Adapter

Abstract

This utility model discloses an adapter device relating to the server field, comprising: an adapter board, a backplane, and a power connector. The adapter board includes a soldering area and a gold finger area. The soldering area includes a first power through-hole pin, and the gold finger area includes a second power through-hole pin and a gold finger assembly. A current transmission line is configured between the first and second power through-hole pins. The backplane is mounted on a power supply module. The power connector is a power connector mounted on the server. The soldering area is fixed at a first position on the backplane to allow the first power through-hole pin to contact the backplane. The gold finger area is connected to the power connector via the gold finger assembly to allow the second power through-hole pin to contact the power connector. The height of the first position matches the height of the second position where the power connector is located. This invention solves the technical problem of the inability to connect the power supply module and the storage server.

Description

Technical Field

[0001] This utility model relates to the field of servers, and more specifically, to a switching device. Background Technology

[0002] In modern data center and cloud computing environments, storage servers play a crucial role, and the reliability and compatibility of their power supply units directly impact the stable operation and maintenance costs of these servers. Currently, general-purpose redundant power supply modules follow a unified standard design, aiming to provide stable and hot-swappable power solutions.

[0003] However, due to the difference in the height of the power connectors of different storage servers, the power supply module cannot be directly adapted to the storage server.

[0004] Therefore, there is a technical problem in the existing technology where the power supply module and the storage server cannot be connected due to the high incompatibility between the power supply module and the storage server. Utility Model Content

[0005] This utility model provides an adapter to at least solve the technical problem of the inability to connect the power supply module and the storage server.

[0006] According to one embodiment of the present invention, an adapter device is provided, comprising: an adapter plate, a backplate, and a power connector. The adapter plate includes a soldering area and a gold finger area. The soldering area includes a first power through-hole pin, and the gold finger area includes a second power through-hole pin and a gold finger assembly. A current transmission line is configured between the first power through-hole pin and the second power through-hole pin. The backplate is configured on a power supply module for providing power to a server. The power connector is a power connector configured on the server. The soldering area is fixed at a first position on the backplate so that the first power through-hole pin contacts the backplate. The gold finger area is connected to the power connector via the gold finger assembly so that the second power through-hole pin contacts the power connector. The height of the first position matches the height of the second position where the power connector is located.

[0007] The adapter device of this utility model includes: an adapter plate, a backplate, and a power connector. The adapter plate includes a soldering area and a gold finger area. The soldering area includes a first power through-hole pin, and the gold finger area includes a second power through-hole pin and a gold finger assembly. A current transmission line is configured between the first and second power through-hole pins. The backplate is mounted on a power supply module for providing power to a server. The power connector is a power connector mounted on the server. The soldering area is fixed at a first position on the backplate so that the first power through-hole pin contacts the backplate. The gold finger area is connected to the power connector via the gold finger assembly so that the second power through-hole pin contacts the power connector. The height of the first position matches the height of the second position where the power connector is located. In other words, in this utility model, the soldering area of ​​the adapter plate is fixed at a position on the backplate of the power supply module that matches the height of the server's power connector, allowing the gold finger area of ​​the adapter plate to connect with the power connector, thereby achieving height compensation and adaptive docking between the power supply module and the server power converter. Furthermore, by configuring the current transmission lines between the soldering area and the gold finger area, the standard power supply module can be directly connected to servers of different height specifications via an adapter board. In summary, this invention solves the technical problem of the inability to connect the power supply module and the storage server due to height incompatibility, achieving a height-adaptive connection between the power supply module and the server. Attached Figure Description

[0008] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A disassembled structural diagram of an adapter provided in an embodiment of this utility model;

[0010] Figure 2 This is a structural diagram of an adapter plate provided in an embodiment of the present utility model.

[0011] Figure 3 This is a schematic diagram of a printed circuit board panel structure provided for an embodiment of the present invention. Detailed Implementation

[0012] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0013] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0014] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0015] As an optional embodiment, the above-mentioned adapter device is as follows: Figure 1 As shown, it includes: an adapter board 101, a backplate 102, and a power connector 103. The adapter board 101 includes a soldering area 101-1 and a gold finger area 101-2. The soldering area 101-1 includes a first power through-hole pin 101-3. The gold finger area 101-2 includes a second power through-hole pin 101-4 and a gold finger assembly 101-5. A line for transmitting current is configured between the first power through-hole pin 101-3 and the second power through-hole pin 101-4. The backplate 102 is configured on a power supply module for providing power to the server.

[0016] Power connector 103 is the power connector configured on the server;

[0017] The soldering area is fixed at a first position on the backplate so that the first power via pins are in contact with the backplate. The gold finger area is connected to the power connector via the gold finger assembly so that the second power via pins are in contact with the power connector. The height of the first position matches the height of the second position where the power connector is located.

[0018] It should be noted that the aforementioned adapter is a device used to perform electrical signal conversion between the power supply module and the storage server, ensuring compatibility between the two at the physical and electrical levels. Even in the face of inconsistent interface heights, the connection between the power supply module and the storage server can be achieved through this adapter.

[0019] It should be noted that the aforementioned adapter board may include, but is not limited to, a specially designed circuit board used to establish an electrical signal and power bridge between the backplane of the power supply module and the server's power connector. The structure and wiring design of the adapter board directly determine its connection performance and electrical characteristics.

