Integrated cloud control terminal for dam safety monitoring

Abstract

This utility model discloses an integrated cloud control terminal for dam safety monitoring. The cloud control terminal includes a terminal shell, a battery compartment, battery connection cables, a mainboard PCBA, an MCU core circuit, a Bluetooth communication circuit, a LoRa wireless communication circuit, a solar charge / discharge management circuit, and a vibrating wire sensor. The mainboard PCBA further includes a magnetic induction circuit, a data storage circuit, an analog quantity testing circuit, an indicator light circuit, and a buzzer circuit. The data storage circuit stores operating parameters, equipment operating information, and operating data such as seepage pressure, frequency, water level, and air pressure collected by the terminal. The analog quantity measurement circuit measures the temperature of the vibrating wire sensor and the power supply voltage of the cloud control terminal. This integrated cloud control terminal for dam safety monitoring can achieve autonomous data acquisition, storage, and calculation functions. Combined with a centralized control gateway, it can realize multi-point wireless data acquisition and transmission functions. Furthermore, it can greatly reduce the difficulty of system deployment.

Description

Technical Field

[0001] The embodiments of this utility model belong to the field of dam safety monitoring technology, and more specifically, relate to an integrated cloud control terminal for dam safety monitoring. Background Technology

[0002] As a core and crucial facility in the water conservancy engineering system, the safe operation of dams directly affects flood control safety, water resource allocation efficiency, and the safety of people's lives and property in downstream areas. With the extension of dam service life and the frequent occurrence of extreme hydrological and meteorological events, the need for real-time, accurate, and continuous monitoring of key dam status parameters (such as dam displacement, seepage field distribution, stress and strain, dam foundation settlement, water level and temperature, and deformation of the surrounding geological environment) is becoming increasingly urgent and has become a core component of the intelligent operation and maintenance system of water conservancy projects.

[0003] Currently, dam safety monitoring systems generally adopt an architecture of "distributed sensors + independent acquisition modules + single transmission link + local / simple cloud platform". Existing monitoring terminals mostly adopt general industrial designs and lack targeted protection structures, which are prone to failures such as sensor signal drift, acquisition module crashes, and transmission link interruptions. This results in missing or distorted monitoring data. The output data formats of each acquisition terminal are not uniform, and there is a lack of standardized data interaction interfaces. As a result, it is difficult to achieve efficient fusion and analysis of multi-source heterogeneous monitoring data (displacement, seepage pressure, stress, etc.) on the same cloud platform. There is a lack of a system terminal that can realize multi-point wireless data acquisition and transmission functions and has low system deployment difficulty. Summary of the Invention

[0004] To address the aforementioned deficiencies or improvement needs of existing technologies, this utility model provides an integrated cloud control terminal for dam safety monitoring. Through a LoRa wireless communication circuit built into the PCBA motherboard, long-distance, low-power data transmission can be achieved. Through an analog measurement circuit built into the PCBA motherboard, the temperature of the vibrating wire sensor and the power supply voltage of the cloud control terminal can be measured. Through a vibrating wire sensor excitation circuit built into the vibrating wire sensor, the low-voltage PWM waveform output from the MCU core circuit is amplified by a combination circuit of NPN transistors and PMOS transistors and then output to the vibrating wire sensor coil terminals, thereby enabling the vibrating wire sensor coil to generate vibration output. Through a vibrating wire signal conditioning circuit built into the vibrating wire sensor, the AC signal of the vibrating wire sensor coil during operation can be amplified. When the signal excitation circuit successfully excites the internal working coil of the vibrating wire sensor, the coil will oscillate and output a weak AC signal after the excitation signal is disconnected.

[0005] To achieve the above objectives, this utility model provides an integrated cloud control terminal for dam safety monitoring, comprising:

[0006] The cloud control terminal includes an outermost terminal shell, a battery compartment located inside the right side of the terminal shell, and a mainboard PCBA mounted on a mounting post inside the terminal shell. The mainboard PCBA has a built-in LoRa wireless communication circuit and an analog measurement circuit.

