A laser marking inspection device and a laser marking system for firearm sights

Abstract

This application discloses a laser marking and inspection device and a laser marking system for firearm sights. The laser marking and inspection device includes a laser marker, a first CCD detection component, a material clamping and flipping component, a second drive mechanism, and a third drive mechanism. The laser marker and the first CCD detection component are both connected to the second drive mechanism, which drives the laser marker and the first CCD detection component to move in the Z-axis direction. The first CCD detection component is located above the clamping end of the material clamping and flipping component. The material clamping and flipping component is connected to the third drive mechanism, which drives the material clamping and flipping component to move in the X-axis direction. This application utilizes the first CCD detection component to achieve positioning and marking inspection of materials, resulting in more accurate positioning and more transparent and consistent standards for qualification judgment, which helps reduce labor costs and labor intensity.

Description

Technical Field

[0001] This application relates to the field of military laser marking technology, specifically to a laser marking detection device and a laser marking system for firearm sights. Background Technology

[0002] In the military industry, the manufacturing of various military equipment requires marking, such as the marking of firearm sights. Marking firearm sights typically involves manual handling, positioning, and laser marking. Upon receiving a nearly completed firearm sight, workers first manually position it, then activate the laser device to mark the manually positioned location. After marking, workers manually verify the marking; if it passes inspection, the marked firearm sight proceeds to the next process. Throughout the entire marking process, human involvement is significant and crucial, including manually locating the marking position and subsequently judging the marking's quality. This traditional method has low automation, high reliance on manual labor, high labor intensity, and requires improvement in positioning accuracy. Utility Model Content

[0003] This application provides a laser marking detection device and a laser marking system for firearm sights to improve the problem of low automation in laser marking methods for firearm sights.

[0004] In a first aspect, embodiments of this application provide a material gripping device, including a laser marking device, a first CCD detection component, a material clamping and flipping component, a second driving mechanism, and a third driving mechanism. The laser marking device and the first CCD detection component are both connected to the second driving mechanism. The second driving mechanism is used to drive the laser marking device and the first CCD detection component to move in the Z-axis direction. The first CCD detection component is located above the clamping end of the material clamping and flipping component. The material clamping and flipping component is connected to the third driving mechanism. The third driving mechanism is used to drive the material clamping and flipping component to move in the X-axis direction.

[0005] In some embodiments of this application, the laser marking and detection device further includes a connecting bracket, which is connected to the driving end of the second driving mechanism, and the laser marking device and the first CCD detection component are both disposed on the connecting bracket.

[0006] In some embodiments of this application, the first CCD detection component is located on the side of the laser marking device in the X-axis direction and close to the material clamping and flipping component.

[0007] In some embodiments of this application, the laser marking detection device further includes a second CCD detection component, which is located on one side of the material clamping and flipping component in the X-axis direction, and the detection end of the second CCD detection component is arranged facing the clamping end of the material clamping and flipping component.

[0008] In some embodiments of this application, the laser marking detection device further includes a fixed rail and a support base. The fixed rail extends along the Z-axis direction, and the support base is connected to the fixed rail and can be adjusted in position along the fixed rail in the Z-axis direction. The second CCD detection component is connected to the support base.

[0009] In some embodiments of this application, the material clamping and flipping assembly includes a fixed bracket, a first flipping mechanism, a second flipping mechanism, a clamping assembly, and a mounting bracket. The fixed bracket is connected to the driving end of the third driving mechanism. The first flipping mechanism is connected to one side of the fixed bracket in the Y-axis direction, and the flipping motion end of the first flipping mechanism is connected to the mounting bracket to drive the mounting bracket to rotate up and down in the plane defined by the X-axis and Z-axis. The second flipping mechanism is connected to the mounting bracket, and the flipping motion end of the second flipping mechanism is connected to the clamping assembly to drive the clamping assembly to rotate in the plane defined by the Y-axis and Z-axis.

[0010] In some embodiments of this application, the clamping assembly includes a clamping cylinder and a clamping member. One end of the clamping cylinder is connected to the flipping motion end of the second flipping mechanism, and the other end is connected to the clamping member to drive the clamping member to clamp or release the material.

[0011] In some embodiments of this application, the mounting bracket is provided with a positioning sensor, and the fixed bracket is provided with a flip sensor, the flip sensor being located on the movement path of the positioning sensor as the mounting bracket moves.

[0012] Secondly, embodiments of this application provide a laser marking system for a firearm sight, including the laser marking detection device as described in the first aspect.

[0013] In some embodiments of this application, the laser marking system of the firearm sight includes:

[0014] The workbench, on which the laser marking and inspection device is located and has a marking station, is used for positioning the workpiece to be marked, laser marking, and marking quality inspection.

[0015] A storage device is located on one side of the workbench and is used to store parts to be marked and parts that have already been marked.

