A thin-film capacitive sensor
By using the design of limiting posts and limiting holes, combined with a silicone base and sealing ring, the problems of inconvenient disassembly and difficult pressing of thin-film capacitive sensors are solved, achieving convenient installation, accurate pressing and effective protection, and extending service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU DENUOSHU ELECTRONICS CO LTD
- Filing Date
- 2025-09-19
- Publication Date
- 2026-06-30
AI Technical Summary
Existing thin-film capacitive sensors use adhesive to fix the protective film during installation, which makes disassembly inconvenient and makes it difficult to determine the pressing point when pressing, affecting the use.
It adopts a design with limiting posts and limiting holes, combined with a silicone base and sealing ring. The limiting posts are inserted into the limiting holes to achieve fixation. The auxiliary pressing mechanism ensures the accuracy of pressing, and the sealing ring and buckle structure enable easy disassembly and replacement.
It enables convenient installation and removal of thin-film capacitive sensors, ensures accurate pressing position, extends service life, and provides effective protection to avoid wear.
Smart Images

Figure CN224435435U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sensor technology, and in particular to a thin-film capacitive sensor. Background Technology
[0002] In fields such as industrial automation, automotive electronics, medical equipment, and aerospace, the demand for high-precision and high-reliability detection of physical quantities (such as pressure, displacement, humidity, and vibration) is increasing. Thin-film capacitive sensors, as a type of sensor based on the principle of capacitance change, are widely used in these scenarios due to their advantages such as simple structure, high sensitivity, fast dynamic response, and no mechanical contact. Their core working principle is: the measured physical quantity causes deformation of the thin-film material, leading to a change in the dielectric constant of the thin film or the distance between the electrodes, which in turn causes a change in the capacitance value. Finally, the measured physical quantity is deduced by detecting the change in capacitance.
[0003] However, existing thin-film capacitive sensors typically use adhesive to fix a protective film on top of the sensor during installation, which makes subsequent disassembly difficult. Furthermore, when using the thin-film capacitive sensor, it is not easy to find the pressing point, affecting its use.
[0004] Therefore, a thin-film capacitive sensor is proposed to solve the above problems. Utility Model Content
[0005] The purpose of this invention is to provide a thin-film capacitive sensor to solve the problems mentioned above. Existing thin-film capacitive sensors, when installed, have a protective film on the top of the sensor, which is usually fixed with adhesive, making subsequent disassembly difficult. Furthermore, when using the thin-film capacitive sensor, it is not easy to find the pressing point, affecting its use.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a thin-film capacitive sensor, comprising a thin-film capacitive sensor body; a base is disposed on the outer side of the thin-film capacitive sensor body, and the thin-film capacitive sensor body is disposed on the inner side of the base;
[0007] The base is provided with a protective mechanism on the top. The protective mechanism includes a cover plate, a limiting post and a limiting hole. The top of the base is provided with a cover plate, and the bottom of the cover plate is integrally formed with a limiting post. The top of the base is provided with a limiting hole. The limiting post is slidably connected to the inner side of the limiting hole, and the outer wall of the limiting post is adapted to the inner wall of the limiting hole.
[0008] A limiting mechanism is provided at the connection between the thin-film capacitive sensor body and the base, and a sealing mechanism is provided at the connection between the cover plate and the base.
[0009] Preferably, the limiting mechanism includes a placement groove, an arc surface, and a positioning block. The top of the base has a placement groove, the port of the placement groove has an arc surface, and the inner side of the placement groove has a positioning block integrally formed.
[0010] Preferably, the bottom of the positioning block is attached to the top of the thin-film capacitive sensor body, and the outer wall of the thin-film capacitive sensor body is attached to the inner wall of the placement groove.
[0011] Preferably, the sealing mechanism includes a sealing ring and a protrusion, the sealing ring is glued to the bottom of the cover plate, and the protrusion is integrally formed on the outer side of the sealing ring.
[0012] Preferably, the outer wall of the protrusion is in close contact with the inner wall of the placement groove, and the bottom of the protrusion is in contact with the top of the thin-film capacitive sensor body.
[0013] Preferably, an auxiliary pressing mechanism is provided on the outer side of the cover plate. The auxiliary pressing mechanism includes a pressing post and a pressing sheet. The bottom of the cover plate is integrally formed with a pressing post, and the top of the cover plate is integrally formed with a pressing sheet. The bottom of the pressing post is attached to the top of the thin-film capacitive sensor body.
[0014] Preferably, a fixing mechanism is provided at the connection between the base and the cover plate. The fixing mechanism includes a buckle, a protruding plate and a slot. The buckle is integrally formed on the outer side of the cover plate, the protruding plate is integrally formed on the outer side of the buckle, and the slot is provided on the outer side of the base.
