A pressing device for circuit boards

Abstract

This utility model discloses a pressing device for circuit boards, relating to the field of circuit board technology. A movable component is fixedly installed inside the frame, and a cleaning component is fixedly installed on the inner wall of the frame. A pressing component for pressing the circuit board and aluminum sheet is installed on one side of the cleaning component. The pressing component includes a support frame fixedly installed on the inner wall of the frame, a drive cylinder fixedly installed on the top of the support frame, a pressing head fixedly installed at the output end of the drive cylinder, and a telescopic rod rotatably installed on one side of the pressing head. The circuit board and aluminum sheet are bonded together using 3M 9079 adhesive. The circuit board is an FR4 circuit board. This utility model solves the deformation problem caused by the inconsistent expansion coefficients of FR4 circuit boards and aluminum sheets after SMT high-temperature reflow soldering by using 3M 9079 adhesive to bond them together, ensuring the flatness and stability of the finished product, and improving the soldering quality of electronic components on the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically a pressing device applied to circuit boards. Background Technology

[0002] Traditional automotive headlight circuit boards address heat dissipation by laminating an FR4 material circuit board with a 1mm aluminum sheet. Thermally conductive adhesive is used as a bonding agent during the lamination process. The principle is to utilize the excellent thermal conductivity of the aluminum sheet to conduct the heat generated during circuit board operation away, thereby reducing the circuit board's temperature and ensuring the normal operation of the headlights.

[0003] An existing patent (authorization announcement number: CN222638819U) discloses a circuit board pressing device with a protective structure. The key technical points of the solution are: by setting up connecting rings, a fixing plate, an adjusting plate, and a baffle, when in use, the cylinder is activated, which drives the pressure plate to move downward, thereby causing the pressing plates on both sides of the pressure plate to squeeze the adjusting plate. One end of the adjusting plate will drive the fixing plate to move upward, and the connecting rings at both ends of the fixing plate will also move upward. The connecting rings will cause the baffle to move upward, and the baffle will form a protection to prevent the operator from being accidentally squeezed. At the same time, when pressing the circuit board, the support plate will slide downward, and the support plate will cause the spring on the outside of the connecting rod to deform, thereby applying a reverse force to the support plate, which plays a certain role in buffering.

[0004] However, the above technical solutions still have certain drawbacks. After SMT high-temperature reflow soldering, the inconsistent expansion coefficients of FR4 and aluminum sheets cause deformation of the finished product after lamination. This deformation may affect the soldering quality of electronic components on the circuit board, and may even lead to component damage. It will also affect the assembly accuracy and stability of the entire vehicle light, reducing the reliability and service life of the product. Therefore, a lamination device for circuit boards is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a pressing device for circuit boards to solve the problems in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A pressing device for circuit boards includes a frame, a movable component fixedly installed inside the frame, a cleaning component fixedly installed on the inner wall of the frame, and a pressing component for pressing circuit boards and aluminum sheets installed on one side of the cleaning component.

[0008] The pressing assembly includes a support frame fixedly installed on the inner wall of the frame. A drive cylinder is fixedly installed on the top of the support frame. A pressing head is fixedly installed on the output end of the drive cylinder. A telescopic rod is rotatably installed on one side of the pressing head. A sleeve is fixedly installed on the other side of the telescopic rod. The sleeve is sleeved on the end of a fixed shaft. One end of the fixed shaft is fixedly connected to the inner wall of the frame. An extension is provided at the bottom of the sleeve. A merging plate is fixedly connected to the extension. A pressure plate is fixedly installed at the bottom of the pressing head.

[0009] The circuit board and the aluminum sheet are bonded together using 3M 9079 adhesive. The circuit board is an FR4 circuit board.

[0010] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0011] As a further embodiment of this utility model: the cleaning component consists of a water pump, an air pump, an annular pipe, and an air jet pipe; both the water pump and the air pump are connected to the annular pipe, and the annular pipe is connected to the air jet pipe.