[0016] A material transfer device is located on one side of the workbench and is used to hold qualified marked parts and transfer the qualified marked parts.

[0017] The material grabbing device is used to grab the parts to be marked from the storage device to the marking station, grab the marked parts already marked at the marking station back to the storage device, and grab the marked parts in the storage device in batches to the material transfer device.

[0018] Therefore, this embodiment utilizes a first CCD detection component to achieve material positioning and marking detection. Compared to manual positioning and qualification marking detection based on experience, the positioning is more accurate, and the qualification judgment standard is more transparent and consistent. Unlike manual methods, which suffer from increased positioning errors and discrepancies in qualification judgment standards due to worker fatigue over working hours, the first CCD detection component consistently maintains the positioning and qualification detection standards. Furthermore, the cooperation of the second and third drive mechanisms enables material clamping and position adjustment, ensuring the material is accurately positioned for laser marking. This adjustment is achieved through the drive mechanisms, eliminating the need for manual adjustment and resulting in more precise position control. Finally, the material clamping and flipping component enables material clamping and flipping, allowing for marking on multiple sides of the material without changing the number and position of the laser marks. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a laser marking system for a firearm sight provided in this application embodiment;

[0021] Figure 2 A schematic diagram of the material storage device in a laser marking system for a firearm sight provided in this application embodiment;

[0022] Figure 3 A schematic diagram of a laser marking detection device in a laser marking system for a firearm sight provided in this application embodiment;

[0023] Figure 4 A schematic diagram of another laser marking detection device in a laser marking system for a firearm sight provided in an embodiment of this application;

[0024] Figure 5A schematic diagram of the material gripping device in a laser marking system for a firearm sight provided in an embodiment of this application;

[0025] Figure 6 for Figure 5 A schematic diagram of the material gripping component in the provided material gripping device;

[0026] Figure 7 for Figure 5 A schematic diagram of the material gripping component in the provided material gripping device;

[0027] Figure 8 This is a schematic diagram of the material transfer mechanism in a laser marking system for a firearm sight provided in an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Workbench; 2. Material storage device; 21. Material rack; 211. Positioning plate; 212. Position sensor; 22. Material tray; 23. First drive mechanism; 3. Material transfer device; 4. Laser marking and detection device; 41. Laser marking device; 42. First CCD detection component; 43. Second CCD detection component; 44. Material clamping and flipping component; 441. Fixed bracket; 442. First flipping mechanism; 443. Clamping component; 444. Mounting bracket; 45. Second drive mechanism; 46. Third drive mechanism; 47. Connecting bracket; 5. Material gripping device; 51. Material gripping component; 511. First gripping cylinder; 512. First gripper; 52. Fourth drive mechanism; 53. Fifth drive mechanism; 54. Material transfer mechanism; 541. Support platform assembly; 541 1. First support plate; 5412. Second support plate; 5413. Support column; 5414. Buffer column; 542. Lifting cylinder; 543. Feeding assembly; 5431. Feeding cylinder; 5432. Feeding slider; 544. Workstation; 5441. Unloading station; 5442. Picking station; 545. Pushing assembly; 5451. Pushing cylinder; 5452. Connecting plate; 5453. Push rod; 546. Positioning assembly; 5461. Positioning cylinder; 5462. Positioning abutment; 55. Material tray gripping assembly; 551. Gripping bracket; 552. Gripper assembly; 5521. Second gripping cylinder; 5522. Third gripping cylinder; 5523. First clamping piece; 5524. Second clamping piece; 56. Sixth drive mechanism; 57. Seventh drive mechanism; 6. Buzzer indicator. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0032] Please see Figures 1 to 8 This application provides a laser marking system for firearm sights, including a workbench 1, a storage device 2, a material transfer device 3, a laser marking detection device 4, and a material gripping device 5. The storage device 2 is located on one side of the workbench 1 and is used to store parts to be marked and parts already marked. The material transfer device 3 is located on one side of the workbench 1 and is used to hold qualified marked parts and transfer them. The laser marking detection device 4 is located on the workbench 1 and has a marking station for positioning, laser marking, and marking quality detection of the parts to be marked. The material gripping device 5 is used to grip parts to be marked from the storage device 2 to the marking station, grip marked parts already marked at the marking station back to the storage device 2, and batch grip the marked parts in the storage device 2 to the material transfer device 3.

[0033] The technical solution provided in this application utilizes a storage device 2 to store parts to be marked and parts already marked. A material gripping device 5 then grips the parts to be marked and sends them to a laser marking and inspection device 4 for marking. The marked parts are then gripped and sent back to the storage device 2. Once a certain number of marked parts are stored in the storage device 2, the material gripping device 5 transfers the marked parts in batches to the storage device 2. The entire process of storage, material transfer, and marking is automated, which improves work efficiency and reduces labor costs and intensity. Furthermore, the laser marking and inspection device 4 can position the parts to be marked, perform laser marking, and inspect the marking quality, eliminating the need for manual marking quality inspection and positioning. This improves marking accuracy and quality, further reducing labor costs and intensity.