[0007] The system includes an MCU core circuit built into the central area of ​​the motherboard PCBA, a Bluetooth communication circuit built into one side of the motherboard PCBA, a LoRa wireless communication circuit built into the other side of the motherboard PCBA, a solar charging and discharging management circuit built into the other side of the motherboard PCBA and located below the MCU core circuit, and a vibrating wire sensor built into the outermost part of the other side of the motherboard PCBA; the vibrating wire sensor has a built-in vibrating wire sensor excitation circuit and a vibrating wire signal conditioning circuit.

[0008] Furthermore, it also includes a battery connection cable with an opening at the bottom inside the battery compartment.

[0009] Furthermore, the battery connection wire passes through the bottom opening inside the battery compartment to connect the battery to the motherboard PCBA.

[0010] Furthermore, the LoRa wireless communication circuit is based on the E32-TTL-100 module and adopts LoRa spread spectrum technology.

[0011] Furthermore, the E32-TTL-100 module uses a USART serial communication interface to communicate with the MCU core circuit.

[0012] Furthermore, the excitation circuit of the vibrating wire sensor is equipped with an NPN transistor Q5 and a PMOS transistor Q10, and uses a PWM signal as the signal input.

[0013] Furthermore, the PWM signal is output from the PWM output I / O port of the MCU core circuit.

[0014] Furthermore, the vibrating string signal conditioning circuit is internally equipped with a U9A voltage follower circuit and a U9B voltage follower circuit; the U9A voltage follower circuit and the U9B voltage follower circuit respectively form their respective inverting amplifier circuits.

[0015] Furthermore, the analog measurement circuit is internally equipped with an LM285 chip and an ADC chip MCP3204.

[0016] Furthermore, the ADC chip MCP3204 is connected to the MCU core circuit via an SPI interface.

[0017] In summary, compared with the prior art, the above-described technical solution conceived by this utility model can achieve the following beneficial effects:

[0018] 1. The cloud control terminal of this utility model can achieve long-distance, low-power data transmission through the LoRa wireless communication circuit built into the PCBA motherboard. Through the analog measurement circuit built into the PCBA motherboard, it can measure the temperature of the vibrating wire sensor and the power supply voltage of the cloud control terminal. Through the vibrating wire sensor excitation circuit built into the vibrating wire sensor, the low-voltage PWM waveform output by the MCU core circuit can be amplified by the NPN transistor and PMOS transistor combination circuit and output to the vibrating wire sensor coil terminal, so that the vibrating wire sensor coil can generate vibration output. Through the vibrating wire signal conditioning circuit built into the vibrating wire sensor, the AC signal when the vibrating wire sensor coil is working can be amplified. When the signal excitation circuit successfully excites the working coil inside the vibrating wire sensor, the coil will oscillate and output a weak AC signal after the excitation signal is disconnected.

[0019] 2. The LoRa wireless communication circuit of this utility model controls the E32-TTL-100 module to be in sleep mode by setting the two signals RF_M0 and RF_M1 to high level, thereby setting the working parameters. By setting both signals RF_M0 and RF_M1 to low level, the E32-TTL-100 module is controlled to be in transparent transmission mode, thereby enabling wireless communication. The C57 Zener diode is used to replenish the power of the E32-TTL-100 module when transmitting signals. The inductor L11 is used to reduce the signal transmission moment. The C74 Zener diode reduces the interference of wireless communication to other circuits of the cloud control terminal.

[0020] 3. The excitation circuit of the vibrating wire sensor of this utility model can accelerate the stabilization of the signal to a low level by changing the PWM signal from high level to low level when the excitation circuit is working. By using the bypass load resistor R18, the excessive flyback voltage generated by the vibrating wire sensor oscillation coil after the PMOS transistor Q10 is turned off can be reduced, which plays a stabilizing role in the operation of the vibrating wire sensor coil.