[0020] Furthermore, the aforementioned soldering area may, but is not limited to, refer to a region on the adapter board with multiple through-hole pins for establishing a robust physical contact and electrical connection with the backplane of the power supply module via soldering. This area's design ensures a secure connection between the adapter board and the backplane. For example, the soldering area can, but is not limited to, be fixed to the backplane by screw soldering; for instance, one end of a screw assembly can be passed through the screw through-hole in the soldering area, and the other end soldered to the backplane.

[0021] It should be noted that the welding area can also be fixed to the back plate in other ways, such as using crimping technology, snap-fit ​​connection, or adhesive combined with metal gasket, etc., but this embodiment does not limit this.

[0022] Optionally, the aforementioned first power via pin may, but is not limited to, represent pins on the soldering area. These pins are specifically designed to transmit power, connecting the power supply module to the current transmission lines on the adapter board, ensuring efficient power transmission.

[0023] It should be noted that the aforementioned gold finger area may include, but is not limited to, an area located on the adapter board, with conductive contacts on its surface coated with a gold film, designed to establish a fast and stable electrical connection with the server's power connector. The connection between the gold finger area and the power connector may be achieved, but is not limited to, by inserting the finger components on the gold finger area into the server's power connector.

[0024] Furthermore, the aforementioned second power via pin may refer to, but is not limited to, the pin on the gold finger area. It corresponds to the first power via pin and is connected through the current transmission line in the adapter board to ensure smooth power delivery from the power supply module to the server.

[0025] Optionally, the aforementioned gold finger assembly may, but is not limited to, represent a series of metal contacts in the gold finger area, which are treated with gold plating or other anti-corrosion methods to enhance contact stability and durability with the power connector.

[0026] It should be noted that the aforementioned current transmission lines may include, but are not limited to, lines designed inside the adapter board to carry power from the first power via pin to the second power via pin, ensuring lossless and efficient current transmission inside the adapter board.

[0027] Furthermore, the aforementioned backplate may, but is not limited to, refer to a plate-like assembly on the power supply module, which has contact points for physical contact and electrical connection with the welding area.

[0028] Optionally, the aforementioned power supply module may, but is not limited to, a modular power supply device that provides power to the server, such as a Power Supply Unit (PSU). A PSU may, but is not limited to, include: a Common Redundant Power Supply (CRPS), a Battery Backup Unit (BBU), and a fan. The power supply module must have standardized power performance parameters to ensure compatibility with different servers. The aforementioned backplane is connected to the CRPS of the PSU.

[0029] It should be noted that the aforementioned power connector may include, but is not limited to, a connector or socket on the server for receiving external power signals, and is designed with a structure that matches the gold finger assembly to ensure that power signals and electricity can be transmitted from the gold finger area to the inside of the server.

[0030] Furthermore, the aforementioned first position may, but is not limited to, refer to the fixed position of the soldering area on the backplane. The determination of this position takes into account the actual height of the server power connector, ensuring that the soldering area of ​​the adapter board can be precisely fitted with the backplane to achieve stable power and signal transmission.

[0031] Optionally, the second position mentioned above may, but is not limited to, indicate the exact location of the server power connector on the server board. When fixing the soldering area to the backplane, the height of the power connector must be considered so that the gold finger area of ​​the adapter board can connect with the power connector.

[0032] It should be noted that the aforementioned contact may refer to, but is not limited to, the physical contact between the first power via pin in the soldering area and the contact point on the backplane, and between the second power via pin in the gold finger area and the contact pin of the power connector, ensuring electrical continuity and stable signal transmission.

[0033] Furthermore, the aforementioned height matching may refer to, but is not limited to, the first position of the soldering area on the backplate and the relative position between the gold finger area and the power connector. These need to be aligned in the vertical direction to ensure that the adapter board can establish a solid electrical connection regardless of the height of the server power connector, achieving the technical effect of height-adaptive connection.

[0034] In this embodiment of the invention, the soldering area of ​​the adapter board is fixed to a position on the back panel of the power supply module that matches the height of the server's power connector. This allows the gold finger area of ​​the adapter board to connect with the power connector, thereby achieving height compensation and adaptive docking between the power supply module and the server's power converter. Furthermore, by configuring the current transmission line between the soldering area and the gold finger area, standard CRPS power modules can be directly connected to servers of different heights via the adapter board. In summary, this invention solves the technical problem of the inability to connect the power supply module and the storage server due to height mismatch, achieving a height-adaptive connection between the power supply module and the server.

[0035] As an optional embodiment, the soldering area further includes a first control signal via pin and a first ground pin, and the gold finger area further includes a second control signal via pin and a second ground pin. A line for transmitting control signals is configured between the first control signal via pin and the second control signal via pin. The first control signal via pin is in contact with the backplane, the second control signal via pin is in contact with the power connector, and a grounding line with an electrical loop is configured between the first ground pin and the second ground pin.

[0036] Optionally, the aforementioned first control signal via pin may, but is not limited to, be used to indicate pins set within the soldering area. These pins are used to transmit various control signals, such as power management signals, fan control signals, and battery backup unit signals, to ensure effective data exchange and status monitoring between the server and the power supply module.

