Circuit boards and multilayer circuit boards containing them
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENNAN CIRCUITS
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-30
Smart Images
Figure CN224439278U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board and a multilayer circuit board having the same. Background Technology
[0002] The heat generated by components embedded in the circuit board will diffuse outwards, causing the temperature of components located on the top surface of the circuit board to rise, thereby affecting the reliability of components located on the top surface of the circuit board.
[0003] In related technologies, integrated heat sinks or thermal vias are often used, but these methods are difficult to directionally suppress the heat generated by components embedded in the circuit board from spreading to the top surface of the circuit board. Utility Model Content
[0004] This utility model provides a circuit board to solve the problem of heat generated by components embedded inside the circuit board affecting components located on the top surface of the circuit board, thereby reducing the impact of heat generated by components embedded inside the circuit board on components located on the top surface of the circuit board.
[0005] The circuit board in this embodiment of the utility model includes:
[0006] A first substrate, wherein the first substrate is provided with a through hole therethrough;
[0007] A heat dissipation chip module includes a heat sink and a first component. The heat sink is disposed in the through hole, and the first component is disposed on the top surface of the heat sink. The top surface of the first component is provided with a first heat insulation layer, and the portion of the top surface of the heat sink where the first component is not disposed is provided with a second heat insulation layer.
[0008] Therefore, the circuit board of this utility model embodiment can reduce the impact of heat generated by components embedded inside the circuit board on components located on the top surface of the circuit board.
[0009] Optionally, the top surface of the first heat insulation layer facing away from the first component is flush with the top surface of the first substrate, and the top surface of the second heat insulation layer facing away from the heat sink is flush with the top surface of the first substrate; and / or,
[0010] The thickness of the first insulation layer is 0.02-0.1 mm, and the thickness of the second insulation layer is 0.02-0.1 mm.
[0011] Optionally, a third heat insulation layer is provided between the outer wall surface of the heat sink and the inner wall surface of the through hole.
[0012] Optionally, one end of the third heat insulation layer in the thickness direction of the first substrate is flush with the top surface of the first substrate, and the other end of the third heat insulation layer in the thickness direction of the first substrate is flush with the bottom surface of the first substrate.
[0013] Optionally, the heat sink is provided with a receiving groove, and the first component is disposed in the receiving groove.
[0014] Optionally, at least a portion of the sidewall of the receiving groove and the sidewall of the first component have a gap between them.
[0015] Optionally, a heat dissipation component is provided on the bottom surface of the first substrate, the bottom surface of the heat dissipation block is in contact with the heat dissipation component, and a first insulating and thermally conductive layer is provided between the heat dissipation block and the heat dissipation component.
[0016] Optionally, the heat sink has heat dissipation fins on the surface of the surface away from the first substrate.
[0017] Optionally, a second insulating and thermally conductive layer is provided between the heat sink and the first substrate.
[0018] This utility model also provides a multilayer circuit board.
[0019] The multilayer circuit board of this utility model embodiment includes:
[0020] The circuit board as described in the above embodiments
[0021] The second substrate has a second component on its top surface and its bottom surface abuts against the top surface of the first substrate.
[0022] By providing the circuit board of the above embodiment, the multilayer circuit board of this utility model can suppress the heat generated by the first component embedded in the circuit board from being transmitted along the top surface of the first component, thereby reducing the impact of the heat generated by the first component on the second component located on the top surface of the second substrate.
[0023] Therefore, the circuit board of this utility model embodiment can reduce the impact of heat generated by components embedded inside the circuit board on components located on the top surface of the circuit board. Attached Figure Description
[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1This is a schematic diagram of the structure of a circuit board in the prior art;
[0026] Figure 2 This is a schematic diagram of the circuit board structure according to an embodiment of the present invention;
[0027] Figure 3 This is a schematic diagram of the circuit board structure according to another embodiment of the present invention;
[0028] Figure 4 This is a schematic diagram of the structure of a multilayer circuit board according to an embodiment of the present invention.
[0029] In the picture:
[0030] 100. Circuit board; 200. Multilayer circuit board; 300. Heat dissipation chip module;
[0031] 1. First substrate; 101. Through hole;
[0032] 2. First component;
[0033] 3. Second substrate;
[0034] 4. Second component;
[0035] 5. Heat sink;
[0036] 6. Heat sink components; 601. Heat sink fins;
[0037] 7. First insulation layer;
[0038] 8. Second insulation layer;
[0039] 9. Receiving tank;
[0040] 10. First insulating and thermally conductive layer;
[0041] 11. Second insulating and thermally conductive layer;
[0042] 12. Third insulation layer. Detailed Implementation
[0043] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0044] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0045] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal encapsulation of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0046] As shown in the figure, the heat generated by the components embedded in the circuit board will diffuse to the surroundings. The diffused heat will cause the temperature of the components located on the top surface of the circuit board to rise, thereby affecting the reliability of the components located on the top surface of the circuit board.
