Electronic device rear plug-in box module and electronic device

Abstract

The application discloses an electronic equipment rear plug-in box module and an electronic equipment. The electronic equipment rear plug-in box module comprises a box body, at least one fan module, at least one power supply board, an adapter plate and a middle back plate. The fan module is installed in the box body. The power supply board is located at the fan module and is plugged and matched with the fan module. The adapter plate is arranged at an inner wall of the box body. The power supply board is plugged and matched with the adapter plate. The middle back plate is connected with the box body and is plugged and matched with the adapter plate. The power supply supplies power for the fan module through the middle back plate, the adapter plate and the power supply board. The application solves the problem that fan power supply connection is limited to a mainboard in the prior art.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic equipment rear insert module and an electronic equipment. Background Technology

[0002] Traditional server fan power boards mostly adopt a "motherboard power supply + screw fixing" design. On the one hand, the power board is connected to the motherboard via cables, which not only occupies internal space in the chassis and affects heat dissipation, but also easily leads to safety hazards such as cable tangling / loosening. Furthermore, because the power supply depends on the motherboard, the compatibility of the power board is limited by the motherboard. On the other hand, the installation of the power board relies on screw tightening, and tools are needed to complete the disassembly and assembly. In the operation and maintenance scenarios of large-scale server clusters, the maintenance efficiency is low, and the screws are easy to lose or strip, increasing the operation and maintenance costs. Utility Model Content

[0003] This application provides an electronic device rear panel module and an electronic device to at least solve the problem in the related art where the fan power supply connection is limited by the motherboard.

[0004] This application provides a rear-mounted module for an electronic device, comprising: a housing; at least one fan module installed within the housing; at least one power board located at the fan module and plugged into it; an adapter board disposed on the inner wall of the housing, with the power board plugged into it; and a back panel connected to the housing, with the back panel plugged into the adapter board, wherein power is supplied to the fan module through the back panel, the adapter board, and the power board.

[0005] This application also provides an electronic device, including a chassis, components, and the aforementioned electronic device rear insertion box module. The enclosure of the electronic device rear insertion box module is installed at the rear end of the chassis, and the back panel of the electronic device rear insertion box module is plugged into and cooperates with the components.

[0006] This application provides a power supply board, an adapter board, and a backplane that are interlocked. The power supply board, which provides power and signal control to the fan module, directly plugs into the fan module. The adapter board, acting as an intermediary between the backplane and the power supply board, plugs into both, thus establishing an electrical connection between them. This allows the backplane to directly power the fan module via the adapter board and power supply board. This reduces the space occupied by cables within the chassis, minimizing space usage and preventing issues like tangling or loosening, ensuring a stable and reliable connection. Furthermore, it decouples the fan power supply from the motherboard power supply, freeing the fan module and power supply board from motherboard limitations. This addresses issues of poor cross-model compatibility and unstable cable signal transmission, improving the design's compatibility and scalability. Attached Figure Description

[0007] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of the structure of the electronic device rear insert module of this application;

[0009] Figure 2 for Figure 1 The main view;

[0010] Figure 3 for Figure 1 Top view;

[0011] Figure 4 This is a schematic diagram of the power supply board.

[0012] Figure 5 This is a schematic diagram of the support frame structure;

[0013] Figure 6 This is a schematic diagram of the power board placed on the support frame but not yet installed in place.

[0014] Figure 7 This is a structural diagram showing the power board installed in place on the support frame.

[0015] Figure 8 This is a schematic diagram showing the structure of the power board placed on the support frame and not yet installed in place, in conjunction with the adapter plate.

[0016] Figure 9 for Figure 8 Enlarged view of the mating joint between the first and second connectors;

[0017] Figure 10 This is a schematic diagram showing the structure of the power board and the adapter plate when the power board is installed on the support frame.

[0018] Figure 11 for Figure 10 Enlarged view of the mating joint between the first and second connectors;

[0019] Figure 12 This is a structural schematic diagram of the side panel;

[0020] Figure 13 This is a schematic diagram of the adapter plate.

[0021] Figure 14 This is a schematic diagram of the backplate structure.

[0022] The above figures include the following reference numerals:

[0023] 10. Housing; 11. Support frame; 12. Connecting protrusion; 13. Locking hole; 14. Back panel bracket; 141. Second hollow structure; 15. Side panel; 20. Fan module; 30. Power board; 31. First connector; 32. Connecting recess; 321. Large diameter section; 322. Small diameter section; 33. Locking element; 40. Adapter plate; 41. Second connector; 50. Middle back panel; 51. First hollow structure. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0025] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] To address the issue that fan power supply connections in related technologies are limited by the motherboard, this application provides an electronic device rear panel module and an electronic device.

