A compact programming host housing structure
By employing a compact design and an independent heat dissipation duct, the problems of complex and unstable programming host casing structure have been solved, achieving both portability and power supply stability.
CN224436838UActive Publication Date: 2026-06-30武汉羿云智能科技有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 武汉羿云智能科技有限公司
- Filing Date
- 2025-09-04
- Publication Date
- 2026-06-30
AI Technical Summary
Technical Problem
Existing programming host casings are complex, bulky, and inconvenient to carry, and their power supply and heat dissipation are unstable and prone to deformation.
Method used
It adopts a compact design, using a bottom frame plate and a sealed structural plate to form a U-shaped structure, simplifying it into two plates. It has independent heat dissipation channels and rationally distributes components such as power supply, motherboard and hard drive to ensure the stability of power supply under high load.
Benefits of technology
The design achieves a compact and stable main unit casing structure, making it suitable for carrying and transporting, avoiding heat buildup, and improving the stability of the power supply during long-term high-load operation.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224436838U_ABST
Abstract
This utility model relates to a host casing, specifically a compact programming host casing structure. This compact programming host casing structure includes a bottom frame plate and a sealed structural plate fixed as one piece. Both the bottom frame plate and the sealed structural plate are U-shaped. The bottom frame plate includes a base plate and a front panel and a rear panel fixed to both ends of the base plate. A power supply air inlet is provided through the bottom plate near the rear panel. A first hard drive rack and a second hard drive rack located to one side of the first hard drive rack are fixed on the front panel. This compact programming host casing structure consists of only two plates: the bottom frame plate and the sealed structural plate. The manufacturing process is simpler, and the overall structure formed by the two plates is more robust, suitable for carrying and transporting in various situations. It is less prone to deformation and prevents the power supply from absorbing heat from other components during heat dissipation, thus avoiding heat accumulation and ensuring stable operation even under prolonged high loads.
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