A module FPC for improving differential impedance stability and a display module

By setting an isolation layer in the MIPI circuit area of ​​the module FPC, the problem of the electromagnetic shielding film's influence on the differential impedance is solved, the differential impedance stability of the module FPC is improved, the impedance tolerance requirements are met, and the adverse effects are reduced.

CN224439282UActive Publication Date: 2026-06-30SHENZHEN TXD TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN TXD TECH CO LTD
Filing Date
2025-07-14
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

After applying electromagnetic shielding film, the differential impedance of existing FPC modules is easily affected, leading to adverse effects and making it difficult to meet impedance tolerance requirements.

Method used

An isolation layer is set in the MIPI circuit area of ​​the module FPC to increase the distance between the electromagnetic shielding film and the MIPI circuit. The isolation layer is a cured UV adhesive layer with a thickness of 15±5um, which reduces the impact of the electromagnetic shielding film on the MIPI circuit.

Benefits of technology

This improves the stability of the differential impedance, ensures that the impedance tolerance of the module FPC is within the specification requirements, and reduces the occurrence of adverse effects.

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Abstract

This invention discloses a modular FPC and a display module for improving differential impedance stability. The FPC includes an FPC body with MIPI circuitry covered by a cover film. An isolation layer with a thickness of at least 10 μm is disposed on the FPC body corresponding to the MIPI circuitry. An electromagnetic shielding film is attached to the isolation layer. This invention increases the distance between the electromagnetic shielding film and the MIPI circuitry by adding an isolation layer in the MIPI circuitry area of ​​the FPC, reducing the impact of the electromagnetic shielding film on the MIPI circuitry and improving differential impedance stability.
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