[0034] In some embodiments, see Figure 2The material storage device 2 includes a storage rack 21, multiple trays 22, and a first drive mechanism 23. The storage rack 21 is located on one side of the workbench 1. The multiple trays 22 are stacked and fixed to the drive end of the first drive mechanism 23 along the Z-axis. The first drive mechanism 23 is located within the frame of the storage rack 21 and is used to drive the trays 22 to move up and down, so that the trays 22 are located at a preset position for the material gripping device 5 to grip the material. The storage rack 21 is formed by connecting multiple steel bars. For example, four steel bars are placed vertically, with two steel bars placed between two adjacent vertically placed steel bars. The two steel bars are arranged opposite each other in the Z-axis direction to connect the two adjacent vertically placed steel bars. A space is formed in the middle of the four placed steel bars, and the trays 22 can be stacked in this space. The first drive mechanism 23 can also be set in this space and drive the trays 22 to move up and down in this space. The preset position is that the uppermost material tray 22 is located at the top of the storage rack 21, so as to facilitate the material gripping device 5 to grip the material tray 22 and the material in the material tray 22.

[0035] Furthermore, the storage rack 21 is provided with multiple positioning plates 211. These positioning plates 211 are arranged circumferentially around the storage rack 21, forming a positioning space within which the material tray 22 is located. When the material tray 22 rises to a preset position under the drive of the first drive mechanism 23, the uppermost material tray 22 presses against the positioning plates 211, and correspondingly, the positioning plates 211 also press against the material tray 22, thus positioning the material tray 22 in the preset position.

[0036] Furthermore, the positioning plate 211 includes a fixing plate and a positioning plate. The fixing plate is fixed to the storage rack 21, and the positioning plate is connected to the side of the fixing plate facing the tray 22. The positioning plate is inclined from bottom to top towards the tray 22, so that the initial diameter of the positioning space defined by the multiple positioning plates is less than or equal to the area defined by the maximum edge contour of the tray 22. By setting the positioning plate to be inclined towards the tray 22, and the initial diameter of the positioning space defined by the multiple positioning plates is less than or equal to the area defined by the maximum edge contour of the tray 22, when the tray 22 moves to the preset position under the drive of the first drive mechanism 23, it will contact the positioning plate to achieve the positioning of the tray 22.

[0037] Furthermore, the top-down projection shape of the material tray 22 is rectangular, and the outline area of ​​the material tray 22 gradually decreases along the top-down direction. This allows the material tray 22 to continue moving upward after contacting the positioning plate and performing a positioning function, so that the positioning plate can detach from the material tray 22, avoiding continuous squeezing of the material tray 22 and facilitating the subsequent material gripping device 5 to grip the material tray 22.

[0038] In some embodiments, the storage rack 21 is provided with at least two position sensors 212 arranged opposite to each other to detect whether the tray 22 is located at a preset position.

[0039] In some embodiments, the first drive mechanism 23 is driven by a servo motor and a rail. Specifically, a material tray 22 or a base plate is connected to a slider inside the rail. The rail acts as a guide, and the slider moves in the Z-axis direction under the drive of the servo motor, thereby driving the material tray 22 to move stably in the Z-axis direction.

[0040] In some embodiments, see Figure 3 The laser marking and inspection device 4 includes a laser marking device 41, a first CCD detection component 42, a material clamping and flipping component 44, a second driving mechanism 45, and a third driving mechanism 46. The laser marking device 41 and the first CCD detection component 42 are both connected to the second driving mechanism 45. The second driving mechanism 45 is used to drive the laser marking device 41 and the first CCD detection component 42 to move in the Z-axis direction. The first CCD detection component 42 is located above the clamping end of the material clamping and flipping component 44. The material clamping and flipping component 44 is connected to the third driving mechanism 46. The third driving mechanism 46 is used to drive the material clamping and flipping component 44 to move in the X-axis direction.

[0041] For example, after the material clamping and flipping assembly 44 obtains the part to be marked from the material gripping device 5, it moves towards the laser irradiation area of ​​the laser marking device 41 under the drive of the third drive mechanism 46, so that the part to be marked held by the material clamping and flipping assembly 44 is located at the laser irradiation area. Then, the part to be marked is irradiated by the laser to complete the marking. Before the laser marking device 41 performs laser marking on the part to be marked, the laser marking device 41 and the first CCD detection assembly 42 can be moved in the Z-axis direction by the second drive mechanism 45 to adjust the distance between the laser marking device 41 and the first CCD detection assembly 42 and the part to be marked. Under the drive of the second drive mechanism 45, the first CCD detection assembly 42 can move in the Z-axis direction to achieve focusing of the first CCD detection assembly 42 and improve detection accuracy. After the part to be marked is clamped by the material clamping and flipping assembly 44, the material clamping and flipping assembly 44, driven by the third driving mechanism 46, moves the part to be marked to directly below the laser marking machine 41. At this time, the first CCD detection assembly 42 will detect and position the part to be marked. The third driving mechanism 46 will make further fine adjustments based on the detection and positioning results of the first CCD detection assembly 42. The material clamping and flipping assembly 44 will also flip and adjust based on the detection and positioning results of the first CCD detection assembly 42 to ensure that the surface of the part to be marked faces the laser marking machine 41.

