An electroplating transfer device

Abstract

This utility model relates to the field of electroplating transfer technology, and in particular to an electroplating transfer device, including a transfer motor, a motor shaft mounted on the transfer motor, a transfer base plate at the lower end of the transfer motor, an electroplating tank mounted on the transfer base plate, a transfer main board mounted on the motor shaft, a horizontal cylinder mounted on the transfer main board, a transfer sub-plate mounted on the horizontal cylinder, a vertical cylinder and a vacuum pump mounted on the transfer sub-plate, a vertical slide rod mounted on the vertical cylinder, a vacuum suction cup mounted on the vertical slide rod, a vacuum pipe mounted on the vacuum pump, a storage trolley and a placement trolley mounted on the transfer base plate, the storage trolley having a storage cavity containing a circuit board, and the placement trolley having a placement cavity, and a side opening on the transfer main board. This device enables precise transfer of the circuit board from the storage cavity into the electroplating tank, improving the stability of manual material handling and placement transfer methods.

Description

Technical Field

[0001] This utility model relates to the field of electroplating transmission technology, and in particular to an electroplating transmission device. Background Technology

[0002] Electroplating conveyor is an important piece of equipment in an electroplating production line used to transport workpieces to be electroplated. It is widely used in the surface electroplating of circuit boards.

[0003] Currently, when electroplating the surface of existing circuit boards, the circuit boards are usually handled manually and randomly transported into the electroplating tank. After electroplating is completed, the circuit boards need to be manually retrieved from the electroplating tank and then transported manually into a storage vehicle for later transport to a drying oven for drying.

[0004] In the process of manually feeding and transferring circuit boards for electroplating, randomly feeding them into the electroplating tank can easily cause damage to the circuit boards and the inner wall of the metal electroplating tank. In addition, the manual material handling and transfer method has poor stability.

[0005] Therefore, we designed an electroplating transmission device for circuit board surface electroplating to meet the needs of practical applications. Summary of the Invention

[0006] The purpose of this utility model is to address the aforementioned shortcomings in the existing technology by proposing an electroplating transfer device.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] Design an electroplating transfer device, including a transfer motor, a motor shaft on the transfer motor, a transfer base plate at the lower end of the transfer motor, an electroplating tank on the transfer base plate, a transfer main board on the motor shaft, a horizontal cylinder on the transfer main board, a transfer sub-plate on the horizontal cylinder, a vertical cylinder and a vacuum pump on the transfer sub-plate, a vertical slide rod on the vertical cylinder, a vacuum suction cup on the vertical slide rod, and a vacuum pipe on the vacuum pump;

[0009] The transmission base plate is provided with a storage trolley and a placement trolley. The storage trolley has a storage cavity, and a circuit board is provided inside the storage cavity.

[0010] The material loading trolley has a material loading cavity, and the transmission main board has a side opening.

[0011] In detail, the cylinder rod preset on the horizontal cylinder passes through the transmission main plate and is fixedly installed with the transmission sub-plate, and the transmission sub-plate is a bent structure as a whole.

[0012] In detail, the vertical cylinder and the vacuum pump are both fixedly mounted on the top surface of the transmission sub-plate, and the two ends of the vacuum pipe are connected to the vacuum pump and the vacuum suction cup, respectively.

[0013] In detail, the vacuum suction cup is a cone-shaped structure and is fixedly installed at the lower end of the vertical slide rod, with the lower end surface of the vacuum suction cup being higher than the upper end surface of the electroplating tank.

[0014] In detail, both the storage car cavity and the placement car cavity have a rectangular cross-section with an open top, and the circuit board is placed in the storage car cavity.

[0015] In detail, the vacuum tube has a Z-shaped structure and vertically runs through the transmission sub-plate, and the vacuum tube has a metal corrugated pipe structure.

[0016] In detail, the side openings are two symmetrical rectangular openings that pass through the transmission main board laterally and are both higher than the top surfaces of the storage trolley and the placement trolley.

[0017] The design scheme proposed in this utility model has the following beneficial effects in application:

[0018] 1. This utility model uses a transmission motor with a transmission main board and a transmission sub-board with a vertical cylinder. A vacuum adsorption structure is set on the transmission sub-board, and a storage trolley and a placement trolley structure are also set. This enables the precise transfer of circuit boards in the storage trolley cavity into the electroplating tank, effectively avoiding the situation where the circuit boards are randomly transferred into the electroplating tank and cause collision damage to the inner wall of the metal electroplating tank.