[0012] As a further embodiment of this utility model: the moving component includes a fixed plate fixedly mounted on a frame, a first motor fixedly mounted on the top of the fixed plate, a first guide rail mounted on the top of the fixed plate, a threaded rod mounted on the output end of the first motor, a moving plate threadedly connected to the threaded rod, the moving plate slidably connected to the guide rail, a second motor fixedly mounted on the top of the moving plate, a threaded rod fixedly connected to the output end of the second motor, a pressure plate threadedly connected to the threaded rod, a second guide rail fixedly mounted on the top of the moving plate, and the second guide rail slidably connected to the pressure plate.

[0013] As a further improvement of this utility model, the controller is electrically connected to the water pump, the air pump, the drive cylinder, the first motor, and the second motor.

[0014] As a further improvement of this utility model, the merging plate is made of nylon material.

[0015] As a further improvement of this utility model: the telescopic rod, sleeve, fixed shaft, and merging plate are all provided in two sets mirror images along the center line of the short side of the pressing head.

[0016] As a further improvement of this utility model, a heat-conducting element is provided at the bottom of the pressure plate at the bottom of the pressing head.

[0017] As a further improvement of this utility model, the aluminum sheet has a thickness of 1 mm.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] 1. This utility model solves the deformation problem caused by the inconsistent expansion coefficients between FR4 circuit boards and aluminum sheets after SMT high-temperature reflow soldering by using 3M9079 adhesive to bond the circuit board and aluminum sheet, thus ensuring the flatness and stability of the finished product and improving the soldering quality of electronic components on the circuit board.

[0020] 2. This utility model incorporates a cleaning component that uses a water pump to deliver deionized water or alcohol solution to dissolve organic matter such as oil stains and flux residues. This chemical cleaning ensures that the surface meets the requirements for adhesive bonding. Simultaneously, a gas pump provides high-pressure gas to blow away particulate matter and accelerate liquid evaporation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of this utility model;

[0022] Figure 2 This is a cross-sectional view of the present invention;

[0023] Figure 3 This is a schematic diagram of the cleaning component of this utility model;

[0024] Figure 4 This is a schematic diagram of the pressing assembly of this utility model;

[0025] Figure 5 This is a schematic diagram of the structure of the mobile component of this utility model.

[0026] Figure label annotations: 1. Frame; 2. Cleaning assembly; 3. Pressing assembly; 4. Moving assembly; 5. Controller;

[0027] 21. Water pump; 22. Air pump; 23. Circular pipe; 24. Jet nozzle;

[0028] 31. Support frame; 32. Drive cylinder; 33. Pressing head; 34. Telescopic rod; 35. Fixed shaft; 36. Sleeve; 37. Merging plate;

[0029] 41. Fixed plate; 42. First motor; 43. First guide rail; 44. Moving plate; 45. Second motor; 46. Second guide rail; 47. Pressing plate. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0031] In one embodiment, such as Figures 1-5As shown, a pressing device for circuit boards includes a frame 1, a movable component 4 fixedly installed inside the frame 1, a cleaning component 2 fixedly installed on the inner wall of the frame 1, and a pressing component 3 for pressing the circuit board and aluminum sheet is installed on one side of the cleaning component 2.

[0032] In this embodiment, the frame 1 is made of high-strength engineering plastic, which is vibration-resistant and high-temperature resistant. At the same time, the moving component 4 can accurately transport the circuit board and aluminum sheet. The cleaning component 2 removes oxides, oil stains and particulate impurities from the surface of the PCB and aluminum sheet before pressing. At the same time, the pressing component 3 applies uniform pressure and temperature to the PCB and aluminum sheet after applying adhesive to complete the bonding.

[0033] In one embodiment, such as Figure 5 As shown, the moving component 4 includes a fixed plate 41 fixedly mounted on the frame 1. A first motor 42 is fixedly mounted on the top of the fixed plate 41, and a first guide rail 43 is mounted on the top of the fixed plate 41. A threaded rod is mounted on the output end of the first motor 42, and a moving plate 44 is threadedly connected to the threaded rod. The moving plate 44 is slidably connected to the guide rail. A second motor 45 is fixedly mounted on the top of the moving plate 44, and a threaded rod is fixedly connected to the output end of the second motor 45. A pressing plate 47 is threadedly connected to the threaded rod. A second guide rail 46 is fixedly mounted on the top of the moving plate 44, and the second guide rail 46 is slidably connected to the pressing plate 47. The first motor 42 and the threaded rod control the horizontal movement of the moving plate 44 to ensure that the PCB / aluminum sheet can be accurately delivered to the pressing station. The second motor 45 and the threaded rod control the horizontal movement of the pressing plate 47 to be perpendicular to the movement direction of the moving plate 44, realizing forward, backward, left, and right movement before pressing. It can be moved for PCBs of different sizes, improving the versatility of the equipment.

