A quick heat dissipation type permanent magnet coupler

Abstract

This utility model relates to the field of permanent magnet coupler technology and discloses a fast-heat dissipation permanent magnet coupler, including a coupler body, an upper isolation cover above the coupler body, and a lower isolation cover below the coupler body; a base is disposed below the lower isolation cover, and support plates are vertically installed on the top of both ends of the base. This utility model uses a heat exchange component to cool the air inside the space enclosed by the upper and lower isolation covers, thereby keeping the air near the coupler body at a low temperature. This facilitates better heat exchange between the coupler body and the air, improving the heat dissipation efficiency and effect of the coupler body. The heat dissipation component facilitates the rapid discharge of heat generated at the hot end of the semiconductor cooling chip from the inside of the processing chamber, preventing heat from remaining at the hot end of the semiconductor cooling chip for extended periods, thus improving the working stability of the semiconductor cooling chip.

Description

Technical Field

[0001] This utility model relates to the field of permanent magnet coupler technology, specifically a fast heat dissipation type permanent magnet coupler. Background Technology

[0002] A permanent magnet coupler is a device that transmits torque from a motor to a load through the air gap between a conductor and a permanent magnet. It is a transmission device that enables the motor and the load to be connected without mechanical connection. During the actual operation of the permanent magnet coupler, magnetic induction eddy current losses will generate a lot of heat. After a long period of accumulation, the temperature of the copper disk and the permanent magnet will rise. In order to prevent the permanent magnet from demagnetizing due to the permanent magnet coupler being in a high-temperature state for a long time, the staff will carry out heat dissipation treatment for the permanent magnet coupler.

[0003] Existing permanent magnet couplers typically achieve heat exchange and cooling by adding multiple sets of heat dissipation fins to the outside of the coupler. However, this method, which relies solely on forced convection between the heat dissipation fins and the surrounding air for heat exchange and cooling, has relatively low heat dissipation efficiency and effect. Due to the lack of a cooling mechanism for the air near the permanent magnet coupler, as the permanent magnet coupler operates for a long time, the air temperature near the heat dissipation fins becomes quite high. If cooling is then attempted through the heat dissipation fins, the cooling effect will be relatively low, which is not conducive to the long-term operation of the permanent magnet coupler. Utility Model Content

[0004] The purpose of this invention is to provide a fast-heat dissipation permanent magnet coupler to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a fast heat dissipation permanent magnet coupler, comprising:

[0006] The coupler body has an upper isolation cover above it and a lower isolation cover below it.

[0007] A base is located below the lower isolation cover, and support plates are vertically installed at the top of both ends of the base. The top of the support plates is connected to the lower isolation cover.

[0008] A processing box is installed on top of the base. Inside the processing box, two quadrilateral frames are symmetrically installed, and semiconductor cooling chips are fixedly installed inside the quadrilateral frames.

[0009] A heat dissipation assembly is located inside the processing chamber, and a heat exchange assembly is provided on the outside of the semiconductor cooling chip to create a low-temperature environment inside the upper isolation cover to improve the heat dissipation efficiency of the coupler body.

[0010] Preferably, the heat exchange assembly includes a coiled tube fixed to both sides of the inner wall of the upper isolation cover. One end of the coiled tube extends through to the outside of the upper isolation cover and is connected to a first liquid pipe. The other end of the coiled tube extends through to the outside of the upper isolation cover and is connected to a second liquid pipe. Two liquid pumps are symmetrically installed on one side of the processing tank. The bottom end of the first liquid pipe is connected to the liquid pump outlet. A liquid storage tank is fixedly installed on the other side of the processing tank. The bottom end of the second liquid pipe is connected to the liquid storage tank inlet. A first heat-conducting plate is fixedly connected to the side of each of the two semiconductor cooling chips that are close to each other. A circulation pipe is fixedly installed on one side of the first heat-conducting plate. One end of the circulation pipe extends through the processing tank and is connected to the liquid storage tank outlet. The other end of the circulation pipe extends through the processing tank and is connected to the liquid pump inlet.

[0011] Preferably, the liquid storage tank is provided with a liquid exchange port on one side top and one side bottom, and a valve is installed inside the liquid exchange port.

