difference between the upper and lower surfaces of the liquid cooling plate. During the cooling phase, it quickly removes residual heat and utilizes turbulence protrusions and heat insulation components to improve temperature uniformity and heat dissipation efficiency.
It effectively reduces thermal bending deformation of the liquid cooling plate, ensuring the flatness and positional accuracy of chip bonding, while meeting the needs of high-speed production.
Smart Images
Figure CN224419274U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip bonding technology, specifically to a hot-press bonding head and bonding equipment. Background Technology
[0002] In chip bonding processes, to ensure high-precision alignment and bonding between the chip and the substrate, the chip must be precisely positioned on the substrate. However, existing liquid cooling plates are prone to thermal bending deformation during the heating process due to the significant temperature difference between the upper and lower surfaces. This deformation causes changes in the overall structure of the liquid cooling plate, which in turn affects the flatness and position of the chip placed on the liquid cooling plate, ultimately impacting the accuracy and quality of bonding. Utility Model Content
[0003] This application provides a hot-press bonding head and bonding equipment, which can solve the problem that the significant temperature difference between the upper and lower surfaces of existing liquid cooling plates easily leads to thermal bending deformation, resulting in low bonding alignment accuracy and bonding quality.
[0004] To achieve the above objectives, in a first aspect, the thermocompression bonding head provided in this application includes:
[0005] Support base;
[0006] A liquid cooling plate is installed on one side of the support base, and cooling channels are provided inside the liquid cooling plate;
[0007] The heating plate is located on the side of the liquid cooling plate opposite to the support base;
[0008] The heat exchange system includes a liquid supply line and a gas supply line, which are selectively in fluid communication with the inlet of the cooling channel;
[0009] When the heating plate is heating, the gas supply line is fluidly connected to the inlet of the cooling channel to continuously supply gas into the cooling channel; when the heating plate stops heating, the liquid supply line is fluidly connected to the inlet of the cooling channel to continuously supply coolant into the cooling channel.
[0010] In some embodiments of this application, the heat exchange system further includes an outlet pipe, one end of which is in fluid communication with the outlet of the cooling channel and the other end of which is in fluid communication with the inlet of the liquid supply pipe; the exhaust port of the gas supply pipe is in fluid communication with the liquid supply pipe, and the inlet of the gas supply pipe is used to connect to a gas source.
[0011] In some embodiments of this application, a first control valve is provided on the liquid supply pipeline, which is used to control the liquid supply pipeline to be open or closed; the exhaust port of the gas supply pipeline is connected to the section of the liquid supply pipeline located between the first control valve and the inlet of the cooling flow channel; a second control valve is provided on the gas supply pipeline, which is used to control the gas supply pipeline to be open or closed; wherein,
[0012] When the heating plate is heating, the first control valve is disconnected and the second control valve is turned on; when the heating plate stops heating, the first control valve is turned on and the second control valve is disconnected.
[0013] In some embodiments of this application, the heat exchange system further includes a water chiller, which includes a housing and a water pump and a liquid storage tank disposed within the housing. The liquid storage tank is fluidly connected between the inlet of the outlet pipe and the liquid supply pipe. An exhaust port is provided on the top of the liquid storage tank. The water pump is used to drive the coolant in the liquid storage tank to flow to the liquid supply pipe. After the heating plate has finished cooling, both the first control valve and the second control valve are turned on, and the water pump is turned off, so that a portion of the gas in the gas supply pipe flows through the cooling channel to the liquid storage tank of the water chiller, and another portion of the gas flows through the liquid supply pipe to the liquid storage tank of the water chiller.
[0014] In some embodiments of this application, the cooling channel includes a main channel and a plurality of turbulence protrusions disposed on the channel wall of the main channel, the plurality of turbulence protrusions being spaced apart along the extension direction of the main channel.
[0015] In some embodiments of this application, the main channel is S-shaped and meandering.
[0016] In some embodiments of this application, the plurality of turbulence protrusions include a plurality of first protrusions and a plurality of second protrusions respectively disposed on opposite sides of the flow channel wall of the main flow channel; the plurality of first protrusions and the plurality of second protrusions are all spaced apart along the extension direction of the main flow channel, and at least one second protrusion extends into the interval between two adjacent first protrusions.
[0017] In some embodiments of this application, the thermocompression bonding head further includes:
[0018] A heat insulation component is placed between the liquid cooling plate and the support base and is made of heat insulation material.