[0047] In order to reduce the impact of heat generated by components embedded inside the circuit board 200 on components located on the top surface of the circuit board 200.
[0048] This utility model provides a circuit board 100.
[0049] The resistor plate assembly of this utility model embodiment includes a first substrate 1 and a heat dissipation chip module 300.
[0050] The first substrate 1 has a through hole 101 penetrating the first substrate 1. The heat dissipation chip module 300 includes a heat sink 5 and a first component 2. The heat sink 5 is disposed in the through hole, and the first component 2 is disposed on the top surface of the heat sink 5. The top surface of the first component 2 is provided with a first heat insulation layer 7, and the portion of the top surface of the heat sink where the first component is not disposed is provided with a second heat insulation layer 8. That is, the top surface of the heat dissipation chip module 300 is provided with a heat insulation layer including the first heat insulation layer 7 and the second heat insulation layer 8.
[0051] It should be noted that the "top surface" and "bottom surface" mentioned in this utility model are arranged opposite to each other in the thickness direction of the circuit board. For example, the top surface of the first substrate 1 and the bottom surface of the first substrate 1 are arranged opposite to each other in the thickness direction of the first substrate 1; as another example, the top surface of the first component 2 and the bottom surface of the first component 2 are arranged opposite to each other in the thickness direction of the first component 2, and the top surface of the first substrate 1 and the top surface of the first component 2 face the same direction, and the bottom surface of the first substrate 2 and the bottom surface of the first component 2 face the same direction.
[0052] It is understandable that in the field of circuit board 200 manufacturing, the top surface of the first substrate 1 is usually laminated with other substrates, and other components are set on the top surface of the other substrates to produce a circuit board 200 that meets the requirements.
[0053] The heat dissipation chip module 300 of the circuit board 100 in this embodiment of the present invention has a heat insulation layer including a first heat insulation layer 7 and a second heat insulation layer 8 on its top surface, which can suppress the heat generated by the first component 2 from being transferred to the top surface of the circuit board, thereby reducing the impact of the heat generated by the first component 2 on other components located on the top surface of the circuit board.
[0054] Therefore, the circuit board 100 of this utility model embodiment can reduce the impact of the heat generated by the components embedded inside the circuit board 100 on the components located on the top surface of the circuit board 100.
[0055] The following is in conjunction with the appendix Figure 2-4 The circuit board 100 of this utility model embodiment is further described.
[0056] The resistor plate assembly of this utility model embodiment includes a first substrate 1 and a heat dissipation chip module 300.
[0057] like Figure 2 As shown, in the thickness direction of the first substrate, the first substrate 1 is provided with a through hole 101 that penetrates the first substrate 1, that is, the through hole 101 can connect the top surface and the bottom surface of the first substrate 1.
[0058] The heat dissipation chip module 300 includes a heat sink 5 and a first component 2.
[0059] like Figure 2 As shown, the heat sink 5 is disposed in the through hole 101. The outer wall surface of the heat sink 5 abuts against the inner wall surface of the through hole 101 to fix the heat sink 5 in the through hole 101. The bottom surface of the heat sink 5 is flush with the bottom surface of the first substrate 1.
[0060] Optionally, the heat sink 5 is a metal block, such as a copper block.
[0061] The first component 2 is located on the top surface of the heat sink 5.
[0062] To prevent the first component 2 from dissipating heat from its top surface upwards, a first heat insulation layer 7 is provided on the top surface of the first component 2. To prevent the heat sink 5 from dissipating heat from its top surface upwards, a second heat insulation layer 8 is provided on the part of the top surface of the heat sink 5 where the first component is not located. That is, the top surface of the heat dissipation chip module 300 is provided with a heat insulation layer including the first heat insulation layer 7 and the second heat insulation layer 8.
[0063] On the one hand, a first heat insulation layer and a second heat insulation layer are respectively provided on the top surface of the first component 2 and the top surface of the heat sink 5 where the first component is not provided. This can suppress the heat transfer of the heat sink chip module to the top surface of the circuit board, thereby reducing the impact of the heat sink chip module 300 on other components on the top surface of the circuit board.