[0012] Preferably, the heat exchange assembly includes a second heat-conducting plate fixed to one side of the semiconductor cooling chip, a plurality of heat dissipation fins symmetrically installed on one side of the second heat-conducting plate, heat exhaust ports on both sides of the processing box, heat exhaust fans fixedly installed inside the heat exhaust ports, a protective mesh fixedly connected to one side opening of the heat exhaust port, an air inlet slot inside the processing box, and a dust filter fixedly connected inside the air inlet slot.

[0013] Preferably, extensions are provided at both sides of the upper isolation cover and both sides of the lower isolation cover, and adjacent extensions are connected by bolts.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This invention uses a heat exchange component to cool the air inside the space enclosed by the upper and lower isolation covers, thereby keeping the air near the coupler body at a low temperature. This facilitates better heat exchange between the coupler body and the air, improving the heat dissipation efficiency and effect of the coupler body. The heat dissipation component facilitates the rapid removal of heat generated at the hot end of the semiconductor cooling chip from the inside of the processing chamber, preventing heat from remaining at the hot end of the semiconductor cooling chip for a long time, which helps improve the working stability of the semiconductor cooling chip. Attached Figure Description

[0016] Figure 1 A schematic diagram of a preferred embodiment of the fast heat dissipation permanent magnet coupler provided by this utility model;

[0017] Figure 2 A schematic diagram of the specific structure of the coupler body provided by this utility model;

[0018] Figure 3This is a schematic diagram of the internal structure of the upper isolation cover provided by this utility model;

[0019] Figure 4 A schematic diagram of the specific structure of the spiral tube provided by this utility model;

[0020] Figure 5 A schematic diagram of the specific structure of the processing box provided by this utility model;

[0021] Figure 6 This is a schematic diagram of the heat exchange component structure provided by this utility model.

[0022] In the diagram: 1. Coupler body; 2. Upper isolation cover; 3. Lower isolation cover; 4. Support plate; 5. Base; 6. Processing box; 7. Quadrilateral frame; 8. Semiconductor cooling chip; 9. Heat exchange assembly; 91. First heat conduction plate; 92. Circulation pipe; 93. Liquid pump; 94. First liquid pipe; 95. Liquid storage tank; 96. Second liquid pipe; 97. Coiled pipe; 10. Liquid exchange port; 11. Heat dissipation assembly; 111. Second heat conduction plate; 112. Heat dissipation fins; 113. Heat dissipation port; 114. Heat dissipation fan; 115. Protective fence; 116. Air inlet slot; 117. Dust filter; 12. Extension. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-6As shown, a fast-heat dissipation permanent magnet coupler includes a coupler body 1. It should be noted that the coupler body 1 in this invention is a YCOX-limited-distance permanent magnet coupler. Multiple sets of fins are installed on its two side structural frames, and heat exchange and cooling are achieved through forced convection between the fins and the surrounding air. An upper isolation cover 2 is provided above the coupler body 1, and a lower isolation cover 3 is provided below the coupler body 1. By setting the upper isolation cover 2 and the lower isolation cover 3, on the one hand, all-round protection of the coupler body 1 can be achieved, and on the other hand, a relatively closed environment can be created near the coupler body 1, thereby reducing interference from the external environment and improving the heat dissipation efficiency and effect of the coupler body 1. A base 5 is located below the lower isolation cover 3, and support plates 4 are vertically installed at both ends of the base 5. The top of the support plates 4 are connected to the lower isolation cover 3. A processing box 6 is installed on top of the base 5. Two quadrilateral frames 7 are symmetrically installed inside the processing box 6. A thermoelectric cooling chip 8 is fixedly installed. It should be noted that the thermoelectric cooling chip 8 in this invention is also called a thermoelectric cooling chip. Its cold end and hot end are responsible for heat absorption and heat release, respectively, and the heat transfer is mainly achieved through the Peltier effect. The heat dissipation component 11 is set inside the processing box 6. By setting the heat dissipation component 11, the heat generated by the hot end of the thermoelectric cooling chip 8 can be quickly discharged from the inside of the processing box 6, thereby preventing heat from staying at the hot end of the thermoelectric cooling chip 8 for a long time, which is beneficial to improving the working stability of the thermoelectric cooling chip 8. A heat exchange component 9 is provided on the outside of the thermoelectric cooling chip 8 to create a low temperature environment inside the upper isolation cover 2 to improve the heat dissipation efficiency of the coupler body 1. By setting the heat exchange component 9, the air inside the space enclosed by the upper isolation cover 2 and the lower isolation cover 3 can be cooled, thereby keeping the air near the coupler body 1 at a low temperature. This is conducive to better heat exchange between the coupler body 1 and the air, and enhances the overall heat dissipation efficiency and heat dissipation effect of the coupler body 1.