[0034] In one embodiment, such as Figure 2 and Figure 3 As shown, the cleaning component 2 consists of a water pump 21, an air pump 22, an annular pipe 23, and an air jet pipe 24. Both the water pump 21 and the air pump 22 are connected to the annular pipe 23, which is connected to the air jet pipe 24. The water pump 21 delivers deionized water or alcohol solution to dissolve organic matter such as oil stains and flux residue. Chemical cleaning ensures that the surface meets the adhesive requirements. At the same time, the air pump 22 provides high-pressure gas (such as dry nitrogen or compressed air) to blow away particulate matter and accelerate liquid evaporation, avoiding liquid residue that could cause adhesive failure. It also removes fine dust. The process design of liquid washing followed by air blowing balances thorough cleaning and drying efficiency.

[0035] As a supplement, the annular pipe 23 serves as a pressure buffer chamber, which can balance the output pressure of each jet pipe 24 and prevent excessive local jet pressure from damaging the plate.

[0036] In one embodiment, such as Figure 4As shown, the pressing assembly 3 includes a support frame 31 fixedly installed on the inner wall of the frame 1. A drive cylinder 32 is fixedly installed on the top of the support frame 31. A pressing head 33 is fixedly installed at the output end of the drive cylinder 32. A telescopic rod 34 is rotatably installed on one side of the pressing head 33. A sleeve 36 is fixedly installed on the other side of the telescopic rod 34. The sleeve 36 is sleeved on the end of the fixed shaft 35. One end of the fixed shaft 35 is fixedly connected to the inner wall of the frame 1. An extension is provided at the bottom of the sleeve 36. A merging plate 37 is fixedly connected to the extension. A pressure plate is fixedly provided at the bottom of the pressing head 33. The merging plate 37 is made of nylon. The drive cylinder 32 is started by the controller 5, which drives the pressing head 33. As the pressure head 33 presses down, it drives the telescopic rod 34 to move downwards. Simultaneously, the sleeve 36 rotates outwards towards the cylinder, causing the extension and merging plate 37 to move upwards, thus avoiding interference with the pressure plate's downward pressing. When the drive cylinder 32 moves the pressure head 33 upwards, the merging plate 37 will move towards the center of the pressure plate 47 to merge and align the aluminum plate and circuit board, facilitating the next pressing. The connecting sleeve 36 and the merging plate 37 convert the vertical pressure of the cylinder into a slight oscillation capability of the merging plate 37. At the same time, the low thermal conductivity of the nylon merging plate 37 prevents premature local curing of the 3M 9079 adhesive, ensuring uniform overall curing.

[0037] The circuit board and the aluminum sheet are bonded together using 3M 9079 adhesive. The circuit board is an FR4 circuit board, and the aluminum sheet is 1mm thick. A thermally conductive element is installed at the bottom of the pressure plate of the pressing head 33. By replacing the traditional thermally conductive adhesive with 3M 9079 adhesive, the deformation problem caused by the inconsistent expansion coefficients of the FR4 circuit board and the aluminum sheet after SMT high-temperature reflow soldering is effectively solved.

[0038] 3M 9079 adhesive has good flexibility and cushioning properties, which can alleviate the stress caused by the expansion difference between FR4 and aluminum sheet to a certain extent, ensuring the flatness and stability of the finished product. It not only improves the welding quality of electronic components on the circuit board and reduces the risk of component damage, but also improves the assembly precision of the entire vehicle light, extends the service life of the product, and enhances the product's competitiveness in the market.