[0037] It should be noted that the aforementioned second control signal via pin may include, but is not limited to, pins located within the gold finger area, corresponding to the first control signal via pin, and is used to transmit the control signals received from the soldering area to the server's power connector without loss, thereby enabling the server to perform fine control over the power supply module.

[0038] Furthermore, the aforementioned control signal lines may, but are not limited to, lines designed inside the adapter board to carry signal transmission from the first control signal via pin to the second control signal via pin, ensuring that the server can monitor and adjust the working status of the power supply module in real time, thereby improving the stability and energy efficiency of the entire system.

[0039] Optionally, the aforementioned first ground pin may, but is not limited to, be used to represent pins in the soldering area. Its main responsibility is to establish an electrical loop with the backplane for power signal return and electrical isolation, as well as to provide a reference potential for control signals to ensure high-quality signal transmission.

[0040] It should be noted that the aforementioned second ground pin may include, but is not limited to, pins located within the gold finger area, forming part of an electrical circuit with the first ground pin, and is connected to the server's power connector via a grounding line to achieve stable power signal return and system electromagnetic compatibility.

[0041] Furthermore, the aforementioned grounding line may refer to, but is not limited to, the line inside the adapter board, used to ensure the electrical connection between the first ground pin and the second ground pin, forming a continuous electrical loop. This not only helps the power signal to return effectively, but also shields external interference and protects the signal line from electromagnetic radiation.

[0042] Furthermore, the aforementioned mutual contact may refer to, but is not limited to, the physical contact between the first control signal via pin and the contact point on the backplane, and between the second control signal via pin and the contact pin of the power connector. This contact is a prerequisite for electrical connection, ensuring accurate transmission of control signals and stable return of power signals.

[0043] Optionally, as an optional example, the soldering area may be configured with, but is not limited to, 24 signal via pins (for representing the first control signal via pins), 6 power via pins (for representing the first power signal via pins), 2 ground pins (for representing the first ground pins) and 2 screw holes; the gold finger area may be configured with, but is not limited to, 23 signal via pins (for representing the second control signal via pins), 9 power via pins (for representing the second power signal via pins) and 6 ground pins (for representing the second ground pins).

[0044] Alternatively, as another example, the adapter board described above can be, but is not limited to, as follows: Figure 2 As shown, the soldering area 101-1 includes a first power supply through-hole pin 101-3, a first control signal through-hole pin 101-6, a first ground pin 101-7, and a screw through-hole 101-8 for fixing the soldering area. The gold finger area 101-2 includes a second power supply through-hole pin 101-4, a second control signal through-hole pin 101-9, a second ground pin 101-10, and a gold finger assembly 101-5 for fixing the gold finger area (e.g., Figure 2 As shown, the gold finger assembly is the metal component under each pin, which can be inserted into the server's power converter so that each pin interacts with the internal contact points of the power converter to achieve the connection between the adapter board and the power converter.

[0045] Optionally, when the aforementioned adapter board for connecting the storage server and power supply module is panelized, the printed circuit board piece (PCS) size is 70.4×28mm, the board panel unit (SET) size is 90.4×120mm, the board panel (PNL) size is 622×520mm, and the board sheet size is 4941inch. The printed circuit board (PCB) panelization adopts a double butterfly panelization design, with each SET containing 4 PCS, resulting in a net SET utilization rate of 83.7%. Using a traditional double-up panelization design, the net SET utilization rate is only 70%. Furthermore, the top and bottom edge widths are 8mm, 3mm wider than the traditional design, effectively ensuring the passability and soldering yield of the printed circuit board (PCB). For example, a panel assembly unit consisting of 4 pieces is taken as an example. Figure 3 As shown, from left to right, the first printed circuit board A302, the second printed circuit board B304, the third printed circuit board C306, and the fourth printed circuit board D308 are arranged in a "double butterfly" mirror image: printed circuit board A302 and printed circuit board B304 are head to head to form the left wing, and printed circuit board C306 and printed circuit board D308 are head to head to form the right wing.

[0046] By employing this embodiment of the invention, first and second control signal via pins and first and second ground pins are respectively provided in the soldering area and the gold finger area, enabling reliable signal-level communication and electrical ground connection between the server and the power supply module. This enhances the server's remote management capability over the power supply module while ensuring signal integrity during power transmission and avoiding signal distortion caused by electromagnetic interference or poor grounding. In this way, the server can more intelligently manage and optimize power supply under different conditions, improving system stability and energy efficiency.

[0047] As an optional embodiment, the first control signal via includes a first power control signal via for transmitting power control signals, a first fan control signal via for transmitting fan control signals, and a first battery backup unit signal via for transmitting battery backup unit control signals. The second control signal via includes a second power control signal via for transmitting power control signals, a second fan control signal via for transmitting fan control signals, and a second battery backup unit signal via for transmitting battery backup unit control signals.

[0048] Optionally, the aforementioned control signal via pins may, but are not limited to, be used to indicate through pins designed on the circuit board, whose function is to connect different circuit board layers and realize signal transmission from one layer to another. These pins are provided in both the soldering area and the gold finger area of ​​the adapter board, and are respectively named the first control signal via pin and the second control signal via pin.