[0021] 4. The vibrating wire signal conditioning circuit of this utility model absorbs abnormal overshoot signals through resistor R42, limits excessive current during signal excitation through current limiting resistor R39, and limits voltages greater than ±0.7V entering the conditioning circuit through a low-voltage clamping protection circuit composed of diodes D3 and D4.

[0022] 5. The analog measurement circuit of this utility model uses a bandwidth filter circuit composed of a U4B voltage follower circuit, resistors R25, R26, R28, capacitor C13, and capacitor C16 to filter interference signals on the thermistor RL line of the vibrating wire sensor. Attached Figure Description

[0023] Figure 1This is a schematic diagram of the integrated cloud control terminal for dam safety monitoring according to an embodiment of the present invention;

[0024] Figure 2 This is a circuit functional diagram of an integrated cloud control terminal for dam safety monitoring according to an embodiment of the present invention;

[0025] Figure 3 This is a LoRa wireless communication circuit diagram of an integrated cloud control terminal for dam safety monitoring according to an embodiment of this utility model;

[0026] Figure 4 This is a circuit diagram of the vibrating wire sensor excitation circuit of the integrated cloud control terminal for dam safety monitoring according to an embodiment of the present invention;

[0027] Figure 5 This is a circuit diagram of the vibrating wire signal conditioning circuit of the integrated cloud control terminal for dam safety monitoring according to an embodiment of the present invention;

[0028] Figure 6 This is an analog quantity measurement circuit diagram of an integrated cloud control terminal for dam safety monitoring according to an embodiment of the present invention;

[0029] Figure 7 This is a flowchart illustrating the workflow of an integrated cloud control terminal for dam safety monitoring, as described in this embodiment of the present invention.

[0030] In all the accompanying drawings, the same reference numerals indicate the same technical features, specifically: 1-terminal housing, 2-battery compartment, 3-battery connection cable, 4-PCBA motherboard, 5-MCU core circuit, 6-Bluetooth communication circuit, 7-LoRa wireless communication circuit, 8-solar charging and discharging management circuit, 9-vibrating wire sensor. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Furthermore, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0032] In the description of the embodiments of this utility model, it should be noted that if terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," or "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and "third" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] Furthermore, the use of terms such as "horizontal," "vertical," and "sag" does not imply that the component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0034] In the description of the embodiments of this utility model, "a plurality of" means at least two.

[0035] In the description of the embodiments of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0036] This novel embodiment provides an integrated cloud control terminal for dam safety monitoring. For example... Figure 1As shown, the device includes a terminal housing 1, a battery compartment 2, a battery connection cable 3, a PCBA main board 4, an MCU core circuit 5, a Bluetooth communication circuit 6, a LoRa wireless communication circuit 7, a solar charging and discharging management circuit 8, and a vibrating wire sensor 9. The terminal housing 1 has mounting screw holes on its outer perimeter. The battery compartment 2 is located inside the right side of the terminal housing 1, and a through-hole for the battery connection cable 3 is located at the bottom of the battery compartment 2. The battery connection cable 3 connects the PCBA main board 4 to the battery in the battery compartment 2 through this through-hole. The PCBA main board 4 is mounted on the terminal housing 1 and contains built-in functional circuits. The MCU core circuit 5 is also built into the PCBA main board 4 and is located at P... In the central area of ​​PCBA motherboard 4, Bluetooth communication circuit 6 is built into PCBA motherboard 4, located on one side of the outer side of PCBA motherboard 4. LoRa wireless communication circuit 7 is built into PCBA motherboard 4, located on the other side of PCBA motherboard 4 and on the same side as Bluetooth communication circuit 6. Solar charging and discharging management circuit 8 is built into PCBA motherboard 4, located on the other side of PCBA motherboard 4 near MCU core circuit 5. Vibrating wire sensor 9 is built into PCBA motherboard 4, located on the outer side of PCBA motherboard 4 and on the same side as solar charging and discharging management circuit 8.

