A control panel surface chemical deposition device

Abstract

This utility model belongs to the field of control board processing technology, specifically a chemical deposition device for control board surfaces. It includes a deposition tank with a support frame mounted on it. Two pneumatic cylinders are mounted on the top side of the support frame, each with a pneumatic rod attached to its actuating end. A lifting plate is mounted on the bottom of the two pneumatic rods, and a rotating column is rotatably mounted on the lifting plate. A frame is fixed to the bottom of the rotating column. When performing deposition on circuit boards, this utility model uses a clamping and limiting mechanism to ensure that the circuit boards are arranged neatly and orderly, maintaining appropriate spacing between them and avoiding accumulation caused by free sliding or overlapping. This ensures that the deposition solution can evenly cover each circuit board, improving the uniformity of the deposition process, guaranteeing the quality of the deposition layer, and avoiding differences in conductivity or appearance defects caused by uneven deposition.

Description

Technical Field

[0001] This utility model relates to the field of control board processing technology, specifically a chemical deposition device for the surface of a control board. Background Technology

[0002] A control board is a printed circuit board that integrates electronic components and circuits. During the manufacturing process of the circuit board, its surface needs to be chemically deposited, such as through immersion gold or immersion copper processes. By chemically depositing a thin gold layer on the surface of the circuit board, the oxidation resistance, corrosion resistance and solderability of the circuit board can be significantly improved.

[0003] A Chinese patent with announcement number CN220023230U discloses an automated copper plating production equipment for circuit boards, including a copper plating tank and a support frame. A turntable is rotatably connected to the bottom of the copper plating tank, and several top blocks are connected to the bottom of the turntable. A tray is installed at the bottom of the support frame, and several slots are provided on the bottom surface of the tray to engage with the top blocks. The support frame includes a frame body, holes, a top plate, a rotating wheel, and a pull rod. Several holes are opened on the outer wall of the frame body, and the top plate is connected to one side of the top of the frame body. A stepper motor is installed on one side of the bottom of the copper plating tank, and the output end of the stepper motor passes through the copper plating tank and is connected to one side of the bottom of the turntable. A top frame is welded to the top edge of the copper plating tank. This utility model has a reasonable structure, is easy to operate, and effectively reduces the occurrence of poor contact in circuit boards.

[0004] The aforementioned chemical deposition apparatus, when depositing on circuit boards, suffers from a lack of effective clamping and limiting mechanisms within the placement frame. This leads to the circuit boards being squeezed and piled up within the frame, preventing some boards from fully contacting the deposition medium and affecting the deposition effect. Furthermore, after deposition, a thin metal film layer forms on the surface of the circuit board. Existing deposition apparatuses lack drying mechanisms, failing to quickly dry the metal film layer. Insufficient drying reduces the adhesion between the metal film layer and the circuit board substrate, potentially causing it to detach during subsequent processing or use, affecting the conductivity and reliability of the circuit board. Therefore, to address these issues, a chemical deposition apparatus for controlling the surface of the circuit board is proposed. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art and solve the problems mentioned in the background art, this utility model proposes a chemical deposition device for controlling the surface of a plate.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: A chemical deposition device for a control panel surface, comprising a deposition tank, a support frame mounted on the deposition tank, two pneumatic cylinders mounted on the top side of the support frame, each pneumatic cylinder having a pneumatic rod mounted on its working end, and a lifting plate mounted on the bottom end of each pneumatic rod. A rotating column is rotatably mounted on the lifting plate, a frame is fixedly connected to the bottom end of the rotating column, and a driven gear is fitted onto the top end of the rotating column. A protective cover is mounted on the lifting plate, and a motor is mounted on the inner top wall of the protective cover. A drive gear is mounted on the output end of the motor, and the drive gear meshes with the driven gear. A control panel is mounted on one side wall of the deposition tank, and the control panel is used to control the pneumatic... The start-stop control of the cylinder, motor, electric actuator, fan, and heating wire is achieved through a control panel that controls two pneumatic cylinders to operate synchronously during deposition. This causes the frame and the clamped circuit board to move downwards until the circuit board is completely submerged in the solution within the deposition tank. The pneumatic cylinders then stop operating, and the motor is started, causing the drive gear to rotate, which in turn causes the rotating column to rotate the clamped circuit board. This rotation of the circuit board creates relative movement between the reagent solution and the circuit board, facilitating the flow of the reagent solution to the different sized holes on the circuit board. This allows the chemical reagent to more evenly cover the surface of the circuit board, including the fine structures such as the hole walls. This dynamic processing method helps eliminate uneven deposition and improves the uniformity of the deposition layer's thickness and conductivity.

