A two-way four-pin infrared receiver holder

Abstract

The application relates to a bidirectional four-needle-angle infrared receiver support, which comprises a base plate, a plurality of supports arranged in an array are arranged on the base plate, each support comprises a packaging groove, four pins, a mounting plate and a shielding plate, a plurality of packaging grooves are arranged in an array on the base plate, the four pins are connected with the groove walls on the two sides of the packaging groove respectively in pairs, the two pins located on the upper side of the packaging groove are connected with the mounting plate, the two pins located on the lower side of the packaging groove are respectively provided with a first solder pad and a second solder pad matched with the lower side of the mounting plate, and the shielding plate is connected with one end of the mounting plate. The application belongs to the field of infrared receiving equipment, welding reliability is improved, and the welding yield is increased from 90% to 99.5%; the shielding plate is arranged, which is helpful for improving signal quality, the support is convenient to position, and the production efficiency of chip packaging is improved.

Description

Technical Field

[0001] This application relates to infrared receiving devices, and more particularly to a bidirectional four-pin corner infrared receiver bracket. Background Technology

[0002] With the miniaturization of electronic devices, the installation of infrared receivers faces the following technical challenges: traditional bracket pin soldering has poor stability and is prone to cold solder joints; electromagnetic interference is severe when installed at high density; there is a lack of effective positioning structure, resulting in low assembly efficiency; and insufficient heat dissipation performance affects the lifespan of the device.

[0003] Therefore, there is an urgent need for a bidirectional four-pin corner infrared receiver bracket that combines high stability and efficient heat dissipation. Utility Model Content

[0004] Therefore, it is necessary to provide a bidirectional four-pin corner infrared receiver bracket, the specific technical solution of which is as follows.

[0005] A bidirectional four-pin corner infrared receiver bracket includes a substrate. Multiple brackets are arranged in an array on the substrate. Each bracket includes an encapsulation slot, four pins, a mounting plate, and a shielding plate. The encapsulation slots are arranged in an array on the substrate. The four pins are connected in pairs to the slot walls on both sides of the encapsulation slot. The two pins located on the upper side of the encapsulation slot are connected to the mounting plate. The two pins located on the lower side of the encapsulation slot are respectively provided with a first pad and a second pad adapted to the lower side of the mounting plate. The shielding plate is connected to one end of the mounting plate.

[0006] Furthermore, the shielding plate includes two first bent rods, an end face shielding portion, two second bent rods, a top face shielding portion, and two connecting rods. The two first bent rods are connected to both sides of one end of the mounting plate. The end face shielding portion is connected to the ends of the two first bent rods. The two second bent rods are connected to both sides of the end of the end face shielding portion. The top face shielding portion is connected to the ends of the two second bent rods. The two ends of the two connecting rods are respectively connected to both sides of the end of the top face shielding portion and the groove wall of one end of the encapsulation groove.

[0007] Furthermore, a signal receiving window is provided on the top shielding part, a first through hole is provided between the end shielding part and the two first bent rods and the mounting plate, and a second through hole is provided between the top shielding part and the two connecting rods and the groove wall of the encapsulation groove.

[0008] Furthermore, the mounting plate has a clearance notch on its lower side, and the clearance notch has a first step, a second step, and a third step in sequence. The first pad and the second pad extend into the clearance notch, and the upper sides of the first pad and the second pad are adapted to the first step, the second step, and the third step.

[0009] Furthermore, the first pad and the second pad are L-shaped plate structures. The upper side of the vertical section of the first pad is adapted to the step surface of the first step, the upper side of the horizontal section of the first pad is adapted to the left end of the step surface of the second step, the upper side of the vertical section of the second pad is adapted to the right end of the step surface of the second step, and the upper side of the horizontal section of the second pad is adapted to the step surface of the third step.

[0010] Furthermore, the first and second pads are provided with positioning holes.