[0064] On the other hand, the heat sink 5 can transfer the heat generated by the first component 1 downwards and guide it to the bottom surface of the first substrate 1, which can further reduce the impact of the heat dissipation chip module 300 on other components on the top surface of the circuit board.
[0065] In some embodiments, the top surface of the first heat insulation layer 7 is flush with the top surface of the first substrate 1, and the top surface of the second heat insulation layer 8 is flush with the top surface of the first substrate 1; and / or,
[0066] The thickness of the first insulation layer 7 is 0.02-0.1mm, and the thickness of the second insulation layer 8 is 0.02-0.1mm.
[0067] Preferably, the thickness of the first heat insulation layer 7 is 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, or 0.10mm.
[0068] It is understandable that a larger thickness of the first insulation layer 7 results in better insulation performance but increases manufacturing costs, while a smaller thickness results in lower manufacturing costs but reduces insulation performance. Therefore, the inventors set the thickness of the first insulation layer 7 to 0.02-0.1 mm, which reduces manufacturing costs while meeting normal insulation requirements.
[0069] Preferably, the thickness of the first heat insulation layer 7 is 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, or 0.10mm.
[0070] It is understandable that a larger thickness of the second insulation layer 8 results in better insulation performance but increases manufacturing costs, while a smaller thickness results in lower manufacturing costs but reduces insulation performance. Therefore, the inventors set the thickness of the second insulation layer 8 to 0.02-0.1 mm, which can reduce manufacturing costs while meeting normal insulation requirements.
[0071] In some embodiments, such as Figure 3 As shown, a third heat insulation layer 12 is provided between the outer wall surface of the heat sink 5 and the inner wall surface of the through hole 101.
[0072] Furthermore, such as Figure 3 As shown, one end of the third heat insulation layer 12 in the thickness direction of the first substrate 1 is flush with the top surface of the first substrate, and one end of the third heat insulation layer in the thickness direction of the first substrate is flush with the bottom surface of the first substrate.
[0073] By providing a third heat insulation layer 12, the circuit board of this utility model embodiment can prevent the heat sink from dissipating heat in its circumference, so that the heat sink can only dissipate heat to the bottom surface of the first substrate 1, that is, downwards, which can further reduce the impact of the heat dissipation chip module 300 on other components on the top surface of the circuit board.
[0074] In some embodiments, the top surface of the heat sink 5 is provided with a receiving groove 9, and the first component 2 is disposed in the receiving groove 9.
[0075] In order to facilitate the positioning and installation of the first component 2 on the top surface of the heat sink 5, a receiving groove 9 for accommodating the first component 2 can be provided on the top surface of the heat sink 5.
[0076] Furthermore, at least a portion of the first component 2 is disposed in the first receiving groove 9. That is, a portion of the first component 2 can be disposed in the first receiving groove 9, meaning the depth of the first receiving groove 9 is less than the thickness of the first component 2; or all of the first component 2 can be disposed in the first receiving groove 9, meaning the depth of the first receiving groove 9 is greater than or equal to the thickness of the first component 2.
[0077] For example, the top surface of the first component 2 is flush with the top surface of the heat sink 5.
[0078] In some embodiments, there is a gap between at least part of the inner wall of the receiving groove 9 and the outer wall of the first component 2.
[0079] In other words, it can partially accommodate the gap between the inner wall of the groove 9 and the outer wall of the first component 2; or it can fully accommodate the gap between the inner wall of the groove 9 and the outer wall of the first component 2.
[0080] For example, such as Figure 2 As shown, there is a gap between the inner wall of the entire receiving groove 9 and the outer wall of the first component 2, and the gap is filled with the second heat insulation layer 8.
[0081] like Figure 2 and 3 As shown, part of the second heat insulation layer 8 is located between the inner wall of the receiving groove 9 and the outer wall of the first component 2, thereby preventing the heat generated by the first component 2 from being transmitted out through the side wall of the first component 2.
[0082] In some embodiments, a heat sink 6 is provided on the bottom surface of the first substrate 1, the bottom surface of the heat sink 5 is in contact with the heat sink 6, and a first insulating and thermally conductive layer 10 is provided between the heat sink 5 and the heat sink 6.
[0083] By providing a heat sink 6 on the bottom surface of the first substrate 1, the heat dissipation area can be further increased, the heat generated by the first component 2 can be further accelerated along the bottom surface of the first component 2, and the heat generated by the first component 2 can be further suppressed along the top surface of the first component 2, thereby reducing the impact of the heat generated by the first component 2 on other components located on the top surface of other substrates.