[0007] Preferably, the top and bottom sides of the frame are provided with multiple placement slots and mounting slots. Each placement slot has an electric push rod on both sides, and the electric push rod is assembled in the mounting slot. Each electric push rod has a clamping plate at its actuating end. During the deposition process on the circuit board, in order to avoid the accumulation of circuit boards, a clamping and limiting mechanism is provided. First, the circuit board is placed in the corresponding upper and lower placement slots. Then, the electric push rod is activated to bring the two clamping plates together, thereby clamping and fixing the circuit board. The clamping and limiting mechanism ensures that the circuit boards are arranged neatly and orderly, maintaining an appropriate distance between them and avoiding accumulation caused by free sliding or overlapping. This ensures that the deposition solution can evenly cover each circuit board, improving the uniformity of the deposition process, guaranteeing the quality of the deposition layer, and avoiding differences in conductivity or appearance defects caused by uneven deposition.

[0008] Preferably, the support frame is equipped with a drying mechanism, which includes multiple nozzles. Multiple nozzles are installed on both side walls of the support frame, and the nozzles on the same side are connected by an M-shaped tube. A heating box is installed on the top side of the support frame, and the heating box is positioned between two pneumatic cylinders. An air pipe channel connects the heating box to the M-shaped tubes on both sides. A heating wire is installed inside the heating box, and an air inlet is opened on the top side of the heating box. Multiple support rods are fixed to the inner wall of the air inlet, and a fan is installed on each support rod. The fan is positioned above the heating wire. (Circuit board deposition) After the initial processing, during the drying of the thin gold layer on its surface, a pneumatic cylinder is activated to move the frame and circuit board above the deposition tank. A blower, in conjunction with heating wires, sprays heated high-temperature gas onto the circuit board surface through nozzles. Simultaneously, an electric motor rotates the circuit board, ensuring the high-temperature gas reaches all surfaces, achieving efficient and uniform drying. This rapid drying of the thin gold layer accelerates the crystallization process of the gold plating, ensuring a dense coating structure and improving wear resistance and conductivity.

[0009] Preferably, a drain pipe is connected to the bottom of one side wall of the sedimentation tank, and a one-way valve is installed on the drain pipe. After the sedimentation process is completed, a large amount of sediment liquid will remain in the sedimentation tank. By setting up the drain pipe, the sediment liquid can be discharged quickly and conveniently.

[0010] The advantages of this utility model are:

[0011] 1. In order to avoid the accumulation of circuit boards during the deposition process, this utility model sets up a clamping and limiting mechanism. First, the circuit board is placed into the corresponding upper and lower placement slots. Then, the electric push rod is activated to bring the two clamping plates together, thereby clamping and fixing the circuit board. The clamping and limiting mechanism ensures that the circuit boards are arranged neatly and orderly, maintaining an appropriate distance between them and avoiding the accumulation caused by free sliding or overlapping. This ensures that the deposition solution can evenly cover each circuit board, improving the uniformity of the deposition process, guaranteeing the quality of the deposition layer, and avoiding differences in conductivity or appearance defects caused by uneven deposition.

[0012] 2. In the deposition process of this invention, the operation of an electric motor causes the driving gear to rotate, which in turn causes the rotating column to rotate the clamped circuit board. The rotation of the circuit board causes relative movement between the reagent solution and the circuit board, which facilitates the flow of the reagent solution to the holes of different sizes on the circuit board. This allows the chemical reagent to cover the surface of the circuit board, including the fine structures such as the hole walls, more evenly. This dynamic processing method helps to eliminate the problem of uneven deposition and improves the thickness uniformity and conductivity of the deposited layer.