[0011] Furthermore, the substrate has pin extensions on both sides near the packaging groove that are connected to the four pins, and a connection is provided between two pin extensions on the same side. The pin extensions have cutouts on both sides.

[0012] Furthermore, a positioning notch is provided on one side wall of the encapsulation groove, and the positioning notch is arranged between the two pins.

[0013] Furthermore, the multiple supports are arranged in two rows on both sides of the substrate, and multiple horizontally extending positioning grooves are symmetrically arranged on both sides of the substrate. The positioning grooves correspond to two pins on one side of the support, and multiple evenly arranged waist-shaped holes are provided in the middle of the substrate.

[0014] Compared with existing technologies, this utility model has the following beneficial effects:

[0015] This utility model's bidirectional four-pin corner infrared receiver bracket improves welding reliability, increasing the welding yield from 90% to 99.5%; the addition of a shielding plate helps improve signal quality; and the bracket's convenient positioning helps improve chip packaging production efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the bidirectional four-pin corner infrared receiver bracket of this utility model;

[0018] Figure 2 yes Figure 1 Enlarged schematic diagram of the structure at point a;

[0019] Figure 3 yes Figure 2 A magnified schematic diagram of the structure at point b.

[0020] Explanation of reference numerals in the attached figures:

[0021] 1. Substrate; 2. Support; 3. Encapsulation slot; 4. Four pins; 5. Mounting plate; 6. Shielding plate; 7. First pad; 8. Second pad; 9. First bending rod; 10. End face shield; 11. Second bending rod; 12. Top face shield; 13. Connecting rod; 14. Signal receiving window; 15. First through hole; 16. Second through hole; 17. Clearance notch; 18. First step; 19. Second step; 20. Third step; 21. Positioning hole; 22. Pin extension; 23. Connecting joint; 24. Cutout; 25. Positioning notch; 26. Positioning groove; 27. Waist-shaped hole. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] The embodiments of this utility model will be described below based on its overall structure.

[0024] Reference Figures 1-3 As shown, this embodiment provides a bidirectional four-pin corner infrared receiver bracket, including a substrate 1. The substrate 1 is provided with a plurality of arrayed brackets 2. Each bracket 2 includes an encapsulation slot 3, four pins 4, a mounting plate 5, and a shielding plate 6. The four pins 4 are a positive pin, a negative pin, a signal pin, and an NC pin, respectively. The plurality of encapsulation slots 3 are arranged in an array on the substrate 1. The four pins 4 are connected to the slot walls on both sides of the encapsulation slot 3 in pairs. The two pins 4 located on the upper side of the encapsulation slot 3 are connected to the mounting plate 5. The two pins 4 located on the lower side of the encapsulation slot 3 are respectively provided with a first pad 7 and a second pad 8 adapted to the lower side of the mounting plate 5. The shielding plate 6 is connected to one end of the mounting plate 5.

[0025] In this utility model's bidirectional four-pin corner infrared receiver bracket, the arrayed encapsulation slots 3 achieve high-density mounting with a device spacing of ≤2mm; the paired pins 4 reduce wiring impedance by 40%; the mounting plate 5 and the shielding plate 6 form a three-dimensional support structure, increasing bending strength by 50%. Furthermore, flow-blocking grooves are provided at the base of the four pins 4 to prevent silicone from flowing onto the pins during encapsulation, thus avoiding affecting the pins' conductivity.

[0026] Specifically, refer to Figure 2 and Figure 3 As shown, the shielding plate 6 includes two first bent rods 9, an end face shielding part 10, two second bent rods 11, a top face shielding part 12, and two connecting rods 13. The two first bent rods 9 are connected to both sides of one end of the mounting plate 5. The end face shielding part 10 is connected to the ends of the two first bent rods 9. The two second bent rods 11 are connected to both sides of the end of the end of the end face shielding part 10. The top face shielding part 12 is connected to the ends of the two second bent rods 11. The two ends of the two connecting rods 13 are respectively connected to both sides of the end of the top face shielding part 12 and the groove wall of one end of the encapsulation groove 3. In this embodiment, the first bent rods 9, the second bent rods 11, the end face shielding part 10, and the top face shielding part 12 form a Faraday cage structure with a shielding effectiveness ≥30dB. The connecting rods 13 achieve equipotential connection between the shielding body and the encapsulation groove 3, eliminating potential difference interference. The wavy structure of the top face shielding part 12 increases the heat dissipation area by 30%.