[0042] In some embodiments, the laser marking and inspection device 4 further includes a connecting bracket 47, which is connected to the driving end of the second driving mechanism 45 and can move in the Z-axis direction as driven by the second driving mechanism 45. The laser marking device 41 and the first CCD detection component 42 are both mounted on the connecting bracket 47 so that the first CCD detection component 42 and the laser marking device 41 can move synchronously with the movement of the connecting bracket 47.

[0043] It should be noted that the first CCD detection component 42 is located on the side of the laser marking device 41 in the X-axis direction and close to the material clamping and flipping component 44, so that the first CCD detection component 42 and the laser marking device 41 will not interfere with each other. Moreover, the detection angle of the first CCD detection component 42 is diffused, so that the first CCD detection component 42 can detect the position of the part to be marked even though it is not directly facing the part to be marked. In addition, the first CCD detection component 42 can also detect part of the structure of the material clamping and flipping component 44, such as the clamping end of the material clamping and flipping component 44. Based on the shape and position of the clamping end, it can determine whether the position of the part to be marked is correct.

[0044] In some embodiments, see Figure 4 The laser marking and inspection device 4 also includes a second CCD detection component 43, a fixed rail, and a support. The fixed rail is located on the worktable 1 and extends along the Z-axis. The support is connected to the fixed rail and its position can be adjusted along the fixed rail in the Z-axis direction. The second CCD detection component 43 is connected to the support, with its detection end facing the clamping end of the material clamping and flipping component 44. The support is connected to the track groove of the fixed rail by bolts or other connecting parts. The track groove extends along the Z-axis direction, so that by changing the position of the bolts connecting to the track groove, the position of the support connected to the fixed rail can be changed, thereby adjusting the position of the support in the Z-axis direction. This, in turn, allows for the adjustment of the position of the second CCD detection component 43 in the Z-axis direction, adapting to the inspection of parts to be marked at different heights. Generally speaking, once the height of the clamping end of the material clamping and flipping component 44 is determined, the position of the second CCD detection component 43 will not be easily changed, because the height of the material clamping and flipping component 44 in the Z-axis direction is fixed. Unless the material clamping and flipping component 44 is replaced, causing the height of the new clamping end to change, the second CCD detection component 43 can use the characteristic that the carrier can be adjusted in the Z-axis to change its position, so that the second CCD detection component 43 can achieve detection at different heights.

[0045] By utilizing the first CCD detection component 42 and the second CCD detection component 43, the positioning detection of the part to be marked in the X-axis and Z-axis directions is realized. In conjunction with the material clamping and flipping component 44, the flipping action of the part to be marked is used to realize visual detection of all surfaces of the part to be marked except the side facing the clamping end.

[0046] In some embodiments, see Figure 3 or Figure 4 The material clamping and flipping assembly 44 includes a fixed bracket 441, a first flipping mechanism 442, a second flipping mechanism, a clamping assembly 443, and a mounting bracket 444. The fixed bracket 441 is connected to the drive end of the third drive mechanism 46, enabling the fixed bracket 441 to move in the X-axis direction. The first flipping mechanism 442 is connected to one side of the fixed bracket 441 in the Y-axis direction, and the flipping motion end of the first flipping mechanism 442 is connected to the mounting bracket 444 to drive the mounting bracket 444 to rotate up and down in the plane defined by the X-axis and Z-axis. The second flipping mechanism is connected to the mounting bracket 444. The flipping motion end of the second flipping mechanism is connected to the clamping assembly 443, which is used to drive the clamping assembly 443 to rotate in the plane defined by the Y-axis and Z-axis, so that the part to be marked held by the clamping assembly 443 can rotate in the plane defined by the Y-axis and Z-axis, so that the side of the part to be marked in the Y-axis direction and the Z-axis direction can be flipped and set opposite to the laser marking device 41, thereby enabling the laser marking device 41 to mark multiple sides of the part to be marked.

[0047] Furthermore, the clamping assembly 443 includes a clamping cylinder and a clamping member. One end of the clamping cylinder is connected to the flipping motion end of the second flipping mechanism, and the other end is connected to the clamping member to drive the clamping member to clamp or release the material.