[0049] It should be noted that the aforementioned first power control signal via may include, but is not limited to, pins within the soldering area. It is used to transmit control signals related to power management, such as power status reports and power switching commands, thereby enabling the server to remotely monitor and intelligently control the power supply module.

[0050] Furthermore, the aforementioned first fan control signal via may refer to, but is not limited to, a pin within the soldering area. Its main function is to transmit fan control signals, ensuring that the server can dynamically adjust the fan speed according to internal temperature changes and maintain the optimal thermal balance of the system.

[0051] Optionally, the aforementioned first battery backup unit signal via may be used, but is not limited to, for transmitting signals related to the status and control of the BBU (battery backup unit) to ensure data security in the event of a power outage.

[0052] It should be noted that the aforementioned second power control signal via may include, but is not limited to, pins within the gold finger area. It corresponds to the first power control signal via and is used to receive power control signals and transmit them to the power connector, ensuring smooth data communication between the server and the power supply module.

[0053] Furthermore, the aforementioned second fan control signal via may refer to, but is not limited to, a pin within the gold finger area, used to transmit fan control signals to the server. By connecting with the first fan control signal via, fan status information is transmitted and control commands are sent, ensuring the efficient operation of the server's thermal management system.

[0054] Optionally, the aforementioned second battery backup unit signal via can be used, but is not limited to, in the gold finger area. Through its connection with the first battery backup unit signal via, it enables the transmission of BBU status information, ensuring that the server can monitor the BBU's working status in real time and make reasonable energy management decisions, such as power switching and data saving.

[0055] Optionally, the aforementioned power control signals may include, but are not limited to: Inter-Integrated Circuit Data / Clock Signal (I2C_SDA / SCL), transmitted between the CRPS power supply and the server's Baseboard Management Controller (BMC) chip, used to transmit the PSU power supply status; Power Supply Unit Alert Signal (PSU_ALERT), transmitted between the CRPS power supply and the server's Complex Programmable Logic Device (CPLD) chip, from the CPLD to the PSU; Power Supply Unit Voltage Sensing Signal (PSU_SENSE_P), transmitted between the CRPS power supply and the server's CPLD chip; and Power Supply Unit Voltage Sharing Signal (PSU_SHARE), transmitted between the CRPS power supply and the server's CPLD chip. The Power Supply Unit Input Power Good Signal (PSU_VIN_GOOD) is transmitted between the CRPS power supply and the server's CPLD chip. The Power Supply Unit Presence Detection Signal (PSU_PRESENT_N) is also transmitted between the CRPS power supply and the server's CPLD chip.

[0056] Optionally, the aforementioned fan control signals may include, but are not limited to: BBU_Inter-Integrated Circuit Data / Clock Signal (BBU_I2C_SDA / SCL), used for transmission between the BBU power supply and the server's Central Processing Unit (CPU) chip; specifically, the CPU can obtain the status of the BBU power supply through this signal; BBU_Charge_STATE, used for transmission between the BBU power supply and the server's CPLD chip; specifically, the CPLD can obtain the charging status of the BBU through this signal; BBU_Charge_EN, used for transmission between the BBU power supply and the server's CPLD chip; specifically, the CPLD can enable charging of the BBU through this signal; and BBU_Charge_Rate. The BBU_CHARGE_RATE signal is used for transmission between the BBU power supply and the CPLD chip in the server. Specifically, the CPLD can obtain the BBU charging rate through this signal. The BBU_DISCHG_EN_N signal is used for transmission between the BBU power supply and the CPLD chip in the server. Specifically, the CPLD can enable the BBU to discharge through this signal. The BBU_PRESENT_N signal is used for transmission between the BBU power supply and the CPLD chip in the server.

[0057] Optionally, the aforementioned battery backup unit signals may include, but are not limited to: a fan enable signal (FAN LEDPower Enable Signal, abbreviated as FAN_LED_PWREN), used for transmission between the fan and the server's CPLD chip; a fan speed control signal (Fan Pulse Width Modulation Signal, abbreviated as FAN_PWM), used for transmission between the fan power supply and the server's BMC chip; and a fan speed measurement signal (Fan Tachometer Signal, abbreviated as FAN_TACH0 / 1), used for transmission between the fan power supply and the server's BMC chip.

[0058] By adopting the embodiments of this utility model, the signal paths of the power supply, fan, and battery backup unit are clearly defined through the classification and control signal through-hole pins, thereby achieving classified management and control of the power supply module's power status, fan speed, and battery backup unit, and optimizing the server's energy management and thermal management system.

[0059] As an optional embodiment, a line for transmitting power control signals is configured between the first power control signal via and the second power control signal via. The power control signals are signals used by the server to manage the power supply module. A line for transmitting fan control signals is configured between the first fan control signal via and the second fan control signal via. The fan control signals are signals used by the server to control the fans in the power supply module. A line for transmitting battery backup unit control signals is configured between the first battery backup unit signal via and the second battery backup unit signal via. The battery backup unit control signals are signals used by the server to control the battery backup units in the power supply module.

[0060] By employing this embodiment of the utility model, precise wiring between specific control signal through-hole pins and circuits enables the server to achieve refined control over the power supply module, including power management, fan control, and status monitoring of the battery backup unit, thereby enhancing system response speed and control accuracy.