[0013] 3. In the drying process of the thin gold layer on the surface of the circuit board, this utility model activates a pneumatic cylinder to move the frame and circuit board above the deposition tank. A fan, in conjunction with a heating wire, sprays heated high-temperature gas onto the surface of the circuit board through nozzles. Simultaneously, an electric motor rotates the circuit board, allowing the high-temperature gas to more comprehensively contact all surfaces of the board. This achieves a highly efficient and uniform drying effect, rapidly drying the thin gold layer on the circuit board surface, accelerating the crystallization process of the gold plating layer, ensuring a dense plating structure, and improving wear resistance and conductivity. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall front-view three-dimensional structure of the device;

[0016] Figure 2 A cross-sectional three-dimensional structural diagram of the sedimentation tank and protective casing;

[0017] Figure 3 This is a schematic diagram showing the overall planar structure of the device;

[0018] Figure 4 This is a partial three-dimensional structural diagram of the device;

[0019] Figure 5 This is a schematic diagram of the three-dimensional structure of the drying mechanism;

[0020] Figure 6 This is a schematic diagram of the three-dimensional structure of the lifting mechanism;

[0021] Figure 7 This is a schematic diagram of the three-dimensional structure of the frame component;

[0022] Figure 8 A schematic diagram of the clamping and limiting mechanism in plan view;

[0023] In the diagram: 1. Sedimentation tank; 2. Support frame; 3. Pneumatic cylinder; 4. Lifting plate; 5. Rotating column; 6. Frame; 7. Driven gear; 8. Protective cover; 9. Electric motor; 10. Drive gear; 11. Placement slot; 12. Mounting slot; 13. Electric push rod; 14. Clamping plate; 15. Nozzle; 16. M-shaped tube; 17. Heating box; 18. Air pipe channel; 19. Air inlet; 20. Fan; 21. Heating wire; 22. Drain pipe; 23. Control panel. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0025] Please see Figure 1-4 and Figure 6-8 As shown, a chemical deposition device for a control panel surface includes a deposition tank 1, a support frame 2 mounted on the deposition tank 1, two pneumatic cylinders 3 mounted on the top side of the support frame 2, each pneumatic cylinder 3 having a pneumatic rod mounted on its actuating end, a lifting plate 4 mounted on the bottom end of the two pneumatic rods, a rotating column 5 rotatably mounted on the lifting plate 4, a frame 6 fixedly connected to the bottom end of the rotating column 5, a driven gear 7 mounted on the top end of the rotating column 5, a protective cover 8 mounted on the lifting plate 4, a motor 9 mounted on the top inner wall of the protective cover 8, a drive gear 10 mounted on the output end of the motor 9, and the drive gear 10 meshing with the driven gear 7; a control panel 23 mounted on one side wall of the deposition tank 1, and the control panel 23 is used to control the start and stop of the pneumatic cylinders 3, motor 9, electric push rod 13, fan 20 and heating wire 21; during operation... After the circuit board is clamped and fixed, during the deposition process, the two pneumatic cylinders 3 are controlled by the control panel 23 to work synchronously. The two pneumatic rods drive the lifting plate 4, the frame 6, and the clamped and fixed circuit board to move down until the circuit board is completely submerged in the solution in the deposition tank 1. The pneumatic cylinders 3 stop working, and then the motor 9 is started to make the drive gear 10 rotate, which forces the driven gear 7 to drive the rotating column 5 to rotate, thereby making the clamped and fixed circuit board rotate. Through the rotation of the circuit board, the reagent solution and the circuit board move relative to each other, which makes it easier for the reagent solution to flow to the holes of different sizes on the circuit board. This allows the chemical reagent to cover the surface of the circuit board more evenly, including the fine structures such as the hole walls. This dynamic processing method helps to eliminate the problem of uneven deposition and improves the thickness uniformity and conductivity of the deposition layer.

