Chip pin shaping device for improving chip electrical mounting safety

Abstract

The utility model relates to the technical field of chip packaging provides a chip pin forming equipment for improving chip electric installation security, including support base plate, fixed bolster and press -down mechanism, the fixed bolster is fixed on support base plate, the press -down mechanism is fixed on fixed bolster, still include upper die and lower die, the upper die is connected with press -down mechanism, the lower die is also fixed on support base plate, the upper die is configured as the close adhesion with lower die under the action of press -down mechanism, the pin of the chip placed in the lower die is extruded as two continuous curved surfaces. By being equipped with inclined surface on the boss of upper mould, the arc section is equipped on the chip placement position of lower mould, the pin is extruded as two continuous curved surfaces when pressing down, increase the space of chip bottom, can carry out point gum etc. Mechanics buffering technology when welding, increase the anti - mechanics environmental ability of chip, also can be in the chip bottom in wiring and copper -clad, promote the compactness of printed board drawing.

Description

Technical Field

[0001] This utility model relates to the technical field of chip packaging, and in particular to a chip pin forming device for improving the safety of chip electrical assembly. Background Technology

[0002] In modern electronic devices, chip packaging technology plays a crucial role in ensuring chip performance, reliability, and the realization of circuit functions. As electronic products develop towards miniaturization and integration, the requirements for the compactness of printed circuit board (PCB) design and the mechanical environmental adaptability of chips are increasing.

[0003] Currently, some chip packages have a non-insulated bottom design, resulting in exposed metal leads. During the design process, to avoid abnormal conductivity between the chip's bottom metal surface and the conductive metal surface on the front of the printed circuit board (PCB), it's necessary to deliberately avoid routing traces and copper plating on the chip's bottom, increasing the difficulty of PCB layout and reducing its compactness. Secondly, after SMT soldering the chip in its original state, insufficient space at the bottom prevents the implementation of mechanical buffering processes such as adhesive dispensing, negatively impacting the chip's resistance to mechanical environments. Considering these two reasons, it is necessary to perform lead forming on chips with exposed metal surfaces at the bottom. Therefore, there is an urgent need for those skilled in the art to design a chip lead forming device to solve these problems. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a chip pin forming device for improving the safety of chip assembly, comprising a support base plate, a fixing frame, and a pressing mechanism. The fixing frame is fixed to the support base plate, and the pressing mechanism is fixed to the fixing frame. It also includes an upper template and a lower template. The upper template is connected to the pressing mechanism, and the lower template is also fixed to the support base plate. The upper template is configured to fit tightly against the lower template under the action of the pressing mechanism, pressing the pins of the chip placed in the lower template into two continuous curved surfaces.

[0005] Furthermore, the upper template is provided with two protrusions, which are configured to be extruded pins.

[0006] Furthermore, a chamfered surface is provided between the side of the protrusion closest to another protrusion and the bottom surface. The angle between the chamfered surface and the horizontal plane is an acute angle, which bends the pin into an arc, avoiding damage to the pin caused by being too close to a right angle.

[0007] Furthermore, the lower template is provided with grooves corresponding to the protrusions, and a chip placement position is provided between the two grooves.

[0008] Furthermore, the chip placement area has arc-shaped grooves at the four corners to facilitate chip placement and removal.

[0009] Furthermore, the chip placement area has arc-shaped cut surfaces on both sides for placing the pins.

[0010] Furthermore, the lowest horizontal plane containing the arc-shaped cut surface is higher than the inner groove surface of the groove.

[0011] Furthermore, the pressing mechanism includes a handle, a pressure rod, a pressing ring, a connector, a connecting block, and a guide block. The connector is connected to the fixed frame. The handle is hinged to the connector and the pressing ring. The pressure rod is hinged to the pressing ring. The pressure rod is connected to the connecting block. The connecting block is connected to the guide block. The guide block is connected to the upper template.

[0012] Furthermore, the guide block is provided with a guide hole, and the support base plate is provided with a guide rod. The guide block is configured to move up and down along the direction of the guide rod through the guide hole under the action of the pressing mechanism.