[0048] Furthermore, the mounting bracket 444 is equipped with a positioning sensor, and the fixed bracket 441 is equipped with a flip sensor. The flip sensor is located on the movement path of the positioning sensor as the mounting bracket 444 moves. When the first flipping mechanism 442 operates, causing the mounting bracket 444 to rotate, the positioning sensor will also move with the mounting bracket 444 until the positioning sensor moves to the flip sensor. At this point, the flip sensor will receive an electrical signal and determine that the mounting bracket 444 has rotated to a preset position, thus achieving the rotational positioning of the mounting bracket 444.

[0049] In some embodiments, see Figure 5The material gripping device 5 includes a material gripping component 51, a fourth drive mechanism 52, and a fifth drive mechanism 53. The material gripping component 51 is connected to the drive end of the fourth drive mechanism 52, which drives the material gripping component 51 to move in the Z-axis direction. Both the fourth drive mechanism 52 and the material gripping component 51 are connected to the drive end of the fifth drive mechanism 53, which drives the material gripping component 51 and the fourth drive mechanism 52 to move synchronously in the Y-axis direction, so that the material gripping component 51 moves closer to or further away from the laser marking and detection device 4. During material gripping, the fourth drive mechanism 52 actuates, driving the material gripping component 51 to move in the Z-axis direction, so that the material gripping component 51 moves closer to the material tray 22 and grips the material in the material tray 22, i.e., the part to be marked. After the material gripping component 51 grips the part to be marked, it moves away from the material tray 22 in the Z-axis direction under the drive of the fourth drive mechanism 52. Then the fifth drive mechanism 53 is activated, driving the fourth drive mechanism 52 and the material gripping component 51 to move synchronously in the Y-axis direction, so that the material gripping component 51 is close to the clamping part in the laser marking detection device used to hold the part to be marked, thereby transferring the part to be marked to the clamping part for laser marking.

[0050] Further, please see Figure 6 The material gripping assembly 51 includes a first gripping cylinder 511 and a first gripper 512. The first gripping cylinder 511 is connected to the drive end of the fourth drive mechanism 52. The first gripper 512 is connected to the drive end of the first gripping cylinder 511 so that the first gripper 512 can grip and release materials.

[0051] In some embodiments, see Figure 7The material gripping device 5 also includes a tray gripping assembly 55, a sixth drive mechanism 56, and a seventh drive mechanism 57. The drive end of the sixth drive mechanism 56 is connected to the tray gripping assembly 55 and is used to drive the tray gripping assembly 55 to move in the Z-axis direction. The seventh drive mechanism 57 is located at the drive end of the fifth drive mechanism 53. The fourth drive mechanism 52 and the sixth drive mechanism 56 are both connected to the drive end of the seventh drive mechanism 57, so that the seventh drive mechanism 57 can drive the fourth drive mechanism 52 and the sixth drive mechanism 56 to move in the X-axis direction. The tray gripping assembly 55 is used to grip the tray 22. Mainly, after the tray 22 has been filled with a preset number of marking parts, when the tray 22 needs to be replaced, the tray gripping assembly 55 will grip the tray 22 to replace it. During the transfer of the material tray 22, the sixth drive mechanism 56 drives the material tray gripping component 55 to move in the Z-axis direction, so that the material tray gripping component 55 moves toward the material tray 22 and grips the material tray 22. Then, it moves away from the material tray 22 to raise the material tray gripping component 55 and avoid interference. Then, the seventh drive mechanism 57 drives the sixth drive mechanism 56 to move in the X-axis direction, and the fifth drive mechanism 53 drives the seventh drive mechanism 57 to move in the Y-axis direction, thereby driving the material tray gripping component 55 to move in the X-axis and Y-axis directions, so that the material tray gripping component 55 moves to one side of the storage device 2. Then, the sixth drive mechanism 56 drives the material tray gripping component 55 to move downward again, placing the material tray 22 in the preset position.

[0052] Furthermore, a material transfer device 3 is provided at a preset location to carry the material trays 22 transferred from the storage rack 21. After the material trays 22 are stacked to a certain height, the staff will move the material transfer device 3 to other workstations to unload the material trays 22, thus completing the batch transfer of the marked parts. The material transfer device 3 can be a trolley.

[0053] In some embodiments, see Figure 7 The material tray gripping assembly 55 includes a gripping bracket 551 and a gripper assembly 552. The gripper assembly 552 is mounted on the gripping assembly and is used to grip and release the material tray 22. The gripping bracket 551 is connected to the drive end of the sixth drive mechanism 56 so that the gripping bracket 551 can drive the gripper assembly 552 to move in the Z-axis direction, thereby enabling the gripping assembly to approach the material tray 22 to grip the material tray 22 and move away from the storage rack 21 to avoid interference with the storage rack 21.