[0037] like Figure 2As shown, the integrated cloud control terminal used for dam safety monitoring has the following functions: (1) The solar power supply charging and discharging management circuit has charging and discharging management functions; (2) The power supply conditioning circuit is used to condition the input power supply voltage into a stable power supply voltage used by the entire circuit system. At the same time, the voltage conditioning circuit also provides a separate stable voltage for the excitation and acquisition of the vibrating wire sensor 9; (3) The data storage circuit is used to store working parameters, equipment operation information, and working data such as seepage pressure, frequency, water level, and air pressure collected by the terminal; (4) The MCU core circuit is the main processing circuit of the entire cloud control terminal, used to coordinate and manage the work of all other component circuits; (5) The magnetic induction circuit is used to manually activate the Bluetooth function of the cloud control terminal; (6) The Bluetooth communication circuit allows users to connect to the cloud control terminal via a mobile phone applet or app, and then query and set working parameters, query data records, event records, trigger LoRa wireless communication, etc.; (7) The LoRa wireless communication circuit is used for data communication between the cloud control terminal and the centralized control gateway. The cloud control terminal sends measurement data to the cloud control terminal through this LoRa wireless communication circuit. The collected working data include seepage pressure, frequency, water level, and air pressure; (8) The air pressure sensor is used to measure the current atmospheric pressure and to compensate for the seepage pressure measured by the vibrating wire sensor; (9) The vibrating wire sensor excitation circuit is used to generate the excitation signal necessary for the operation of the vibrating wire sensor. The excitation signal is a set of square wave signals with variable frequency. After the vibrating wire sensor receives the excitation signal with the same inherent frequency as under the current working conditions, it will generate a resonance phenomenon. After resonance, the sensor can still output a set of waveform signals after the excitation signal stops; (10) The vibrating wire signal conditioning circuit is used to receive the waveform signal output by the vibrating wire sensor, and to amplify, filter and condition the signal, and then transmit it to the MCU core circuit 5. The MCU core circuit 5 calculates the waveform frequency output by the vibrating wire sensor; (11) The analog quantity measurement circuit is used to measure the temperature of the vibrating wire sensor 9 and to measure the power supply voltage of the cloud control terminal; (12) The indicator light circuit is used to indicate the operating status of the cloud control terminal; (13) The buzzer circuit is used for sound prompts in special states of the cloud control terminal, including device restart, device from hibernation to activation and other state changes.

[0038] According to the embodiments of this utility model, the LoRa wireless communication circuit 7, the vibrating wire sensor excitation circuit, the vibrating wire signal conditioning circuit, and the analog quantity measurement circuit work together to achieve the function. The circuit is integrated on the PCBA motherboard 4, which simplifies the structural design of the cloud control terminal and avoids the cloud control terminal structure being too large and not conducive to installation and use. On the other hand, integrating multiple functional circuits on the PCBA motherboard 4 improves the convenience of using the cloud control terminal.