[0019] In some embodiments of this application, the thermocompression bonding head further includes:
[0020] The suction cup is located on the side of the heating plate that faces away from the liquid cooling plate.
[0021] The orthographic projection of the suction cup on the support base is located within the orthographic projection of the heating plate on the support base, and the orthographic projection of the heating plate on the support base is located within the orthographic projection of the liquid cooling plate on the support base.
[0022] Secondly, this application also provides a bonding apparatus, which includes a hot-press bonding head as described in any of the above technical solutions.
[0023] The above-mentioned technical solution of this application has at least the following beneficial effects:
[0024] By adopting the above design, on the one hand, during the heating process of the heating plate, since the thermal conductivity of gases (such as compressed air or inert gases) is much lower than that of liquids (such as water), introducing gas into the cooling channel can significantly reduce the heat transfer efficiency, making the heating rate of the liquid cooling plate slower and more uniform. Specifically, the slow heat transfer prevents the upper surface of the liquid cooling plate near the heating plate from heating too quickly, while the lower surface far from the heating plate, lacking a direct heat source, also heats up relatively slowly. This synchronization of the heating rates of the upper and lower surfaces effectively reduces the temperature difference between them, thereby significantly reducing the risk of thermal bending deformation of the liquid cooling plate caused by inconsistent heating of the upper and lower surfaces, and thus avoiding the impact of thermal bending deformation on the surface flatness of the chip to be bonded. On the other hand, after the heating plate stops heating, switching to the circulation of a high thermal conductivity coolant can quickly remove the residual heat from the heating plate, allowing the thermosetting bonding head to cool down rapidly, thereby meeting the requirements of high-cycle production. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the structure of the thermo-press bonding head in the embodiments of this application;
[0027] Figure 2 This is a cross-sectional view of the liquid cooling plate in the thermo-press bonding head in an embodiment of this application;
[0028] Figure 3 This is a schematic diagram of the heat exchange system in the thermo-pressed bonding head in the embodiments of this application;
[0029] Figure 4 This is a schematic diagram of the heat exchange system in the hot-press bonding head in the liquid supply mode in the embodiments of this application;
[0030] Figure 5 This is a schematic diagram of the heat exchange system in the hot-press bonding head in the gas supply mode in the embodiments of this application;
[0031] Figure 6 This is a schematic diagram of the heat exchange system in the hot-press bonding head in the purging mode in the embodiments of this application.
[0032] Explanation of reference numerals in the attached figures:
[0033] 1-Support base; 2-Liquid cooling plate; 21-Cooling channel; 211-Main channel; 212-Turbulence protrusion; 2121-First protrusion; 2122-Second protrusion; 3-Heating plate; 4-Heat exchange system; 41-Liquid supply line; 42-Gas supply line; 43-Outlet line; 44-First control valve; 45-Second control valve; 46-Water chiller; 5-Insulation component; 6-Suction cup; 100-Chip. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0035] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0036] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0038] This application provides a hot-press bonding head and bonding apparatus, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.
[0039] Bonding is a crucial process in the manufacturing of micro-nano devices and integrated circuits. Its core function is to firmly bond different materials or functional components through physical or chemical means, thereby meeting the electrical performance, mechanical stability, and functional integration requirements of device designs. In chip manufacturing, chip bonding is a core step, and its mainstream process typically employs a combination of double-sided heating and pressure loading. First, the two chips to be bonded are precisely heated at controlled temperatures. Then, controlled bonding pressure is applied to induce atomic-level interactions (such as covalent bonds, metal diffusion, or van der Waals forces) between the chip interfaces, ultimately achieving highly reliable chip interconnection. The key technical parameters of this process consist of three parts: heating temperature determines the diffusion activity and reaction kinetics of interface atoms; the pressure bonding force directly affects the contact tightness and stress distribution of the bonding interface; and the cooling rate is related to the thermal stress release efficiency inside the chip after bonding. These three factors together determine the bonding quality (such as bonding strength and interface defect density) and the overall production efficiency (such as the number of chips bonded per unit time).
[0040] In chip bonding processes, to ensure high-precision alignment and bonding between the chip and the substrate, the chip must be precisely positioned on the substrate. However, existing liquid cooling plates are prone to thermal bending deformation during the heating process of the heating plate due to the significant temperature difference between the upper and lower surfaces. This deformation causes the overall structure of the liquid cooling plate to change, which in turn affects the surface flatness and chip misalignment of the chip placed indirectly on the liquid cooling plate, ultimately affecting the accuracy and quality of bonding.