[0028] like Figures 1 to 14 The illustrated rear-mount module for an electronic device includes a housing 10, at least one fan module 20, at least one power board 30, an adapter board 40, and a back panel 50. The fan module 20 is installed inside the housing 10. The power board 30 is located at the fan module 20 and is plugged into it. The adapter board 40 is disposed on the inner wall of the housing 10, and the power board 30 is plugged into the adapter board 40. The back panel 50 is connected to the housing 10 and is plugged into the adapter board 40. Power is supplied to the fan module 20 through the back panel 50, the adapter board 40, and the power board 30.

[0029] This embodiment features a power board 30, an adapter board 40, and a backplate 50 that are interconnected. The power board 30, which supplies power and controls the signal of the fan module 20, directly plugs into it. The adapter board 40, acting as an intermediary between the backplate 50 and the power board 30, plugs into both, thus establishing an electrical connection between them. This allows the backplate 50 to directly supply power to the fan module 20 via the adapter board 40 and the power board 30. This reduces the space occupied by cables within the chassis, minimizing tangling and loosening, and ensuring a stable and reliable connection. Furthermore, it decouples the fan power supply from the motherboard power supply, freeing the fan module 20 and power board 30 from motherboard limitations. This addresses issues of poor cross-model compatibility and unstable cable signal transmission, improving the design's compatibility and scalability.

[0030] This embodiment uses a server as an example for illustration. The rear panel module of the electronic device is installed at the rear window of the server chassis. In addition to cooperating with the fan module 20 through the adapter board 40 and the power board 30, the back panel 50 can also cooperate with other components such as the graphics processor to achieve unified and coordinated power supply for the back panel 50. Of course, the electronic device can also be other devices such as a switch.

[0031] Optionally, the specific number of fan modules 20 can be set as needed, and one or more can be used. Based on the application scenario of the server in this application, this embodiment preferably uses multiple fan modules 20, and each fan module 20 is arranged in a stacked manner. Correspondingly, multiple power boards 30 are also set. In this embodiment, it is preferred that the fan modules 20 and the power boards 30 are matched one-to-one, so that the power boards 30 and the fan modules 20 are plugged in to each other. Only one adapter board 40 can be set, and each power board 30 is plugged in to the adapter board 40. This allows all the power boards 30 to be electrically connected to the backplane 50 through one adapter board 40, reducing the number of adapter boards 40 and reducing space occupation.

[0032] like Figures 1 to 3As shown, the fan module 20 of this embodiment may include multiple fans. Specifically, the fan module 20 includes a fan frame and multiple fans. The fan frame adopts a frame structure, and the fans are disposed within the fan frame. The fan frame has multiple mounting cavities, and each mounting cavity houses one fan. The fans within the same fan module 20 are preferably arranged horizontally, so that the arrangement direction between the fans within the same fan module 20 is approximately perpendicular to the arrangement direction between individual fan modules 20. Correspondingly, the power board 30 is arranged horizontally. In this embodiment, the power board 30 adopts a flat rectangular plate structure, with multiple connection ends on its long side. The connection ends can adopt a connector structure, and the connection ends are connected to the fans using male and female terminals, thereby connecting the fans within the same fan module 20 to the same power board 30. Based on this, the power boards 30 in this embodiment are also arranged vertically at intervals, and their positions correspond to those of the fan modules 20. Of course, the number of fan modules 20, their specific structural form, and the related settings of the power supply board 30 can all be adjusted as needed, and are not limited to the methods described in this embodiment.

[0033] like Figures 4 to 11 As shown, in order to facilitate the insertion between the power board 30 and the adapter board 40, the power board 30 in this embodiment is movably configured. Specifically, the housing 10 in this embodiment has a horizontally arranged support frame 11, on which the fan module 20 and the power board 30 can be mounted and supported. The support frame 11 has a groove for mounting the power board 30, and the projection of the power board 30 on the support frame 11 is located in the groove, thereby achieving the effect of the power board 30 being stably mounted in the groove. A first connector 31 is provided at the end of the power board 30, more specifically on the short side of the power board 30. Since the power boards 30 are arranged vertically, the adapter plate 40 in this embodiment is vertically positioned and extends vertically, located at one end of the power board 30. A second connector 41 is provided on the longitudinal side of the adapter plate 40. Thus, during installation, the power board 30 can be placed on the support frame 11 with the first connector 31 and the second connector 41 laterally offset and not yet inserted. Then, the power board 30 is moved laterally towards the adapter plate 40, causing the first connector 31 to gradually approach the second connector 41 until it is inserted into the second connector 41, achieving insertion and engagement between them. Disassembly is performed by reversing the operation. It should be noted that the projections mentioned in this embodiment refer to orthographic projections.