[0039] Specifically, in Figure 3In the LoRa wireless communication circuit 7, resistors R80, R81, R82, R86, and R87 are included, along with inductor L11, a C57 Zener diode, a C74 Zener diode, and an E32-TTL-100 module. The E32-TTL-100 module is the core of the LoRa wireless communication circuit 7 and utilizes LoRa... Spread spectrum technology enables long-distance, low-power data transmission. The E32-TTL-100 module communicates with the MCU core circuit 5 via a USART serial communication interface. The MCU core circuit 5 also controls the operating state of the E32-TTL-100 module through two I / O interfaces, RF_M0 and RF_M1, and resets it via the RF_REST port. Different levels of RF_M0 and RF_M1 constitute the four operating modes of the E32-TTL-100 module. When the MCU core circuit 5 needs to set LoRa communication parameters, it must first set both RF_M0 and RF_M1 to a high level. At this time, the E32-TTL-100 module is in sleep mode, where operating parameters can be set. After setting all operating parameters, the RF_M0 and RF_M1 signals are reset. Both _M0 and RF_M1 signals are set to low level. At this time, the E32-TTL-100 module will enter transparent transmission mode, the operating mode for LoRa wireless communication by the cloud control terminal. Resistors R80, R81, R82, R86, and R87 are interface matching resistors. Zener diodes C57 and C74, along with inductor L11, form an energy storage and filtering circuit. Zener diode C57 replenishes power to the E32-TTL-100 module during signal transmission. Inductor L11 reduces excessive interference from the LoRa wireless communication module to the main power supply V33F during signal transmission. Zener diode C74 acts as a second-stage energy storage capacitor, further reducing voltage fluctuations in V33F, thereby minimizing interference from wireless communication to other circuits in the cloud control terminal. This LoRa wireless communication circuit enables long-distance, low-power data transmission.

[0040] Specifically, in Figure 4The vibrating wire sensor 9 incorporates a vibrating wire sensor excitation circuit and a vibrating wire signal conditioning circuit. The vibrating wire sensor excitation circuit includes resistors R16, R17, R18, R19, and R20, a PMOS transistor Q10, an NPN transistor Q5, and a PWM signal. Resistors R17, R19, and R20 are all 10K resistors, R16 is a 270R resistor, and R18 is a 1K resistor. The PWM signal is connected to the PWM output I / O port of the MCU core circuit 5. Resistor R20 serves a signal stabilization function, ensuring the PWM signal remains low during initialization to prevent excessive voltage output from the excitation circuit. During operation, the PWM signal transitions from high to low, stabilizing faster. Resistor R19 is a current-limiting resistor; the PWM signal is current-limited by R19 before driving the NPN transistor Q5. Under normal conditions, the base-emitter voltage drop of NPN transistor Q5 is 0.7V, the high level of the PWM signal is 3.3V, and resistor R19 will divide the voltage to 2.6V, driving the NPN transistor Q5 with a current of approximately 0.26mA. Resistor R17 provides a pull-up to the gate of PMOS transistor Q10. When NPN transistor Q5 is not working, resistor R17 makes the gate voltage of PMOS transistor Q10 the same as the source voltage, keeping PMOS transistor Q10 in the off state. When NPN transistor Q5 is working, it pulls the gate of NPN transistor Q5 low, turning on PMOS transistor Q10. Resistor R18 is used as a bypass load to reduce the excessive flyback voltage generated by the oscillation coil of vibrating wire sensor 9 after PMOS transistor Q10 is turned off, thus stabilizing the operation of the vibrating wire sensor 9 coil. Resistor R16 is a current-limiting resistor to prevent abnormalities in the startup circuit from directly applying 12V voltage to the vibrating wire sensor 9 coil for a long time, which could damage the vibrating wire sensor 9. This vibrating wire sensor excitation circuit is used to amplify the low-voltage PWM waveform output from the MCU core circuit through a combination circuit of NPN transistor and PMOS transistor, and then output it to the vibrating wire sensor coil terminal, so that the vibrating wire sensor coil can generate vibration output.