[0041] Therefore, the hot-press bonding head provided in this application enables the liquid cooling plate to control the temperature difference between the upper and lower surfaces to a minimum during the heating phase of the heating plate, and at the same time, it can quickly and efficiently remove residual heat after the heating plate stops heating.
[0042] Please refer to Figure 1 , Figure 2 and Figure 3 The thermocompression bonding head includes a support base 1, a liquid cooling plate 2, a heating plate 3, and a heat exchange system 4. The liquid cooling plate 2 is disposed on one side of the support base 1, and a cooling channel 21 is provided inside the liquid cooling plate 2. The heating plate 3 is disposed on the side of the liquid cooling plate 2 opposite to the support base 1. The heat exchange system 4 includes a liquid supply pipe 41 and a gas supply pipe 42, and the liquid supply pipe 41 and the gas supply pipe 42 can selectively communicate with the inlet of the cooling channel 21. Specifically, when the heating plate 3 is heating, the gas supply pipe 42 is in fluid communication with the inlet of the cooling channel 21 to continuously supply gas into the cooling channel 21; when the heating plate 3 is not heating, the liquid supply pipe 41 is in fluid communication with the inlet of the cooling channel 21 to continuously supply coolant into the cooling channel 21.
[0043] With the above design, on the one hand, during the heating process of the heating plate 3, since the thermal conductivity of gases (such as compressed air or inert gases) is much lower than that of liquids (such as water), introducing gas into the cooling channel 21 can significantly reduce the heat transfer efficiency, making the heating rate of the liquid cooling plate 2 slower and more uniform. Specifically, the slow heat transfer prevents the upper surface of the liquid cooling plate 2 near the heating plate 3 from heating too quickly, while the lower surface far from the heating plate 3, lacking a direct heat source, also heats up relatively slowly. This synchronization of the heating rates of the upper and lower surfaces effectively reduces the temperature difference between them, thereby significantly reducing the risk of thermal bending deformation of the liquid cooling plate 2 caused by inconsistent heating of the upper and lower surfaces, and thus avoiding the impact of thermal bending deformation of the liquid cooling plate 2 on the surface flatness of the chip to be bonded. On the other hand, after the heating plate 3 stops heating, switching to the circulation of a coolant with a high thermal conductivity can quickly remove the residual heat from the heating plate 3, allowing the thermosetting bonding head to cool down rapidly, thereby meeting the requirements of high-cycle production.
[0044] It should be noted that since the temperature of the upper and lower surfaces of the liquid cooling plate 2 is directly related to the temperature of the channel wall of the cooling channel 21, the uniformity of the temperature distribution of the channel wall directly determines the temperature difference control effect of the upper and lower surfaces of the liquid cooling plate 2. Therefore, this application continuously injects gas into the cooling channel 21 through the gas supply pipe 42. At the same time, the gas in the cooling channel 21 can be discharged through the outlet of the cooling channel, forming a dynamic gas circulation. The heat of the heating plate 3 will be quickly carried away from the channel wall of the cooling channel 21 along with the gas flow, and will not accumulate and rise in a local area, so as to maintain the temperature uniformity of the upper and lower surfaces of the liquid cooling plate 2 by improving the uniformity of the temperature distribution of the channel wall.
[0045] Please combine Figure 2 and Figure 3 The heat exchange system 4 also includes an outlet pipe 43, one end of which is fluidly connected to the outlet of the cooling channel 21, and the other end is fluidly connected to the inlet of the liquid supply pipe 41, thus forming a circulation loop together with the liquid supply pipe 41. The exhaust port of the gas supply pipe 42 is fluidly connected to the liquid supply pipe 41, and the inlet of the gas supply pipe 42 is used to connect to the gas source. In other words, the outlet pipe 43 connects the outlet of the cooling channel 21 to the liquid supply pipe 41, forming a closed circulation loop. At the same time, the exhaust port of the gas supply pipe 42 is directly connected to the liquid supply pipe 41, rather than having a separate venting channel. This design, by connecting the exhaust port to the circulation loop, ensures that the gas is always in a flowing state, and the pressure can be released through the circulation path, avoiding the risk of local high pressure and significantly improving the safety of the thermo-pressurized bonding head. It can also be understood that this circulation loop allows both liquid and gas to flow through.