[0061] As an optional embodiment, the adapter board includes multiple adapter board sub-layers, which, from top to bottom, include a first signal layer, a first ground layer, a first power layer, a second power layer, a second ground layer, and a second signal layer.

[0062] Optionally, the aforementioned multiple adapter board sub-layers may, but are not limited to, represent the various layer structures constituting the adapter board. These layers are stacked in a specific order to achieve multiple purposes such as signal transmission, power distribution, and electrical isolation, ensuring the integrity of the adapter board's functions and the superiority of its performance.

[0063] It should be noted that the aforementioned first signal layer may include, but is not limited to, the top layer of the adapter board or a layer close to the top layer. It is mainly responsible for carrying and transmitting various control signals received by the signal via pins, such as power control signals, fan control signals, and battery backup unit signals, to ensure the quality and integrity of the signals at the adapter board level.

[0064] Furthermore, the aforementioned first grounding layer may, but is not limited to, refer to the layer immediately below the first signal layer. Its main function is to provide a stable reference potential to shield signal interference on the signal layer, while providing support for the return path of the control signal to ensure signal clarity and system stability.

[0065] Optionally, the aforementioned first power layer may, but is not limited to, describe a layer inside the adapter board used for distributing and transmitting power signals, including a large area of ​​power wiring (shape) to ensure high-efficiency and low-loss power transmission and support energy exchange between the power supply module and the server.

[0066] It should be noted that the aforementioned second power layer may include, but is not limited to, another layer inside the adapter board specifically for power signal transmission and distribution, which works in conjunction with the first power layer to enhance power transmission capabilities, reduce signal interference, and is suitable for high-power and high-performance server environments.

[0067] Furthermore, the aforementioned second grounding layer may, but is not limited to, another grounding layer inside the adapter board, located below the second power layer, in order to further strengthen the electrical isolation between signal lines and power lines, reduce electromagnetic interference, and improve the stability and reliability of the overall circuit.

[0068] Optionally, the second signal layer may, but is not limited to, represent the bottom layer of the adapter board or a layer close to the bottom layer, corresponding to the first signal layer, and jointly carrying the signal transmission task of the signal via pins to ensure the bidirectional communication quality of the signal from the soldering area to the gold finger area.

[0069] By employing the embodiments of this utility model, a multi-layer board structure is used to divide different signal, power, and ground layers, thereby achieving efficient utilization of board space, optimizing signal quality, reducing power interference, enhancing grounding effect, and improving the overall electrical performance of the board.

[0070] As an optional embodiment, the lines in the adapter board for transmitting control signals are configured on the first signal layer, the second power layer, and the second signal layer; the lines in the adapter board for transmitting current are configured on the first signal layer, the first power layer, the second power layer, and the second signal layer; and the grounding lines in the adapter board are configured on the first signal layer, the first ground layer, the second ground layer, and the second signal layer.

[0071] Optionally, the aforementioned lines used for transmitting control signals may, but are not limited to, lines laid out on a specific layer inside the adapter board, such as lines between the first power control signal via and the second power control signal via, lines between the first fan control signal via and the second fan control signal via, and lines between the first battery backup unit signal via and the second battery backup unit signal via. These lines are responsible for carrying critical control information such as power management signals, fan control signals, and battery backup unit signals. In particular, these lines are precisely laid out in the first signal layer, the second power layer, and the second signal layer to ensure high-speed and lossless transmission of control signals.

[0072] It should be noted that the control signal lines on the first signal layer mentioned above may include, but are not limited to, lines located on or near the top layer of the adapter board. These lines are directly connected to the control signal via pins in the soldering area to ensure that the signal is transmitted from the server backplane to the adapter board in the first instant, and also to facilitate signal quality detection.

[0073] Furthermore, the control signal lines on the second power layer mentioned above may refer to, but are not limited to, lines located close to the power supply layer. They utilize the second power layer as a reference plane, enhancing the anti-interference capability of the signal lines and enabling the control signals to maintain stable transmission even in high-current environments, unaffected by power fluctuations.

[0074] It should be emphasized that the control signal lines on the second signal layer mentioned above may, but are not limited to, the lines on or near the bottom layer of the adapter board. Its design takes into account the precise connection between the gold finger area and the server power connector, ensuring that the control signals can be transmitted accurately from the adapter board to the server, thereby achieving efficient data interaction.

[0075] Optionally, the lines used for transmitting current may refer to, but are not limited to, special wiring that carries high-current signals inside the adapter board, such as lines between the first power via pin and the second power via pin. These lines are distributed in the first signal layer, the first power layer, the second power layer, and the second signal layer to support stable power delivery from the CRPS to the server, while ensuring that the signal lines are not affected by current and thus do not cause interference.

[0076] It should be noted that the current lines on the first power layer mentioned above may include, but are not limited to, the lines inside the adapter board used to transmit the main power current. It achieves high current capacity through a large area of ​​metal filling (shape), ensuring sufficient and stable power supply, while reducing resistance and heat generation.

[0077] Furthermore, the current lines on the second power layer mentioned above may refer to, but are not limited to, the power transmission-related lines inside the adapter board, which work together with the lines on the first power layer to jointly build a stable power supply network to meet the power supply needs of high-power components inside the server.