[0019] 2. This utility model improves the stability of manual material handling and material placement by setting symmetrical storage trolley and placement trolley structures on the transmission base plate, and opening storage trolley cavity and placement trolley cavity on the storage trolley and placement trolley respectively. Attached Figure Description

[0020] Figure 1 This is a first-view perspective perspective view of the overall structure of this utility model;

[0021] Figure 2 For the present utility model Figure 1 A three-dimensional structural diagram of the transmission motherboard and transmission sub-board;

[0022] Figure 3 This is a second-view perspective perspective view of the overall structure of this utility model;

[0023] Figure 4 This is a top view of the overall structure of this utility model;

[0024] Figure 5This is a side view of the overall structure of this utility model.

[0025] In the diagram: 1. Transmission motor; 11. Motor shaft; 2. Transmission base plate; 21. Electroplating tank; 3. Transmission main board; 31. Side opening; 4. Horizontal cylinder; 41. Transmission auxiliary board; 5. Vertical cylinder; 51. Vertical slide bar; 52. Vacuum suction cup; 6. Vacuum pump; 61. Vacuum pipe; 7. Storage trolley; 71. Storage trolley cavity; 72. Circuit board; 8. Material placement trolley; 81. Material placement trolley cavity. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] Reference Figures 1-5 An electroplating transfer device includes a transfer motor 1, a motor shaft 11 on the transfer motor 1, a transfer base plate 2 at the lower end of the transfer motor 1, an electroplating tank 21 on the transfer base plate 2, a transfer main plate 3 on the motor shaft 11, a horizontal cylinder 4 on the transfer main plate 3, a transfer sub-plate 41 on the horizontal cylinder 4, a vertical cylinder 5 and a vacuum pump 6 on the transfer sub-plate 41, a vertical slide rod 51 on the vertical cylinder 5, a vacuum suction cup 52 on the vertical slide rod 51, and a vacuum pipe 61 on the vacuum pump 6.

[0028] The base plate 2 is provided with a storage trolley 7 and a feeding trolley 8. The storage trolley 7 has a storage cavity 71 and a circuit board 72 is provided inside the storage cavity 71.

[0029] The material loading trolley 8 has a material loading cavity 81, and the transmission main board 3 has a side opening 31.

[0030] It should be further noted that the cylinder rod pre-set on the horizontal cylinder 4 passes through the transmission main board 3 and is fixedly set with the transmission sub-board 41. The transmission sub-board 41 has a bent structure as a whole. The electroplating tank 21 is a device structure for surface electroplating of the circuit board 72 of the raw material that needs to be electroplated, which is the prior art.

[0031] It should be further noted that the vertical cylinder 5 and the vacuum pump 6 are both fixedly mounted on the top surface of the transmission sub-plate 41. The two ends of the vacuum pipe 61 are connected to the vacuum pump 6 and the vacuum suction cup 52 respectively. The vacuum pump 6, the vacuum pipe 61, and the vacuum suction cup 52 form a group. In the existing technology, the circuit board 72 can be vacuum adsorbed and released.

[0032] It should be further noted that the vacuum suction cup 52 is a cone-shaped structure and is fixedly installed at the lower end of the vertical slide rod 51. The lower end surface of the vacuum suction cup 52 is higher than the upper end surface of the electroplating tank 21. The outer walls of both the vacuum suction cup 52 and the vertical slide rod 51 are coated with a corrosion-resistant and high-temperature resistant coating made of nickel alloy, which improves the corrosion resistance and high-temperature resistance of the outer walls of the vacuum suction cup 52 and the vertical slide rod 51 when they are immersed in the electroplating tank.

[0033] It should be further noted that both the storage carriage 71 and the placement carriage 81 have rectangular cross-sections with open tops, which not only facilitates the vacuum adsorption and transfer of the circuit board 72 from the storage carriage 71, but also facilitates the subsequent electroplating and placement into the placement carriage 81.

[0034] The circuit board 72 is placed in the storage car cavity 71. Multiple circuit boards 72 are placed in a vertical array in the storage car cavity 71.

[0035] It should be further explained that the vacuum tube 61 has a Z-shaped structure and vertically runs through the transmission sub-plate 41. The vacuum tube 61 has a metal corrugated tube structure. When the vacuum suction cup 52 moves up and down, the vacuum tube 61 can expand and contract, but it does not affect the stable effect of vacuum adsorption.

[0036] It should be further explained that the side openings 31 are two symmetrical rectangular openings. The side openings 31 are horizontally connected to the transmission main board 3 and are both higher than the top surfaces of the storage trolley 7 and the placement trolley 8. When the transmission main board 3 rotates horizontally, it avoids the transmission main board 3 from colliding with the storage trolley 7 and the placement trolley 8 during the horizontal rotation process.