[0046] Specifically, the liquid supply line 41 and the gas supply line 42 are selectively connected to the inlet of the same cooling channel 21. When the heating plate 3 heats up, the gas supply line 42 selectively connects to the inlet of the cooling channel 21, injecting a low thermal conductivity gas (such as compressed air) into the cooling channel 21. The gas forms a heat insulation layer in the cooling channel 21, slowing down the heat transfer rate from the heating plate 3 to the liquid cooling plate 2, making the upper and lower surfaces of the liquid cooling plate 2 heat up more evenly, avoiding thermal bending deformation caused by local overheating (large temperature difference), and ensuring the flatness and positional accuracy of the chip during bonding. After the heating plate 3 stops heating, the liquid supply line 41 switches to connect to the inlet of the cooling channel 21, and the coolant directly impacts the channel wall, quickly removing residual heat through efficient convection heat transfer, significantly improving heat dissipation efficiency and meeting the rapid cooling requirements of high-cycle production. Therefore, by dynamically switching the fluid type, the same flow channel can simultaneously meet the differentiated needs of "slow heating" and "rapid cooling", avoiding the structural complexity caused by the need to set up separate heating / cooling channels in traditional designs.
[0047] In some embodiments, a first control valve 44 is provided on the liquid supply line 41, which is used to control the opening or closing of the liquid supply line 41 (circulation loop). The exhaust port of the gas supply line 42 is connected to the section of the liquid supply line 41 located between the first control valve 44 and the inlet of the cooling channel 21. A second control valve 45 is provided on the gas supply line 42, which is used to control the opening or closing of the gas supply line 42. Thus, the first control valve 44 is installed in the liquid circulation loop to cut off or restore liquid flow. The second control valve 45 is installed on the gas supply line 42 to independently control the gas flow. The liquid supply mode and the gas supply mode are independently controlled by dual valves to avoid complex operating conditions caused by the simultaneous action of gas and liquid. Compared with ordinary manual shut-off valves, the first control valve 44 and the second control valve 45 can accurately match the process sequence and avoid temperature fluctuations or decreased bonding accuracy due to valve lag. Manual valves require operator intervention and cannot adapt to the fully automated production cycle. The control valve can be directly controlled by a PLC, which can significantly improve production efficiency.
[0048] like Figure 4 As shown, in liquid supply mode, the first control valve 44 is open, the liquid supply line 41 is open, and the coolant can flow normally to the cooling channel 21. At this time, the second control valve 45 is closed, the gas supply line 42 is disconnected, and gas cannot enter the circulation loop, ensuring that the heat exchange system 4 operates in a pure liquid cooling mode to efficiently dissipate heat from the heating plate 3. Figure 4 The direction indicated by the middle arrow is the flow direction of the coolant. For example... Figure 5As shown, in the gas supply mode, the first control valve 44 is closed, the liquid supply line 41 is disconnected, and the coolant stops flowing; at this time, the second control valve 45 is opened, the gas supply line 42 is opened, and gas can enter the cooling channel 21 through the section of the liquid supply line 41 located between the first control valve 44 and the cooling channel 21, so as to make the heating rate of the liquid cooling plate 2 more slow and uniform during the bonding process. Figure 5 The direction indicated by the middle arrow is the direction of gas flow. This dual-valve independent control architecture decouples the on / off control of gas and liquid, avoiding complex operating conditions that may be caused by the simultaneous action of gas and liquid (such as instability in gas-liquid two-phase flow, abnormal increase in local thermal resistance, etc.), thus improving the stability and controllability of cooling operation.
[0049] It is understood that the hot-press bonding head also includes a control module, which is electrically connected to both the first control valve 44 and the second control valve 45. When the heating plate 3 is heating, the control module controls the first control valve 44 to open and the second control valve 45 to open; when the heating plate 3 stops heating, the control module controls the first control valve 44 to open and the second control valve 45 to open, thereby realizing the automatic switching between the gas supply mode and the liquid supply mode of the liquid cooling plate 2. This control module can be a separate module or integrated into the main control module of the bonding equipment.