[0041] Specifically, in Figure 5In the circuit, the vibrating wire sensor 9 includes a vibrating wire sensor excitation circuit and a vibrating wire signal conditioning circuit. The vibrating wire signal conditioning circuit includes resistors R35, R37, R39, R40, R42, R43, and R44; capacitors C22, C29, and C31; a U9A voltage follower circuit; a U9B voltage follower circuit; diodes D3 and D4. Resistor R42 is used to absorb abnormal overshoot signals, especially during excitation; this resistor acts as an energy-absorbing resistor. Resistor R39 is a current-limiting resistor used to limit excessive current during signal excitation. This circuit also forms part of the subsequent inverting amplifier circuit. Diodes D3 and D4 form a low-voltage clamping protection circuit, limiting voltages greater than ±0.7V to entering the conditioning circuit. The U9A voltage follower circuit, resistors R35, R39, and R44 form an inverting amplifier circuit with a gain of -20. The U9B voltage follower circuit, resistors R37, R40, and R40 form a second inverting amplifier circuit with a gain of -4.7. Therefore, the total gain of the signal conditioning circuit is 94. Capacitors C22 and C31 are operational amplifier decoupling capacitors. This vibrating wire signal conditioning circuit amplifies the AC signal when the vibrating wire sensor coil is working. When the signal excitation circuit successfully excites the internal working coil of the vibrating wire sensor, the coil will oscillate and output a weak AC signal after the excitation signal is disconnected.

[0042] Specifically, in Figure 6The analog measurement circuit includes 13 resistors (R21-R33), 9 capacitors (C11-C19), a U4A voltage follower circuit, a U4B voltage follower circuit, a U4D voltage follower circuit, an LM285 chip, an MCP3204 ADC chip, a TSIG signal, a VBAT signal, and a reference voltage Vref. The TSIG signal connects to the thermistor RL inside the vibrating wire sensor. The thermistor RL has two terminals on the wiring terminal block, corresponding to the two ends of the thermistor. During connection, one terminal is connected to the TSIG signal terminal, and the other to the GND signal terminal. The VBAT signal measures the voltage of the power supply battery. The LM285 chip, resistor R21, and capacitor C12 form the reference voltage output circuit. The LM285 is a 2.5V reference source chip. Resistors R22 and R24 provide bias balancing. The reference voltage Vref, after passing through the U4A voltage follower circuit, provides a more powerful and stable 2.5V output voltage. Simultaneously, the follower reduces the impact of load changes on the reference voltage. Due to the influence of voltage Vref, resistor R23 is used as a voltage divider resistor for the thermistor RL of the sensor. The U4B voltage follower circuit is the core of the bandwidth filter circuit. The U4B voltage follower circuit, together with resistors R25, R26, R28, capacitors C13 and C16, forms a bandwidth filter circuit. This filter circuit is used to filter interference signals on the thermistor RL line of the vibrating wire sensor. Since the working coil of the vibrating wire sensor 9 and the thermistor RL are generally connected in parallel to the cloud control terminal, AC signals are easily coupled onto the thermistor signal line during coil oscillation. This bandwidth filter circuit not only filters these coupled interferences but also improves the signal response speed. The bandwidth filter circuit, resistor R27, and capacitor C17 form an RC filter circuit to further filter the signal. The filtered signal is input to the 12-bit high-speed ADC chip MCP3204 for ADC acquisition. VBAT is directly connected to the battery power supply terminal. Resistors R29 and R30 divide the supply voltage. The U4D voltage follower circuit plays a signal conditioning role in the circuit, making the output voltage Vo on the op-amp 14 terminal... = Vref - VBAT, resistor R31 and capacitor C19 form an RC filter circuit. The filtered signal is input to the high-speed ADC chip MCP3204 for ADC acquisition. The ADC chip MCP3204 is connected to the MCU core circuit 5 via an SPI interface. The MCU core circuit 5 can set the operating parameters of the ADC chip MCP3204 and read the ADC conversion results through this SPI interface. Capacitor C14 is used as a decoupling capacitor, and capacitor C15 is a stabilizing capacitor for the VREF reference voltage input. This analog measurement circuit is used for temperature measurement of the vibrating wire sensor and power supply voltage measurement of the cloud control terminal.

[0043] In another embodiment of this utility model, an integrated cloud control terminal for dam safety monitoring is provided, comprising the following steps:

[0044] Select the monitoring points based on the dam's location and install cloud control terminals at each of these points.