[0054] Furthermore, the gripper assembly 552 includes a second gripping cylinder 5521, a third gripping cylinder 5522, a first clamping plate 5523, and a second clamping plate 5524. The second gripping cylinder 5521 and the third gripping cylinder 5522 are spaced apart on the gripping bracket 551 along the Y-axis. The first clamping plate 5523 is connected to the drive end of the second gripping cylinder 5521, and the second clamping plate 5524 is connected to the drive end of the third gripping cylinder 5522, so that the distance between the first clamping plate 5523 and the second clamping plate 5524 can be changed by driving the second gripping cylinder 5521 and the third gripping cylinder 5522, thereby realizing the gripping and release of the material tray 22.

[0055] In some embodiments, see Figure 8 The material gripping device 5 also includes a material transfer mechanism 54, which is located on the workbench 1. The material transfer mechanism 54 has a feeding station 5441 and a picking station 5442, which are connected. The feeding station 5441 is used to temporarily place the parts to be marked that the material gripping component 51 grips from the storage device 2. The picking station 5442 is used to temporarily place the parts to be marked transferred from the feeding station 5441, and is then picked up by the laser marking and detection device 4 and placed at the marking station. By setting up the material transfer mechanism 54, the parts to be marked that the material gripping component 51 grips from the material tray 22 can be placed in the material transfer mechanism 54. Then, the parts to be marked are clamped by the material clamping and flipping component 44, and then marked, making the transfer of the parts to be marked smoother. Furthermore, due to the presence of the material transfer mechanism 54, while the material clamping and flipping component 44 is clamping the part to be marked for marking, the material gripping component 51 can also continue to grip the part to be marked and transfer it to the material gripping component, reducing intermediate waiting time and improving work efficiency.

[0056] Further, please see Figure 8The material transfer mechanism 54 includes a support platform assembly 541, a lifting cylinder 542, a feeding assembly 543, a workstation 544, and a pushing assembly 545. The support platform assembly 541 is mounted on the worktable 1. The lifting cylinder 542 is located at the bottom of the support platform assembly 541 and is used to drive the support platform assembly 541 to move up and down in the Z-axis direction. The workstation 544 is mounted on the support platform assembly 541 and is used to receive materials conveyed from the material gripping assembly 51. These materials include both parts to be labeled and parts already labeled. The workstation 544 has a feeding station 5441 and a picking station 5442. The feeding station 5441 is mainly used to place parts to be labeled, and the picking station 5442 is mainly used to receive parts to be labeled from the feeding station 5441 and parts labeled from the material gripping assembly 51. The picking station 5442 can also be used to place parts to be labeled. The unloading station 5441 and the unloading station 5442 are connected to allow materials to be transferred from the unloading station 5441 to the unloading station 5442. A feeding assembly 543 is located between the worktable 544 and the support platform assembly 541, serving to support the worktable 544 and drive its movement. The feeding end of the feeding assembly 543 is connected to the worktable 544 and can move in the Y-axis direction, allowing the worktable 544 to move towards the material clamping and flipping assembly 44 under the drive of the feeding assembly 543. The pushing component 545 is mounted on the workstation 544 and the pushing end of the pushing component 545 can move in the X-axis direction. The feeding station 5441 and the picking station 5442 are arranged adjacent to each other in the X-axis direction, and the feeding station 5441 is located between the picking station 5442 and the pushing end, so that when the pushing end moves toward the picking station 5442, it can move the part to be marked on the feeding station 5441 to the picking station 5442, so that the first gripper 512 of the material gripping component 51 can move to the picking station 5442 to pick up the material. Furthermore, since the position of the material picking station 5442 remains unchanged during material picking, whether the first gripper 512 picks up the part to be marked to the material clamping and flipping component 44, picks up the marked part and places it at the material picking station 5442, or takes the marked part away from the material picking station 5442, the gripping position of the first gripper 512 remains unchanged, which helps to simplify the gripping and positioning of the first gripper 512.

[0057] In some embodiments, the support platform assembly 541 includes a first support plate 5411, a second support plate 5412, a plurality of support columns 5413, and a plurality of buffer columns 5414. The plurality of support columns 5413 are disposed at the bottom of the first support plate 5411, with one end of each support column 5413 away from the first support plate 5411 fixed to the workbench 1, so that the first support plate 5411 and the workbench 1 are spaced apart, reserving space for the placement of the lifting cylinder 542. The second support plate 5412 is disposed opposite to the first support plate 5411, and the plurality of buffer columns 5414 are disposed between the first support plate 5411 and the second support plate 5412 to support the second support plate 5412. The lifting cylinder 542 is fixed to the side of the first support plate 5411 facing the worktable 1, and the telescopic end of the lifting cylinder 542 extends between the first support plate 5411 and the second support plate 5412 and is connected to the second support plate 5412, so that the lifting cylinder 542 can drive the second support plate 5412 to rise and fall in the Z-axis direction.