[0034] like Figures 4 to 7As shown, in this embodiment, a mounting locking structure is provided between the power board 30 and the support frame 11 to achieve the effect of locking the power board 30 onto the support frame 11. Based on the above-mentioned cooperation method between the power board 30 and the adapter plate 40, in this embodiment, one of the support frame 11 and the power board 30 has a connecting protrusion 12, and the other of the support frame 11 and the power board 30 has a connecting recess 32. In this embodiment, the connecting protrusion 12 is set on the support frame 11, and the connecting recess 32 is set on the power board 30. The connecting protrusion 12 is a protruding post, which is divided into a head with a larger diameter and a connecting part with a smaller diameter. The head and the connecting part are arranged vertically, so that the connecting protrusion 12 forms an I-shaped structure. The connecting recess 32 is a through hole that runs vertically through the hole. The connecting recess 32 has a large diameter section 321 and a small diameter section 322 that are connected in sequence. The large diameter section 321 is closer to the adapter plate 40 than the small diameter section 322, so that the through hole forms a horizontal gourd-shaped hole or an I-shaped hole. The diameter of the connecting part of the connecting protrusion 12 is smaller than the diameter of the small diameter section 322, while the head is larger than the diameter of the small diameter section 322 and smaller than the diameter of the large diameter section 321. Thus, as Figure 6 , Figure 8 and Figure 9 As shown, when installing the power board 30, first align the connecting protrusion 12 with the large-diameter section 321. Since the head can pass through the large-diameter section 321, the power board 30 can be placed on the support frame 11. At this time, the first connector 31 and the second connector 41 are not inserted, and the connecting protrusion 12 is located inside the large-diameter section 321. Then, move the power board 30 laterally so that the first connector 31 is inserted into the second connector 41. During this process, the connecting protrusion 12 will move from the large-diameter section 321 to the small-diameter section 322 until the power board 30 is inserted into the adapter plate 40, as shown. Figure 7 , Figure 10 and Figure 11 As shown, the connecting protrusion 12 is located within the large-diameter section 321. Due to the head's limiting position, the connecting protrusion 12 cannot directly disengage from the small-diameter section 322, thus achieving a locking fit between the connecting protrusion 12 and the connecting recess 32. This arrangement creates a cooperative guiding and locking structure between the connecting protrusion 12 and the connecting recess 32. Combined with the guide pins on the connector, this effectively constrains the degrees of freedom of the power board 30, ensuring accurate connector mating.

[0035] In addition to the aforementioned engagement between the connecting protrusion 12 and the connecting recess 32, this embodiment also includes a locking structure. Specifically, one of the support frame 11 and the power board 30 has a locking member 33, and the other of the support frame 11 and the power board 30 has a locking hole 13. In this embodiment, the support frame 11 has a locking hole 13, and the power board 30 has a locking member 33. The locking member 33 is in the form of a hand-tightening screw, and its end is a non-circular structure. Correspondingly, the locking hole 13 is a non-circular hole with a matching shape. When the power board 30 is inserted into the adapter plate 40, the locking member 33 and the locking hole 13 are aligned vertically, and the end of the locking member 33 can extend into the locking hole 13. Then, rotating the locking member 33 by about 90 degrees will form a limiting locking connection between the locking member 33 and the locking hole 13, thereby achieving the effect of stably and reliably installing the power board 30 on the support frame 11. The above-mentioned method utilizes the stepped stop of the I-beam nail and the quarter-turn screw to form a rigid engagement, which can complete tool-free disassembly and assembly without the need for additional locking parts, thus solving the problems of cumbersome operation and inaccurate positioning.

[0036] The enclosure 10 of this embodiment is made of sheet metal casting and includes side panels 15 and support frames 11. The side panels 15 are vertical and serve as the external frame of the enclosure 10, providing support and protection for the main body. The side panels 15 enclose a central receiving area, where components such as the fan module 20 and support frames 11 are installed. The front and rear sides of the receiving area are open, and the middle back panel 50 is located at the front opening, placing it at the connection area between the chassis and the enclosure 10. The support frames 11 are horizontally arranged within the receiving area, allowing the fan modules 20 and power boards 30 of each layer to be installed on their respective support frames 11.