[0084] Furthermore, heat sink 6 is provided with heat sink fins 601 on the side away from the first substrate 1;
[0085] By providing heat dissipation fins 601 on the side of the heat sink 6 away from the first substrate 1, the heat dissipation area can be further increased, the downward transfer speed of the heat generated by the first component 2 can be further accelerated, and the upward transfer of the heat generated by the first component 2 can be further suppressed, reducing the impact of the heat generated by the first component 2 on other components located on the top surface of other substrates.
[0086] In some embodiments, a second insulating and thermally conductive layer 11 is provided between the heat sink 6 and the bottom surface of the first substrate 1.
[0087] It is understood that the first insulating conductive layer and the second insulating conductive layer are an integral structure, that is, the first insulating conductive layer and the second insulating conductive layer can be integrally coated on the bottom surface of the first substrate 1 and the heat sink 5.
[0088] By providing a second insulating and thermally conductive layer 11 between the heat sink 6 and the bottom surface of the first substrate 1, the heat dissipation area of the first substrate 1 can be further increased, and the heat generated by the first component 2 can be further accelerated to be transmitted along the bottom surface of the first component 2. In turn, the heat generated by the first component 2 can be further suppressed to be transmitted along the top surface of the first component 2, thereby reducing the impact of the heat generated by the first component 2 on other components located on the top surface of other substrates.
[0089] This utility model also provides a multilayer circuit board 200.
[0090] like Figure 3 As shown, the multilayer circuit board 200 of this utility model embodiment includes the circuit board 100 and the second substrate 3 as described in the above embodiment. The top surface of the second substrate 3 is provided with a second component 4, and the first substrate 1 is adapted to be pressed onto the bottom surface of the second substrate 3.
[0091] The multilayer circuit board 200 of this utility model embodiment, by setting the circuit board 100 of the above embodiment, can suppress the heat generated by the first component 2 embedded in the multilayer circuit board 200 from being transmitted along the bottom surface of the first component 2, thereby reducing the impact of the heat generated by the first component 2 on the second component 4 disposed on the top surface of the second substrate 3.
[0092] Therefore, the multilayer circuit board 200 of this utility model embodiment can reduce the impact of the heat generated by the components embedded inside the multilayer circuit board 200 on the components located on the top surface of the multilayer circuit board 200.
[0093] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.
Claims
1. A circuit board, characterized by, include: A first substrate, wherein the first substrate is provided with a through hole therethrough; A heat dissipation chip module includes a heat sink and a first component. The heat sink is disposed in the through hole, and the first component is disposed on the top surface of the heat sink. The top surface of the first component is provided with a first heat insulation layer, and the portion of the top surface of the heat sink where the first component is not disposed is provided with a second heat insulation layer.
2. The circuit board according to claim 1, characterized in that, The top surface of the first heat insulation layer is flush with the top surface of the first substrate, the top surface of the second heat insulation layer is flush with the top surface of the first substrate, and / or, The thickness of the first insulation layer is 0.02-0.1 mm, and the thickness of the second insulation layer is 0.02-0.1 mm.
3. The circuit board according to claim 1, characterized in that, A third heat insulation layer is provided between the outer wall surface of the heat sink and the inner wall surface of the through hole.
4. The circuit board according to claim 3, characterized in that, One end of the third heat insulation layer in the thickness direction of the first substrate is flush with the top surface of the first substrate, and the other end of the third heat insulation layer in the thickness direction of the first substrate is flush with the bottom surface of the first substrate.
5. The circuit board according to claim 1, characterized in that, The heat sink is provided with a receiving groove, and the first component is disposed in the receiving groove.
6. The circuit board according to claim 5, characterized in that, There is a gap between at least a portion of the sidewall of the receiving groove and the sidewall of the first component.
7. The circuit board according to any one of claims 1-6, characterized in that, The bottom surface of the first substrate is provided with a heat dissipation component, the bottom surface of the heat dissipation block is in contact with the heat dissipation component, and a first insulating and thermally conductive layer is provided between the heat dissipation block and the heat dissipation component.
8. The circuit board according to claim 7, characterized in that, The heat sink has heat dissipation fins on the surface of the heat sink away from the first substrate.
9. The circuit board according to claim 8, characterized in that, A second insulating and thermally conductive layer is provided between the heat sink and the first substrate.
10. A multilayer circuit board, characterized in that, include: The circuit board as described in any one of claims 1-9, The second substrate has a second component on its top surface and its bottom surface abuts against the top surface of the first substrate.