[0058] In some embodiments, the feeding assembly 543 is disposed on the top surface of the second support plate 5412 and includes a feeding cylinder 5431 and a feeding slider 5432. The feeding slider 5432 is sleeved on the sliding end of the feeding cylinder 5431 so that the feeding slider 5432 can move in the Y-axis direction under the drive of the feeding cylinder 5431, thereby driving the workstation 544 to move in the Y-axis direction so that the material picking station 5442 can be moved to the position for clamping the clamping part.

[0059] In some embodiments, the feeding assembly 545 includes a feeding cylinder 5451, a connecting plate 5452, and a push rod 5453. The feeding cylinder 5451 is mounted on the worktable 544, and its telescopic end faces the X-axis direction so that the telescopic end of the feeding cylinder 5451 can extend and retract in the X-axis direction. The connecting rod is connected to the telescopic end of the feeding cylinder 5451 and extends in the Y-axis direction toward the material clamping and flipping assembly 44 so that the connecting rod can move in the X-axis direction under the drive of the feeding cylinder 5451. The push rod 5453 is connected to the end of the connecting plate 5452 away from the push cylinder 5451 and extends along the X-axis towards the unloading station 5441. This allows the push rod 5453 to move in the X-axis direction when the connecting plate 5452 moves in the X-axis direction. This ensures that the telescopic end of the push cylinder 5451 does not occupy the area of ​​the station 544 in the Y-axis direction, while also applying thrust to the material located on the Y-axis side of the push cylinder 5451. This allows the material to move in the X-axis direction, which helps to shorten the length of the station 544 in the Y-axis direction and enables material pushing and avoidance.

[0060] In some embodiments, the material transfer mechanism 54 further includes a positioning component 546, which is disposed on the workstation 544 and located on the side of the pushing component 545 away from the material clamping and flipping component 44 in the Y-axis direction. The positioning end of the positioning component 546 is extendable and retractable in the Y-axis direction, and the retractable end is located above the pushing cylinder 5451, so that the retractable end can avoid the pushing cylinder 5451 during extension and retraction, thus avoiding interference. When the retractable end of the positioning component 546 extends toward the picking station 5442, it can push the marking part or the part to be marked placed on the picking station 5442 toward the material clamping and flipping component 44, so that the marking part or the part to be marked collides with the baffle on the side of the workstation 544 facing the material clamping and flipping component 44, and the baffle and the retractable end of the positioning component 546 clamp the marking part or the part to be marked, thereby completing the positioning.

[0061] Furthermore, the positioning component 546 includes a positioning cylinder 5461 and a positioning abutment 5462. The positioning cylinder 5461 is located on the workstation 544 and its telescopic end is connected to one side of the positioning abutment 5462 to drive the positioning abutment 5462 to move in the Y-axis direction, so that the positioning abutment 5462 can push the marking part or the part to be marked on the material picking station 5442 and cooperate with the baffle to complete the extrusion positioning.

[0062] In some embodiments, the laser marking system further includes a buzzer indicator 6, which is located on the workbench 1 and is used to emit an alarm sound and display an indicator light of one of three colors: red, yellow, or green, depending on the operating condition. A red light indicates a problem with the current operating condition, a yellow light serves as a warning of danger, and a green light indicates that the system is operating normally.

[0063] To better understand the working process of this laser marking system, a detailed introduction is provided below:

[0064] Please see Figures 1 to 8First, the workers place the parts to be marked into the material tray 22. Then, the stacked material trays 22 are overlapped and placed in the material storage rack 21. The first drive mechanism 23 drives the material tray 22 to move in the Z-axis direction so that the material tray 22 is positioned at the height for the material gripping device 5 to grip. Then, the fourth drive mechanism 52 drives the material gripping component 51 to move in the Z-axis direction, the fifth drive mechanism 53 drives the material gripping component 51 to move in the Y-axis direction, and the seventh drive mechanism 57 drives the material gripping component 51 to move in the X-axis direction. This achieves three-dimensional position adjustment of the material gripping component 51 so that it can grip the parts to be marked in the material tray 22 and transfer them to the unloading station 5441. Then, the pushing component 545 pushes the workpiece to be marked, moving it to the picking station 5442. Subsequently, the positioning component 546 pushes the workpiece to be marked to abut against the baffle of the worktable 544, completing the positioning of the workpiece. Then, the feeding component 543 sends the worktable 544 to the clamping end of the material clamping and flipping component 44. The material clamping and flipping component 44 moves along the X-axis under the action of the third drive mechanism 46 to clamp the workpiece to be marked. After the material clamping and flipping component 44 clamps the workpiece to be marked, the lifting cylinder 542 drives the worktable 544 to descend, so that the workpiece to be marked is released from the worktable 544, making it easier for the clamping component to move the workpiece to be marked to the laser irradiation area of ​​the laser marking machine 41. The first CCD detection component 42 and the second CCD detection component 43 are used to locate and detect the position of the part to be marked. Then, the laser marking machine 41 is turned on to mark the part to be marked. If multiple sides need to be marked, the part to be marked can be rotated by the second flipping mechanism to achieve marking on multiple sides. After marking is completed, the marking is inspected using the first CCD detection component 42 and the second CCD detection component 43. After passing the inspection, the workstation 544 is sent to the marking part by the feeding component 543 to receive the marked part and place it at the material picking station 5442. The material gripping component 51 then grabs the part to be marked from the material tray 22 and places it into the material dispensing station 5441. The marked part is then grabbed from the material picking station 5442 and placed into the material tray 22. The pushing component 545 then pushes the part to be marked back to the material picking station 5442. This process is repeated until the material tray 22 is full of marked parts. The material tray gripping component 55 is then adjusted in three-dimensional space under the joint drive of the fifth drive mechanism 53, the sixth drive mechanism 56 and the seventh drive mechanism 57. The gripper component 552 in the material tray gripping component 55 then grabs the material tray 22 and transports it to the trolley.