[0037] In this embodiment, the adapter plate 40 is installed on the inner side of the side plate 15. The adapter plate 40 is also long and extends longitudinally. A second connector 41 is provided on the inner side of the adapter plate 40 away from the side plate 15 for cooperating with the first connector 31 of the power board 30. A connector for cooperating with the middle back plate 50 is provided on the side or other positions of the adapter plate 40 to realize the cooperation between the adapter plate 40 and the middle back plate 50.

[0038] like Figure 12 and Figure 13As shown, in addition to the above-mentioned cooperation between the connecting protrusion 12 and the connecting recess 32, and the cooperation between the locking member 33 and the locking hole 13 between the power board 30 and the adapter plate 40, this embodiment also adopts the above-mentioned arrangement between the adapter plate 40 and the side plate 15. That is, the adapter plate 40 is also provided with the connecting recess 32 and the locking member 33, and the side plate 15 is provided with the connecting protrusion 12 and the locking hole 13. The specific structural forms of the connecting protrusion 12 and the connecting recess 32, and the locking member 33 and the locking hole 13 are the same as those described above. Thus, the adapter plate 40 can achieve the effect of locking and connecting to the side plate 15 through the cooperation between the connecting protrusion 12 and the connecting recess 32, and between the locking member 33 and the locking hole 13. This also enables the adapter plate 40 to be quickly disassembled and assembled without tools.

[0039] Optionally, the number and position of the connecting protrusions 12, connecting recesses 32, locking elements 33, and locking holes 13 correspondingly provided on components such as the power board 30, adapter plate 40, support frame 11, and side plate 15 can be adjusted as needed. Taking the power board 30 and support frame 11 as an example, in this embodiment, the power board 30 is provided with eight connecting recesses 32 and two locking elements 33, and the support frame 11 is provided with eight connecting protrusions 12 and two locking holes 13. The eight connecting recesses 32 are arranged in a roughly evenly distributed manner on the surface of the power board 30, thereby ensuring stable and reliable installation and locking.

[0040] In this embodiment, a limiting structure is also provided on the adapter plate 40 and / or the side plate 15. The limiting structure can take the form of a protrusion, pin, or other structure. When the adapter plate 40 is installed on the side plate 15, the adapter plate 40 and the side plate 15 are positioned and engaged by the limiting structure, thereby ensuring installation accuracy and avoiding damage caused by over-installation or incorrect installation position. The limiting structure can be provided on the power board 30, and a limiting or positioning structure for controlling the installation position can also be provided between the adapter plate 40 and the middle back plate 50 as needed.

[0041] like Figure 2 and Figure 14 As shown, in this embodiment, the backplate 50 is located at the front end of the housing 10, that is, at the end of the housing 10 closest to the internal components, thus positioning the backplate 50 on the side where the fan module 20 exhausts air. The backplate 50 has a first perforated structure 51, which is located within the projection area of ​​the fan module 20 onto the backplate 50. This first perforated structure 51 allows airflow to be prevented from passing through, ensuring that the airflow generated by the fan module 20 can flow smoothly through the first perforated structure 51, thereby guaranteeing good heat dissipation.

[0042] It should be noted that, since the back panel 50 in this embodiment is upright and the fan module 20 has multiple rows, the height of the back panel 50 may not be higher than the overall height of the fan module 20. Therefore, the number of the first hollow structure 51 on the back panel 50 can be set as needed, and it can be a single layer or multiple layers. Since the fan module 20 has a certain length in the horizontal direction, it can be a long first hollow structure 51 or multiple first hollow structures 51 spaced apart from each other in the horizontal direction.

[0043] In this embodiment, the housing 10 also includes a backplate bracket 14, which is erected and stacked on top of the middle backplate 50. The middle backplate 50 is connected to the backplate bracket 14, and the middle backplate 50 is located on the outer side of the backplate bracket 14 away from the receiving area, so that the backplate bracket 14 is closer to the fan module 20 than the middle backplate 50, thereby realizing the installation connection of the middle backplate 50. Since the middle backplate 50 will be provided with connectors and other devices for external connection, the backplate bracket 14 is provided with corresponding through holes to allow the devices to pass through.