[0025] The heat exchange assembly 9 includes coiled tubes 97 fixed to both sides of the inner wall of the upper isolation cover 2. One end of the coiled tube 97 extends to the outside of the upper isolation cover 2 and is connected to a first liquid pipe 94. The other end of the coiled tube 97 extends to the outside of the upper isolation cover 2 and is connected to a second liquid pipe 96. Two liquid pumps 93 are symmetrically installed on one side of the processing tank 6. The bottom end of the first liquid pipe 94 is connected to the outlet of the liquid pump 93. A storage tank 95 is fixedly installed on the other side of the processing tank 6. The bottom end of the second liquid pipe 96 is connected to the inlet of the storage tank 95. A first heat-conducting plate 91 is fixedly connected to the side of the two semiconductor cooling chips 8 that are close to each other. A circulation pipe 92 is fixedly installed on one side of the first heat-conducting plate 91. One end of the circulation pipe 92 extends through the processing tank 6 and is connected to the outlet of the storage tank 95. The other end of the circulation pipe 92 extends through the processing tank 6 and is connected to the inlet of the liquid pump 93. Figure 2 , Figure 4 and Figure 6As shown, the coolant inside the storage tank 95 can be drawn into the circulation pipe 92 by the liquid pump 93. Under the action of the semiconductor cooling chip 8, the coolant will be cooled down. Then, the cooled coolant enters the spiral tube 97 through the first liquid pipe 94. The spiral tube 97 extends the time that the coolant stays in the upper isolation cover 2 and increases the contact area between the coolant and the air inside the upper isolation cover 2. This keeps the air near the coupler body 1 at a low temperature, which is beneficial for the coupler body 1 to exchange heat with the air better. It should be noted that in order to ensure the normal heat dissipation of the coupler body 1, the first heat conduction plate 91 should be set at the cold end of the semiconductor cooling chip 8.

[0026] The liquid storage tank 95 has a liquid exchange port 10 on both the top and bottom sides. A valve is installed inside the liquid exchange port 10, such as... Figure 5 As shown, in actual use, the upper fluid exchange port 10 is the injection port, and the lower fluid exchange port 10 is the drain port. By setting the fluid exchange port 10, it is convenient to replace the coolant inside the liquid storage tank 95.

[0027] The heat exchange assembly 9 includes a second heat-conducting plate 111 fixed to one side of the semiconductor cooling chip 8. Multiple heat dissipation fins 112 are symmetrically mounted on one side of the second heat-conducting plate 111. Exhaust ports 113 are provided on both sides of the processing box 6. Exhaust fans 114 are fixedly installed inside the exhaust ports 113. A protective mesh 115 is fixedly connected to one opening of the exhaust port 113. An air inlet slot 116 is provided inside the processing box 6. A dust filter 117 is fixedly connected inside the air inlet slot 116. Figure 2 , Figure 5 and Figure 6 As shown, the heat generated by the thermoelectric cooler 8 during operation is transferred to the heat dissipation fins 112 through the second heat-conducting plate 111. At this time, the exhaust fan 114 can drive the external air into the interior of the processing box 6 through the air inlet slot 116. Then, the external air absorbs the heat from the heat dissipation fins 112 and is discharged from the heat dissipation port 113. This facilitates the rapid discharge of the heat generated by the hot end of the thermoelectric cooler 8 from the interior of the processing box 6, thereby preventing the heat from staying at the hot end of the thermoelectric cooler 8 for a long time and improving the working stability of the thermoelectric cooler 8. It should be noted that, in order to ensure the normal operation of the coupler body 1 heat dissipation, the second heat-conducting plate 111 should be set at the hot end of the thermoelectric cooler 8.

[0028] Extensions 12 are provided at both sides of the upper isolation cover 2 and both sides of the lower isolation cover 3. Adjacent extensions 12 are connected by bolts. Figure 1 , Figure 2As shown, by setting the extension 12, in actual use, the staff can use the extension 12 in conjunction with bolts and other fasteners to facilitate the assembly of the upper isolation cover 2 and the lower isolation cover 3, thereby facilitating the disassembly and installation of the coupler body 1.