[0050] Please continue to refer to Figure 3 and Figure 6 The heat exchange system 4 also includes a water chiller 46, which includes a housing and a water pump and a liquid storage tank (not shown) housed within the housing. The liquid storage tank is fluidly connected between the outlet pipe 43 and the inlet of the supply pipe 41, and an exhaust port is provided on the top of the liquid storage tank. The water pump drives the coolant in the liquid storage tank to flow to the supply pipe 41. After the heating plate 3 has finished cooling (i.e., in purging mode), both the first control valve 44 and the second control valve 45 are turned on, and the water pump is turned off, so that a portion of the gas in the gas supply pipe 42 flows through the cooling channel 21 to the liquid storage tank, and another portion of the gas flows through the supply pipe 41 to the liquid storage tank. Thus, after the heating plate 3 has finished cooling, the gas supply pipe 42 is connected to the inlet of the cooling channel 21, and a portion of the gas flows sequentially into the cooling channel 21 of the liquid-cooled plate 2 and the outlet pipe 43 into the liquid storage tank (e.g., Figure 6 (As indicated by the solid arrow). Simultaneously, another portion of the gas flows through the liquid supply line 41 to the storage tank (as shown by the arrow). Figure 6 (As shown by the dashed arrow in the middle), this effectively removes residual water stains from the entire circulation loop, preventing moisture from generating steam or affecting heat transfer efficiency during the next heating, thus ensuring that the thermosetting bonding head is always in optimal working condition.
[0051] Please continue to refer to Figure 2The cooling channel 21 includes a main channel 211 and multiple turbulence protrusions 212 disposed on the channel wall of the main channel 211, with the protrusions 212 spaced apart along the extension direction of the main channel 211. The protrusions 212 serve as extensions of the channel wall, increasing the contact area between the fluid and the channel wall. Although the area increment of a single protrusion 212 is limited, the overall heat transfer area of the liquid cooling plate 2 is significantly increased by the multiple protrusions 212 spaced apart along the main channel 211, thereby enhancing the heat transfer capacity of the liquid cooling plate 2. Simultaneously, the protrusions 212 disrupt the laminar flow structure of the fluid, causing the fluid to detach from the channel wall and form vortices. These vortices carry the high-temperature fluid from the channel wall to the center of the main channel 211, while simultaneously carrying the low-temperature fluid back from the center to the vicinity of the wall, resulting in efficient energy exchange. This dynamic equilibrium mechanism makes the temperatures at different locations on the channel wall more uniform, avoiding localized overheating or undercooling and improving temperature uniformity.
[0052] The main channel 211 is S-shaped, which significantly extends its length within a limited space, requiring the fluid to undergo multiple turns to traverse the entire channel. At the same volumetric flow rate, the residence time of the fluid within the main channel 211 is significantly increased, as is the contact time with the channel wall, resulting in more efficient heat transfer. Therefore, the heating rate can be slowed down during the heating phase, while heat dissipation can be accelerated during the cooling phase, enhancing thermal management.
[0053] For example, the plurality of turbulence protrusions 212 include a plurality of first protrusions 2121 and a plurality of second protrusions 2122 respectively disposed on opposite sides of the flow channel wall of the main flow channel 211. The plurality of first protrusions 2121 and the plurality of second protrusions 2122 are all spaced apart along the extension direction of the main flow channel 211, and at least one second protrusion 2122 extends into the gap between two adjacent first protrusions 2121. With this design, an asymmetric disturbance source can be introduced into the region where the fluid originally flows smoothly. By breaking the original symmetrical flow path of the fluid, it forces the fluid to generate disordered lateral displacement and vortex motion in local areas, thereby significantly enhancing the turbulence intensity. At the same time, this asymmetric disturbance layout can effectively increase the disturbance frequency, prevent the formation of localized heat accumulation or insufficient distribution within the flow channel, ensure that the temperature at each location on the flow channel wall remains basically consistent with the temperature of the main flow area, and avoid the decrease in chip surface accuracy caused by temperature unevenness, as well as the thermal deformation problem of the thermosetting bonding head.
[0054] For example, the first protrusion 2121 and the second protrusion 2122 are arranged alternately and at intervals along the extension direction of the main flow channel 211, that is, a second protrusion 2122 is arranged between two adjacent first protrusions 2121. The alternating arrangement of the first protrusions 2121 and the second protrusions 2122 forms a symmetrical flow channel. After passing through the first protrusion 2121, the fluid is deflected to one side and then guided to the other side by the second protrusion 2122, forming a regular transverse flow. This avoids local stagnation or excessive deflection of the fluid in the flow channel, reduces pressure fluctuations and flow dead zones, and ensures uniform pressure distribution in the main flow channel 211.