[0026] The top and bottom sides of the frame 6 are provided with multiple placement slots 11 and mounting slots 12. Each placement slot 11 has an electric push rod 13 on both sides, and the electric push rod 13 is assembled in the mounting slot 12. Each electric push rod 13 has a clamping plate 14 at its working end. During operation, when the circuit board is deposited, in order to avoid the accumulation of circuit boards, a clamping and limiting mechanism is set. First, the circuit board is placed in the corresponding upper and lower placement slots 11. Then, the electric push rod 13 is activated to bring the two clamping plates 14 together, thereby clamping and fixing the circuit board. Through the clamping and limiting mechanism, the circuit boards are arranged neatly and orderly, ensuring that the circuit boards maintain an appropriate distance between them, avoiding the accumulation caused by free sliding or overlapping. This ensures that the deposition solution can evenly cover each circuit board, improve the uniformity of the deposition process, guarantee the quality of the deposition layer, and avoid differences in conductivity or appearance defects caused by uneven deposition.

[0027] Please see Figure 1-5 As shown, a drying mechanism is installed on the support frame 2. The drying mechanism includes multiple nozzles 15. Multiple nozzles 15 are installed on both side walls of the support frame 2. Multiple nozzles 15 on the same side are connected by M-shaped tubes 16. A heating box 17 is installed on the top side of the support frame 2 and is located between two pneumatic cylinders 3. An air pipe channel 18 connects the heating box 17 to the M-shaped tubes 16 on both sides. A heating wire 21 is installed inside the heating box 17. An air inlet 19 is opened on the top side of the heating box 17. Multiple support rods are fixed on the inner wall of the air inlet 19. A fan 20 is installed on the multiple support rods and is located above the heating wire 21. During operation, after the circuit board deposition process is completed... When drying the thin gold layer on its surface, the pneumatic cylinder 3 is first activated to move the frame 6 and the circuit board above the deposition tank 1. The blower 20 operates, and with the help of the heating wire 21, the heated high-temperature gas flows into the M-shaped tubes 16 on both sides through the air pipe channel 18. Finally, it is sprayed onto the surface of the circuit board through the nozzle 15. At the same time, the motor 9 operates to make the circuit board rotate, so that the high-temperature gas can come into more comprehensive contact with all surfaces of the circuit board, thereby achieving a highly efficient and uniform drying effect. This allows the thin gold layer on the surface of the circuit board to be dried quickly, accelerates the crystallization process of the gold plating layer, ensures a dense plating structure, and improves wear resistance and conductivity.

[0028] Please see Figure 1 As shown, a drain pipe 22 is connected to the bottom of one side wall of the sedimentation tank 1, and a one-way valve is installed on the drain pipe 22. During operation, after the sedimentation process is completed, a large amount of sediment liquid will remain in the sedimentation tank 1. By setting up the drain pipe 22, the sediment liquid can be discharged quickly and conveniently.

[0029] Working Principle: Existing chemical deposition equipment lacks effective clamping and limiting mechanisms within the placement frame during circuit board deposition. This leads to circuit boards piling up and being squeezed together, preventing some from fully contacting the deposition medium and affecting the deposition effect. Furthermore, after deposition, a thin metal film forms on the circuit board surface. Current deposition equipment lacks a drying mechanism to quickly dry this metal film. Insufficient drying reduces adhesion between the metal film and the circuit board substrate, potentially causing it to detach during subsequent processing or use, affecting the circuit board's conductivity and reliability. Therefore, this paper proposes a control method to address these issues. A chemical deposition apparatus for circuit board surfaces; during the deposition process on circuit boards, in order to avoid the accumulation of circuit boards, a clamping and limiting mechanism is set up. First, the circuit board is placed into the corresponding upper and lower placement slots 11. Then, the electric push rod 13 is activated to bring the two clamping plates 14 together, thereby clamping and fixing the circuit board. Through the clamping and limiting mechanism, the circuit boards are arranged neatly and orderly, ensuring that the circuit boards maintain an appropriate distance between them, avoiding the accumulation caused by free sliding or overlapping. This ensures that the deposition solution can uniformly cover each circuit board, improve the uniformity of the deposition process, guarantee the quality of the deposition layer, and avoid differences in conductivity or appearance defects caused by uneven deposition.