[0027] Specifically, refer to Figure 2 and Figure 3 As shown, a signal receiving window 14 is provided on the top shielding part 12, and a first through hole 15 is provided between the end shielding part 10 and the two first bent rods 9 and the mounting plate 5. A second through hole 16 is provided between the top shielding part 12 and the two connecting rods 13 and the groove wall of the encapsulation groove 3. In this embodiment, the trapezoidal opening of the signal receiving window 14 expands the receiving angle to ±25°, the first through hole 15 realizes thermal expansion compensation of the mounting plate 5 (compensation amount ±0.2mm), the second through hole 16 reduces structural stress, and the vibration test passes the IEC60068-2-6 standard.

[0028] Specifically, refer to Figure 2 and Figure 3 As shown, the mounting plate 5 has a clearance notch 17 on its lower side. The clearance notch 17 has a first step 18, a second step 19, and a third step 20 arranged sequentially. The first pad 7 and the second pad 8 extend into the clearance notch 17, and their upper surfaces are adapted to the first step 18, the second step 19, and the third step 20. In this embodiment, the three steps (18-20) and the L-shaped pads (7,8) form a mechanical interlock, with a positioning accuracy of ±0.05mm. The horizontal section of the pads increases the welding area by 30%, and the tensile test result is ≥5kgf. The vertical section cooperates with the step surface to eliminate welding thermal deformation.

[0029] Specifically, refer to Figure 2 and Figure 3As shown, the first pad 7 and the second pad 8 are L-shaped plate structures. The upper side of the vertical section of the first pad 7 is adapted to the step surface of the first step 18. The upper side of the horizontal section of the first pad 7 is adapted to the left end of the step surface of the second step 19. The upper side of the vertical section of the second pad 8 is adapted to the right end of the step surface of the second step 19. The upper side of the horizontal section of the second pad 8 is adapted to the step surface of the third step 20.

[0030] Specifically, refer to Figure 2 and Figure 3 As shown, the first pad 7 and the second pad 8 are provided with positioning holes 21. The positioning holes 21 facilitate positioning, help to achieve automated packaging, and improve efficiency.

[0031] Specifically, refer to Figure 2 and Figure 3 As shown, the substrate 1 has pin extensions 22 on both sides near the packaging groove 3, which are connected to the four pins 4. A connecting joint 23 is provided between two pin extensions 22 on the same side, and cutouts 24 are provided on both sides of the pin extensions 22. The connection joints 23 and cutouts 24 help to enhance structural reliability, increase strength, and prevent stress concentration.

[0032] Specifically, refer to Figure 2 and Figure 3 As shown, a positioning notch 25 is provided on one side wall of the encapsulation groove 3, and the positioning notch 25 is arranged between the two pins 4. In this embodiment, the positioning notch 25 cooperates with the fixture to achieve blind mounting positioning (error <0.1mm);

[0033] Specifically, refer to Figure 1 Multiple supports 2 are arranged in two rows on both sides of the substrate 1. Multiple laterally extending positioning grooves 26 are symmetrically arranged along the edges of both sides of the substrate 1. Each positioning groove 26 corresponds to two pins 4 on one side of the support 2. Multiple evenly arranged waist-shaped holes 27 are provided in the center of the substrate 1. In this embodiment, the double-row arrangement increases space utilization by 60%; the waist-shaped holes 27 enable adaptive adjustment of thermal deformation (displacement ±0.3mm).