[0039] In one embodiment, such as Figure 4 As shown, the telescopic rod 34, sleeve 36, fixed shaft 35, and merging plate 37 are all mirrored in two sets along the short side centerline of the pressing head 33; by clamping and pressing from both sides of the output end of the drive cylinder 32 towards the center, the aluminum plate and the circuit board are effectively aligned and bonded, preventing them from shifting.

[0040] The above embodiments disclose a pressing device for circuit boards. The frame 1 is made of high-strength engineering plastic, which is vibration-resistant and high-temperature resistant. The moving component 4 can accurately transport the circuit board and aluminum sheet. The cleaning component 2 removes oxides, oil stains and particulate impurities from the surface of the PCB and aluminum sheet before pressing. The pressing component 3 applies uniform pressure and temperature to the PCB and aluminum sheet after applying adhesive to complete the bonding. The circuit board and aluminum sheet are bonded with 3M9079 adhesive. By replacing the traditional thermally conductive adhesive with 3M9079 adhesive, the deformation problem caused by the inconsistent expansion coefficients of FR4 circuit boards and aluminum sheets after SMT high-temperature reflow soldering is effectively solved.

[0041] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A press device applied to a circuit board, comprising a rack (1), a moving assembly (4) fixedly installed in the rack (1), characterized in that, A cleaning component (2) is fixedly installed on the inner wall of the frame (1), and a pressing component (3) for pressing the circuit board and aluminum sheet is installed on one side of the cleaning component (2). The pressing assembly (3) includes a support frame (31) fixedly installed on the inner wall of the frame (1). A drive cylinder (32) is fixedly installed on the top of the support frame (31). A pressing head (33) is fixedly installed at the output end of the drive cylinder (32). A telescopic rod (34) is rotatably installed on one side of the pressing head (33). A sleeve (36) is fixedly installed on the other side of the telescopic rod (34). The sleeve (36) is sleeved on the end of the fixed shaft (35). One end of the fixed shaft (35) is fixedly connected to the inner wall of the frame (1). An extension is provided at the bottom of the sleeve (36). A merging plate (37) is fixedly connected to the extension. A pressure plate is fixedly provided at the bottom of the pressing head (33). The circuit board and the aluminum sheet are bonded together using 3M 9079 adhesive. The circuit board is an FR4 circuit board.

2. The press bonding apparatus for a circuit board according to claim 1, wherein The cleaning component (2) consists of a water pump (21), an air pump (22), an annular pipe (23), and a jet pipe (24); the water pump (21) and the air pump (22) are both connected to the annular pipe (23), and the annular pipe (23) is connected to the jet pipe (24).

3. The laminating device for circuit boards according to claim 2, characterized in that, The moving component (4) includes a fixed plate (41) fixedly mounted on the frame (1), a first motor (42) fixedly mounted on the top of the fixed plate (41), a first guide rail (43) mounted on the top of the fixed plate (41), a threaded rod mounted on the output end of the first motor (42), a moving plate (44) threadedly connected to the threaded rod, the moving plate (44) slidably connected to the guide rail, a second motor (45) fixedly mounted on the top of the moving plate (44), a threaded rod fixedly connected to the output end of the second motor (45), a pressing plate (47) threadedly connected to the threaded rod, a second guide rail (46) fixedly mounted on the top of the moving plate (44), and the second guide rail (46) slidably connected to the pressing plate (47).

4. The laminating device for circuit boards according to claim 3, characterized in that, The water pump (21), air pump (22), drive cylinder (32), first motor (42), and second motor (45) are all electrically connected to the controller (5).

5. The laminating device for circuit boards according to claim 1, characterized in that, The merging plate (37) is made of nylon material.

6. The laminating device for circuit boards according to claim 1, characterized in that, The telescopic rod (34), sleeve (36), fixed shaft (35), and merging plate (37) are all provided in two sets mirror images along the center line of the short side of the pressing head (33).

7. The laminating device for circuit boards according to claim 1, characterized in that, The bottom of the pressure plate at the bottom of the pressing head (33) is provided with a heat-conducting element.

8. The laminating device for circuit boards according to claim 1, characterized in that, The aluminum sheet is 1 mm thick.

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