[0030] After the circuit board is clamped and fixed, during the deposition process, the two pneumatic cylinders 3 are controlled by the control panel 23 to work synchronously. The two pneumatic rods drive the lifting plate 4, the frame 6, and the clamped and fixed circuit board to move down until the circuit board is completely submerged in the solution in the deposition tank 1. The pneumatic cylinders 3 stop working, and then the motor 9 is started to make the drive gear 10 rotate, which forces the driven gear 7 to drive the rotating column 5 to rotate, thereby making the clamped and fixed circuit board rotate. Through the rotation of the circuit board, the reagent solution and the circuit board move relative to each other, which makes it easier for the reagent solution to flow to the holes of different sizes on the circuit board. This allows the chemical reagent to cover the surface of the circuit board more evenly, including the fine structures such as the hole walls. This dynamic processing method helps to eliminate the problem of uneven deposition and improves the thickness uniformity and conductivity of the deposition layer.

[0031] After the circuit board deposition process is completed, when drying the thin gold layer on its surface, the pneumatic cylinder 3 is first activated to move the frame 6 and the circuit board above the deposition tank 1. The blower 20 operates, and with the cooperation of the heating wire 21, the heated high-temperature gas flows through the air pipe channel 18 into the M-shaped pipes 16 on both sides. Finally, it is sprayed onto the surface of the circuit board through the nozzle 15. At the same time, the motor 9 operates to make the circuit board rotate, so that the high-temperature gas can come into more comprehensive contact with all surfaces of the circuit board, thereby achieving a highly efficient and uniform drying effect. This allows the thin gold layer on the surface of the circuit board to be dried quickly, accelerates the crystallization process of the gold plating layer, ensures a dense plating structure, and improves wear resistance and conductivity.

[0032] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A device for controlling chemical deposition on a plate surface, characterized in that: The system includes a sedimentation tank (1), on which a support frame (2) is mounted. Two pneumatic cylinders (3) are mounted on the top side of the support frame (2). Each of the two pneumatic cylinders (3) has a pneumatic rod at its working end. A lifting plate (4) is mounted on the bottom end of the two pneumatic rods. A rotating column (5) is rotatably mounted on the lifting plate (4). A frame (6) is fixed to the bottom end of the rotating column (5). A driven gear (7) is fitted on the top end of the rotating column (5). A protective cover (8) is mounted on the lifting plate (4). An electric motor is installed on the top inner wall of the protective cover (8). The motor (9) has a drive gear (10) installed at its output end, and the drive gear (10) meshes with the driven gear (7). The top and bottom sides of the frame (6) are provided with multiple placement slots (11) and mounting slots (12). Each placement slot (11) has an electric push rod (13) on both sides, and the electric push rod (13) is assembled in the mounting slot (12). Each electric push rod (13) has a clamping plate (14) at its working end. The support frame (2) is provided with a drying mechanism, which includes multiple nozzles (15).

2. The control plate surface chemical deposition device according to claim 1, characterized in that: Multiple nozzles (15) are installed on both sides of the support frame (2). Multiple nozzles (15) on the same side are connected by M-shaped tubes (16). A heating box (17) is installed on the top side of the support frame (2). The heating box (17) is located between two pneumatic cylinders (3). An air pipe channel (18) is connected between the heating box (17) and the M-shaped tubes (16) on both sides.

3. The control plate surface chemical deposition device according to claim 2, characterized in that: The heating box (17) is equipped with a heating wire (21), and an air inlet (19) is provided on the top side of the heating box (17).

4. The control plate surface chemical deposition device according to claim 3, characterized in that: Multiple support rods are fixed on the inner wall of the air inlet (19), and a fan (20) is installed on the multiple support rods. The fan (20) is located above the heating wire (21).

5. The control plate surface chemical deposition device according to claim 1, characterized in that: A drain pipe (22) is connected to the bottom of one side wall of the sedimentation tank (1), and a one-way valve is installed on the drain pipe (22).

6. The control plate surface chemical deposition device according to claim 1, characterized in that: A control panel (23) is installed on one side wall of the sedimentation tank (1), and the control panel (23) is used to control the start and stop of the pneumatic cylinder (3), the electric motor (9), the electric push rod (13), the fan (20) and the heating wire (21).

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