[0078] It should be noted that the aforementioned grounding lines may refer to, but are not limited to, lines installed inside the adapter board to establish electrical loops and provide reference potentials for signal lines, such as the lines between the first ground pin and the second ground pin. These lines cover the first signal layer, the first ground layer, the second ground layer, and the second signal layer, forming a comprehensive grounding network that effectively suppresses electromagnetic interference between signal lines and current lines, ensuring the overall electrical performance of the adapter board.

[0079] Optionally, as an example, the first signal layer can be the outermost copper foil of the adapter board, with serial communication, fan control, and other signal traces etched on its surface, serving as a soldering carrier for components and gold finger contacts; the first ground layer can be a full-plane copper foil adjacent to the first signal layer, with a grounding network laid across the entire board to provide a low-impedance reference plane for signal return and reduce external electromagnetic radiation; the first power layer can be a full-plane copper foil adjacent to the first ground layer, used to carry the 12V main power supply and form a parallel plate capacitor with the ground layer to reduce the power impedance in the high-frequency band; the second power layer can be another full-plane copper foil parallel to the first power layer, with the two power layers connected in parallel to expand the copper cross-sectional area and meet the temperature rise limit of 120 A continuous current; the second ground layer can include, but is not limited to, a full-plane copper foil adjacent to the second signal layer, with its potential connected at the same potential as the first ground layer, forming a dual return plane to further reduce common-mode noise; the second signal layer can be the outermost copper foil on the other side of the adapter board, used to lay out the remaining signal network and tightly coupled with the second ground layer to maintain impedance continuity.

[0080] Alternatively, the specific details of the above six layers can be found in Table 1:

[0081] Table 1

[0082]

[0083] In this design, the top layer 1 represents the first signal layer, the ground layer 2 represents the first ground layer, the power layer 3 represents the first power layer, the power layer 4 represents the second power layer, the ground layer 5 represents the second ground layer, and the bottom layer 6 represents the second signal layer. Optionally, in the 6-layer board design, the stack-up thickness can be, but is not limited to, 61.44 mil (1.56 mm). The ground layer and power layer can be, but are not limited to, a symmetrical 2 oz copper thickness design to ensure that the current of the power supply unit (PSU) can reach more than 120A. The signal lines are mainly routed on the top layer 1 and the bottom layer 6 to ensure that the signal reference is a complete ground layer and that the signal traces are not interfered with by high-frequency signals and power signals.

[0084] By employing the embodiments of this utility model, the physical separation of signal lines and power lines is achieved through the layered arrangement of control signal lines, current transmission lines and grounding lines. This effectively suppresses signal interference, ensures unobstructed current transmission, enhances the reliability and coverage of the grounding network, and improves the overall electrical performance of the circuit board.

[0085] As an optional embodiment, the line width of the first type of control line used for transmitting control signals in the adapter board is a first width, and the first type of control line is used to transmit control signals that match the target communication protocol;

[0086] The second type of control circuit in the adapter board, used for transmitting control signals, has a line width of the second width. The second type of control circuit includes fan speed control signal circuit, fan speed measurement signal circuit, fan enable signal circuit, power supply unit voltage detection signal circuit, and power supply unit voltage current sharing signal circuit.

[0087] The second width is smaller than the first width.

[0088] Optionally, the aforementioned first type of control lines may, but are not limited to, be used to represent lines that transmit conventional control signals. These signals may include, but are not limited to, Inter-Integrated Circuit (I2C) signals, and their line width is defined as the first width. The width setting of I2C and other signal lines (e.g., 11.9 mil) ensures the control of the signal line impedance, for example, keeping it at around 50 ohms. This is crucial for signal integrity, ensuring that the signal does not reflect during transmission on the line and maintaining the purity of the signal waveform.

[0089] It should be noted that the aforementioned second type of control lines may include, but are not limited to, lines that transmit specific function control signals, such as fan speed control signal lines (FAN_PWM), fan speed measurement signal lines (FAN_TACH0 / FAN_TACH1), fan enable signal lines (FAN_LED_PWREN), power supply unit voltage detection signal lines (PSU_SENSE_P), and power supply unit voltage current sharing signal lines (PSU_SHARE). The width of these lines is defined as the second width. Since the second width is smaller than the first width, this design takes into account maintaining signal stability and reducing signal attenuation under high-speed and high-load conditions.

[0090] Furthermore, the aforementioned first width may, but is not limited to, refer to the width of the lines on the adapter board used to transmit basic control signals. This width, for example, 11.9 mil, is chosen to ensure that the signal lines have the correct characteristic impedance, thereby preventing excessive signal reflection or transmission loss on the signal lines and maintaining signal integrity and efficiency.

[0091] Optionally, the second width mentioned above may, but is not limited to, the line width on the adapter board used for transmitting critical or high-frequency control signals, and may be smaller than the first width, such as 10 mil. This design ensures signal integrity and immunity under high bandwidth and high load conditions. Especially for signal types that require higher current or higher frequency transmission, wider lines help improve signal quality and reduce crosstalk between lines.

[0092] It should be noted that the control signals that match the target communication protocol mentioned above may include, but are not limited to, those designed according to a specific communication protocol standard, such as I2C.