[0013] During operation, the up-and-down movement of the pressing mechanism drives the pressing rod to move up and down, thereby bringing the chip on the upper template into contact with and pressing it together, causing the chip pins to bend into two continuous curved surfaces.

[0014] This utility model has the following beneficial effects:

[0015] (1) This utility model has a beveled surface on the protrusion of the upper mold and an arc-shaped surface on the chip placement position of the lower mold. When pressed down, the chip pins can be squeezed into two continuous curved surfaces, increasing the space at the bottom of the chip. During soldering, mechanical buffering processes such as dispensing can be performed to increase the chip's resistance to mechanical environment. Since there is space at the bottom of the chip, traces and copper plating can be done at the bottom of the chip, improving the compactness of the printed circuit board drawing.

[0016] (2) By providing a beveled surface on the protrusion of the upper mold, this utility model can prevent the pin from being bent into a right angle and causing hard damage, improve the pin forming quality, reduce the risk of pin damage, and thus improve the safety of chip electrical assembly.

[0017] (3) The chip placement position of this utility model has arc-shaped grooves at the four corners, which facilitates the placement and removal of the chip; the two sides of the placement pin have arc-shaped cut surfaces, and the lowest horizontal plane of the arc-shaped cut surface is higher than the groove surface, which not only facilitates the placement of the pin, but also provides reasonable support and guidance for the pin during the molding process.

[0018] (4) This utility model adopts a multi-component hinged combination of handle, pressure rod, lower pressure ring, etc. Through the guiding action of guide block and guide rod, the upper template moves up and down stably, ensuring that the upper template and lower template fit tightly together, making the pin forming process stable and reliable, and improving the performance and work efficiency of the equipment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0020] Figure 2 This is a schematic diagram of the chip pins formed by extrusion molding using this utility model.

[0021] Figure 3 This is a schematic diagram of the upper template in this utility model.

[0022] Figure 4 This is a schematic diagram of the lower template in this utility model.

[0023] Figure 5 This is a schematic diagram showing the state of the chip placed inside the lower template in this utility model. Detailed Implementation

[0024] The technical solution of this utility model will be further described in detail below with reference to specific embodiments. However, this embodiment is not intended to limit this utility model. Any similar structure or similar variation of this utility model should be included in the protection scope of this utility model. The commas in this utility model all indicate the relationship between and. The English letters in this utility model are case-sensitive.

[0025] like Figure 1 As shown, this utility model provides a chip pin forming device for improving the safety of chip assembly, including a supporting base plate 1, a fixing frame 2, a pressing mechanism 3, an upper template 4, and a lower template 5. The fixing frame 2 and the lower template 5 are both fixed to the supporting base plate 1, the pressing mechanism 3 is fixed to the fixing frame 2, and the upper template 4 is connected to the pressing mechanism 3. The upper template 4 is configured to fit tightly against the lower template 5 under the action of the pressing mechanism 3, pressing the pins of the chip 6 placed in the lower template 5 into two continuous curved surfaces 61, such as... Figure 2 As shown.

[0026] like Figure 3 As shown, the upper template 4 has two protrusions 41, which are configured to extrude pins. One of the protrusions 41 has a chamfered surface 411 between its side and bottom surface near the other protrusion. The chamfered surface 411 forms an acute angle with the horizontal plane, bending the pin into an arc and preventing damage to the pin from being too close to a right angle.

[0027] like Figures 4-5As shown, the lower template 5 has grooves 51 corresponding to the protrusions 41, and a chip placement position 52 is provided between the two grooves 51. The four corners of the chip placement position 52 have arc-shaped grooves 521 for easy chip placement and removal. The two sides of the chip placement position 52 for placing pins have arc-shaped cut surfaces 522. The lowest horizontal plane of the arc-shaped cut surface 522 is higher than the inner groove surface 511 of the groove 51; this design facilitates pin placement and provides reasonable support and guidance for the pins during the molding process.