[0055] The liquid cooling plate 2 heats up under the action of the heating plate 3. If the liquid cooling plate 2 is in direct contact with the support base 1, heat will be transferred to the support base 1, causing a local temperature increase and thermal expansion deformation of the support base 1. Therefore, as... Figure 1 As shown, in some embodiments, the thermocompression bonding head further includes a heat insulation component 5. The heat insulation component 5 is disposed between the liquid cooling plate 2 and the support base 1 and is made of heat-insulating material. This effectively blocks the heat transfer path between the liquid cooling plate 2 and the support base 1, preventing the support base 1 from deforming due to heat and affecting the overall structural rigidity of the device, thereby ensuring the positioning accuracy and movement stability of the bonding head. Simultaneously, after the heat insulation component 5 prevents heat from diffusing to the support base 1, more heat is retained on the liquid cooling plate 2 and above it (such as the heating plate 3 and the suction cup 6), thereby improving heat utilization and avoiding energy waste. Exemplarily, the heat insulation component 5 is a microcrystalline glass plate, silicon nitride ceramic, or polyimide, etc.
[0056] In some embodiments, the thermocompression bonding head further includes a suction cup 6, which is disposed on the side of the heating plate 3 facing away from the liquid cooling plate 2. The orthographic projection of the suction cup 6 onto the support base 1 lies within the orthographic projection of the heating plate 3 onto the support base 1, and the orthographic projection of the heating plate 3 onto the support base 1 lies within the orthographic projection of the liquid cooling plate 2 onto the support base 1. That is, the suction cup 6, heating plate 3, and liquid cooling plate 2 are stacked sequentially from top to bottom, with the orthographic projection of the heating plate 3 completely covered by the liquid cooling plate 2, meaning that the liquid cooling plate 2 provides all-around physical support for the heating plate 3. During rapid heating and cooling, the heating plate 3 will experience thermal expansion or contraction. The large contact area of the liquid cooling plate 2 can evenly distribute these deformation stresses, preventing local warping or deformation of the heating plate 3, thereby ensuring its structural stability during long-term use. The side of the suction cup 6 facing away from the heating plate 3 is used to adsorb the chip 100.
[0057] Furthermore, the orthographic projection of the suction cup 6 lies within the heating plate 3, meaning that the suction cup 6 only covers the central functional area of the heating plate 3, not its edges. This avoids the edge areas being suspended or experiencing uneven force due to the suction cup 6's large area when adsorbing the chip 100 (e.g., slight deformation of the suction cup 6's edges due to uneven vacuum adsorption force). Moreover, the pressure during chip bonding is concentrated in the central functional area of the heating plate 3, ensuring that the pressure acts directly on the chip bonding surface, thus improving bonding quality.
[0058] Specifically, the thermocompression bonding head adopts a layered stacked structure, consisting of a support base 1, a heat insulation component 5, a liquid cooling plate 2, a heating plate 3, and a suction cup 6, from bottom to top. The components are fixed together via a vacuum adsorption system. The upper surface of the support base 1 has vacuum channels for adsorbing and fixing the heat insulation component 5. The upper surface of the heat insulation component 5 uses vacuum channels to adsorb the liquid cooling plate 2. The upper surface of the liquid cooling plate 2 uses vacuum channels to connect to the heating plate 3. The upper surface of the heating plate 3 uses vacuum channels to fix the suction cup 6. Finally, the upper surface of the suction cup 6 uses vacuum channels to complete the adsorption and fixation of the chip 100.
[0059] In this structure, the suction cup 6 serves as a functional component that directly contacts the chip 100, achieving precise positioning and bonding of the chip 100 through vacuum adsorption. The heating plate 3, as the core heat source, provides a precise and controllable heating environment for chip bonding. The liquid cooling plate 2 integrates the cooling channel 21 and the heat exchange system 4, undertaking the tasks of rapid cooling of the chip 100 after bonding and ensuring chip surface shape and bonding quality. The heat insulation component 5 uses low thermal conductivity materials such as microcrystalline glass to effectively block heat transfer from the heating plate 3 to the support base 1, preventing the overall structure from being affected by thermal deformation and thus the bonding accuracy. The support base 1, as a load-bearing base, provides stable mechanical support for the multi-layer structure above. All components are connected rigidly as a whole through vacuum adsorption, ensuring the stability of heat-force transfer during bonding and achieving modular functional integration.