[0015] Compared with the prior art, the beneficial effects of this utility model are that it provides a thin-film capacitive sensor with the following advantages:
[0016] 1. After the thin-film capacitive sensor body is fixed in place, the base is made of silicone material to prevent deformation of the thin-film capacitive sensor due to hard compression, thus providing protection and extending the service life of the thin-film capacitive sensor body.
[0017] 2. When installing the cover plate, during the process of inserting the limiting post into the limiting hole, the buckle changes shape and springs back, locking into the slot to fix the cover plate. The protruding plate makes it easy to pull the buckle, remove the cover plate, and replace it. By pressing the pressing plate, the lower pressing post presses down on the thin film capacitive sensor body, making it easier to determine the pressing position.
[0018] 3. After the cover plate is installed and fixed, the sealing ring can seal the connection, providing better protection for the thin-film capacitive sensor body. The cover plate can also prevent wear on the thin-film capacitive sensor during use, and it is easy to replace the cover plate when it is worn. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the appearance and structure of this utility model;
[0020] Figure 2 This is a schematic diagram of the placement groove structure of this utility model;
[0021] Figure 3 This is a schematic diagram of the sealing mechanism of this utility model;
[0022] Figure 4 This is a schematic diagram of the fixing mechanism of this utility model.
[0023] In the diagram: 1. Thin-film capacitive sensor body; 2. Base; 3. Placement slot; 4. Curved surface; 5. Positioning block; 6. Cover plate; 7. Limiting post; 8. Limiting hole; 9. Sealing ring; 10. Protrusion; 11. Pressing post; 12. Pressing piece; 13. Buckle; 14. Protruding plate; 15. Slot. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.
[0026] Example
[0027] Please see Figure 1-4 The present invention relates to a thin-film capacitive sensor, comprising a thin-film capacitive sensor body 1; a base 2 is provided on the outer side of the thin-film capacitive sensor body 1, and the thin-film capacitive sensor body 1 is disposed on the inner side of the base 2.
[0028] The base 2 is equipped with a protective mechanism on its top, which includes a cover plate 6, a limiting post 7, and a limiting hole 8. The cover plate 6 is located on the top of the base 2, and the bottom of the cover plate 6 is integrally formed with a limiting post 7. The limiting hole 8 is opened on the top of the base 2. The limiting post 7 is slidably connected to the inner side of the limiting hole 8. The outer wall of the limiting post 7 is adapted to the inner wall of the limiting hole 8. A limiting mechanism is provided at the connection between the thin film capacitive sensor body 1 and the base 2. A sealing mechanism is provided at the connection between the cover plate 6 and the base 2. The limiting mechanism includes a placement groove 3, an arc surface 4, and a positioning block 5. The placement groove 3 is opened on the top of the base 2, and the arc surface 4 is opened at the port of the placement groove 3. The positioning block 5 is integrally formed on the inner side of the placement groove 3. The cover plate 6 is made of PVC material.
[0029] An auxiliary pressing mechanism is provided on the outer side of the cover plate 6. The auxiliary pressing mechanism includes a pressing post 11 and a pressing piece 12. The bottom of the cover plate 6 is integrally formed with the pressing post 11, and the top of the cover plate 6 is integrally formed with the pressing piece 12. The bottom of the pressing post 11 is attached to the top of the thin film capacitive sensor body 1.
[0030] In use, the base 2 is fixed in the designated position with adhesive. The base 2 is made of silicone. The thin film capacitive sensor body 1 is placed inside the placement groove 3, so that the bottom of the positioning block 5 is attached to the top of the thin film capacitive sensor body 1, thereby limiting and fixing the thin film capacitive sensor body 1. Then, the limiting post 7 of the cover plate 6 is inserted into the limiting hole 8, so that the bottom of the pressing post 11 is attached to the top of the thin film capacitive sensor body 1. By pressing the pressing piece 12, the cover plate 6 deforms downward, so that the pressing post 11 presses down on the thin film capacitive sensor body 1. This makes it easier to determine the pressing position. In addition, the base 2 is made of silicone, which avoids hard compression that may cause the film to deform and extends the service life of the thin film capacitive sensor body 1.
[0031] Furthermore, the bottom of the positioning block 5 is attached to the top of the thin-film capacitive sensor body 1, and the outer wall of the thin-film capacitive sensor body 1 is attached to the inner wall of the placement groove 3.
[0032] To ensure a seal after installation, the sealing mechanism includes a sealing ring 9 and a protrusion 10. The sealing ring 9 is glued to the bottom of the cover plate 6, and the protrusion 10 is integrally formed on the outer side of the sealing ring 9. The outer wall of the protrusion 10 fits tightly against the inner wall of the placement groove 3, and the bottom of the protrusion 10 fits against the top of the thin film capacitive sensor body 1. After the cover plate 6 is installed and fixed, the sealing ring 9 can achieve a sealing effect at the connection, providing better protection for the thin film capacitive sensor body 1.