[0034] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The above embodiments only illustrate one or more implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A bidirectional four-pin corner infrared receiver bracket, comprising a substrate (1), characterized in that, The substrate (1) is provided with a plurality of arrayed brackets (2). Each bracket (2) includes an encapsulation slot (3), four pins (4), a mounting plate (5), and a shielding plate (6). The plurality of encapsulation slots (3) are arranged in an array on the substrate (1). The four pins (4) are connected to the slot walls on both sides of the encapsulation slot (3) in pairs. The two pins (4) located on the upper side of the encapsulation slot (3) are connected to the mounting plate (5). The two pins (4) located on the lower side of the encapsulation slot (3) are respectively provided with a first pad (7) and a second pad (8) adapted to the lower side of the mounting plate (5). The shielding plate (6) is connected to one end of the mounting plate (5).

2. The bidirectional four-pin corner infrared receiver bracket according to claim 1, characterized in that, The shielding plate (6) includes two first bent rods (9), an end face shielding part (10), two second bent rods (11), a top face shielding part (12), and two connecting rods (13). The two first bent rods (9) are connected to both sides of one end of the mounting plate (5). The end face shielding part (10) is connected to the ends of the two first bent rods (9). The two second bent rods (11) are connected to both sides of the end of the end face shielding part (10). The top face shielding part (12) is connected to the ends of the two second bent rods (11). The two ends of the two connecting rods (13) are respectively connected to both sides of the end of the top face shielding part (12) and the groove wall of one end of the encapsulation groove (3).

3. A bidirectional four-pin corner infrared receiver bracket according to claim 2, characterized in that, A signal receiving window (14) is provided on the top shield (12), a first through hole (15) is provided between the end shield (10) and the two first bent rods (9) and the mounting plate (5), and a second through hole (16) is provided between the top shield (12) and the two connecting rods (13) and the wall of the encapsulation groove (3).

4. A bidirectional four-pin corner infrared receiver bracket according to claim 1, 2, or 3, characterized in that, The mounting plate (5) has a clearance notch (17) on its lower side. The clearance notch (17) has a first step (18), a second step (19), and a third step (20) in sequence. The first pad (7) and the second pad (8) extend into the clearance notch (17), and the upper side of the first pad (7) and the second pad (8) are adapted to the first step (18), the second step (19), and the third step (20).

5. A bidirectional four-pin corner infrared receiver bracket according to claim 4, characterized in that, The first pad (7) and the second pad (8) are L-shaped plate structures. The upper side of the vertical section of the first pad (7) is adapted to the step surface of the first step (18). The upper side of the horizontal section of the first pad (7) is adapted to the left end of the step surface of the second step (19). The upper side of the vertical section of the second pad (8) is adapted to the right end of the step surface of the second step (19). The upper side of the horizontal section of the second pad (8) is adapted to the step surface of the third step (20).

6. A bidirectional four-pin corner infrared receiver bracket according to claim 5, characterized in that, The first pad (7) and the second pad (8) are provided with positioning holes (21).

7. A bidirectional four-pin corner infrared receiver bracket according to claim 5, characterized in that, The substrate (1) has pin extensions (22) on both sides near the encapsulation groove (3) that are connected to the four pins (4). A connection (23) is provided between two pin extensions (22) on the same side. Cutouts (24) are provided on both sides of the pin extensions (22).

8. A bidirectional four-pin corner infrared receiver bracket according to claim 7, characterized in that, The packaging groove (3) has a positioning notch (25) on one side wall, and the positioning notch (25) is arranged between two pins (4).

9. A bidirectional four-pin corner infrared receiver bracket according to claim 7, characterized in that, Multiple brackets (2) are arranged in two rows on both sides of the substrate (1). Multiple horizontally extending positioning grooves (26) are symmetrically arranged on both sides of the substrate (1). The positioning grooves (26) correspond to two pins (4) on one side of the bracket (2). Multiple evenly arranged waist-shaped holes (27) are provided in the middle of the substrate (1).

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