[0060] In some embodiments of this application, a bonding apparatus is also provided, which includes the hot-press bonding head described in any of the above-described technical solutions. Since the hot-press bonding head in this bonding apparatus has the same technical features as the aforementioned hot-press bonding head, both can solve the same technical problem and achieve the same technical effect.
[0061] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0062] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.
Claims
1. A thermocompression bonding head, characterized in that, include: Support base; A liquid cooling plate is disposed on one side of the support base, and a cooling channel is provided inside the liquid cooling plate; A heating plate is disposed on the side of the liquid cooling plate opposite to the support base; A heat exchange system includes a liquid supply line and a gas supply line, wherein the liquid supply line and the gas supply line are selectively in fluid communication with the inlet of the cooling channel; When the heating plate is heating, the gas supply line is fluidly connected to the inlet of the cooling channel to continuously supply gas into the cooling channel; when the heating plate stops heating, the liquid supply line is fluidly connected to the inlet of the cooling channel to continuously supply coolant into the cooling channel.
2. The thermocompression bonding head according to claim 1, characterized in that, The heat exchange system further includes an outlet pipe, one end of which is fluidly connected to the outlet of the cooling channel and the other end of which is fluidly connected to the inlet of the liquid supply pipe; the exhaust port of the gas supply pipe is fluidly connected to the liquid supply pipe, and the inlet of the gas supply pipe is used to connect to a gas source.
3. The thermocompression bonding head according to claim 2, characterized in that, A first control valve is installed on the liquid supply pipeline, which controls the opening or closing of the liquid supply pipeline; the exhaust port of the gas supply pipeline is connected to the section of the liquid supply pipeline located between the first control valve and the inlet of the cooling channel; a second control valve is installed on the gas supply pipeline, which controls the opening or closing of the gas supply pipeline. When the heating plate is heating, the first control valve is disconnected and the second control valve is turned on; when the heating plate stops heating, the first control valve is turned on and the second control valve is disconnected.
4. The thermocompression bonding head according to claim 3, characterized in that, The heat exchange system also includes a water chiller, which includes a housing and a water pump and a liquid storage tank disposed within the housing. The liquid storage tank is fluidly connected between the inlet of the outlet pipe and the inlet of the supply pipe. An exhaust port is provided on the top of the liquid storage tank. The water pump is used to drive the coolant in the liquid storage tank to flow to the supply pipe. After the heating plate has finished cooling, both the first control valve and the second control valve are turned on, and the water pump is turned off, so that a portion of the gas in the gas supply pipe flows through the cooling channel to the liquid storage tank of the water chiller, and another portion of the gas flows through the supply pipe to the liquid storage tank of the water chiller.
5. The thermosetting bonding head according to claim 1, characterized in that, The cooling channel includes a main channel and a plurality of turbulence protrusions disposed on the channel wall of the main channel, the plurality of turbulence protrusions being spaced apart along the extension direction of the main channel.
6. The thermocompression bonding head according to claim 5, characterized in that, The main road is S-shaped and meandering.
7. The thermocompression bonding head according to claim 5, characterized in that, The plurality of the turbulence protrusions include a plurality of first protrusions and a plurality of second protrusions respectively disposed on opposite sides of the flow channel wall of the main flow channel; the plurality of first protrusions and the plurality of second protrusions are all spaced apart along the extension direction of the main flow channel, and at least one second protrusion extends into the interval between two adjacent first protrusions.
8. The thermocompression bonding head according to claim 1, characterized in that, The hot-press bonding head also includes: A heat insulation element is disposed between the liquid cooling plate and the support base and is made of heat insulation material.
9. The thermocompression bonding head according to claim 1, characterized in that, The hot-press bonding head also includes: A suction cup is disposed on the side of the heating plate opposite to the liquid cooling plate; The orthographic projection of the suction cup on the support base is located within the orthographic projection of the heating plate on the support base, and the orthographic projection of the heating plate on the support base is located within the orthographic projection of the liquid cooling plate on the support base.
10. A bonding apparatus, characterized in that, Includes the thermocompression bonding head as described in any one of claims 1 to 9.