[0029] Working principle: First, the operator places the coupler body 1 inside the space formed by the upper isolation cover 2 and the lower isolation cover 3. Then, the two ends of the coupler body 1 are connected to the external motor shaft and load shaft, respectively. When the coupler body 1 is working, the heat exchange component 9 can cool the air inside the space enclosed by the upper isolation cover 2 and the lower isolation cover 3, thereby keeping the air near the coupler body 1 at a low temperature. This is conducive to better heat exchange between the coupler body 1 and the air, enhancing the heat dissipation efficiency and effect of the coupler body 1. During this process, the heat dissipation component 11 can facilitate the rapid discharge of the heat generated by the hot end of the semiconductor cooling chip 8 from the inside of the processing box 6, thereby preventing the heat from staying at the hot end of the semiconductor cooling chip 8 for a long time, which is conducive to improving the working stability of the semiconductor cooling chip 8.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A quick heat-dissipation type permanent magnet coupler, characterized by, include: Coupler body (1), with an upper isolation cover (2) above the coupler body (1) and a lower isolation cover (3) below the coupler body (1); The base (5) is located below the lower isolation cover (3). Support plates (4) are vertically installed on the top of both ends of the base (5). The top of the support plates (4) is connected to the lower isolation cover (3). A processing box (6) is installed on top of a base (5). Two quadrilateral frames (7) are symmetrically installed inside the processing box (6). A semiconductor cooling chip (8) is fixedly installed inside the quadrilateral frame (7). A heat dissipation assembly (11) is disposed inside the processing box (6), and a heat exchange assembly (9) is provided on the outside of the semiconductor cooling chip (8) for creating a low-temperature environment inside the upper isolation cover (2) to enhance the heat dissipation efficiency of the coupler body (1).

2. The fast heat dissipation permanent magnet coupler according to claim 1, characterized in that: The heat exchange assembly (9) includes a coiled tube (97) fixed to both sides of the inner wall of the upper isolation cover (2). One end of the coiled tube (97) extends through to the outside of the upper isolation cover (2) and is connected to a first liquid pipe (94). The other end of the coiled tube (97) extends through to the outside of the upper isolation cover (2) and is connected to a second liquid pipe (96). Two liquid pumps (93) are symmetrically installed on one side of the processing tank (6). The bottom end of the first liquid pipe (94) is connected to the outlet of the liquid pump (93). The other end of the processing tank (6)... A liquid storage tank (95) is fixedly installed on the side. The bottom end of the second liquid pipe (96) is connected to the liquid inlet of the liquid storage tank (95). A first heat-conducting plate (91) is fixedly connected to the side of each of the two semiconductor cooling chips (8) that are close to each other. A circulation pipe (92) is fixedly installed on one side of the first heat-conducting plate (91). One end of the circulation pipe (92) passes through the processing box (6) and is connected to the liquid outlet of the liquid storage tank (95). The other end of the circulation pipe (92) passes through the processing box (6) and is connected to the liquid inlet of the pump (93).

3. A fast-heat dissipation permanent magnet coupler according to claim 2, characterized in that: The liquid storage tank (95) is provided with a liquid exchange port (10) on one side top and one side bottom, and a valve is installed inside the liquid exchange port (10).

4. A fast-heat dissipation permanent magnet coupler according to claim 1, characterized in that: The heat exchange assembly (9) includes a second heat-conducting plate (111) fixed to one side of the semiconductor cooling chip (8). Multiple heat dissipation fins (112) are symmetrically installed on one side of the second heat-conducting plate (111). The processing box (6) has heat exhaust ports (113) on both sides. A heat exhaust fan (114) is fixedly installed inside the heat exhaust port (113). A protective net (115) is fixedly connected to the opening on one side of the heat exhaust port (113). An air inlet slot (116) is opened inside the processing box (6). A dust filter (117) is fixedly connected inside the air inlet slot (116).

5. A fast-heat dissipation permanent magnet coupler according to claim 1, characterized in that: Extensions (12) are provided on both sides of the upper isolation cover (2) and both sides of the lower isolation cover (3), and adjacent extensions (12) are connected by bolts.

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