[0093] By employing the embodiments of this utility model, high-precision transmission of critical signal lines is achieved through differentiated configuration of line widths for different types of control signal lines, as well as additional protection for sensitive signals such as voltage detection and current sharing signals. This reduces signal distortion and improves the reliability of signal transmission and the accuracy of data.

[0094] As an optional embodiment, the spacing between the first type of control line and the adjacent line is a first spacing;

[0095] The spacing between the fan speed control signal line and the adjacent line is the first spacing.

[0096] The spacing between the power supply unit voltage detection signal line and the power supply unit voltage current sharing signal line and the adjacent lines is the second spacing.

[0097] Except for the first type of control line, fan speed control signal line, power supply unit voltage detection signal line and power supply unit voltage current sharing signal line, the distance between the line and the adjacent line is greater than the predetermined distance.

[0098] Among them, the first spacing is smaller than the second spacing, and the predetermined spacing is smaller than the first spacing.

[0099] It should be noted that the aforementioned first spacing may include, but is not limited to, a carefully adjusted distance value to ensure a reasonable interval between the first type of control lines and adjacent lines. The selection of the first spacing must consider both signal stability and efficient use of the adapter board space, and is generally set to be smaller than the second spacing to accommodate the high-density wiring requirements of signals such as I2C. For example, the first spacing may be, but is not limited to, set to 20 mil.

[0100] Furthermore, the aforementioned second spacing may, but is not limited to, a distance larger than the first spacing, to ensure sufficient isolation between sensitive lines such as the power supply unit voltage detection signal line and the voltage current sharing signal line and surrounding lines, preventing the impact of high-frequency noise or power fluctuations on signal quality, thereby achieving higher signal transmission accuracy and system stability. For example, the second spacing may, but is not limited to, be set to 25 mil.

[0101] Optionally, the aforementioned predetermined spacing may, but is not limited to, represent a basic spacing distance set for general signal lines in the adapter board design. This spacing is smaller than the first spacing, meaning that the minimum clearance between most signal lines, except for those specifically mentioned, is set more leniently. This helps to maximize space utilization while ensuring basic signal quality. For example, the predetermined spacing may, but is not limited to, be set to 19.68 mil to meet the condition of ≥3W (18.06 mil), which can effectively prevent crosstalk and interference between signals and ensure effective and distortion-free signal transmission.

[0102] By employing the embodiments of this utility model, the differential configuration of the spacing between different lines achieves precise control of signal interference, especially prioritizing the protection of sensitive voltage detection signals and current sharing signals, while optimizing the space utilization of the circuit board.

[0103] As an optional embodiment, the spacing between the welding area and the gold finger area is smaller than the target spacing.

[0104] It should be noted that the target spacing mentioned above may include, but is not limited to, the maximum allowable distance threshold set during the design phase. Layouts smaller than this threshold are considered to meet the compactness requirements. For example, assuming the predetermined spacing is 1.1mm, the aforementioned "spacing" may be set to, but is not limited to, 1mm.

[0105] Optionally, the aforementioned "less than target spacing" may, but is not limited to, indicate that the actual measured distance between the edges of the two regions falls below the threshold range, thereby shortening the conductive path, reducing the loop impedance, and saving material.

[0106] Optionally, as an example, after configuring the signal trace width and spacing, the PCB traces are routed according to the pin definitions. Signal lines run on three layers: top layer 1, bottom layer 6, and power layer 4. The two nets on power layer 4 have complete ground plane signals referenced on both sides. Power lines run on four layers: top layer 1, bottom layer 6, power layer 3, and power layer 4, with a power copper shape width of at least 2400 mil to ensure the Power Supply Unit 12V (PSU_12V) power supply meets at least 120A. Ground plane lines are laid with a ground shape across all layers of ground layer 2 and ground layer 5. Ground connection points and empty areas on other layers are also laid with ground plane shapes. This design not only reduces layer stack-up but also ensures signal quality and power signal output efficiency across the entire board. Power signal output efficiency can reach 100%, enabling lossless transmission.

[0107] By employing the embodiments of this utility model, the ultra-small target spacing design between the soldering area and the gold finger area achieves extremely high circuit board space efficiency and the possibility of realizing complex signal and power connections in a small space, saving circuit board area and facilitating deployment and maintenance in high-density server environments.

[0108] As an optional embodiment, the gold finger area includes a first gold finger area and a second gold finger area located on both sides of the adapter board. The first gold finger area includes at least one second power via pin, at least one second control signal via pin, and at least one second ground pin. The second gold finger area includes at least one second power via pin, at least one second control signal via pin, and at least one second ground pin.

[0109] It should be noted that the first and second gold finger areas mentioned above may include, but are not limited to, gold finger areas independently set on both sides of the adapter board. They each contain a series of pins for electrical connection with the server's power connector and power supply module, ensuring bidirectional transmission of power and control signals.

[0110] By adopting the embodiments of this utility model, the dual-sided design of the first gold finger area and the second gold finger area enhances the mechanical strength and electrical connection stability of the circuit board. By distributing the layout of power supply and signal pins, the current path and signal transmission are optimized, while providing a more balanced power distribution and control signal routing for large servers.