[0065] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0066] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0067] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0068] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent application are incorporated herein by reference, except for historical application documents that are inconsistent with or conflict with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0069] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser-marking inspection apparatus, characterized by, The device includes a laser marking device, a first CCD detection component, a material clamping and flipping component, a second driving mechanism, and a third driving mechanism. The laser marking device and the first CCD detection component are both connected to the second driving mechanism. The second driving mechanism is used to drive the laser marking device and the first CCD detection component to move in the Z-axis direction. The first CCD detection component is located above the clamping end of the material clamping and flipping component. The material clamping and flipping component is connected to the third driving mechanism, which is used to drive the material clamping and flipping component to move in the X-axis direction.

2. The laser marking and inspection device according to claim 1, characterized in that, The laser marking and inspection device also includes a connecting bracket, which is connected to the driving end of the second driving mechanism. The laser marking device and the first CCD detection component are both mounted on the connecting bracket.

3. The laser marking and inspection device according to claim 1, characterized in that, The first CCD detection component is located on the side of the laser marking device in the X-axis direction and close to the material clamping and flipping component.

4. The laser marking and inspection device according to claim 1, characterized in that, The laser marking detection device further includes a second CCD detection component, which is located on one side of the material clamping and flipping component in the X-axis direction, and the detection end of the second CCD detection component is arranged facing the clamping end of the material clamping and flipping component.

5. The laser marking and inspection device according to claim 4, characterized in that, The laser marking and inspection device also includes a fixed rail and a support base. The fixed rail extends along the Z-axis direction, and the support base is connected to the fixed rail and can be adjusted in position along the fixed rail in the Z-axis direction. The second CCD detection component is connected to the support base.

6. The laser marking and inspection device according to claim 1, characterized in that, The material clamping and flipping assembly includes a fixed bracket, a first flipping mechanism, a second flipping mechanism, a clamping assembly, and a mounting bracket. The fixed bracket is connected to the driving end of the third driving mechanism. The first flipping mechanism is connected to one side of the fixed bracket in the Y-axis direction, and the flipping motion end of the first flipping mechanism is connected to the mounting bracket to drive the mounting bracket to rotate up and down in the plane defined by the X-axis and Z-axis. The second flipping mechanism is connected to the mounting bracket, and the flipping motion end of the second flipping mechanism is connected to the clamping assembly to drive the clamping assembly to rotate in the plane defined by the Y-axis and Z-axis.

7. The laser marking and inspection device according to claim 6, characterized in that, The clamping assembly includes a clamping cylinder and a clamping member. One end of the clamping cylinder is connected to the flipping motion end of the second flipping mechanism, and the other end is connected to the clamping member to drive the clamping member to clamp or release the material.

8. The laser marking and inspection device according to claim 6, characterized in that, The mounting bracket is equipped with a positioning sensor, and the fixed bracket is equipped with a flip sensor. The flip sensor is located on the movement path of the positioning sensor as the mounting bracket moves.

9. A laser marking system for a firearm sight, characterized in that, Includes the laser marking detection device as described in any one of claims 1 to 8.

10. The laser marking system for a firearm sight according to claim 9, characterized in that, include: The workbench, on which the laser marking and inspection device is located and has a marking station, is used for positioning the workpiece to be marked, laser marking, and marking quality inspection. A storage device is located on one side of the workbench and is used to store parts to be marked and parts that have already been marked. A material transfer device is located on one side of the workbench and is used to hold qualified marked parts and transfer the qualified marked parts. The material grabbing device is used to grab the parts to be marked from the storage device to the marking station, grab the marked parts already marked at the marking station back to the storage device, and grab the marked parts in the storage device in batches to the material transfer device.

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