[0037] Operating procedure: First start transmission motor 1, refer to... Figure 4 The motor shaft 11 will drive the transmission sub-plate 41 to rotate counterclockwise horizontally by 90 degrees via the transmission main board 3 and then stop. At this time, the vacuum suction cup 52 is already aligned with the storage trolley cavity 71. Then, the vertical cylinder 5 is activated. (See reference...) Figure 1 The vertical slide bar 51 slides downwards, causing the vacuum suction cup 52 to move downwards. Once the vacuum suction cup 52 contacts the first circuit board 72 at the top of the storage trolley cavity 71, the vertical cylinder 5 stops and the vacuum pump 6 starts. Through the vacuum tube 61, the vacuum suction cup 52 will stably vacuum and adhere to the current circuit board 72.

[0038] Then, activate the vertical cylinder 5 to move the vacuum suction cup 52 and the circuit board 72 currently held in vacuum upwards and reset. Next, activate the transmission motor 1. (See...) Figure 4The motor shaft 11 drives the vacuum suction cup 52 and the circuit board 72 currently vacuum-adsorbed to rotate 90 degrees clockwise to the left and stop. Then, the horizontal cylinder 4 is activated to move the circuit board 72 vacuum-adsorbed horizontally to the left until it is above the electroplating tank 21. Then, the vertical cylinder 5 is activated to move the circuit board 72 vacuum-adsorbed steadily downward and immerse it in the electroplating solution preset in the electroplating tank 21, in preparation for the subsequent electroplating operation (the electroplating operation is existing technology).

[0039] After electroplating is completed, the vertical cylinder 5 is activated, which moves the electroplated circuit board 72 steadily upwards out of the electroplating tank 21. (See reference...) Figure 4 Next, start the transmission motor 1 to rotate the electroplated circuit board 72 horizontally clockwise by 90 degrees. At this point, the electroplated circuit board 72 is directly above the material placement chamber 81. Then, start the vertical cylinder 5 to move the electroplated circuit board 72 downward and steadily place it into the material placement chamber 81.

[0040] The above operation enables the circuit board 72 in the storage compartment 71 to be accurately transferred into the electroplating tank 21, avoiding the situation where the circuit board 72 is randomly transferred into the electroplating tank 21 and causes damage to the inner wall of the metal electroplating tank 21.

[0041] Moreover, the above operations improve the stability of manual material handling and material placement methods.

[0042] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An electroplating transfer device, comprising a transfer motor (1), characterized in that: The transmission motor (1) is provided with a motor shaft (11), the lower end of the transmission motor (1) is provided with a transmission base plate (2), the transmission base plate (2) is provided with an electroplating tank (21), the motor shaft (11) is provided with a transmission main plate (3), the transmission main plate (3) is provided with a horizontal cylinder (4), the horizontal cylinder (4) is provided with a transmission sub-plate (41), the transmission sub-plate (41) is provided with a vertical cylinder (5) and a vacuum pump (6), the vertical cylinder (5) is provided with a vertical slide rod (51), the vertical slide rod (51) is provided with a vacuum suction cup (52), and the vacuum pump (6) is provided with a vacuum tube (61). The transmission base plate (2) is provided with a storage trolley (7) and a placement trolley (8). The storage trolley (7) has a storage cavity (71) and a circuit board (72) is provided inside the storage cavity (71). The material placement trolley (8) has a material placement cavity (81), and the transmission main board (3) has a side opening (31).

2. The electroplating transfer device according to claim 1, characterized in that: The cylinder rod preset on the horizontal cylinder (4) passes through the transmission main plate (3) and is fixedly set with the transmission sub-plate (41). The transmission sub-plate (41) is a bent structure as a whole.

3. The electroplating transfer device according to claim 1, characterized in that: The vertical cylinder (5) and the vacuum pump (6) are both fixedly mounted on the top surface of the transmission sub-plate (41), and the two ends of the vacuum pipe (61) are connected to the vacuum pump (6) and the vacuum suction cup (52) respectively.

4. The electroplating transfer device according to claim 1, characterized in that: The vacuum suction cup (52) is a cone-shaped structure and is fixedly installed at the lower end of the vertical slide bar (51). The lower end surface of the vacuum suction cup (52) is higher than the upper end surface of the electroplating tank (21).

5. The electroplating transfer device according to claim 1, characterized in that: The top view of the storage car cavity (71) and the placement car cavity (81) are both rectangular structures with an open top. The circuit board (72) is placed in the storage car cavity (71).

6. The electroplating transfer device according to claim 1, characterized in that: The vacuum tube (61) has a Z-shaped structure and vertically penetrates the transmission sub-plate (41). The vacuum tube (61) has a metal corrugated tube structure.

7. The electroplating transfer device according to claim 1, characterized in that: The side openings (31) are two symmetrical rectangular openings. The side openings (31) pass through the transmission main board (3) laterally and are higher than the top surfaces of the storage trolley (7) and the placement trolley (8).

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