[0111] Any of the components, modules, units, parts, methods, and operations described herein can be implemented using software, firmware, hardware (e.g., fixed logic circuitry), manual processing, or any combination thereof. Alternatively or additionally, any functionality described herein can be executed at least in part by one or more hardware logic components, such as, but not limited to, a central processing unit (CPU), a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), an application-specific standard product (ASSP), a system-on-a-chip (SoC), a complex programmable logic device (CPLD), a microprocessor (MCU), etc. The terms "system," "computing device," or "apparatus" as used herein encompass various means, devices, and machines for processing data, including, for example, one or more programmable processors, computers, SoCs, or combinations thereof. The apparatus may also include code that creates an execution environment for the computer program in question, such as code constituting processor firmware, a protocol stack, a database management system, an operating system, a cross-platform runtime environment, a virtual machine, or one or more combinations thereof. The aforementioned computer program (also known as a program, software, software application, app, script, or code) can be written in any form of programming language, including compiled or interpreted languages, declarative or procedural languages, and can be deployed in any form, including as a standalone program or as a module, component, subroutine, object, or other unit suitable for a computing environment.

[0112] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0113] The foregoing has provided a detailed description of the adapter provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A switching device, characterized by The adapter includes: an adapter plate, a backplate, and a power connector, wherein... The adapter board includes a soldering area and a gold finger area. The soldering area includes a first power via pin, and the gold finger area includes a second power via pin and a gold finger assembly. A line for transmitting current is configured between the first power via pin and the second power via pin. The backplane is configured on a power supply module for providing power to the server; The power connector is the power connector configured on the server; The soldering area is fixed at a first position on the backplate so that the first power through-hole pin is in contact with the backplate. The gold finger area is connected to the power connector through the gold finger assembly so that the second power through-hole pin is in contact with the power connector. The height of the first position matches the height of the second position where the power connector is located.

2. The relay device according to claim 1, wherein The soldering area also includes a first control signal via pin and a first ground pin, and the gold finger area also includes a second control signal via pin and a second ground pin. A line for transmitting control signals is configured between the first control signal via pin and the second control signal via pin. The first control signal via pin is in contact with the backplane, and the second control signal via pin is in contact with the power connector. A grounding line with an electrical loop is configured between the first ground pin and the second ground pin.

3. The adapter according to claim 2, characterized in that, The first control signal via includes a first power control signal via for transmitting power control signals, a first fan control signal via for transmitting fan control signals, and a first battery backup unit signal via for transmitting battery backup unit control signals. The second control signal via includes a second power control signal via for transmitting power control signals, a second fan control signal via for transmitting fan control signals, and a second battery backup unit signal via for transmitting battery backup unit control signals.

4. The adapter according to claim 3, characterized in that, A line for transmitting power control signals is configured between the first power control signal via and the second power control signal via. The power control signals are signals used by the server to manage the power supply module. A line for transmitting fan control signals is configured between the first fan control signal via and the second fan control signal via. The fan control signals are signals used by the server to control the fans in the power supply module. A line for transmitting battery backup unit control signals is configured between the first battery backup unit signal via and the second battery backup unit signal via. The battery backup unit control signals are signals used by the server to control the battery backup units in the power supply module.

5. The adapter according to claim 1, characterized in that, The adapter board includes multiple adapter board sub-layers, which, from top to bottom, include a first signal layer, a first ground layer, a first power layer, a second power layer, a second ground layer, and a second signal layer.

6. The adapter according to claim 5, characterized in that, The lines in the adapter board for transmitting control signals are configured on the first signal layer, the second power layer, and the second signal layer. The lines in the adapter board for transmitting current are configured on the first signal layer, the first power layer, the second power layer, and the second signal layer. The grounding lines in the adapter board are configured on the first signal layer, the first ground layer, the second ground layer, and the second signal layer.

7. The adapter according to claim 6, characterized in that, The width of the first type of control line used for transmitting control signals in the adapter board is a first width. The first type of control line is used to transmit control signals that match the target communication protocol. The second type of control line used for transmitting control signals in the adapter board has a second width. The second type of control line includes a fan speed control signal line, a fan speed measurement signal line, a fan enable signal line, a power supply unit voltage detection signal line, and a power supply unit voltage current sharing signal line. The second width is smaller than the first width.

8. The adapter according to claim 7, characterized in that, The distance between the first type of control line and the adjacent line is the first distance; The spacing between the fan speed control signal line and the adjacent line is the first spacing; The spacing between the power supply unit voltage detection signal line and the power supply unit voltage current sharing signal line and their adjacent lines is the second spacing. Except for the first type of control line, the fan speed control signal line, the power supply unit voltage detection signal line and the power supply unit voltage current sharing signal line, the distance between the lines and the adjacent lines is greater than a predetermined distance. Wherein, the first spacing is smaller than the second spacing, and the predetermined spacing is smaller than the first spacing.

9. The adapter according to any one of claims 1 to 8, characterized in that, The distance between the welding area and the gold finger area is less than the target distance.

10. The adapter according to any one of claims 1 to 8, characterized in that, The gold finger area includes a first gold finger area and a second gold finger area located on both sides of the adapter board. The first gold finger area includes at least one second power via pin, at least one second control signal via pin, and at least one second ground pin. The second gold finger area includes at least one second power via pin, at least one second control signal via pin, and at least one second ground pin.

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