[0028] The pressing mechanism 3 includes a handle 31, a pressure rod 32, a pressing ring 33, a connecting member 34, a connecting block 35, and a guide block 36. The connecting member 34 is connected to the fixed frame 2. Preferably, a gasket 30 may be provided between the connecting member 34 and the fixed frame 2. The handle 31 is hinged to the connecting member 34 and the pressing ring 33. The pressure rod 32 is hinged to the pressing ring 33. The pressure rod 32 is connected to the connecting block 35. The connecting block 35 is connected to the guide block 36. The guide block 36 is connected to the upper template 4. The guide block 36 is provided with a guide hole 361. The supporting base plate 1 is provided with a guide rod 7. The guide block 36 is configured to move up and down along the direction of the guide rod 7 through the guide hole 361 under the action of the pressing mechanism 3. The upper template 4 moves stably up and down by means of a hinged combination of multiple components such as handle 31, pressure rod 32, and lower pressure ring 33, and is guided by guide block 36 and guide rod 7. This ensures that the upper template 4 and lower template 5 fit tightly together, making the pin forming process stable and reliable, and improving the performance and efficiency of the equipment.

[0029] During operation, the up-and-down movement of the pressing mechanism 3 drives the pressing rod 32 to move up and down, thereby causing the upper template 4 to contact and press the chip 6 on the lower template 5, bending the chip pins into two continuous curved surfaces, increasing the space at the bottom of the chip. During soldering, mechanical buffering processes such as dispensing can be performed, increasing the chip's resistance to mechanical environments. Because there is space at the bottom of the chip, traces and copper plating can be done at the bottom of the chip, improving the compactness of the printed circuit board design.

[0030] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

Claims

1. A chip pin forming device for improving the safety of chip electrical assembly, comprising a support base plate, a fixing frame, and a pressing mechanism, wherein the fixing frame is fixed to the support base plate, and the pressing mechanism is fixed to the fixing frame; characterized in that, It also includes an upper template and a lower template. The upper template is connected to the pressing mechanism, and the lower template is also fixed on the support base plate. The upper template is configured to fit tightly against the lower template under the action of the pressing mechanism, pressing the pins of the chip placed in the lower template into two continuous curved surfaces.

2. The chip pin forming apparatus for improving the safety of chip electric equipment according to claim 1, wherein, The upper template has two protrusions, which are configured to be extruded pins.

3. The chip pin forming apparatus for improving the safety of chip electric equipment according to claim 2, wherein, The protrusion has a beveled surface between the side and the bottom surface near the other protrusion.

4. The chip pin forming apparatus for improving the safety of chip electric equipment according to claim 2, wherein The lower template has grooves corresponding to the protrusions, and a chip placement position is provided between the two grooves.

5. The chip pin forming apparatus for improving the safety of chip mounting according to claim 4, wherein The chip placement area has arc-shaped grooves at the four corners.

6. The chip pin forming apparatus for improving the safety of chip mounting according to claim 4, wherein The chip placement area has arc-shaped cut surfaces on both sides for placing pins.

7. The chip pin forming apparatus for improving the safety of chip mounting according to claim 6, wherein The lowest horizontal plane containing the arc-shaped cut surface is higher than the inner groove surface of the groove.

8. The chip pin forming apparatus for improving the safety of chip mounting according to claim 6, wherein The pressing mechanism includes a handle, a pressure rod, a pressing ring, a connector, a connecting block, and a guide block. The connector is connected to the fixed frame. The handle is hinged to the connector and the pressing ring. The pressure rod is hinged to the pressing ring. The pressure rod is connected to the connecting block. The connecting block is connected to the guide block. The guide block is connected to the upper template.

9. The chip pin forming apparatus for improving the safety of chip mounting according to claim 8, wherein The guide block is provided with a guide hole, and the support base plate is provided with a guide rod. The guide block is configured to move up and down along the direction of the guide rod through the guide hole under the action of the pressing mechanism.

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