[0045] After the cloud control terminal is powered on, it first performs system initialization. The initialization includes setting the system clock, initializing peripherals such as ADC, RTC, UART, and SPI, obtaining the cloud control terminal's working parameters and previous running status information from external memory, and recording the current device's startup information.

[0046] By comparing the RTC time in real time, it is determined whether the conditions for data acquisition have been met. When the corresponding conditions are met, the corresponding operation is performed.

[0047] By comparing the RTC time in real time, it is determined whether the conditions for data reporting have been met. If the reporting conditions are met, data reporting is carried out immediately.

[0048] Regularly perform equipment maintenance, pay attention to any abnormalities in equipment data, conduct regular inspections to ensure that the equipment is not damaged and is securely installed, and regularly calibrate the equipment to ensure accuracy.

[0049] In summary, the integrated cloud control terminal used for dam safety monitoring can achieve autonomous data collection, storage, and computing functions. When used with a centralized control gateway, it can achieve multi-point wireless data collection and transmission. In addition, it can greatly reduce the difficulty of system deployment.

[0050] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated cloud control terminal for dam safety monitoring, characterized in that, include: The terminal housing (1) is located on the outermost side of the cloud control terminal, the battery compartment (2) is located inside the outer side of the terminal housing (1), and the mainboard PCBA (4) is located on the mounting post inside the terminal housing (1); the mainboard PCBA (4) has a built-in LoRa wireless communication circuit and an analog measurement circuit; The MCU core circuit (5) is built into the central area of ​​the motherboard PCBA (4), the Bluetooth communication circuit (6) is built into one side of the motherboard PCBA (4), the LoRa wireless communication circuit (7) is built into the other side of the motherboard PCBA (4), the solar charging and discharging management circuit (8) is built into the other side of the motherboard PCBA (4) and located below the MCU core circuit (5), and the vibrating wire sensor (9) is built into the outermost end of the other side of the motherboard PCBA (4); the vibrating wire sensor (9) has a built-in vibrating wire sensor excitation circuit and a vibrating wire signal conditioning circuit.

2. The integrated cloud control terminal for dam safety monitoring according to claim 1, characterized in that, It also includes a battery connection wire (3) with an opening at the bottom inside the battery compartment (2).

3. The integrated cloud control terminal for dam safety monitoring according to claim 2, characterized in that, The battery connection cable (3) passes through the bottom opening inside the battery compartment (2) and connects the battery to the motherboard PCBA (4).

4. The integrated cloud control terminal for dam safety monitoring according to any one of claims 1-3, characterized in that, The LoRa wireless communication circuit is based on the E32-TTL-100 module and uses LoRa spread spectrum technology.

5. The integrated cloud control terminal for dam safety monitoring according to claim 4, characterized in that, The E32-TTL-100 module uses a USART serial communication interface to communicate with the MCU core circuit (5).

6. The integrated cloud control terminal for dam safety monitoring according to any one of claims 1-3, characterized in that, The excitation circuit of the vibrating wire sensor is equipped with an NPN transistor Q5 and a PMOS transistor Q10, and uses a PWM signal as the signal input.

7. The integrated cloud control terminal for dam safety monitoring according to claim 6, wherein, The PWM signal is output from the PWM output IO port of the MCU core circuit (5).

8. The integrated cloud control terminal for dam safety monitoring according to any one of claims 1-3, characterized in that, The vibrating string signal conditioning circuit is internally equipped with a U9A voltage follower circuit and a U9B voltage follower circuit; the U9A voltage follower circuit and the U9B voltage follower circuit respectively form their respective inverting amplifier circuits.

9. The integrated cloud control terminal for dam safety monitoring according to any one of claims 1-3, characterized in that, The analog measurement circuit is equipped with an LM285 chip and an ADC chip MCP3204.

10. The integrated cloud control terminal for dam safety monitoring according to claim 9, wherein, The ADC chip MCP3204 is connected to the MCU core circuit (5) via an SPI interface.

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