[0044] Because of the overlapping arrangement between the backplate bracket 14 and the middle backplate 50, this embodiment provides a clearance hole on the backplate bracket 14. The clearance hole is used to cooperate with the first hollow structure 51. In this embodiment, it is preferred that the clearance hole and the first hollow structure 51 are exactly the same in size and position, and the two are completely aligned front and back, so that the airflow can pass smoothly through the clearance hole and the first hollow structure 51 to achieve front and back circulation. Of course, the housing 10 may also not have a backplate bracket 14, and the middle backplate 50 may be directly installed on the side plate 15, or the backplate bracket 14 may also be located outside the projection range of the fan module 20 on the plane where the middle backplate 50 is located, so that the backplate bracket 14 itself will not affect the airflow.

[0045] To ensure the stable and reliable installation of the back panel 50, this embodiment adopts a back panel bracket 14 with a relatively high overall height, and the area of ​​the back panel bracket 14 is larger than that of the back panel 50. Furthermore, in this embodiment, the projection of the back panel 50 on the back panel bracket 14 is located within the back panel bracket 14, so that the top of the back panel bracket 14 is higher than the top of the back panel 50. Therefore, the back panel bracket 14 includes an overlapping part and a protruding part connected vertically. The overlapping part is stacked on top of the back panel 50, and the two are the same size. The protruding part is located above the overlapping part and extends beyond the back panel 50, so that the protruding part is the part of the back panel bracket 14 that is higher than the back panel 50. Due to the protrusion, the protrusion in this embodiment has a second hollow structure 141. The second hollow structure 141 is located within the projection range of the fan module 20 on the backplate bracket 14, so that the second hollow structure 141 can also function as the first hollow structure 51. This allows the airflow of the fan module 20 to flow smoothly back and forth through the second hollow structure 141, avoiding obstruction by the protrusion of the backplate bracket 14 and thus preventing heat dissipation. In this way, the cooperation between the first hollow structure 51 and the second hollow structure 141 ensures that the airflow of all fan modules 20 can flow smoothly back and forth, guaranteeing the efficient heat dissipation effect of the fan module 20.

[0046] The rear insert module of the electronic device in this embodiment also includes an insulating component. The insulating component can be a Mylar sheet or similar structure. Insulating components can be provided at positions such as between the support frame 11 and the power board 30, and between the adapter board 40 and the side plate 15. The insulating component is used to achieve insulation between the board and the enclosure 10, thus avoiding short circuits and other situations.

[0047] This embodiment also provides an electronic device, including a chassis, components, and the aforementioned rear-mounted module. The components can be devices such as a graphics processor within the chassis. The housing 10 of the rear-mounted module is installed at the rear of the chassis, and the backplate 50 of the rear-mounted module is plugged into and mates with the components. This embodiment adopts an integrated structure with a gourd-shaped hole and quarter-turn screw locking, a cable-free direct-plug connection method, and an independent power supply decoupling scheme. The integrated structure eliminates the need for additional locking components, enabling tool-free assembly and disassembly and simplifying the operation process. Simultaneously, the coordinated design of the guiding and locking functions improves the accuracy of inter-board connection positioning. The independent power board 30 and adapter board 40 achieve decoupling from the motherboard through direct plugging, taking into account cross-model compatibility, improved heat dissipation efficiency, and signal transmission stability. The compact structure can also adapt to the high-density layout requirements of servers, comprehensively overcoming the shortcomings of existing technologies.

[0048] It should be noted that "multiple" in the above embodiments refers to at least two.

[0049] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0050] This embodiment features a power board 30, an adapter board 40, and a backplate 50 that are interconnected. The power board 30, which supplies power and controls the signal of the fan module 20, directly plugs into it. The adapter board 40, acting as an intermediary between the backplate 50 and the power board 30, plugs into both, thus establishing an electrical connection between them. This allows the backplate 50 to directly supply power to the fan module 20 via the adapter board 40 and the power board 30. This reduces the space occupied by cables within the chassis, minimizing tangling and loosening, and ensuring a stable and reliable connection. Furthermore, it decouples the fan power supply from the motherboard power supply, freeing the fan module 20 and power board 30 from motherboard limitations. This addresses issues of poor cross-model compatibility and unstable cable signal transmission, improving the design's compatibility and scalability.