[0033] Furthermore, a fixing mechanism is provided at the connection between the base 2 and the cover plate 6. The fixing mechanism includes a buckle 13, a protruding plate 14, and a slot 15. The buckle 13 is integrally formed on the outer side of the cover plate 6, and the protruding plate 14 is integrally formed on the outer side of the buckle 13. The slot 15 is opened on the outer side of the base 2. When the cover plate 6 is installed, during the process of the limiting post 7 being inserted into the limiting hole 8, the buckle 13 deforms outward and springs back, locking into the slot 15, thereby fixing the cover plate 6. The protruding plate 14 is provided to facilitate pulling the buckle 13 to remove the cover plate 6 and replace it.
[0034] Working principle: In use, the base 2, made of silicone, is fixed in the designated position with adhesive. The thin-film capacitive sensor body 1 is placed inside the placement slot 3, so that the bottom of the positioning block 5 is attached to the top of the thin-film capacitive sensor body 1, thereby limiting and fixing the thin-film capacitive sensor body 1. Then, the limiting post 7 of the cover plate 6 is inserted into the limiting hole 8, so that the bottom of the pressing post 11 is attached to the top of the thin-film capacitive sensor body 1. By pressing the pressing piece 12, the pressing post 11 is pressed down on the thin-film capacitive sensor body 1. This makes it easier to determine the pressing position, and the silicone material of the base 2 avoids hard compression that could cause the thin film to deform. The shape extends the service life of the thin-film capacitive sensor body 1. When installing the cover plate 6, during the process of the limiting post 7 inserting into the limiting hole 8, the buckle 13 deforms into the shape and springs back, locking into the slot 15, thereby fixing the cover plate 6. The protruding plate 14 makes it easy to pull the buckle 13 to remove the cover plate 6 for replacement. After the cover plate 6 is installed and fixed, the sealing ring 9 can achieve the effect of sealing the connection, providing better protection for the thin-film capacitive sensor body 1. The model of the thin-film capacitive sensor body 1 is UNIGREAT-FSR-008. The structure and working principle of this model are existing technologies and will not be described in detail here.
[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A thin-film capacitive sensor, characterized by: It includes a thin-film capacitive sensor body (1); a base (2) is provided on the outside of the thin-film capacitive sensor body (1), and the thin-film capacitive sensor body (1) is provided on the inside of the base (2); The base (2) is provided with a protective mechanism on the top. The protective mechanism includes a cover plate (6), a limiting post (7) and a limiting hole (8). The base (2) is provided with a cover plate (6) on the top. The bottom of the cover plate (6) is integrally formed with a limiting post (7). The base (2) is provided with a limiting hole (8) on the top. The limiting post (7) is slidably connected to the inner side of the limiting hole (8). The outer wall of the limiting post (7) is adapted to the inner wall of the limiting hole (8). A limiting mechanism is provided at the connection between the thin-film capacitive sensor body (1) and the base (2), and a sealing mechanism is provided at the connection between the cover plate (6) and the base (2).
2. A thin-film capacitive sensor according to claim 1, wherein: The limiting mechanism includes a placement groove (3), an arc surface (4), and a positioning block (5). The top of the base (2) is provided with a placement groove (3), the port of the placement groove (3) is provided with an arc surface (4), and the inner side of the placement groove (3) is integrally formed with a positioning block (5).
3. A thin-film capacitive sensor according to claim 2, wherein: The bottom of the positioning block (5) is attached to the top of the thin film capacitive sensor body (1), and the outer wall of the thin film capacitive sensor body (1) is attached to the inner wall of the placement groove (3).
4. A thin-film capacitive sensor according to claim 2, wherein: The sealing mechanism includes a sealing ring (9) and a protrusion (10). The bottom of the cover plate (6) is glued and fixedly connected to the sealing ring (9), and the outer side of the sealing ring (9) is integrally formed with a protrusion (10).
5. A thin-film capacitive sensor according to claim 4, wherein: The outer wall of the protrusion (10) is closely fitted to the inner wall of the placement groove (3), and the bottom of the protrusion (10) is fitted to the top of the thin film capacitive sensor body (1).
6. A thin-film capacitive sensor according to claim 4, characterized in that: An auxiliary pressing mechanism is provided on the outside of the cover plate (6). The auxiliary pressing mechanism includes a pressing column (11) and a pressing piece (12). The bottom of the cover plate (6) is integrally formed with the pressing column (11), and the top of the cover plate (6) is integrally formed with the pressing piece (12). The bottom of the pressing column (11) is attached to the top of the thin film capacitive sensor body (1).
7. The thin-film capacitive sensor of claim 1, wherein: A fixing mechanism is provided at the connection between the base (2) and the cover plate (6). The fixing mechanism includes a buckle (13), a protruding plate (14), and a slot (15). The buckle (13) is integrally formed on the outer side of the cover plate (6), and the protruding plate (14) is integrally formed on the outer side of the buckle (13). The slot (15) is opened on the outer side of the base (2).