[0051] The foregoing has provided a detailed description of an electronic device rear insert module and an electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A rear insert module for an electronic device, characterized in that, include: Box (10); At least one fan module (20) is installed inside the housing (10); At least one power board (30) is located at the fan module (20) and is plugged into the fan module (20); The adapter plate (40) is disposed on the inner wall of the housing (10), and the power board (30) is plugged into the adapter plate (40); The back panel (50) is connected to the housing (10). The back panel (50) is plugged into the adapter plate (40). Power is supplied to the fan module (20) through the back panel (50), the adapter plate (40), and the power board (30).

2. The electronic device backplane module of claim 1, wherein, There are multiple fan modules (20), and each fan module (20) is stacked on top of each other. There are multiple power boards (30), and each power board (30) is plugged into the fan module (20) and each power board (30) is plugged into the adapter board (40).

3. The electronic device rear slot-in module of claim 1, wherein, The power board (30) is movably disposed, and the end of the power board (30) has a first connector (31). The adapter plate (40) is located at one end of the power board (30), and the adapter plate (40) has a second connector (41). When the power board (30) moves, the first connector (31) and the second connector (41) are inserted or separated.

4. The electronic device backplane module of claim 3, wherein, The housing (10) has a support frame (11) with a groove. The projection of the power board (30) on the support frame (11) is located in the groove. One of the support frame (11) and the power board (30) has a connecting protrusion (12). The other of the support frame (11) and the power board (30) has a connecting recess (32). The connecting recess (32) has a large diameter section (321) and a small diameter section (322) connected in sequence. The large diameter section (321) is closer to the adapter plate (40) than the small diameter section (322). When the power board (30) is placed on the support frame (11), the connecting protrusion (12) is located in the large diameter section (321). When the power board (30) is inserted into the adapter plate (40), the connecting protrusion (12) is located in the small diameter section (322).

5. The electronic device backplane module of claim 4, wherein, One of the support frame (11) and the power board (30) has a locking member (33), and the other of the support frame (11) and the power board (30) has a locking hole (13). When the power board (30) is inserted into the adapter plate (40), the locking member (33) is aligned with the locking hole (13) and locked in place.

6. The electronic device rear slot-in module of claim 1, wherein, The back panel (50) has a first hollow structure (51) located within the projection range of the fan module (20) on the back panel (50).

7. The electronic device rear slot-in module of claim 1, wherein, The enclosure (10) includes a back panel support (14), which is stacked with the middle back panel (50), and the middle back panel (50) is connected to the back panel support (14).

8. The electronic device backplane module of claim 7, wherein, The projection of the middle backplate (50) on the backplate bracket (14) is located within the backplate bracket (14), and the backplate bracket (14) has a protrusion that extends beyond the middle backplate (50). The protrusion has a second hollow structure (141), which is located within the range of the projection of the fan module (20) on the backplate bracket (14).

9. The electronic device rear insert module according to claim 1, characterized in that, The housing (10) has a support frame (11) and a side plate (15). The power board (30) is laterally movably mounted on the support frame (11). Both the support frame (11) and the side plate (15) have connecting protrusions (12). Both the power board (30) and the adapter plate (40) have connecting recesses (32). The connecting recesses (32) have a large-diameter section (321) and a small-diameter section (322) connected in sequence. The large-diameter section on the power board (30) (321) Compared to the small diameter section (322) which is closer to the adapter plate (40), when the power board (30) is placed on the support frame (11), the connecting protrusion (12) is located in the large diameter section (321). When the power board (30) is inserted into the adapter plate (40), the connecting protrusion (12) is located in the small diameter section (322). The adapter plate (40) is connected to the side plate (15) through the connecting protrusion (12) and the connecting recess (32). The housing (10) includes a backplate bracket (14), the middle backplate (50) is mounted on the backplate bracket (14), the backplate bracket (14) is stacked with the middle backplate (50), and the backplate bracket (14) is closer to the fan module (20) than the middle backplate (50). The back panel (50) has a first hollow structure (51), which is located within the projection range of the fan module (20) on the back panel (50). The back panel bracket (14) has a clearance hole, which is aligned with the first hollow structure (51) front and back. Both the middle backplate (50) and the backplate bracket (14) are upright, and the top of the backplate bracket (14) has a protrusion higher than the middle backplate (50). The protrusion has a second hollow structure (141), which is located within the range of the projection of the fan module (20) on the backplate bracket (14).

10. An electronic device, comprising: The device includes a chassis, components, and an electronic device rear insertion box module as described in any one of claims 1 to 9. The housing (10) of the electronic device rear insertion box module is installed at the rear end of the chassis, and the back panel (50) of the electronic device rear insertion box module is plugged into the components.

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